Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.

Abstract: The invention relates to a method and a device (20) for cooling tool holders comprising shrink fit chucks, said tool holders beings received in a tool holder seat. The invention provides an especially efficient and above all completely automatable cooling system which allows a successive cooling of a plurality of tool holders (36). The cooling device (20) is very economical and can be shaped in such a manner as to be perfectly adapted to the space available and to already present shrink-fit devices (42).

Abstract: A method of reducing a temperature of a bake plate within a semiconductor processing tool includes (a) providing a substrate and (b) transferring the substrate to a position adjacent the bake plate. The bake plate is characterized by an initial bake plate temperature greater than a set point temperature. The method also includes (c) reducing the temperature of the bake plate by a first predetermined amount and (d) transferring the substrate from the position adjacent the bake plate to a position adjacent a chill plate. The chill plate is characterized by a chill plate temperature less than the set point temperature.

Abstract: Various embodiments for a freezing receptacle and apparatus are described. The freezing receptacle includes a freezing box with a thermal agent that serves to freeze or cool an object or maintain the temperature of the object. The freezing receptacle includes at least one side wall having a sloped inner face that slopes inwards to ensure that the thermal agent remains in thermal contact with the object continuously as the thermal agent changes size and at least one side wall with a vertical face or an outer face that slopes outwards.

Abstract: A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a chassis with an opening and a support unit slidably positioned within the opening. The support unit receives various thermal management devices such as a coolant pump, a filter, a heater and the like. A first rail and a second rail are attached within the interior of the chassis that movably receive a first guide and a second guide of the support unit respectively. Electrical and fluid connectors attached to the chassis and the support unit allow for the connection of the thermal management devices on the support unit to the chassis.

Abstract: A Stirling engine assembly comprising a Stirling engine having a generally cylindrical head. An annular burner surrounds the head and defines a combustion chamber between the burner and head. An annular seal between the burner and head provides a seal for combustion gases. A thermocouple housing is in thermal contact with the head and sealed from the combustion chamber. The thermocouple housing extends out of the combustion chamber, with the interface between the thermocouple housing and combustion chamber being sealed. The thermocouple housing has an opening outside the combustion chamber. A thermocouple in the thermocouple housing extends from a location adjacent to the head out of the opening in the thermocouple housing.

Abstract: Techniques for low-temperature ion implantation are disclosed. In one particular exemplary embodiment, the techniques may be realized as a wafer support assembly for low-temperature ion implantation. The wafer support assembly may comprise a base. The wafer support assembly may also comprise a platen configured to mount to the base via one or more low-thermal-contact members, wherein the platen has a heat capacity larger than that of a wafer mounted thereon, such that, if pre-chilled to a predetermined temperature, the platen causes the wafer to stay within a range of the predetermined temperature during ion implantation.

Abstract: A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each of the heat dissipating fins is predetermined when assembling to constitute the structure. The heat dissipating fins are completed from a single stamping, and can be assembled to form heat dissipation areas of different spacing to accommodate a cool air flow being fanned from different oriented fans, thereby reducing obstruction and disturbance of the air flow and rapidly and smoothly guiding the air flow to other heat dissipating fins. Moreover, the heat dissipating structure enlarges area of heat circulation, thereby augmenting speed of heat diffusion, improving heat dissipation effect on heat emitting from computer electronic components, and enhancing functionality of the fan.

Abstract: The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.

Abstract: The invention relates to a component (20) for supporting a tubular filter member (15) in a portable channel (2) in a plate heat exchanger (1). The invention also relates to a device including the component (20) and the filter member (15). Furthermore, the invention relates to a plate heat exchanger (1), which includes a package of heat transfer plates (3) provided between a first plate (5) and a second plate (6). The filter member (15) has an inner surface and an outer surface. The component (20) includes a first part (21), which is arranged to be introduceable into the filter member (15) to abutment against the inner surface of the filter member, and a second part (22), which is arranged to abut a surface area of one of said first and second plates (5, 6), which surface area extends around the porthole channel (2).

Abstract: An electrical connection box includes a plurality of circuit components at least partially overlapped one above the other and substantially arranged in parallel. Each of the circuit components includes a substrate having a switching member and an electrical power conductive path; a supporting member that supports the circuit components; and a heat insulating member located between an upper circuit component and a lower circuit component. The heat insulating member is capable of regulating a heat transfer between the upper circuit component and the lower circuit component.

Abstract: A mounting apparatus includes a surface plate; a temperature control unit integrated with the surface plate; and a bottom plate integrated with the temperature control unit via a heat insulation ring, wherein a temperature of a target object held on the surface plate is capable of being controlled and the surface plate is formed of ceramic. The surface plate and the temperature control unit are coupled to each other by a first coupling member at each portion thereof except for each peripheral portion thereof such that the peripheral portion of the surface plate being not coupled thereto. The peripheral portion of the temperature control unit is coupled to the heat insulation ring by a second coupling member.

Abstract: A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.

Abstract: A case for covering electronic parts and efficiently discharging heat generated from the electronic parts and a display apparatus including the case are provided. The case includes at least one partition wall partially separating at least an inner space of the case. An entry portion, through which air flows in, and an exit portion, through which the air having flowed in through the entry portion and then having absorbed heat from the electronic parts flows out, are formed in each plane of the case. Each plane is separated by the partition wall.

Abstract: A heat sink and component support assembly that includes a core structure (110). The core structure (110) includes: a central member (112) having first (114, 116) and second opposing sides; at least one heat dissipating surface (124, 126, 128) extending from at least one of the first opposing sides (114, 116); and first and second extension members (118, 120) positioned adjacent to each of the second opposing sides. The assembly may also include an airflow facilitating arrangement, such as a fan (184), positioned adjacent to the core structure (110) for further enhanced heat dissipating capabilities.

Abstract: A heat transfer cover mitigates temperature changes of an object. A cover body is configured to receive the object. A plurality of heat transfer channels are defined in an interior of the cover body. The channels are arranged to transport a heat transfer fluid in thermal communication with the object. An inlet port is configured to connect the plurality of channels with a source of the heat transfer fluid. An interior surface of the cover body may substantially conform to a shape of an exterior of the object. A plurality of lands may be defined in the interior of the cover body. The lands are arranged to engage the exterior of the object. The heat transfer channels may be defined between adjacent lands. At least a first end of the cover body may define an opening. The at least first end and the object are substantially sealed at the opening.

Abstract: An apparatus for housing and cooling circuit card assemblies employed in communication and other systems is disclosed including a chassis having opposed end walls which are formed with a series of spaced inlet card guides and correspondingly spaced outlet card guides, respectively. A straight-pass heat exchanger is directly mounted to each circuit card assembly via thermally conductive material, and opposed ends of the heat exchanger are mounted by a wedge lock to respective inlet and outlet card guides. The heat exchanger employs unique angled interface geometry that creates a gasketless airtight joint with complimentary inlet and outlet card guide geometry through which cooling air passes.

Abstract: A device for cooling a computer, the device including a housing with a sidewall and a bottom forming an inner cavity, a horizontal board having a first end and a second end disclosed within the inner cavity, a motor connected to the horizontal board to rotate the horizontal board, a track disposed within the inner cavity with segments of the track at a higher elevation than other segments of the track, a first fan connected to a first end of the horizontal board displacing air vertically and nearly vertically connected to an end of the horizontal board and riding upon the track, a second fan fixed therethrough the sidewall to move air from outside of the housing to within the inner cavity, a third fan fixed therethrough the sidewall to move air from within the inner cavity to outside the housing; and a connection point to secure the computer to the device.

Abstract: An improved structure and method for mounting a fan, particularly a miniature fan (3), in a supporting wall (4), both facilitates a mounting operation and minimizes noise conduction after the mounting operation. An elastomeric overcoat (1) at least partially surrounds the fan (3) and is preferably integrally formed with a plurality of mushroom-shaped mounting elements (7) adapted to engage in a corresponding plurality of mounting holes (41) formed in the supporting wall (4). Each mounting element has a shaft portion (71) and a head portion (72) with an internal channel (74) starting in the shaft portion (71) and ending in the head portion (72).

Abstract: Systems and methods eliminate vibrations produced by coolant fluid flowing through a short stroke stage and prevent change in thermally-induced distortion of the short stroke stage by maintaining the temperature and temperature distribution within the short stroke stage constant regardless of actinic heat load incident on a reticle. This is done by: (1) conducting heat through the reticle and short stroke stage components, (2) radiatively transferring heat from the short stroke stage to a long stroke stage, and (3) using convection and a cooling system to dissipate heat from the long stroke stage. The short stroke stage can be magnetically levitated from the long stroke stage. This way there is no physical contact, but the long stroke stage's movements can still control the short stroke stage's movements. By not physically contacting the long stroke stage, the short stroke stage is not affected by vibrations in the long stroke stage caused by the flowing coolant.

Abstract: A heat dissipating device includes a fastening structure and a heat sink. The heat sink has a thermal conductive base which has a top surface and two T-shape slots formed at two opposing ends of the top surface. The fastening structure has a pair of brackets. Each of the brackets has a planar plate and a T-shape arm to be inserted into the corresponding T-shape slot. The T-shape arms are hinged with one end of the planar plates, such that when the T-shape arms are inserted into the T-shape slots, the planar plates extend horizontally at a level lower than the top surface of the base. Each of the planar plates has a through hole through which the fastening structure can be mounted to a board by a fastener.

Abstract: A computer system and a method for cooling the system incorporate removable modules within a housing. The housing includes a parallelepiped structure with at least four walls. The four walls include at least two sets of opposing walls. Both walls of one set of opposing walls include opposing first and second openings substantially aligned with each other to allow passage of a cooling medium therethough. The module is receivable through a third opening in the parallelepiped structure and includes an electrical component region. The housing includes a first airflow path in-line with the third opening and a second airflow path between the first opening and the second opening. The first airflow path and the second airflow path are directed across the component region of the module when the module is received within the housing.

Abstract: Methods and apparatuses are provided for cooling semiconductor substrates prior to handling. In one embodiment, a substrate and support structure combination is lifted after high temperature processing to a cold wall of a thermal processing chamber, which acts as a heat sink. Conductive heat transfer across a small gap from the substrate to the heat sink speeds wafer cooling prior to handling the wafer (e.g., with a robot). In another embodiment, a separate plate is kept cool within a pocket during processing, and is moved close to the substrate and support after processing. In yet another embodiment, a cooling station between a processing chamber and a storage cassette includes two movable cold plates, which are movable to positions closely spaced on either side of the wafer.

Abstract: A heat sink assembly includes a fan (10), a heat sink (20) and a mounting device (50). The heat sink includes a base (22) and plural of fins (24) extending upwardly from the base. Plural of claws (26) are formed in a top end of one fin which extends from a side of the base. A locking hole (30) is defined in another fin which extends from an opposite side of the base. A vent (52) is defined in the center of the mounting device, and four fixing holes (54) are defined in four comers of the mounting device for engaging with four screws (14) which extend through the fan to the mounting device. Plural of pivots (56) are provided in a first side of the mounting device for pivotably received in the claws of the heat sink thereby pivotably attaching the mounting device to the heat sink. A hook (62) is provided in an opposite side of the mounting device for engaging with the locking hole of the heat sink thereby fixing the mounting device to the heat sink.

Abstract: A chuck body mounts a substrate within a vacuum chamber. Contiguous portions of the substrate and the chuck body form a heat-transfer interface. An intermediate sealing structure seals the chuck body to the substrate independently of any contact between the chuck body and the substrate and forms a separately pressurizable region within the vacuum chamber. A control system promotes flows of fluid through a periphery of the heat-transfer interface within the separately pressurizable region for controlling fluid pressures and related transfers of heat at the heat-transfer interface according to an overall aim of regulating the substrate temperature.

Abstract: A novel particle beam target comprising: a rotating target disc mounted on a retainer and thermally coupled to a first array of spaced-apart parallel plate fins that extend radially inwardly from the retainer and mesh without physical contact with a second array of spaced-apart parallel plate fins that extend radially outwardly from and are thermally coupled to a cooling mechanism capable of removing heat from said second array of spaced-apart fins and located within the first array of spaced-apart parallel fins. Radiant thermal exchange between the two arrays of parallel plate fins provides removal of heat from the rotating disc. A method of cooling the rotating target is also described.

Abstract: A temperature control apparatus where it is easy to replace a heat exchange unit to enhance the maintainability and the space efficiency and which can absorb the thermal expansion/shrinkage of a heat exchanger is provided. The temperature control apparatus has a heat exchanger 11 with a passage 31 for passing a fluid; a connecting pipe 21 connected to the passage of the heat exchanger; a passage block 16 with a passage for passing the fluid to the heat exchanger; a relay block 15 for forming a passage between the passage of the passage block and the connecting pipe; and sealing means 14 for connecting the connecting pipe movably to the passage of the relay block. In the temperature control apparatus, the length of the connecting pipe 21 is made substantially equal to or slightly shorter than the spacing between the heat exchanger 11 and the passage block 16.

Abstract: A docking station is provided with apertures that line up with apertures in a notebook. When the notebook is docked on the docking station, air is forced out of the notebook through the openings of the docking station and the notebook.

Abstract: Some embodiments of the invention include two heat exchange members, which are arranged facing each other with a semiconductor module therebetween, the semiconductor module including a plurality of packages; a connection member formed in the middle of each of the heat exchange members to hinge join the heat exchange members such that portions of the heat exchange members protrude above the semiconductor module inserted between the heat exchange members; and an elastic member disposed between the heat exchange members to provide a force pushing portions of the heat exchange members below the connection member toward the packages of the semiconductor module. Other embodiments of the invention are described in the claims.

Abstract: Device to produce ice-cream wherein there is an outer container (11), a cover (26), an inner container (14), a mixing blade (20), and an evaporator coil (21) located in cooperation with the bottom (17) of the inner container (14), through at least a contact surface (27). The inner container (14) is axially mobile to assume at least an axial working position correlated to the position of the cover (26) when it is installed on the outer container (11), and is pressed elastically against the evaporator coil (21) by spring means (22) located under the evaporator coil (21).

Abstract: The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Abstract: A system for and method of controlling the temperature of a flat workpiece such as a semiconductor wafer are disclosed. The workpiece is mounted on a workpiece chuck which is mounted over a base between the chuck and a host machine such as a wafer prober used to test integrated circuits on a wafer. The chuck includes an upper portion on which the workpiece is mounted. The temperature of the upper portion of the chuck is controlled to control the temperature of the workpiece. The temperature of the base is controlled to reduce the amount of heat flow between the chuck and the host machine. A power and control system includes a switching power supply which provides power to system components including heaters in the chuck used to heat the workpiece. A series of filters removes electrical noise generated by the switching power supply such that low-noise operation is realized.

Abstract: Structure and methods are disclosed for transferring thermal energy from an object to a thermal spreader. A plurality of pins are biased against the object so that the plurality of pins contact with, and substantially conform to, a macroscopic surface of the object. Thermal energy is communicated from the object through the pins and through a plurality of air gaps between the pins and the thermal spreader. The pins are retained to the passageways of the thermal spreader so that the pins are retained with the thermal spreader when unbiased against the object.

Abstract: A temperature adjusting system includes a chamber, a cooler which cools an inert gas to be supplied to the chamber, a circulating path which circulates the inert gas through the chamber and the cooler, a shut-off valve arranged in the circulating path between the chamber and an outlet port of the cooler, and a shut-off valve arranged in the circulating path between the chamber and an inlet port of the cooler.

Abstract: This gas supply apparatus supplies a gas by vaporizing a liquefied gas filled in a gas container. This apparatus includes an installation stand having an upper surface on which the gas container is placed; at least one nozzle which discharges a beating medium towards a bottom surface of the gas container and is provided in a hole formed in the installation stand; and a heating medium discharge path which discharges the heating medium from a space between the bottom surface of the gas container and the upper surface of the installation stand.

Abstract: A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

Abstract: A heat sink element coupling structure comprised of a “+” or a “+”-shaped horizontal offset disposed on the upper and lower or left and right two sides or a certain position on the lateral edge at the center portion of an L-shaped or a horizontally oriented U-shaped heat sink unit (element) plate. The structure includes inverted U-shaped or U-shaped appendages situated at the anterior section of the horizontal offsets as well as one or two wing-shaped lock tabs formed at the two sides or either the left or the right side of the inverted U-shaped or U-shaped appendages. Also included in the structure are one or two cutaways at the two sides or either the left or the right side of the horizontal offsets and a downward or upward lock tab at the two sides or the either left or right of the anterior edge of the horizontal offsets.

Abstract: A CPU cooler based on a flow field of impinging jet array includes a cooling base having an array of recesses on a top surface. The cooling base is disposed on a CPU. An orifice plate of a size substantially similar to the cooling base has an array of orifices with each orifice corresponding to a recess of the array of recesses. The orifice plate is spaced above the cooling base by a separation distance. A fan is secured to the CPU, with the cooling base and orifice plate being secured between the fan and the CPU. The fan when activated provides a coolant flow that produces vortical flow structures with enhanced turbulence on each recess by impinging air jets onto the recesses through the orifices corresponding to the recesses, thereby dissipating heat generated fly the running CPU.

Abstract: A compact, inexpensive pipe freezer with defrost cycle for forming a frozen ice plug in a section of pipe to be repaired, and, after the repair operation has been completed, defrosting the pipe freezer's evaporator and freeze heads so that the pipe freezer can be removed from the frozen pipe without damaging the pipe freezer.

Abstract: A piezoelectric wafer clamping system for securing semiconductor wafers during the integrated circuit manufacturing processes. The piezoelectric wafer clamping system includes a plurality of piezoelectric stack assemblies designed for providing a real time adjustable vertical clamping force to a semiconductor wafer, an annular wafer clamp member coupled to each one of the plurality of piezoelectric stack assemblies and positionable to abut a top surface of a semiconductor wafer, a wafer support assembly designed for supporting the semiconductor wafer during processing, and a control assembly to monitor and compare actual cooling gas process parameters with preset process chamber parameters and electronically regulate a vertical clamping force applied by the plurality of the piezoelectric stack assemblies.

Abstract: The invention provides systems and methods for controlling resist baking processes, such as PEB of chemically amplified photoresists. A system of the invention provides a baking plate through which hot fluids and cold fluids may be alternately circulated. The system takes measurements relating to temperature of the baking plate, temperature of the resist, and/or extent of the baking process. Using this data, the system controls the baking temperature and/or the overall extent of the baking process through control over the flow of hot and cold fluids. By alternating between hot and cold fluid circulation, systems of the invention provide rapidly responsive temperature control and/or abrupt termination of baking. Control over the baking process is further increased by implementing flow and process control separately over each of a plurality of different portions of a baking plate.

Abstract: A removably mounted fan for an active heat sink, and the mounting of that combination to a part to be cooled, is obtained by: (1) The use a fan that engages and registers itself upon and against a top peripheral surface surrounding a cavity where the fan is to be located; (2) Holding the fan in place with one or more resilient mounting clips that span the distance from the top of the fan and an opposing outside bottom surface of the active heat sink; and, (3) Providing the resilient mounting clips with outward projecting mounting tabs that are flexible and resilient and that have mounting holes through which the resilient mounting clips (and the active heat sink they grip) can be attached to an assembly carrying the part to be cooled, such that the bottom of the active heat sink is in good thermal contact with that part.

Abstract: A fan duct assembly includes a base (1), a first plate (20), a second plate (30) pivotably connected to the first plate, a connection member (40) pivotably connected to the second plate, and a fan cover (70) connected with the connection member. The base is mounted over a heat sink, and includes a pair of side panels (3). Each side panel has a horizontal portion (7), a slant portion (9) and a vertical portion (11). The horizontal portions, slant portions and vertical portions define a pair of locking apertures (13), respectively. The connection member has a pair of latches (52). The latches can be selectively engaged in any one pair of the locking apertures and orientations of the plates can be varied. Accordingly, outside cooling air from the fan cover can be guided through the connection member to the heat sink from a variety of directions.

Abstract: A heat sink is constructed including at least one heat sink fin. Each fin includes an opening sized to fit a thermal device when the fins are heated to a temperature above that of the thermal device. When the fins cool to the temperature of the thermal device they shrink in size and form a tight compression fit around the thermal device.

Abstract: A flow field of impinging jet array based CPU cooler is provided. The cooler comprises a cooling base having an array of recess on a top surface, the cooling base being rested on CPU; a substantially similar sized orifice plate having an array of orifice each corresponding to recess, orifice plate being above cooling base by a separation distance; and a fan with cooling base and orifice plate enclosed therein and secured on the CPU. An activated fan provides coolant flow that produces the vortical flow structures with enhanced turbulence on each recess by impinging air jets onto the recesses through the orifices, thereby convecting the heat flux generated from the running CPU. Also, the orifices may be oblique other than vertical.

Abstract: The invention relates to a heat transmission unit for a motor vehicle, comprising a fan cowling (12) and at least one heat exchanger (14) connected thereto. In order to provide an improved heat transmission unit which can be especially produced in an economical manner an which enables easy connection to the heat exchanger to the fan cowling especially during pre-assembly of the cooling module, the heat exchanger (14) is maintained on the fan cowling (12) by means of its manifolds (18, 20).

Abstract: The present invention provides a cooldown chamber allowing more efficient and rapid cooling of a substrate. The substrate is cooled in the cooldown chamber utilizing a pair of cooling members, preferably mating “clam shell” style members, positioned adjacent the top and bottom surfaces of the substrate. While the top surface of the substrate should not be contacted directly, the upper cooling member can approach the substrate surface, preferably to within about 0.01 to about 0.03 inches. The bottom cooling member should also approach the bottom substrate surface, preferably making contact or being within about 0.01 to about 0.03 inches. With the cooling members closed to define an enclosure around a hot substrate, an inert gas is supplied into the enclosure at pressures between about 5 and about 30 torr to allow efficient thermal conduction from the substrate to the cooling members.

Abstract: A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.