Abstract: A heat sink protecting retention module is described. The heat sink protecting retention module has a main frame, protective feet, hooks, and a positioning mechanism. The protective feet are disposed under the main frame to keep screws therein before the heat sink protecting retention module is installed on the motherboard so as to avoid scratching the motherboard or damaging electric components thereon. The hooks are disposed on the main frame for clamping the heat sink and the positioning mechanism are disposed around and under the main frame for aligning the heat sink protecting retention module to a central processing unit socket.

Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.

Abstract: An electronic equipment includes: a circuit board on which an electronic part is mounted to a mounting surface thereof; a heat radiating member mounted on the mounting surface of the circuit board and disposed in abutment with the electronic part to radiate heat generated by the electronic part; a fan mounted on the mounting surface of the circuit board; a housing in which the circuit board, the heat radiating member and the fan are installed; a first fixing member that fixes the heat radiating member onto the circuit board; and a second fixing member that fixes the heat radiating member to the housing.

Abstract: A retaining device holds a PCB to a heat sink that has channels for receiving the retaining device. The retaining device includes a body having portions configured for receipt into the channels of the heat sink and moveable tabs and protuberances protruding away from a first surface of each moveable tab. A method for holding the PCB to the heat sink is disclosed. A lighting assembly that includes the retaining device is also disclosed.

Abstract: A cooler for cooling of electronic components comprises at least two heatsinks thermally connected with each other by heat spreading means, and a double inlet centrifugal blower comprises a casing with two inlets and an outlet, a radial impeller with an axle and an electric drive. The cooler thermally connected with the electronic component. Each of the heatsinks comprises inflow and outflow openings, and thermally connected heat exchanging means and a base. The impeller comprises radial blades located from both sides of an impeller disk. The double inlet centrifugal blower is located between the heatsinks thus each of the outflow openings is coincided with the closest inlet, so cooling air flows through the inflow openings, the heat exchanging means, the outflow openings and the inlets of the blower in a series way.

Abstract: A mounting device (10) for mounting a heat sink (20) to a circuit board (40), includes a locking member (16) extending through the heat sink and including a through hole (162) and barbs (172) formed in one end portion thereof for engaging with the circuit board, an operation member (12) including a cylinder (122) and a rod (128) extending from the cylinder into the through hole of the locking member. First and second bumps (178, 179) are formed in the locking member, and a pair of slots (126) is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring (14) is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.

Abstract: One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first interface attached to the core cooling module is configured to thermally couple the core cooling module to the supplemental cooling module. The core cooling module and the supplemental cooling module may be used alone or in combination to dissipate heat from the heat-generating electronic device.

Abstract: A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

Abstract: A system of mounting a heat sink to a processor in a console is provided. The processor is mounted on a first side of a PCB and the heat sink is mounted to the first side of the PCB so as to be in contact with the processor. A plurality of studs are mounted to the heat sink and extend through passageways in the PCB. A spring element is mounted to the studs on the second side of the PCB. A thrust plate is mounted to the spring element so that the spring element can press the thrust plate against the second side of the PCB. The spring element thus provides a force that aids in ensuring the heat sink and the processor are in tight contact. The studs can be attached to a housing via fasteners so the housing supports the heat sink rather than the PCB.

Abstract: A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

Abstract: Apparatus and methods for secure attachment of a heat sink to its respective retention clip as well as attachment to an electronic device are presented. One embodiment of a retention clip retention apparatus consists of a protruding hip depending from a side of a heat sink protrusion adapted to capture the retention clip between the hip and the heat sink body. One embodiment of a method for forming the hip consists of using a tool to deform the heat sink protrusion. One embodiment of heat sink lateral retention apparatus consists of one or more split bobbins adapted to attach to the retention clip to prevent lateral motion of the heat sink with respect to the clip.

Abstract: A power converter with a fan assembly cools down a temperature of the power converter. The power converter with a fan assembly includes a housing, a plate, and a second plate. The housing includes a fan assembly (which is integral to the housing) to draw in air. The plate is coupled to the housing to create an air channel between the plate and the housing and the second plated is coupled to the housing to create a second air channel between the second plate and the housing. The fan assembly draws in air through one of the air channel or the second air channel and moves air out through the other of the air channel and the second air channel to cool down the temperature of the power adapter.

Abstract: An integrated heatsink and core power distribution mechanism. First and second power rails are disposed on opposite sides of one of more integrated circuits on a printed circuit board (PCB). The power rails are electrically coupled to a power supply and the integrated circuits. At the same time, the power rails are used to thermally couple one or more heatsinks to the integrated circuit(s). Each power rails includes at least one slot configured to receive a flange on the heatsink(s). In situations under which different voltages are supplied via the power rails, means are provided to electrically insulate at least one power rail from the heatsink(s) while maintaining thermal coupling to the power rails. In one embodiment, a split-rail configuration is used, wherein the power rail includes multiple conductive sections separated by one or more insulator sections. The scheme is well-suited for modular board/blade architectures, such as the Advanced Telecommunications Architecture (ATCA).

Abstract: A heat dissipation device assembly includes a heat sink (20) placed on an electronic component (52) which is mounted on a printed circuit board (PCB) (50) and including a pair of shoulders (23) on opposite sides thereof, a pressing part (30) including a pair of pressing portions (36) supported on the shoulders and a pair of locking portions (34) spaced from the shoulders, a sliding part (40) slidably attached to the pressing part and including a pair of locking portions (41) spaced from the shoulder, and a back plate (60) mounted below the PCB and including four posts (61) extending through the PCB and the heat sink to resilently engage with the locking portions. Each locking portion defines a locking opening (33, 43) including an entrance (33a, 43a) and a locking slot (33b, 43b), the post being capable of extending through the entrance to engage in the locking slot.

Abstract: An apparatus in one example comprises a plurality of levers that convert a lesser input force to a greater output force for support of a heatsink component coupled with an electronic component.

Abstract: A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and connection protrude electrodes. The radiation protrude electrodes are formed on the back surface of the substrate in a chip area where said semiconductor chip is located. Each of the radiation protrude electrodes are formed with a first pitch so that the radiation protrude electrodes make one body joining layer when the package structure is subjected to a heat treatment. The connection protrude electrodes are formed on the back surface of the substrate in a peripheral area of the chip area. Each of the connection protrude electrodes formed with a second pitch which is larger than the first pitch so that the connection protrude electrodes stay individual when the package structure is subjected to a heat treatment.

Abstract: An electronic control device enabling heat generated by a power module to be favorably radiated even in a high-temperature condition in an engine compartment. The unit includes a casing accommodating a control circuit substrate; a die-cast mounting plate forming a control circuit substrate support portion, a frame-like fitting member and an external mounting portion integrally together; and a metal substrate on which a power module is adhered. When the mounting plate is mounted on the wall of a transmission and the metal substrate is fitted in the opening in the bottom surface of the frame-like fitting member, a mounting surface in nearly the same plane is formed by the lower surface of the mounting plate and by the lower surface of the metal substrate permitting heat from the power module to be radiated to the wall.

Abstract: A mother board includes a CPU, a suction fan mounted on the CPU for dissipating heat resulting from operation of the CPU, a north bridge chip disposed downstream to the suction fan, a power-consumption component disposed at one side of the CPU, and a ventilation-enhancing member disposed above the chip and capable of diverting an air flow of the suction fan toward the power-consumption component.

Abstract: An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.

Abstract: An apparatus and method for reducing dust on components in a computer system is disclosed. Embodiments include a system that generally includes an enclosure, a component mounted with the enclosure, and a fan adapted to induce an airflow towards the component to provide cooling. The system also generally includes a dust ionizer adapted to provide an electrical charge to dust particles within the airflow and a dust reflector having an electrical charge adapted to deflect the charge dust particles away from the component. In some embodiments, the component may be a processor, heat sink, video chip, memory module, voltage regulator module, etc.

Abstract: A heat dissipating device for taking away heat from a plurality of heat sources is disclosed. It includes a plurality of heat sinks installed on heat sources and a heat conductor connected to the heat sinks. When a temperature difference is generated among the heat sources in work, the heat conductor can pass the heat from a hot heat sink to cooler ones. This enables heat transfers among the heat sinks to increase the heat dissipating efficiency.

Abstract: A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one or more heat generating components within the housing. A compliant thermally conductive material may then be placed between the heat generating components and the plate to facilitate conductive heat transfer from the component to the plate. From the plate, heat is transferred to the external environment through radiation and convection of air through perforations in the housing which cover a substantial portion of the surface area of the housing. The housing may also be inexpensively manufactured through stamping and may include two mating pieces which interlock using chamfered electrostatic discharge fingers. The housing may also incorporate a metal shroud for enveloping certain ESD sensitive connectors, such as optical couplers.

Abstract: A centrifugal fan type cooling module includes a centrifugal fan and a radiator. The centrifugal fan provides a fan rotor with fan blades and an axial shaft and a fan stator set with an axial core, an upper cover and a frame. The fan blades extend straight forward radially with the outer end of each fan blade has an enlarged curve end part and the rest part of the respective fan blade has a width shorter than the axial shaft. The frame encloses and fits with the top of the radiator and the axial shaft is rotationally joined to the axial core such that a hollow space is formed between the radiator and the fan rotor. Heat from an electronic component is transmited to the radiator and removed outward quickly in all directions by way of upward suction force of the centrifugal fan instead of contacting other electronic members directly.

Abstract: A CPU heat dissipating unit for assembly into a 1U industrial computer, wherein, used to improve the effect of dissipating heat, mainly consisting of a cover unit, a tunnel unit and a heat dissipating fin. The cover unit is assembled to an upper side of a power supply unit, forming a ventilation channel between them. A heat dissipating unit is assembled on an upper side of the CPU and stored suitably into one side of the tunnel unit, while a cooling fan is assembled on the other side, thus providing quick dissipation of heat produced by the CPU.

Abstract: An electronic apparatus includes a housing and a printed wiring board contained in the housing. The printed wiring board includes a first surface, a second surface and a conductive layer. The first surface has a mounting area, the second surface is located opposite to the first surface in a position corresponding to the mounting area, between the first surface and the second surface. A heat generating component is mounted on the mounting area of the printed wiring board. A reinforcing member is provided on the second surface of the printed wiring board, and is in thermal contact therewith. The heat of the heat generating component is conducted to the reinforcing member through the printed wiring board, and is radiated from the reinforcing member.

Abstract: A locking device, for locking a heat sink (30) to a socket (10) on which an electronic component (20) is mounted, includes a pair of clips (60) each having a handle (62) and a ring (66). The handle includes a pair of first tabs (68) at one end thereof. A pivot (64) is connected between the first tabs and received in a slot (40) defined in an outmost fin of the heat sink. The handle further includes a pair of second tabs (72). The ring includes an opening end and a closed end for engaging with the socket. The opening end includes a pair of pivot portions extending through the second tabs. The handles are pivotable about the corresponding outmost fins between first positions at which the closed end of the rings are engaged with the socket and second positions at which the closed end are disengaged from the socket.

Abstract: A housing (1) for a passively cooled computer (2), which is to be accommodated in the housing, the housing (1) including: a housing cover (3) and a housing floor (4), whereby at least the housing cover (3) includes a passive cooling member (3a), and an insulator member (5) arranged between the housing cover (3) and the housing floor (4) to prevent a thermal flow between the housing cover (3) and the housing floor (4).

Abstract: The present invention is to provide a heat-dissipating device comprising a sheet formed thereon with a plurality of first parts and a plurality of second parts, wherein any one of said second part is disposed between any two of said first parts, and the junction therebetween is bent with an angle enabling the ends of two adjacent first parts distal to the second part to be connected with each other. As a result, the second parts form corresponding parallel plates respectively on each side of a heat-dissipating device for being placed on a heat-source to dissipate heat transmitted therefrom, and the first parts act as the supporting plates for supporting the parallel plates.

Abstract: A heat sink having graduated lengths of fins, with the tallest fins being in the center of the heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual fans impinge air against the fins, and particularly the tallest fins, to provide a highly efficient system for heat removal from the IC chip. By reducing the size of the lateral fins, additional space is made available for the dual fans. The use of the dual fans allows the fans to run at a lower speed that a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan system if one of the fans should fail.

Abstract: A control box 10 according to the present invention has at least one electric device 12 and fan unit 17 inside a case 11. In the case 11, a dividing board 15 divides a room into two rooms which include a heated room 30, close to the electric device 12, and a ventilated room 31. First and second openings 24B,24A open the heated and Ventilated rooms 30,31 to the outside of the case 11, respectively. The fan unit 17 is disposed on a window penetrating the dividing board 15 and feeds air from one of two rooms to another.

Abstract: A heat dissipation apparatus comprising a base and a plurality of fins connected to the base and extending out from the base at a non-orthogonal angle to the base.

Abstract: An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.

Abstract: A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.

Abstract: A computer system includes an enclosure, a forced air cooling system configured to create air flow within the enclosure, a printed circuit board and an air flow blockage member. The printed circuit board is within the enclosure and includes a plurality of connectors including a first connector and a second connector separated by a first space. The air flow blockage member is proximate the first space and is movable between at least a first open position and a second open position distinct from the first open position.

Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.

Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.

Abstract: A locking device (30) for mounting a heat sink (40) to a CPU (70), includes a supporting member (32), a pair of locking members (33) pivotably attached to the supporting member and each having a connecting portion (332) and a hook (333), a pressing member (34) resting on the connecting portions, a spring installed between the supporting member and the connecting portions, and an operating member (31) pivotably attached to the supporting member. The operating member is pivotable between a first position at which the operating member abuts against the pressing member and the locking members are located at a released position and a second position at which the abutting portion releases the pressing member to allow the elastic member to drive the locking members to interlock with a retention module around the CPU.

Abstract: A device for removably mounting a hard disk drive in a memory storage housing, includes a carrier for holding a hard disk drive. The carrier being removably mountable in a memory storage device housing. The device also includes a heat sink mounted on the carrier. The carrier fans, an air filter, an air filter cover and a handle.

Abstract: A mainframe cooling structure is disclosed to include a body, which has a side cover and a ventilation grille at the side cover for letting air in and out, a circuit board, which is fixedly mounted inside the body and has an electronic device that produces heat during operation, and a cooler module, which includes a heat sink attached to the electronic device, a fan holder provided at the top side of the heat sink, and two fans mounted in the fan holder and aimed at different parts of the ventilation grille for drawing outside cooling air toward the heat sink and drawing inside hot air out of the body.

Abstract: A clip (10) includes a main body (20), a buckling piece (40), and a camming member (30). The main body includes a pressing part (22), a first leg (24) extending downwardly from one end of the pressing part, and a supporting portion (26) extending horizontal from an opposite end of the pressing part. The supporting portion defining a hole. The cam member located above the supporting portion which comprises a cam (32) and a handle (34) extending from the cam for rotating the cam. The buckling piece located below the supporting portion which comprises a connecting part (42) and a second leg (44) extending from the connecting part. The connecting part move up through the hole of the supporting portion to pivotally connect with the cam, and the heak sink can be secured to the electronic device by rotating the cam to a locked position from an unlocked position.

Abstract: A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.

Abstract: In the present invention, a printed wiring board with an electronic component mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting heat internally generated, includes a heat radiating device mounted at a position corresponding to the electronic component on a rear surface of the circuit board.

Abstract: Measures are provided to prevent temperature rise caused by that heat generated from power elements, which is radiated inside a housing. In a housing comprising a radiating section and a cooling fan, a guide is provided on a part of the housing to be made longer a predetermined value than the radiating section. When the cooling fan performs forced cooling through the guide, gases heated by a substrate that generates much heat are prevented from flowing onto a substrate that generates comparatively less heat, to heat the substrate that generates comparatively less heat. Therefore, for example, the substrate that generates much heat is arranged in a position nearer to the cooling fan than the substrate that generates comparatively less heat. Alternatively, the substrate that generates much heat is arranged in a position nearer to the intake face than the substrate that generates comparatively less heat.

Abstract: Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.

Abstract: An automotive control module includes a plastic housing with a snap-fit metal cover. A printed circuit board is positioned within a cavity formed in the housing, and is attached to the housing with a plurality of fasteners. Resilient tabs are formed on side walls of the housing and grip a cover plate surface to define a snap-fit attachment. Once the cover is attached to the plastic housing, the printed circuit board is enclosed within the cavity between the cover and the housing. The cover includes a plurality of heat transfer fins and/or stamped indentations that form surfaces that are positioned in close proximity to the printed circuit board. The cover utilizes these fins and surfaces to form a heat sink for cooling electronics mounted to the printed circuit board.

Abstract: A cooler for electronic devices provides cool air to the inlet sides of the heat sink by using a radial blower with blades located around air outlets of the heat sink. This blower is driven by a brushless DC electric motor. The motor has an opening in the center allowing for the transfer of incoming air to the center of the heat sink. The rotors outer circumferential arrayed poles are rigidly secured to the frame of the radial blower. The stator of the motor is rigidly secured to the heat sink and has an opening in its center. The stator comprises circumferential arrayed coils on circuit board material. When the current flows through the stator coils, the coils acquire a magnetic polarity. The poles of the rotor and stator coils attract and repel depending on the polarities. The cool air comes simultaneously from opposite sides of the heat sink. For this reason the heat sink has a divider located approximately in the middle of the heat sink fins.

Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (6), a fan (1) and a fan holder (2). The fan holder comprises a guiding receptacle (20) and a securing base (40) covering the heat sink. An inlet (24) of the guiding receptacle is coupled to the bottom of the fan. An opening (221) is defined in the guiding receptacle for providing airflow access from the fan to the heat sink.

Abstract: A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of first slits disposed parallel to the heat receiving face and a plurality of second slits disposed transversely to the heat receiving face. These slits form a plurality of pillar-type protrusions functioning as fins for cooling. At least one of cross sections of the column has a shape of a rectangle, a trapezoid, a triangle or a shape which tapers off as it goes away at right angle from the heat receiving face. A method of manufacturing the heatsink of the present invention includes first and second processes. In the first process, the first slits are formed by providing a plurality of metallic plate fins on the column along its length by the methods including the extrusion molding using a metallic mold.