Abstract: A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.

Abstract: A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.

Abstract: An apparatus and method for cooling electronics is disclosed. An encapsulated inert non-conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate to an external heatsink. The top of a flip chip die (e.g. a ceramic column grid array flip chip) may be enclosed with a metallic cover. The metallic cover is sealed to an outer frame, which in turn is sealed to metallization on the top of the flip chip through a flexure, minimizing mechanical load imparted to the flip chip. This forms a hermetic cavity enclosing the die. This hermetic cavity is partially filled with an inert non conductive fluid, which vaporizes when heated. Condensation occurs on the inner surface of the metal cover where the heat may be conducted into the outer frame for removal (e.g. rejection from the spacecraft).

Abstract: An exemplary isolating tube, and production method thereof, includes a mechanically load-bearing plastic tube composed of a fiber-reinforced polymer for use in a cooling element which can be loaded with high voltage, during whose operation the isolating tube forms an electrical isolation gap and in the tube interior carries an agent which flows as a liquid and/or vapor. The isolating tube can have a diffusion barrier which is held coaxially by the plastic tube. Such an isolating tube can be produced using an exemplary novel method for production.

Abstract: A heat-dissipating module includes a heat pipe and a heat-dissipating device. The heat pipe has a first end, a second end and a partition pipe section. The first end is connected to a first heat-generating component. The second end is connected to a second heat-generating component. The diameter of the partition pipe section is different from the diameter of the first end. The heat-dissipating device is disposed on the heat pipe and is located between the first end and the second end. The heat-dissipating device includes a first heat-dissipating part and a second heat-dissipating part. The first heat-dissipating part is located between the first end and the partition pipe section for dissipating heat generated by the first heat-generating component. The second heat-dissipating part is located between the second end and the partition pipe section for dissipating heat generated by the second heat-generating component.

Abstract: An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.

Abstract: A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

Abstract: Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an inlet port and a cavity. The cavity can be positioned intermediate a heat source and an opposing surface spaced apart from the heat source. The inlet port can receive a liquid (such as a coolant or cooling fluid) and direct the liquid to the cavity. The cavity can be configured to control the thickness of the liquid within the cavity. Liquid within the cavity can be heated by the heat source, and the opposing surface can comprise openings to allow evaporated liquid to exit the openings. A gas flow proximate the opposing surface can be used to carry vapor and be used to enhance liquid evaporation. Movement of the evaporated liquid enables heat from the heat source to be removed. The opposing surface can be a perforated membrane having micro-sized and nano-sized perforations.

Abstract: One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

Abstract: A computer module includes a housing having a cover defining a condenser chamber, and a heat-absorbing unit having at least one cavity body adapted to contact a heat source, and a working fluid received in the cavity body. A tubing unit is connected fluidly to the condenser chamber and the heat-absorbing unit. The working fluid flows through the tubing unit to circulate from the condenser chamber to the heat-absorbing unit by gravity and from the heat-absorbing unit to the condenser chamber by natural convection. The tubing unit forms a closed circulating loop with the heat-absorbing unit and the condenser chamber. The cover is adapted to exchange heat with external cold air so as to condense the working fluid in the condenser chamber.

Abstract: A fixing frame is used to fix at least one heat sink fan on a case of an electronic device. The fixing frame includes a cradle and at least one fastener. The cradle has two oppositely disposed plates, and the two plates respectively have a combining portion and a latching portion, such that at least one accommodation region is partitioned from the cradle for accommodating the fan, and the latching portion and the combining portion are combined with each other to form a clamping region. The fastener is disposed on the case and clamped in the clamping region, such that the cradle is fixed on the case.

Abstract: An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling unit which is disposed in close proximity with the electronic device so as to face a surface thereof; and a controller which drives at least one of the primary cooling unit and the auxiliary cooling unit so as to cool the electronic device.

Abstract: This invention provides a structure for holding cards having electronic and/or micromachined components. A chassis comprises a plurality of bays for receiving cards such that the cards are oriented parallel to one another. Each bay comprises a fin front-plate fabricated from thermally-conductive material(s). Each fin front-plate is coupled to or integrally formed with a base in a manner which permits thermal conductivity therebetween. For each bay holding a card, a backplane comprises an electrical connector for coupling to the card. When held in their respective bays, cards are thermally coupled to the fin front-plates. The base of the chassis preferably comprises an ingress port, an egress port and a network of conduits for conducting fluid which cools and/or redistributes heat created by the cards and their components. The network of conduits may extend from the base and into the fin front-plates.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a direct-exposure heat transfer system are presented. In addition, several embodiments of a multi-processor heat transfer systems are presented. Lastly, several embodiments of heat transfer systems deployed in circuit boards are shown. Each of the heat transfer systems is in liquid communication with a heat exchange system that receives heated liquid from the heat transfer system and returns cooled liquid to the heat transfer system.

Abstract: Embodiments of the present disclosure include devices, systems, and methods. For example, one device embodiment of a thermally conductive shelf for operation with a conduction-cooled electronic module includes an expandable member defining a fluid passage between a first end and a second end, where the expandable member includes a first outer surface to contact a first conduction-cooled electronic module, an inlet located at a first end to receive a conductive fluid, and an outlet located at the second end to exhaust the conductive fluid.

Abstract: A method of cooling a module attached to a board by a spring mechanism that provides access to the module during testing. A cold plate assembly features a dry thermal interface coupled with spring loaded plunger to ensure a module, such as a dual chip module (DCM), for example, remains in place during individual cold plate removal.

Abstract: The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.

Abstract: The invention relates to a cooling system for an electronic box capable of releasing heat. It comprises a passive cooling device able to be connected to the electronic box and an element consisting of a heat-conducting material, and this element comprises at least one contact region connected to the passive cooling device, this contact region being arranged on the element so as to dissipate the heat coming from the cooling device toward the whole of the element.

Abstract: A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate and one or more thermally conductive discs attached to the primary plate. The one or more thermally conductive discs make intimate contact with the one or more ICs mounted to the printed circuit board such that the heat generated by the one or more ICs in operation transfers through the one or more discs and onto the plate, whereupon the heat laterally distributes across the primary plate and dissipates into the environment.

Abstract: The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator.

Abstract: A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated within the cavity such that a lower portion of the spring protrudes outwardly a predetermined distance from the lower surface of the casing. A heatsink is positioned below a heat generating component such that the spring of the retaining device forces the heat generating component against the heatsink.

Abstract: A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

Abstract: A heat spreading member is received on a predetermined surface of an electronic component. The heat spreading member extends larger than the predetermined surface. A contact piece is contacted with the heat spreading member over a contact area smaller than the predetermined surface. The contact piece serves to realize concentration of an urging force applied to the heat spreading member. The heat spreading member is thus reliably urged against the electronic component. The concentration of the urging force serves to prevent the heat spreading member and the electronic component from camber even if heat is applied to the heat spreading member and the electronic component. Separation is thus avoided between the heat spreading member and the electronic component. The heat spreading member reliably keeps contacting with the electronic component, so that the electronic component package is allowed to enjoy improvement in heat radiation.

Abstract: A cooling device having a heat receiving portion, a heat radiating portion, a heat pipe, and a fan. The heat receiving portion is held on a wiring board and thermally connected to a heat-generating component. The heat radiating portion radiates the heat generated by the heat-generating component, at a position remote from the heat receiving portion. The heat pipe transfers the heat generated by the heat-generating component, from the heat receiving portion to the heat radiating portion. The heat pipe couples the heat receiving portion and the heat radiating portion. The fan applies cooling air to the heat radiating portion. The fan is coupled to the heat radiating portion.

Abstract: A circuit board assembly comprises a circuit board having a connector or contact pad, and a housing. The housing includes a casing having an open end, an end cover sealing the open end of the casing and having a conductor, a coolant inlet for introducing a coolant into the housing, a coolant outlet for discharging the coolant from the housing, an inside connector connected to an inside surface of the conductor of the end cover, and an outside connector connected to an outside surface of conductor. The conductor of the end cover extends from an inside surface of the end cover to an outside surface of the end cover.

Abstract: A plurality of channels are formed in a base, e.g., a substrate of an integrated circuit, each channel extending between edges of the base. Two pairs of manifolds are provided, the first pair communicating with a first group of channels and the second pair communicating with a second group of channels, the first group of channels and the first pair of plena isolated from the second group of channels and the second pair of plena. Each of the pairs of manifolds includes multiple branches coupled to the channels and a common plenum. Cooling fluid is injected into the channels from different sides of the base, causing fluid to flow in different directions in the two groups of channels, the channels in thermal contact with the integrated circuit.

Abstract: A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

Abstract: A phase-separated evaporator includes a boiler plate and a phase separation chamber that includes a housing, connected to the boiler plate, having a gas port and a liquid port; and a phase partitioner connected to interiors of the housing, dividing the phase-separated evaporator into a vapor directing compartment and a condensate directing compartment. The phase partitioner includes a partition panel and multiple feeding injectors extending from the partition panel, with the injector tips disposed immediately above the boiler plate. The returning condensate from a condenser enters from the liquid port into the condensate directing compartment and feeds onto the boiler plate through the feeding injectors; while the vapor generated in the vapor directing compartment exits from the gas port, without encountering the condensate.

Abstract: A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal transmission member, which transmits electrical signals between a chassis member supporting a panel displaying image and including at least one device and a circuit unit separated from the chassis member to drive the panel. The thermal conductive supporter includes: a base portion formed of a thermal conductive material, and having a side surface contacting the chassis member and another side surface contacting the signal transmission member; and a recess portion oriented on the base portion toward the chassis member so that the at least one device does not contact the base portion.

Abstract: A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the first cover and the second cover are formed with a receiving portion corresponding to each other, respectively. The receiving portions are adapted to be connected to the conduit connectors. A channel portion is formed between the first cover and the second cover for receiving one end of the heat pipe. With the above arrangement, the present invention can perform the heat dissipations of different heat-generating elements simultaneously to make the heat-generating elements operate under acceptable working temperatures. Further, the present invention can be widely used in the heat dissipation of compact electronic products.

Abstract: A system and method of thermal management of electrical and electronic systems and components that adequately maintains the temperatures of the system electronics and electrical devices within reliable limits during various postulated system malfunctions. The system and method use a phase change material (PCM). In at least some embodiments, the PCM is disposed such that, if a flow of coolant ceases when primary and backup control circuits are energized, primary control circuit temperature will exceed a predetermined temperature within a first time period after the flow of coolant ceases, and backup control circuit temperature will exceed the predetermined temperature a second time period, which is greater than the first time period, after the flow of coolant ceases.

Abstract: A fluidic cooling assembly for removing heat from electrical equipment includes operational diversity features in which multiple fluid moving devices are mounted in a single housing. The assembly may include a first fluid baffle and a second fluid baffle disposed within the housing so as to define a first and a second control compartment. A first fan and a second fan may be disposed within the first control compartment and the second control compartment, respectively. A first sensor and a second sensor may be configured to sense changes in operation of the first fluid moving device and the second fluid moving device, respectively; and a controller unit configured for receiving signals generated by the first sensor and the second sensor go as to the transmit control signals to the first fan and the second fan.

Abstract: According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle. The impeller inlet velocity angle may be based on an operational speed of the plurality of blades and an angle of the plurality of blades with respect to a center of the impeller.

Abstract: A heat sink uses a pump assembly to generate a magnetic field. A direction of electrically and thermally conductive liquid flowing through the pump assembly is dependent on an orientation of the magnetic field and the direction of electrical current induced across flowing fluid in the magnetic field. In such a manner, cool liquid may be directed toward a heat source and warmer liquid may be directed to flow away from the heat source, where heat transfer occurs between the liquid and the heat sink. Additional pump assemblies that generate separate magnetic fields may be used to increase fluid flow volume, thereby increasing heat transfer away from the heat source.

Abstract: A device which is used to cool the power electronics of a vehicle, by circulating a liquid through a cooling circuit which is mounted under a plate bearing the power electronics. According to the invention, the cooling circuit can include deflectors and/or turbulators in order to increase the exchange coefficient between the cooling circuit and the cooling liquid. The invention also relates to a method of producing the device.

Abstract: Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one or more flow-regulation features having a first and second manifold to provide and regulate at least a portion of a first fluid flow to the plurality of first channels and to drain at least the portion of the first fluid flow from the plurality of first channels. Other embodiments may be described and claimed.

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A cryogenically-cooled HTS cable is configured to be included within a utility power grid having a maximum fault current that would occur in the absence of the cryogenically-cooled HTS cable. The cryogenically-cooled HTS cable includes a continuous liquid cryogen coolant path for circulating a liquid cryogen. A continuously flexible arrangement of HTS wires has an impedance characteristic that attenuates the maximum fault current by at least 10%. The continuously flexible arrangement of HTS wires is configured to allow the cryogenically-cooled HTS cable to operate, during the occurrence of a maximum fault condition, with a maximum temperature rise within the HTS wires that is low enough to prevent the formation of gas bubbles within the liquid cryogen.

Abstract: A rack system is disclosed that includes a plurality of electrical modules (48), a frame (10) supporting the plurality of electrical modules (48) that includes a plurality of frame members (16, 18, 20, 22, 26, 38, 39, 40) and a plurality of locations (52) for supportably receiving one of the plurality of electrical modules (48), a first frame member (16) of the plurality of frame members including a first bore (68) for transporting a liquid along a length of the first frame member (16) and having a plurality of openings extending through the first frame member (16) between a sidewall of the bore (68) and an exterior surface of the frame member (68), and a plurality of first connectors (64) mounted in the plurality of openings, wherein one of the plurality of electrical modules (48) includes a cooling liquid pathway (84) and at least one second connector (86) providing access to the cooling liquid pathway (84) detachably engaging the first connector (64) to provide fluid communication between the first bore (6

Abstract: A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

Abstract: A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.

Abstract: A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main dissipater through heat pipe, hereby effectively solving the heat dissipation problem of the interface cards, so that the main-machine-board will not be bent and deformed due to the overweight caused by the interface cards.

Abstract: The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an internal width and is coupled with the conduit. The flexible channel is comprised of a resilient material having spring-like characteristics. In one embodiment, this material provides a spring-like restoring force when compressed. The cooling device also includes an interconnect mechanism between the conduit and the flexible channel to allow a gas or a fluid introduced within the conduit to move between the conduit and the flexible channel.

Abstract: An assembly structure provided for securing a heat-dissipating fan, includes a casing board and a fan covering for covering the fan, The casing board has ventilation openings, coupling openings and positioning openings, and the fan covering formed with coupling portions and positioning portions secures the fan to a side of the casing board, wherein the coupling portions are coupled to the coupling openings, and the positioning portions are positioned and coupled to the positioning openings, so that the fan is installed at a location allowing wind or airflow to pass through the ventilation openings. Arrangement as such, without using tools during assembling or dissembling processes, allows two heat-dissipating fans to be correspondingly coupled at both sides of the casing board, so as to increase wind force to increase heat dissipation in a simple but convenient way.

Abstract: A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes four pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.

Abstract: An integrated liquid cooling system for removing heat from a heat-generating component includes a base (10), a pump (20) mounted in the base and a heat-dissipating member (30) communicating with the pump and coupling with the base. The pump includes a casing (21) having a chamber (212). A rotor (22), a partition seat (23) and a stator (24) are in turn received in the chamber. A top cover (25) is attached on the casing. The casing includes a bottom plate (214) having a bottom surface. The bottom surface of the bottom plate contacts the heat-generating electronic component for absorbing heat generated by the electronic component.

Abstract: A cryostat cooled by a pulse tube refrigerator and containing electrically powered equipment, wherein an electrical conductor is provided to the electrically powered equipment, said electrical conductor being in thermal and mechanical contact with one or more of the tubes of the pulse tube refrigerator.

Abstract: A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and the contacts themselves.

Abstract: One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

Abstract: An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.