Abstract: A server rack cooling arrangement may include a server rack enclosure defining a single undivided interior volume of space and configured to be sealable; two or more open-frame-server-units disposed within the interior volume of space and arranged in a multi-level arrangement, wherein heat-producing-electronic-components may be exposed to environmental conditions of the interior volume of space; a central condenser disposed towards a rear; a coolant reservoir for collecting condensate from the central condenser; at least one nozzle in fluid communication with the coolant reservoir and configured to deliver fine coolant droplets into the interior volume of space for impingement on the heat-producing-electronic-components; and a fan configured to generate an airflow through the two or more open-frame-server-units from a front to the rear in a manner so as to carry coolant vapour generated from impingement of the fine coolant droplets on the heat-producing-electronic-components to the central condenser.

Abstract: An alternating current neutral and ground inductive electromagnetic rectification unit includes a first and second reactor connectable to a neutral and a ground of an existing circuit respectively. The first redactor includes a first pair of inductive coils, each coil disposed interior to a nonconductive tube. The second redactor includes a second pair of inductive coils, each coil also disposed interior to a nonconductive tube. The first pair of inductive coils are connected together in parallel, and also connected at opposing extremes terminating the neutral. The second pair of inductive coils are also connected in parallel, at opposing extremes of the ground. The first and second redactors are surrounded by an insulating matrix set within the housing. Once connected to the ground and neutral, the first and second redactors establish a magnetic field that redacts harmonic interference emerging on the neutral thereby increasing efficiency and power factor across the circuit.

Abstract: The disclosure relates to an immersion cooling apparatus configured to accommodate and cool at least one heat source. The immersion cooling includes a tank, a coolant, and at least one condenser. The coolant is accommodated in the tank and configured to direct thermal contact the at least one heat source. At least part of the at least one condenser is immersed in the coolant.

Abstract: Devices are provided that include a device housing defining and a maximum dielectric cooling liquid level, and a dielectric cooling liquid outlet weir in the device housing from which dielectric cooling liquid exits the interior space. The cooling liquid outlet weir can set the level of the dielectric cooling liquid within the interior space and establish a volumetric rate of flow of the dielectric cooling liquid within the interior space that is needed for the cooling of heat-generating electronic components.

Abstract: Technologies for embedded and immersed vapor chambers in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more vapor chambers coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more vapor chambers; and a chassis housing the one or more cold plates, the one or more processors, and the one or more vapor chambers.

Abstract: Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

Abstract: An article is presented. The article includes one or more ceramic insulators having a plurality of recesses including a first portion having a first set of recesses of the plurality of recesses and a second portion having a second set of recesses of the plurality of recesses. At least a portion of a first conductor and at least a portion of a first cooling channel are overlappingly disposed in a recess of the first set of recesses. At least a portion of a second conductor and at least a portion of a second cooling channel are disposed in at least one recess of the second set of recesses wherein the at least a portion of the second cooling channel offsets from the at least a portion of the second conductor. A system including the article is also presented.

Abstract: A coil apparatus and methods for magnetic resonance imaging involving a wire winding, the wire winding having at least one of: a hollow cross-section wire and a solid cross-section wire, the solid cross-section wire having at least one of: a solid small cross-section wire and a solid large cross-section wire, the solid large cross-section wire having a thickness greater than that of the solid small cross-section wire, and the solid small cross-section wire disposed in one of adjacent and proximate at least one of the hollow cross-section wire and the solid large cross-section wire, whereby at least one of current density, winding density, and heat extraction are increasable.

Abstract: The invention provides a data storage device comprising a shell, a main circuit board, and an external connector. The shell comprises a plurality of vents. The main circuit board is placed in the shell, and covered by a fire protection material. The main circuit board is provided with a controller and a plurality of flash memory elements. The external connector is disposed outside the shell. When the data storage device is in a fire scene, the flash memory elements on the main circuit board can be avoided to be burned since the fire protection material covers the main circuit board. Further, the data storage device has a better heat dissipation and convection effect via the vents of the shell, such that the data storage device can cool down quickly, and thereby the integrity of data storage can ensured.

Abstract: A heat dissipation module including a heat dissipation portion, a working fluid, and a buffer member is provided. The heat dissipation portion has a containing portion, the working fluid is contained in the containing portion, and the buffer member is connected to the containing portion. When the working fluid is heated, the buffer member is expanded to maintain a constant pressure within the containing portion.

Abstract: An apparatus includes a heat sink configured to receive thermal energy from one or more heat sources. The heat sink includes a local reservoir configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.

Abstract: In one embodiment, a method includes delivering power and data on a cable from a central network device to a splitter device for splitting and transmitting the power and data to a plurality of remote communications devices over a plurality of cables, each of the cables carrying the power and data, receiving at the central network device, monitoring information from the remote communications devices on the cable, processing the monitoring information, and allocating the power and data to each of the remote communications devices based on the monitoring information. The power and data comprises pulsed power and optical data. A system is also disclosed herein.

Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.

Abstract: A liquid immersion cooling apparatus includes a first receptacle in which a refrigerant liquid is accommodated, configured to include a first tank having a first sidewall, a first lid configured to cover the first tank, and a first space provided between the refrigerant liquid and the first lid, a second receptacle in which a sealing material is accommodated, configured to include a second tank having a second sidewall facing the first sidewall, a second lid configured to cover the second tank, a second space provided between the sealing material and the second lid, and configured to communicate with the first space, and a third space provided between the sealing material and the second lid, partitioned from the second space, and configured to communicate with an outside, and a heat insulator provided between the first sidewall and the second sidewall.

Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Abstract: A transformer with integrated cooling is disclosed. The transformer comprises a primary winding and a secondary winding, and a coolant line partly or completely embedded in at least one of the primary or secondary windings. The coolant line is supplied with coolant from a supply device. The coolant line has a plurality of exit holes that are arranged to lead in a direction of at least one of the primary or secondary winding, so as to supply it with coolant.

Abstract: A data center immersion cooling system is described. The system comprises: an immersion tank; a heat exchanger to extract heat from heated coolant and transform heated coolant into cooled coolant; a coolant supply line to supply the cooled coolant from the heat exchanger to the immersion tank; and a coolant return line to return the heated coolant from the immersion tank to the heat exchanger, wherein the immersion tank further comprises: a plurality of equipment compartments that accommodate electronic devices; and a heated coolant reservoir disposed around the plurality of equipment compartments, wherein the cooled coolant enters the equipment compartments from the bottom, wherein the heated coolant in the equipment compartments exits the equipment compartments at the top, and is collected into the heated coolant reservoir, and wherein the heated coolant in the heated coolant reservoir is returned to the heat exchanger via the coolant return line.

Abstract: A heat exchanger for cooling a component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

Abstract: A battery system can include an evaporation chamber and condenser. One or more battery cells can be immersed in a fluid where the battery cells and the fluid are housed in the evaporation chamber. The condenser can be fluid connected to the evaporation chamber through one or more vapor channels and one or more liquid channels. When the battery cells charge and discharge, heat dissipated by the battery cells is absorbed by the fluid, causing the fluid to change from liquid to vapor. The vapor travels through the one or more vapor channels into the condenser where the vapor changes back to liquid and returns to the evaporation chamber through the one or more liquid channels. The thermal management solution is a self-sensing and self-regulating system.

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

Abstract: An air cooling system, method, apparatus and kit applied to lower transformer operating temperatures, such as governed by a tank or container of oil, allowing transformer components to run more efficiently at a lower temperature level, e.g., down from the hot level operating temperatures typical in stressed conventional devices. By lowering the operational levels to within or below the nominal operational temperature ranges for the equipment, and recovering heat generated during operation, several advantages are obtained.

Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.

Abstract: A appliance immersion tank system comprising: a generally rectangular tank adapted to immerse in a dielectric fluid a plurality of appliances, each in a respective appliance slot distributed vertically along, and extending transverse to, the long axis of the tank; a primary circulation facility adapted to circulate the dielectric fluid through the tank; a secondary fluid circulation facility adapted to extract heat from the dielectric fluid circulating in the primary circulation facility, and to dissipate to the environment the heat so extracted; and a control facility adapted to coordinate the operation of the primary and secondary fluid circulation facilities as a function of the temperature of the dielectric fluid in the tank. A plenum, positioned adjacent the bottom of the tank, is adapted to dispense the dielectric fluid substantially uniformly upwardly through each appliance slot.

Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.

Abstract: An electrical power conversion apparatus is provided which includes a semiconductor module and a plurality of cooling pipes. Each of the cooling pipes has an electrical conductivity and a cooling medium flow path formed therein. Each of the cooling pipes is equipped with a flow path extension forming portion which protrudes above a module body in at least one of height-wise directions and in which a portion of the cooling medium flow path is formed. The flow path extension forming portion overlaps at least either of the power terminals or the control terminals in a stacking direction of the cooling pipes. This enhances the efficiency in decreasing the inductance of the power terminals and/or the control terminals, improves the productivity of the electrical power conversion apparatus, and enables the size of the electrical power conversion apparatus to be reduced.

Abstract: The invention relates to an electrical conductor which is made up substantially of one or even several metal conductors which are sheathed by a graphene layer. Particularly in the case of the electrical conductor transporting an alternating current, the current in the conductor is forced radially outwards and therefore flows in the graphene layer. Since graphene has a substantially better conductivity than the materials customary in this application, such as copper for example, relatively low losses are accordingly produced and substantially higher degrees of efficiency can be achieved. The electrical conductor constructed in this way is used in a stator and/or rotor winding of an electrical machine, so that it has a significantly elevated power-to-weight ratio.

Abstract: Devices, systems, methods, and computer-implemented methods to facilitate transmitting microwave signals to one or more cryogenic stages of a cryogenic refrigerator are provided. According to an embodiment, a device can comprise a monolithic signal carrier device comprising a thermal barrier disposed within a ground layer and a signal layer. The device can further comprise a thermal decoupling device coupled at the thermal barrier to the ground layer and the signal layer.

Abstract: An inverter device includes a heat generator, a cooler, and a cooler-side housing that covers the cooler and includes an opening that exposes a side of the cooler closer to the heat generator, and a circumferential rib that comes into contact with the cooler is provided in a vicinity of a peripheral edge of the opening of the cooler-side housing.

Abstract: A temperature control device includes: a circulating cooling/heating unit cooling and heating a circulating fluid and circulating the circulating fluid relative to a chamber; a controller adjusting a temperature of the circulating fluid to adjust the temperature of the chamber to a temperature setpoint, and a housing for housing the circulating cooling/heating unit and the controller, the housing defining therein a circulation chamber in which the circulating cooling/heating unit is disposed and a control chamber in which the controller is disposed. These chambers are on the same level. A reservoir for storing the circulating fluid, a pump for circulating the circulating fluid, a heat exchanger for cooling the circulating fluid, and a heater for heating the circulating fluid are disposed in the circulation chamber. An inverter for controlling a drive of the pump and an SSR for switching ON/OFF of the heater are disposed in the control chamber.

Abstract: An MRI system for imaging a subject is provided. The MRI system includes a magnet assembly that includes a gradient coil having a hollow conducting wire. The hollow conducting wire includes a body defining a passageway, and one or more conductors disposed within the body around the passageway.

Abstract: The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity. The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.

Abstract: An electric motor includes a stator having an outer peripheral surface including a plurality of projections and a housing having an inner peripheral surface including a plurality of recesses and holding the stator in a state of respective fits of the projections with the recesses. The housing is internally formed with a cooling channel, which includes a plurality of main channels each formed in an inter-recess region defined between circumferentially adjacent recesses and a connection channel axially shifted from a recess and extending across the recess to connect main channels adjacent across the recess. The electric motor is capable of effectively cooling a stator without upsizing.

Abstract: A method of installing an electrically-heatable subsea flowline includes launching the flowline with at least one electric power cable attached in piggybacked relation. After landing the flowline with the piggybacked cable on the seabed, a free end portion of the, or each, cable having a length greater than the water depth is released from the flowline. This allows a free end of the, or each, cable to be recovered to the surface to be spliced to one or more power supply conductors. After lowering the, or each, cable and the, or each, connected conductor beneath the surface, the free end portion of at least one cable is reattached to the flowline on the seabed in piggybacked relation. To perform the method, a subsea flowline assembly includes subsea-releasable fastenings spaced along the cable and the flowline to attach at least an end portion of the cable releasably to the flowline.

Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.

Abstract: A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.

Abstract: A connector module including a connector and a heatsink is provided. The connector includes a shaft. The heatsink includes a groove recessed in a single direction. The heatsink is adapted to move along a direction opposite to the recessed direction of the groove to insert the shaft into the groove. The shaft is pivoted in the groove so that the heatsink is adapted to pivotally rotate relative to the connector.

Abstract: A power-electronics system includes a plurality of power modules each having a power stage and defining a side pocket. The power stages are stacked in an array such that the side pockets are interleaved with the power stages. A dummy module defines a first coolant pocket and is disposed within the array such that the first coolant pocket cooperates with one of the side pockets to define a coolant chamber.

Abstract: Systems and methods for a dry power supply for immersion-cooled Information Handling Systems (IHSs) are described. In some embodiments, an IHS may include: a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant, where the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS; and a power supply coupled to the chassis and configured to provide power to the one or more components via an adaptor configured to maintain the power supply above the surface of the dielectric liquid coolant during operation of the IHS, where the power supply comprises a fan configured to blow air.

Abstract: A sensor abnormality determining apparatus is applied to an inverter that includes: a power element; a cooling water circulation path for cooling the power element; a temperature sensor that detects a temperature of the power element; and a water temperature sensor that detects a temperature of the cooling water circulating in the cooling water circulation path. The sensor abnormality determining apparatus includes: an abnormality determining section and a determination temperature setting section. The abnormality determining section determines the temperature sensor is abnormal when a temperature difference between the detected power element temperature and the detected water temperature is larger than a prescribed determination temperature difference.

Abstract: A static apparatus is provided in which a partial discharge, if occurred in a winding end portion, is unlikely to lead to insulation breakdown. The windings and core of a static apparatus are housed in a tank filled with coolant. The winding is fixed by upper and lower parts supporting winding. A continuous coolant duct is formed in a section embracing the winding and the upper and lower parts supporting winding. A coolant duct from the wiring, extending through the upper or lower parts supporting winding and connected with the coolant space is configured in a structure in which toroidal ducts in multiple tiers are connected in a vertical direction of the winding. Connecting holes of one toroidal duct and of its next toroidal duct are staggered with respect to each other and spaced at intervals which are longer than the width of the toroidal ducts.

Abstract: There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.

Abstract: A reinforcement-free tank for an electromagnetic apparatus, as may be immersed in a fluid is provided. The tank may include a pair of mutually-opposite side walls. Each side wall may have at least one curved segment defining a vertically-curving profile between a top edge and a bottom edge of a side wall. A pair of mutually-opposite end walls. Each end wall may have a substantially vertically-extending semi-cylindrical shape defining a vertically-straight profile between a top edge and a bottom edge of an end wall. A plurality of vertically-extending joining members. Each joining member may be configured to provide a transition between the vertically-curving profile of a side wall and the vertically-straight profile of a corresponding end wall. The walls can withstand vacuum and overpressure conditions which can develop in the tank, without a reinforcing member connected to the walls.

Abstract: A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

Abstract: A layout method for a printed circuit board, comprising: defining a layout area on the printed circuit board; disposing at least one padstack on the layout area; disposing a welding material area on the padstack to partially cover the padstack and be located at one end of the padstack; disposing a blocking area on the layout area, wherein the blocking area comprises an opening to expose the padstack; and forming a wiring, wherein the wiring is connected with the padstack and the welding material area through the opening without overlapping the blocking area. The layout method for a printed circuit board and the printed circuit board may avoid that the outlet of the wiring is formed through the side of the welding material area to leave a blank area on the padstack.

Abstract: Power conversion sub-blocks are combined to be configured as a power conversion block. The power conversion sub-blocks include power conversion modules including cooler base sections on which semiconductor elements are mounted and cooler fin sections provided on the rear surface side of semiconductor element mounting surfaces in the cooler base sections and cooler attachment members to which cooler fin sections are attached back to back, the cooler attachment members being configured to be capable of separating an opened section where the cooler fin sections are present and external air circulates and a closed section where the semiconductor elements are present and circulating cooling air to the cooler fin sections.

Abstract: An encapsulated switchgear that includes a housing defining, an insulating space, and an electrical active part arranged in the insulating space, the insulating space with an insulation medium. The switchgear is characterized in that the insulation medium with a dielectric compound having a boiling point of above ?5° C.

Abstract: Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within the electronics enclosure. Each fluid transport structure includes multiple pipes and multiple flow channels. The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. The fluid transport structure(s) and the electronics enclosure are formed from different materials. The at least one fluid transport structure can be resistant to corrosion caused by the cooling fluid, and the electronics enclosure can be susceptible to corrosion caused by the cooling fluid.

Abstract: An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.