Abstract: A heat dissipater with an antenna structure comprises a heat conductive portion capable of being contacted with a heat source of an electronic device for heat dissipation; and an antennal portion integrally formed to the heat conductive portion so as to form as an integral body; and the antenna portion comprises at least one sheet body. A conductive layer is coated on a surface of the sheet body; in that the conductive layer can be connected to a conductive wire for being lead to the portable electronic device for signal receiving and transmission. The heat conductive portion 10 has the function of heat dissipation and the antenna portion 20 has the function of wireless transmission which are made integrally with a compact space so that the space in an portable electronic device for receiving the heat conductive device is sufficient to receiving the whole structure.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: A power module including a power device and a magnetic component is provided. The magnetic component is stacked with the power device and a vertical projection of the magnetic component is at least partially overlapping with the power device. The magnetic component includes a magnetic core and a winding set. The magnetic core includes a first surface, a second surface and at least one window. The window is located between the first surface and the second surface, and includes a passing-through axis vertical to a surface of the power device, where at least one leading pin or pad is disposed on the surface of the power device. The winding set includes at least one winding portion. The winding portion passes through the window and electrically connected to the power device. Each winding set and the magnetic core are configured to form an inductor, and the winding set is preformed.

Abstract: A heat-exchanger heat sink (1; 102; 103; 104) includes a plurality of fin plates (2; 202; 203; 203a, 203b; 205), which are lined up spaced apart from one another in a plate-thickness direction; and at least one linking part (3; 3a, 3b; 304), which is disposed such that it intersects and hold the plurality of fin plates (2). The at least one linking part has a base (31), which may be rod or bar shaped, and a plurality of positioning protrusions (32), which protrude from a side surface of the base. Each of the fin plates has at least one latching groove (21, 26), into which the base is inserted such that each fin plate is located between adjacent positioning protrusions of the at least one linking part.

Abstract: A method of making a glass sheet includes treating a refractory block material comprising at least one multivalent component with a vehicle comprising at least one redox altering component or precursor. The method also includes flowing molten glass over the refractory block material, wherein the treatment of the refractory block material with the vehicle comprising at least one redox altering component or precursor reduces the amount of oxygen production resulting from interaction between the at least one multivalent component and the molten glass.

Abstract: The present teachings disclose various embodiments of a thermal block assembly having low thermal non-uniformity throughout the thermal block assembly. Accordingly, various embodiments of thermal block assemblies having such low thermal non-uniformity provide for desired performance of bioanalysis instrumentation utilizing such thermal block assemblies.

Abstract: This invention relates to a thermal interface device (206) arranged to provide a thermal coupling interface between a heat-generating unit (202) and a heat-removing unit (204), comprising a liner layer (210), which has opposite first and second surfaces (218,220), at least the first surface being a slide surface, and which is provided with multiple perforations (212); and a thermal connection layer (208), which is engaged with the liner layer at the second surface (220) thereof, and which is one of elastically and inelastically deformable. The thermal interface device has an idle state where the perforations are open, and an active state where the perforations are filled with a part of the thermal connection layer. The thermal connection layer is arranged to be deformed by the thermal interface device being subjected to a compression force exceeding a deformation threshold, and thereby to fill the perforations.

Abstract: A heat dissipation unit is provided and includes a casing and a heat pipe. The casing has a casing chamber which contains therein a working fluid. Casing capillaries are disposed on an inner wall of the casing chamber. The heat pipe has an open end and a closed end. A heat pipe chamber is defined between the open end and the closed end and communicates with the casing chamber through the open end. Heat pipe capillaries are disposed on an inner wall of the heat pipe chamber and are in capillary connection with the casing capillaries through the open end of the heat pipe.

Abstract: A chassis to receive a line replaceable module including a molded body formed from a composite material, a card guide integrally formed in the molded body to receive the line replaceable module, the card guide including a card guide wall integrally formed in the molded body and extending outwardly from the molded body, and a plurality of tolerance features disposed within the card guide to retain the line replaceable module.

Abstract: Described are techniques for controlling the transfer of heat on various portions of a device or other structure. A structure may include a substrate having a first thermal conductivity. A material having a different thermal conductivity is distributed on the substrate. The position, quantity, and thickness of the material affects the manner in which heat is transferred away from at least one hot spot on the substrate.

Abstract: A cage can include a thermal plate positioned so as to be aligned with a bottom of a channel. An adjustable biasing system is provided to urge a module toward the thermal plate. The adjustable biasing system may be a riding heat sink. The thermal plate may include a fin to help increase its surface area. A housing with a card slot aligned with the channel can be provided in the cage to provide a receptacle that has a card slot aligned with the channel. A receptacle so configured allows for greater thermal energy to be removed from a module.

Abstract: A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slidably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

Abstract: A heat dissipation structure is provided for arrangement on an addin card and includes a plurality of heat dissipation fins arranged on the addin card, at least one bent section formed at one side of the heat dissipation fins and located on the addin card, at least one gap section formed between each bent section, and at least one first through-hole section formed in the heat dissipation fins. The heat dissipation fins allow heat to be dissipated from the addin card. The gap section and the first through-hole section of the heat dissipation fins allow air to flow therethrough and ventilate so as to enhance the effect of heat dissipation.

Abstract: In an embodiment, an electronic component includes a dielectric core layer having a thickness, at least one semiconductor die embedded in the dielectric core layer and electrically coupled to at least one contact pad arranged on a first side of the dielectric core layer, and a heat dissipation layer arranged on a second side of the dielectric core layer and thermally coupled to the semiconductor die. The semiconductor die has a thickness that is substantially equal to, or greater than, or equal to the thickness of the dielectric core layer. The heat dissipation layer includes a material with a substantially isotropic thermal conductivity.

Abstract: A heat radiation member, a heat radiation circuit board, and a heat emission device package are provided. The heat radiation circuit board includes a printed circuit board in which a heat radiation region is defined, and a heat radiation member inserted into the heat radiation region and including a bottom surface attached to the heat radiation region and a lateral surface bent from the bottom surface to pass through the printed circuit board. The heat radiation member is inserted into a region of the heat radiation circuit board adjacent to the heat emission device so that the heat radiation effect is improved. The heat radiation member having the spatial structure is formed to obtain the superior heat radiation effect. The structure of the heat radiation member is simplified so that the heat radiation member is automatically assembled, thereby reducing the failure of the heat radiation member.

Abstract: Heat transfer devices and methods for making the same that include a first enclosure having at least one inlet port; a second enclosure having a bottom plate and one or more dividing walls to establish channels, at least one internal surface of each channel having rib structures to create turbulence in a fluid flow; and a jet plate connecting the first enclosure and the second enclosure having impinging jets that convey fluid from the first enclosure to the channels, said impinging jets being set at an angular deviation from normal to cause local acceleration of fluid and to increase a local heat transfer rate.

Abstract: A heat-dissipating structure including a heat sink having a recessed portion on a first surface facing a heat generator, the recessed portion having a side surface; a heat block fit into the recessed portion, the heat block having a bottom surface and a side surface; and thermally conductive grease in contact with both of the side surface of the recessed portion and the side surface of the heat block, wherein the bottom surface of the heat block is in contact with the heat generator.

Abstract: A device for aligning and bringing a large-area substrate into contact with a carrier substrate comprising: a substrate holding means for attaching the substrate; a carrier substrate holding means for attaching the carrier substrate; detection means for detection of a peripheral contour of the substrate attached to the substrate holding means and detection of a peripheral contour of the carrier substrate attached to the carrier substrate holding means relative to a contact plane of the substrate with the carrier substrate; aligning means for aligning the substrate relative to the carrier substrate; and contacting means for bringing the substrate into contact with the carrier substrate.

Abstract: Methods and systems for facilitating placement of a small cell in a network are provided. A small cell may be positioned such that it is communicatively coupled to a macro cell to provide a relay backhaul to a wireless network. The small cell may be configured to provide feedback of some form when the small cell is moved from a desired location, to facilitate desired placement and use of the small cell. The feedback may be in the form of reduced or changed operation of an associated device, such as a fan, a speaker, and/or a sign, or in the form of one or more communications over the network.

Abstract: A power conversion device includes: a metal housing; a power semiconductor module that is contained in the metal housing and converts direct electric current to alternating electric current; a capacitor module that is contained in the metal housing and arranged side by side with the power semiconductor module, wherein the capacitor module smoothes the direct electric current supplied to the power semiconductor module; a substrate that has a drive circuit part mounted in a first region, the drive circuit part driving the power semiconductor module, and a control circuit part mounted in a second region, the control circuit part controlling the drive circuit part, wherein the substrate is disposed so as to cover over the metal housing; a base plate that extends in a space in which the second region of the substrate and the capacitor module oppose to each other, and that is electrically connected to the metal housing; and a first noise shielding member that extends in a direction along a boundary between the firs

Abstract: An in-vehicle radiant heater control apparatus includes: a temperature detection device for a heater in a vehicle compartment; a first switch element connected in series to the radiant heater between a power supply and a ground; a temperature control device controlling the first switch element that the heater temperature approaches a target temperature; a resistive element having one electrode connected to one electrode of the heater; an inter-electrode voltage detection device for the resistive element; and a resistance calculation device repeatedly obtaining a heater resistance of the radiant heater based on a voltage between the other electrode of the resistive element and the other electrode of the heater, a detected resistance voltage, and a resistance of the resistive element. The temperature detection device obtains the heater temperature based on the heater resistance.

Abstract: Provided are cooling subsystems for a vehicle energy-storage system comprising a heat pipe disposed between two battery modules, the heat pipe being thermally coupled to each of a plurality of cells of the two battery modules at an end of each cell. The heat pipe comprises an envelope and a working fluid, the heat pipe transferring heat from the plurality of cells. Optionally, the cooling subsystem further includes a heat exchanger thermally coupled to the heat pipe, the heat exchanger receiving heat from the heat pipe.

Abstract: A heat dissipation structure of a semiconductor device with excellent heat dissipation applicable to surface-mount thin semiconductor devices is provided, and preferably a heat dissipation structure of a semiconductor device also with excellent insulating reliability is provided. In a heat dissipation structure 101 of a semiconductor device 10, the semiconductor device 10 has an electric bonding surface 11a electrically connected with a substrate 20 and a heat dissipation surface 11b on an opposite side thereof, wherein the heat dissipation surface 11b is bonded or contacted to a heat spreader 31 via a non-insulated member 32, and the heat spreader 31 is bonded or contacted to a heat sink 30 via an insulated member 41.

Abstract: The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

Abstract: Semiconductor module has a first member, a second member, a conductor column extending in the vertical direction between the first member and the second member and a sealing resin covering a first conductor layer and a first power device of the first member, a second conductor layer and a second power device of the second member and the conductor column. Positions of the first power device and the second power device on the horizontal plane are shifted, the second conductor layer is not provided in the vertical direction from a first connection part connected to the first power device, and the first conductor layer is not provided in the vertical direction from a second connection part, connected to the second power device, of the second power device.

Abstract: A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.

Abstract: To bond a layered substrate and a cooling chamber having different linear expansion coefficients while preventing cracking and breaking, provided is a semiconductor module including a layered substrate formed by layering a circuit board, an insulating board, and a metal board; a semiconductor chip mounted on the circuit board; and a cooling chamber bonded to the metal board by solder. The cooling chamber includes a first board portion bonded to the metal board; a second board portion facing the first board portion; and a plurality of zigzag fins arranged between the first board portion and the second board portion. The plurality of zigzag fins are joined to the first board portion and the second board portion, and a flow path through which a coolant passes is formed by the first board portion, the second board portion, and the plurality of zigzag fins.

Abstract: An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.

Abstract: An integrated power electronics assembly module includes a power unit and a clamping auxiliary circuit board. The power unit includes a power level circuit board and a shielding casing. The power level circuit board is contained in the shielding casing. The clamping auxiliary circuit board is disposed against the shielding casing and stacked with the power level circuit board to reduce a parasitic inductance generated by a commutation loop constituted by the power level circuit board and the clamping auxiliary circuit board. The clamping auxiliary circuit board is electrically coupled to the power level circuit board via the shielding casing.

Abstract: The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.

Abstract: A heat dissipation assembly includes a heat sink, an electronic component and an elastic fastener. The heat sink includes a contact surface, an engaging part and a wing part. The engaging part and the wing part are protruded externally from the contact surface. An accommodation space is defined by the engaging part, the wing part and the contact surface. The engaging part has a concave structure disposed within the accommodation space. The electronic component is disposed on the contact surface. The elastic fastener includes a first free end, a bent segment and a second free end. The first free end is locked on an inner wall of the concave structure. The bent segment is contacted with a first sidewall of the wing part. The second free end is locked on an external surface of the electronic component. Consequently, the electronic component is attached and fixed on the contact surface.

Abstract: Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.

Abstract: A power converter includes a plurality of power cards, a plurality of coolers and a pressure member. Each of the power cards houses a semiconductor element. The plurality of coolers is laminated with the power cards. The cooler includes a body, a gasket and a metal plate. The body is made of resin, and has an opening that is provided in a side surface of the cooler that faces the adjacent power card. A surface on one side of the metal plate is configured to close the opening through the gasket, and the other surface faces the power card. The pressure member is configured to apply a pressure in a laminating direction on a lamination unit. The opening is sealed by the metal plate by pressure applied by the pressure member on the lamination unit.

Abstract: This application discloses an electronic device including a cooling structure and a plurality of electrical components. The cooling structure is made from a thermally conductive material, and has an exterior surface, an interior surface and a hollow portion defined by the interior surface. The exterior surface is configured to radiate away heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The electrical components are contained within the hollow portion. Heat generated by the electrical components during operation of the electronic device is carried away by the cooling structure. In some implementations, the exterior surface includes a base form and a plurality of surface features that project away from the base form, and the surface features are physically configured to form a helical structure that wraps around the cooling structure and increases rate of thermal radiation from the exterior surface.

Abstract: A receptacle assembly includes a receptacle housing having panels defining a housing cavity receiving a pluggable module. The panels are conductive to provide electromagnetic interference shielding. The receptacle housing has a bottom mounted to a circuit board. A communication module is received in the housing cavity and mounted to the circuit board. The communication module includes a communication connector interfacing with the pluggable module. The receptacle assembly includes a light pipe assembly coupled to the receptacle housing having has a plurality of flexible light pipes each extending between a light-receiving end and a light-emitting end. The light-receiving end is positioned proximate to the bottom to receive light from a light-emitting device mounted to the circuit board. The light-emitting end is provided proximate to the front end of the receptacle housing for displaying a status indicator for the communication connector.

Abstract: Embodiments disclosed herein include systems and methods for mounting electrical components in electrical systems. In one example, there is provided a heat-generating electrical component and base assembly configured to be secured to a component wall. The assembly comprises a base including an upper portion having a recess and a lower portion having a floating electrical connector, a heat-generating electrical component secured in the recess of the base and including an electrical lead in electrical communication with the floating electrical connector, and a gasket circumscribing a perimeter of the lower portion.

Abstract: Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.

Abstract: The present invention includes a holding stay made of a heat conductive material that is the same as that of an isolator holder, the holding stay being in contact with a radiation stay made of a member having good thermal conductivity, the radiation stay being in contact with radiation fins extracted from the inside of the isolator holder through an external opening for extraction, columnar welded portions bond the holding stay and the isolator holder through openings for welding, the welded portions apply tensile force toward the isolator holder to the radiation stay via the holding stay, and the radiation stay presses the radiation fins by means of the above-described tensile force to be fixed to the isolator holder.

Abstract: A low-cost passive radiative cooling panel includes an emitter layer disposed under an upper reflective layer, where the emitter layer includes metamaterial nanostructures (e.g., tapered nanopores) configured to dissipate heat in the form of radiant energy that is transmitted through the reflective layer into cold near-space. In an embodiment the emitter layer includes ultra-black material configured to emit, with an emissivity close to unity, radiant energy having wavelengths/frequencies that fall within known atmospheric transparency windows (e.g., 8-13 ?m or 16-28 ?m). In a practical embodiment the emitter layer is formed using a modified Anodic Aluminum Oxide (AAO) self-assembly technique followed by electroless plating that forms metal-plated tapered nanopores.

Abstract: A portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. A plurality of heat removers selectively thermal contact to at least one wall of an enclosure of the portable electronic device depended on the configuration of the portable electronic device.

Abstract: A heat sink includes a heat sink base, a first fin, and a second fin. The spacing between the base and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

Abstract: A cooler for diode-laser bars comprises a machined base including a water-input plenum and a water-output plenum, and a top plate on which the diode-laser bars can be mounted. A stack of three etched plates is provided between the base and first plate. The stack of etched plates is configured to provide a five longitudinally spaced-apart rows of eight laterally spaced-apart cooling-channels connected to the water-input and water-output plenums. Water flows in the cooling-channels and in thermal contact with the first plate.

Abstract: An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.

Abstract: A thermal response engine on an information handling system compares a processor thermal response to a predetermined workload with an expected thermal response to the predetermined workload in order to validate that a heat sink disposed on the processor matches a heat sink used by a thermal controller profile to manage thermal conditions of the information handling system. If the heat sink thermal characteristics fail to match up with expected thermal characteristics, the thermal response engine provides the thermal controller with an appropriate thermal profile and alerts the end user of an incompatibility.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.

Abstract: The invention relates to an inductor (1) having a coil (2) and a core (3), wherein the core (3) is made of a Soft Magnetic Composite (SMC), the coil (2) is composed of a annularly wound electrical conductor, the coil (2) is substantially integrated into said core (3) so that the core (3) material acts as a thermal conductor having thermal conductivity above 1.5 W/m*K more preferably 2 W/m*K most preferably 3 W/m*K, conducting heat from said coil (2), wherein the inductor (1) is in thermal connection with at least one thermal connecting fixture (10-25), wherein said at least one thermal connecting fixture (10-25) is adapted to be connected to a first external heat receiver (4) so as to conduct heat from the inductor to said first external heat receiver (4).