Abstract: A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.

Abstract: The invention relates to an inductor (1) having a coil (2) and a core (3), wherein the core (3) is made of a Soft Magnetic Composite (SMC), the coil (2) is composed of a annularly wound electrical conductor, the coil (2) is substantially integrated into said core (3) so that the core (3) material acts as a thermal conductor having thermal conductivity above 1.5 W/m*K more preferably 2 W/m*K most preferably 3 W/m*K, conducting heat from said coil (2), wherein the inductor (1) is in thermal connection with at least one thermal connecting fixture (10-25), wherein said at least one thermal connecting fixture (10-25) is adapted to be connected to a first external heat receiver (4) so as to conduct heat from the inductor to said first external heat receiver (4).

Abstract: A package assembly includes a main body, a power module and replaceable top cover. The main body has a hollow part. The power module is disposed within a hollow part of the main body and located beside the bottom part of the main body. At least one first pin is disposed on a surface of the power module. The at least one first pin is accommodated within the hollow part of the main body and partially protruded out of a first open end of the hollow part near a top part of the main body. The top cover is disposed in the hollow part of the main body, and includes at least one first opening corresponding to the at least one first pin. The at least one first pin is penetrated through the corresponding first opening and exposed outside the first open end of the hollow part.

Abstract: Apparatus and method to provide integrated circuit (IC) package integrity without adverse performance degradation are disclosed herein. In some embodiments, an apparatus may include one or more integrated circuits (ICs); a metallic structure that encircles the one or more ICs without being in contact with the one or more ICs, wherein the metallic structure is without an electrical ground; and a conductive epoxy layer disposed below and in contact with the metallic structure, wherein the conductive epoxy is to reduce an electromagnetic field induced by the metallic structure in response to a presence of a wireless signal that operates at approximately a resonant frequency associated with the metallic structure.

Abstract: A light panel for a luminaire includes a frame, a lamp assembly carried by the frame, a dissipater heat sink carried by the frame, and a heat transfer line that thermally couples the lamp assembly to the dissipater heat sink. The heat transfer line transfers heat generated by the lamp assembly, for example by a light element of the lamp assembly, to the dissipater heat sink by conduction. The dissipater heat sink is exposed to an exterior side of the frame such that heat from the lamp assembly is dissipated to the exterior side of the frame by conduction through the heat transfer line and the dissipater heat sink. The light panel may form a door for a housing of a luminaire, which may be easily retrofitted to the housing.

Abstract: An information handling system (IHS) includes a heatsink retention apparatus. A processor mounted on a board receives a heatsink base having peripheral, spaced apertures. At least two latching mechanisms include a mounting portion received respectively in peripheral, spaced apertures on opposites sides of the heatsink base. A latching surface is mounted to one of (i) the heatsink base and (ii) a terminal portion of the mounting portion to engage respectively with either the mounting portion or an upper edge of the corresponding peripheral, spaced aperture of the heatsink base. At least two peripheral, spaced loading screws are sized to be engageable by loading nuts when the heatsink base is positioned not higher than the engagement height. The engaged, at least two, latching mechanisms prevent tipping of the heatsink base during loading of the at least two peripheral, spaced loading screws with the at least two spaced apart loading nuts.

Abstract: A manufacturing method of a semiconductor device includes forming a hard mask layer on a semiconductor substrate using a hard mask composition. Hard mask patterns are formed by patterning the hard mask layer. Semiconductor patterns are formed by etching the semiconductor substrate using the hard mask patterns. The hard mask composition includes a plurality of first carbon nanotubes (CNTs) having a first length, a plurality of second CNTs having a second length, which is at least 3 times the first length, and a dispersing agent in which the first CNTs and the second CNTs are dispersed. The total mass of the first CNTs is 1 to 2.5 times the total mass of the second CNTs.

Abstract: A semiconductor module (100) has a first insulating substrate (11); a first conductor layer (12) provided on a mounting surface of the first insulating substrate (11); a first electronic element (13) provided on the first conductor layer (12); a sealing resin (80), which covers an overall mounting region within the mounting surface of the first insulating substrate (11), the first conductor layer (12), and the first electronic element (13); and a frame body (70), which is made of metal and covers the overall sealing resin (80).

Abstract: An electronic device includes a board having a first surface on which a heating element is mounted, a heat sink plate disposed to face the first surface of the board, and a heat pipe disposed between the board and the heat sink plate such that one end of the heat pipe is disposed at a position where the one end is in contact with the heating element, and the other end of the heat pipe is disposed to be in contact with the heat sink plate, wherein the heat sink plate has a stacking structure of a first heat sink plate of which a front surface faces the board, and a second heat sink plate disposed on a rear surface of the heat sink plate, and a through hole is formed at a position on the first heat sink plate.

Abstract: A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.

Abstract: Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.

Abstract: An electronic device has a heat source and a generally rectangular shape battery proximate the heat source. The battery may have first and second major surfaces. A thermal regulator is in thermal contact with both of the heat source and substantially all of at least the first major surface of the battery. During operation of the device, heat transferred from the heat source to the first major surface via the thermal regulator balances the temperature profile exhibited along the first major surface such that it is substantially uniform.

Abstract: A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.

Abstract: An impregnating resin for an electrical insulation body includes a base resin, a filler having nanoscale particles, and a radically polymerizing reactive diluent. The impregnating resin includes a crosslinker for crosslinking the base resin and the reactive diluents. The base resin is an epoxy resin. An electrical insulation body includes the impregnating resin and a method produces the electrical insulation body by production of an impregnating resin having a base resin, a filler having nanosize particles and a free-radically polymerizing reactive diluent.

Abstract: Provided is a semiconductor device having a small footprint, where the semiconductor device includes multiple power modules and a cooling structure for these power modules. The semiconductor device includes: a first power module on a first top plate of a coolant jacket; and a second power module on a second top plate of the coolant jacket, where the second top plate face the first top plate. The coolant jacket includes a first fin in contact with the first top plate in a passage, and a second fin in contact with the second top plate in the passage. The power modules face each other through the top plates and the fins.

Abstract: Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.

Abstract: A molded semiconductor package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, and one or more heat conductors in the molding compound that are thermally coupled to the substrate. Advantageously, the heat conductors are mounted in the molding compound near one or more of the corners of the die. The package may also include a lid. The heat conductors produce a more uniform distribution of heat in the substrate. The package is assembled by mounting the die on the substrate, mounting the heat conductors on the substrate and applying the molding compound to the substrate, the die, and the heat conductors mounted on the substrate. For packages that use a lid, the lid is then secured to the package and coupled to the heat conductors.

Abstract: A heat sink includes a base, to which an LED element is attached, and a plate-shaped heat dissipating surface integrally and continuously formed with the base around the LED element. The base and the plate-shaped heat dissipating surface are formed of aluminum or an aluminum alloy having a specific thermal conductivity ? and a specific surface emissivity ?. When the plate thickness of the base and the plate-shaped heat dissipating surface is specified in a range from 0.8 to 6 mm, a total projected area of the heat dissipating surfaces of the heat sink is specified in a range from 19000 to 60000 mm2 so as to obtain a heat resistance of 4.0 K/W or smaller. Projected areas of two plate-shaped heat dissipating surfaces of the heat sink in two different directions are sufficiently increased with respect to corresponding sectional areas of the base.

Abstract: A heat dissipation structure of a fan drive of an air conditioner outdoor unit, and an air conditioner outdoor unit are provided. A side plate of the air conditioner outdoor unit is disposed between a side plate of the fan drive and a baffle plate, and the side plate of the air conditioner outdoor unit clings to the side plate of the fan drive; a first air vent communicating with the outside of the air conditioner outdoor unit is provided on the side plate of the air conditioner outdoor unit; and a second air vent is provided on the baffle plate, the first air vent and the second air vent form an air duct between the side plate of the air conditioner outdoor unit and the baffle plate, and the second air vent enables the first air vent to communicate with an inner chamber of the air conditioner outdoor unite.

Abstract: A vehicle power module assembly includes a modular manifold, an upper frame, and a plurality of power stages. The modular manifold includes a first base unit defining an inlet chamber, a second base unit defining an outlet chamber, a mid-unit defining one or more ports open to the chambers, and an upper unit defining a first set of slots and a second set of slots in fluid communication with the chambers via the ports. The plurality of power stages is housed within the frame and each of the power stages are spaced from one another to define inner channels therebetween. The chambers, channels, and ports are arranged with one another such that coolant flowing through the inner channels is in thermal communication with the power stages. The mid-unit may further include flow guides each sized to partially extend into one of the inner channels.

Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 ?m thick.

Abstract: A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.

Abstract: A battery includes at least one integrated first heat exchanger element that forms an integral part of the battery and is formed in one piece with the battery. The heat exchanger element can end flush with the surface of the battery, but it can also protrude from or be recessed into the surface of the battery. A coolable battery system includes at least one such battery and a second heat exchanger element for each battery that can be reversibly brought into thermal operative contact with the first heat exchanger element. A method for cooling such a battery in the coolable battery system, in which the first heat exchanger element of the at least one battery is brought in thermal operative connection with the second heat exchanger element, includes maintaining the second heat exchanger element at a lower temperature level than the first heat exchanger element.

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

Abstract: A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.

Abstract: A method of forming a semiconductor package includes growing a layer of carbon nano material on a chip. The chip has a first surface and a second surface and the layer of carbon nano material is grown on the first surface of the chip. The layer of carbon nano material is configured to provide a path through which heat generated from the chip is dissipated. A substrate is attached to the second surface of the chip. A molding compound is formed above the substrate to encapsulate the chip and the layer of carbon nano material.

Abstract: A cooling fan (1) for cooling an electronic device (2) is disclosed. The cooling fan (1) comprises a heat sink (5) thermally connectable to the electronic device (2), the heat sink (5) having a first clearance side (6a, 6b) centered relative to a longitudinal axis (L) of the heat sink (5), and several thermally conductive fan blades (13) arranged in a circle centered on the longitudinal axis (L). The fan blades (13) are rotatable relative to the heat sink (5) about the longitudinal axis (L) by a motor (19) and each fan blade (13) has a second clearance side (14) facing the first clearance side (6a, 6b). A clearance space (18) is provided between the first clearance side (6) and each second clearance side (14), the majority of said clearance spaces (18) having a size of 100 micrometer or less in a direction perpendicular to the first clearance side (6a, 6b) and the corresponding second clearance side (18).

Abstract: A heat sink includes a bottom surface, a top surface, plural first fins and plural second fins. The plural first fins and the plural second fins are alternately and separately arranged between the top surface and the bottom surface along a specified axis direction. Moreover, plural airflow channels are defined by the plural first fins, the plural second fins, the top surface and the bottom surface collaboratively. The first fin has a first non-overlapped zone and a second non-overlapped zone with respect to a projection area of the second fin along the specified axis direction. The first non-overlapped zone is located at an airflow inlet. In the first non-overlapped zone, the lower portion is wider than the upper portion. The second non-overlapped zone is located at an airflow outlet. In the second non-overlapped zone, the upper portion is wider than the lower portion.

Abstract: A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.

Abstract: A pin fin cooling system may include at least one first surface defining at least a base portion of the cooling system, and at least one pin fin array of a plurality of pin fins and at least one coolant fluid flow detector extending from the first surface. The coolant fluid flow deflector may be configured to split a coolant fluid flow from a primary flow into at least two secondary flows that follow a predetermined path over local heat sources, and may have a maximum wall thickness that is equal to a diameter of a cross-section of one of the pin fins. The cooling system may further include at least one boundary fin extending from the first surface that is in the shape of a spline, at least a portion of which may correspond and match at least a portion of a pattern of the pin fin array.

Abstract: A thermal bridge includes a first plate stack, a second plate stack and a temperature responsive actuator. The first plate stack is placed in thermal communication with a first electrical component and has a plurality of first plates. The second plate stack is placed in thermal communication with a second electrical component and has a plurality of second plates interleaved with the first plates. The temperature responsive actuator is coupled to at least one of the first and second plate stacks. The temperature responsive actuator changes shape based on changes in temperature to change the relative positions of the first and second plates. The temperature responsive actuator causes the first and second plates to vary thermal resistance between the first and second electrical components based on the change in relative positions of the first and second plates.

Abstract: A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.

Abstract: Various applications for structured CNT-engineered materials are disclosed herein. In one application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of providing its own structural feedback. In another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of generating heat. In yet another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of functioning as an antenna, for example, for receiving, transmitting, absorbing and/or dissipating a signal. In still another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of serving as a conduit for thermal or electrical energy.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.

Abstract: An optical module for a motor vehicle lighting and/or signaling device, having an optical deflection element, a support to which the optical deflection element is fixed, the support comprises adapter fixing means capable of fixing an adapter to which a light source is fixed, and wherein the first optical deflection element comprises adapter indexing means arranged so as to be capable of positioning this adapter relative to the first optical deflection element on two separate intersecting axes.

Abstract: A lighting device (1) comprising a driver (7) arranged at a base (2) of the lighting device (1), a heat sink (14) arranged at a portion (3) of the lighting device (1), separate from the driver (7), a light source (13) mounted to the heat sink (14), and a wire (10) arranged to electrically connect the light source (13) to the driver (7), wherein a portion of the wire (10) extending from the base (2) to the portion of the lighting device (1) is arranged to be exposed to light from the light source (13). The present embodiment is advantageous in that the thermal performance is improved and the lifetime of the lighting device (1) is increased. Further, the exposed wire (10) may be illuminated by the light source (13) and visible from outside the lighting device (1), thereby having the appearance of a filament.

Abstract: In a semiconductor module of the invention, a heat sink has a convex portion in which a convex plane has an area smaller than a joint area to the joint layer, a first stepped portion provided to an edge of the convex portion, a thickness of the heat sink in a portion corresponding to the first stepped portion being smaller than a thickness of the heat sink in a portion corresponding to the convex portion, and a second stepped portion provided to an edge of the first stepped portion, a thickness of the heat sink in a portion corresponding to the second stepped portion being further smaller than the thickness of the heat sink in the portion corresponding to the first stepped portion. The joint layer is joined by the convex portion and the first stepped portion of the heat sink.

Abstract: A product and method for packaging high power integrated circuits or infrared emitter arrays for operation through a wide range of temperatures, including cryogenic operation. The present invention addresses key limitations with the prior art, by providing temperature control through direct thermal conduction or active fluid flow and avoiding thermally induced stress on the integrated circuits or emitter arrays. The present invention allows for scaling of emitter arrays up to extremely large formats, which is not viable under the prior art.

Abstract: A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body.

Abstract: Creating surface variations on a stiffener in a stack reduces inter-stiffener sticking and stiffener stack tilt in pick and place media. The surface variations provide one or more airgaps that reduce inter-stiffener surface contact, provide space for contaminants and/or provide an averaged surface height due to surface roughness.

Abstract: An electronic apparatus includes heat generating components accommodated in a sealed housing section of a housing, an internal-side heat exchanger and an external-side heat exchanger on opposing sides of a wall of the housing, an external-side heat exchanger for heat generating components for heat exchange between the heat generating components and air outside the housing section, and an internal fan. A high-heat generating component generating the most heat contacts the inner surface and opposed to the external-side heat exchanger for heat generating components. Heat exchange between the high-heat generating component and air outside the housing section is effected via the external-side heat exchanger for heat generating components. Heat exchange between air inside the housing section and air outside the housing section is effected via the internal-side heat exchanger and the external-side heat exchanger.

Abstract: Dual sided latching retainers including a latching mechanism fixing the dual sided latching retainer to a computer board assembly; a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly; a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly.

Abstract: Exemplary embodiments are disclosed of multifunctional components for electronic devices. In an exemplary embodiment, a multifunctional component generally includes a base component, such as a smart phone case (e.g., a back cover, etc.), an inner plate (e.g., a screenplate, a mid-plate, etc.). A heat spreader may be disposed on the base component. Thermal interface material and electromagnetic interference shielding may be disposed on area(s) of the heat spreader. The area(s) may correspond in mirror image relation to component(s) of a circuit board with which the multifunctional component is configured to be joined. During operation of the electronic device, the multifunctional component may draw waste heat from one area and transfer/spread the waste heat to one or more other areas of the electronic device, which may increase a temperature of these one or more other areas. This, in turn, may make device temperature more uniform.

Abstract: A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.

Abstract: A heat sink mounting apparatus including: a heat sink; and a device housing, the housing having a slot in the wall of the housing configured to receive a heat sink, wherein the heat sink and the housing are configured such that the heat sink can be secured within the slot with an interference fit.

Abstract: A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.

Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Abstract: Methods and devices are disclosed for attracting animals. A game call speaker system having a body portion, first speaker unit configured to rotate about a first axis, a second speaker unit configured to rotate about a second axis and a memory comprising one or more stored game calls is provided. Rotation of the first speaker unit may be independent of rotation of the second speaker unit. The first axis may be substantially parallel to the second axis. In some embodiments, the game call speaker system is configured to emit the stored game calls over a relatively wide angle (e.g., 360 degrees) relative to the body portion.