Abstract: An integrated heat dissipation apparatus includes a thermal conductor base and a heat sink interlocked with each other. The thermal conductor base has a channel formed in an upper portion thereof and a pair of grooves formed on two opposing elongate sidewalls thereof. The channel extends through the thermal conductor base along an elongate direction thereof. The grooves extending between two opposing ends of the thermal conductor base are proximal to bottom edges of the sidewalls. The heat sink has a bottom surface recessed to form a receiving slot conformal to the upper portion of the thermal conductor base. The receiving slot has a pair of protrusions extending along two elongate bottom edges of the receiving slot between two opposing ends of the heat sink.

Abstract: In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted spring has a plurality of holes each of which is aligned with a respective one of the holes in the circuit board. Bosses of the spring are each sandwiched between a respective standoff on a chassis and a respective standoff on a heat sink. Holes in the circuit board at the locus of the standoffs are sized so that the circuit board is not sandwiched between the standoffs. The spring presses the circuit board upwardly to bring an integrated circuit in contact with the heat sink.

Abstract: A clamping structure is used to fix a heat-dissipating body on a chip module. The clamping structure comprises a clamping body, two clamping portions, a pivot element, a top frame and a bottom frame. The two clamping portions are respectively connected to two sides of the clamping body and are clamped to the bottom frame. The pivot element is pivotally connected to the clamping body and has a movable portion and an ear piece. The ear piece has a fixed portion and a release portion respectively formed at an end side thereof for fixing and releasing the heat-dissipating body. The clamping structure is used to eliminate a spare gap between the clamping element and the top frame, and clamping element and the bottom frame without using the elastic element. The clamping structure can also be used with a heat sink to form a heat-dissipating module.

Abstract: A heat sink having an air flow director on each of multiple fins attached to a heat sink base. The air flow directors direct most of the air flow from dual push-pull fans towards a midline and a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. The rest of the air flow from the push-pull fans impinges against the air flow directors, providing additional cooling to the fins.

Abstract: A heat sink element coupling structure comprised of a “+” or a “+”-shaped horizontal offset disposed on the upper and lower or left and right two sides or a certain position on the lateral edge at the center portion of an L-shaped or a horizontally oriented U-shaped heat sink unit (element) plate. The structure includes inverted U-shaped or U-shaped appendages situated at the anterior section of the horizontal offsets as well as one or two wing-shaped lock tabs formed at the two sides or either the left or the right side of the inverted U-shaped or U-shaped appendages. Also included in the structure are one or two cutaways at the two sides or either the left or the right side of the horizontal offsets and a downward or upward lock tab at the two sides or the either left or right of the anterior edge of the horizontal offsets.

Abstract: A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.

Abstract: A heat dissipation apparatus and method for dissipating heat from a heat source includes a thermal conductive element bonding to the heat source to transfer heat energy generated by the heat source and a vibration source located on the thermal conductive element to accelerate heat transfer to the edges of the thermal conductive element to perform heat exchange with external cooling air and improve cooling efficiency.

Abstract: A heat sink having air flow directors on each of multiple fins attached to a heat sink base. The air flow directors direct air flow from dual fans towards a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. In one embodiment, a protrusion in the geometric center of the heat sink base provides additional cooling from air impingement, and also directs air towards the upper portions of the fins. The use of dual fans allows the fans to run at a lower speed than a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan if one of the fans should fail.

Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.

Abstract: A heat dissipating device for a heat generating unit, includes a heat sink placed on the heat generating unit, and two clip members located at opposite sides of the heat sink for securing the heat sink to the heat generating unit. Each clip member includes an operating member movably attached to the heat sink, and a fastening member connected with the operating member. The operating member is movable from a lower position to an upper position to cause the bottom portion of the fastening member to move upwardly via the operating member acting on the fastening member.

Abstract: A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying the circuit board component, the flexure member conforms to the surface of the circuit board component, thereby thermally contacting the circuit board component. The flexure member absorbs local tolerance differences on the circuit board component to provide a relatively uniform stress across the surface of the circuit board component. The flexure member further limits the amount of stress generated by the heat sink on the circuit board component. When used in conjunction with a heat sink spanning several circuit board components, the flexure member absorbs global tolerance differences among the circuit board components, thereby providing relatively uniform stresses to all of the circuit board components and limiting the amount of stress experienced by any one circuit board component.

Abstract: A heat sink clip (20) includes a main body, a post (26), and a spring (27). The main body includes a longitudinal portion (31), first and second locking arms (32, 24) extending downwardly from opposite ends of the longitudinal portion. The longitudinal portion defines a through aperture (36) in a middle thereof. Two hooks (38, 46) are respectively formed at free ends of the first and second locking arms for engagement with catches (52) of a socket (52). The post has a pressing portion at a bottom thereof for being fittingly received in a blind hole (16) of a heat sink (10). The post extends through the through aperture of the longitudinal portion. The resilient element is disposed around the post below the longitudinal portion.

Abstract: A heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. The heat sink comprises cooling ribs which rise at a distance from a base plate and which are clamped in an insert groove made in the surface of the base plate, laterally limited by longitudinal or intermediate ribs with a coupling base that has an approximately rectangular cross-section. The coupling bases are held in their insert grooves in a form-fit and are cold-welded with the base plate at least in some sections. Cross ribs extend at a distance to one another on the surfaces of the intermediate ribs and have the form of upset heels that are linked with the coupling base in a form-fit.

Abstract: A heat sink is fastened to an annular portion of a substrate of an integrated circuit module on a printed circuit card by means of a cured layer of cure shrinkable adhesive. A circuit chip is soldered to a central portion of the substrate, around which the annular portion extends. A layer of thermally conductive material is placed between the circuit chip and a central portion of the heat sink, to be compressed as the layer of cure shrinkable adhesive is cured. A compression limiting structure may additionally extend between the heat sink and the annular portion of the substrate, limiting the shrinkage of the adhesive and thus the compression of the thermally conductive material and the flexure of the substrate.

Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.

Abstract: Embodiments of the present invention provide for a noise-reducing blower structure in which a fan-housing is disposed on an expansion card and juxtaposed to a heat sink. The heat sink is disposed on the expansion card and resides within a rigid frame above a processing unit chip. A fan that circulates air is disposed on the expansion card within the fan-housing. A duct is disposed on the expansion card, covering the heat sink and the fan-housing, and the duct is mechanically separated from the fan-housing for reducing vibration noises. By placement of the fan next to the heat sink, and not on top of it, the fan can be made larger to thereby rotate at slower speeds.

Abstract: A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture sized for receiving a portion of the heat sink. The IC package includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate with the first surface of the IC package facing the substrate. The second surface of the IC package is in thermal contact with the heat sink, when the heat sink is positioned in the aperture and secured to the case.

Abstract: An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.

Abstract: An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.

Abstract: An engageable assembly comprising a socket and a heat sink. The socket comprises a surface having an array of mounting holes that receive connector pins of an electronic device in order to mount the electronic device within the perimeter of the socket. The heat sink has a footprint extending beyond the perimeter of the socket and is in thermal contact with the electronic device when it is engaged with the socket. The socket and the heat sink include cooperative alignment tabs and alignment slots located outside the array of mounting holes. A locking lever is pivotally connected to an arm extending from the socket to a position outside of the footprint of the heat sink.

Abstract: An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.

Abstract: A system, comprising a circuit board having a heat sink spanning multiple components on the circuit board and at least one compliant pad flexibly interfacing the heat sink with the multiple components.

Abstract: A heat sink mounting assembly includes a socket (90) having first and second side, a retaining clip (10) cooperating with the socket to sandwich a heat sink (70) therebetween. A pair of ears (92) is formed at the first and second sides of the socket. The retaining clip includes a pressing body (11) having first and second ends, a first leg (14) extending from the first end thereof and engaging with one ear, a spring (50) attached to the pressing body, and a second leg (30) attached to the second end thereof and biased by the spring. When the second leg is pressed down toward the socket, the spring biases the second leg upwardly, so that the second leg is resiliently engaged with the other ear. Thus, the heat sink is secured between the socket and the retaining clip.

Abstract: A power adapter includes an insulating casing including an enclosing wall and defining a sealing chamber therein, a power transforming unit disposed in the sealing chamber, and a heat sink device including a heat dispersing member supported within the sealing chamber at a position between the enclosing wall and the power transforming unit to thermal-communicate with the power transforming unit, wherein the heat dispersing member has an air insulating cavity formed above the power transforming unit in such a manner that when the power transforming unit generates heat for heating up air within the air insulating cavity, the heat is diffused throughout the air insulating cavity so as to evenly disperse on the enclosing wall of the insulating casing.

Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.

Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.

Abstract: A heat sink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly consists of a thermal conducting substrate base with a top and bottom side. Radiating fins are attached to the bottom side of the base. The fins are cooled by external air. The component on the circuit board is connected to the top surface of the heat sink base by means of thermal conducting spacers which create a gap between the bottom surface of the circuit board and the top surface of the heat sink base. A first hole is placed in the heat sink base and driving means are attached to the said base at the area of the first hole. A rotating fan is operatively attached to the said driving means in such a manner that when the fan rotates air is forced between the gap created between the circuit board and the heat sink base. A second hole is installed in the heat sink base. The air flowing from the fan is exhausted through the said second hole.

Abstract: A heat collector (50) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame (40) which may be stamped and formed or molded. The heat collector has flanges (53) which bear against retaining tabs (45) formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator (18), or may be formed as a heat sink (56) such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.

Abstract: A method for configuring an electronic unit having a plurality of sides for conductive cooling is described. The electronic unit is configured to be mounted in a mounting rack and the method comprises attaching a heat conduction mechanism including an expandable heat transferring structure to the electronic unit. The heat conduction mechanism is expandable to contact a surface of the mounting rack upon activation, thereby conductively transferring heat from the electronic unit to the mounting rack.

Abstract: A heatsink mounting unit prevents a heatsink cooling an electronic device mounted on a printed circuit board from a breakaway. The heatsink mounting unit includes a flat spring having a first end part formed with a combining arm combined to the printed circuit board by a fastening device and a second end part having a hook. The flat spring elastically presses the heatsink against the printed circuit board. The heatsink mounting unit also includes a hook holding member combined to the printed circuit board and having a hook hole to which the hook is hooked. Thus, the present invention provides a heatsink mounting unit which is easily mounted and effectively prevents a heatsink from a breakaway.

Abstract: An interlocking heat sink is shaped such that it geometrically mates with an adjacent heat sink such that a linear gap for air flow is not formed between adjacent heat sinks. In multiple processor systems, an interlocking heat sink is associated with each processor.

Abstract: An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be moldable.

Abstract: Embodiments of the present invention recite a heat dissipating system. In one embodiment, a heatsink comprising a plurality of cooling elements substantially encases a fan assembly disposed therein. When in operation, at least a portion of intake air for the fan assembly is caused to traverse the plurality of cooling elements prior to being exhausted from the fan assembly.

Abstract: A uniform heat dissipating and cooling heat sink for increasing conductive cooling at locations where conductive cooling and temperature differential is reduced. The heat sink includes a base having a variable thickness with a maximum thickness at the interior thereof and a plurality of fins upstanding from the base with adjacent fins separated by a flow channel having diverging sides.

Abstract: In a card connector having an eject mechanism for removing a card inserted at a predetermined position, the card connector has a heat radiation member which is brought into contact with the card to promote heat radiation. The heat radiation member is held by holding members to be movable with respect to the card. The card connector further has cam mechanisms acting between the holding members and eject mechanisms for removing the card. When the card is removed from the predetermined position, the card is removed after the heat radiation member is separated from the card.

Abstract: An electromagnetic shielding structure is provided for a microprocessor or other electronic device that emits electromagnetic radiation. The structure includes a heat sink with an integrally formed depending skirt, and a conductive, compressible polymer is applied to a bottom surface of the skirt. The bottom surface mounts against a socket carried on a circuit board and is electrically coupled to a ground plane of the circuit board. The socket substantially surrounds the microprocessor in at least two dimensions (e.g. length and width). A shielding structure is formed at least partly by the heat sink, the socket and the ground plane.

Abstract: Disclosed are a heat dissipation computer and method. In one embodiment, a heat dissipation apparatus comprises a heat sink that is adapted to receive a processor mounted thereto, the heat sink comprising an internal chamber that is adapted to receive a fluid flow that removes heat from the heat sink. In one embodiment, a method for dissipating heat generated by a processor comprises forcing fluid through an internal chamber formed within a heat sink to which the processor is mounted, forcing the fluid from the internal chamber of the heat sink through at least one hollow prong that extends from the heat sink and that is in fluid communication with the internal chamber of the heat sink, and forcing fluid over exterior surfaces of the at least one hollow prong.

Abstract: A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.

Abstract: An electronic apparatus includes a housing, a first heat-generating member provided in the housing, a heat-radiating member thermally connected to the first heat-generating member, a first fan module guiding air to the heat-radiating member, a second heat-generating member provided in the housing, a second fan module discharging air out of the housing, and a wall section provided in the housing, located between the first fan module and the second fan module.

Abstract: A heat dissipation assembly (100) includes a retention frame (90), a heat sink (80), a fan holder (10), a pair of clips (60) and a fan (20). The heat sink is mounted on the retention frame and forms a pair of shoulders (822) at opposite sides thereof. The fan holder includes a fan duct (40) surrounding a top portion of the heat sink and including a pair of supports mounted on the shoulders, and a holding frame (30) detachably mounted on the fan duct. The clips are mounted on the supports and engaged with the retention frame. One side of the holding frame is pivotally engaged with the fan duct, an opposite side of the holding frame forms a latching leg (33) that is engaged with an ear (412) formed at the fan duct. Three catching arms extend from the holding frame and retain the fan in the holding frame.

Abstract: A device for use in cooling a microelectronic component in a data processing system with a heat sink and a fan. The device includes means for maintaining the fan in close proximity to the heat sink and in a position relative to the fan for moving air over cooling surfaces of the heat sink and component to vibrationally isolate the fan from the heat sink and reduce the transmission of fan vibration to the heat sink. In one embodiment, the vibration isolation component is also configured to receive the fan and secure the fan in position relative to the heat sink to locate the fan in a predetermined position relative to the heat sink. In another embodiment, the vibration isolation component comprises a compliant gasket defining an opening adapted to receive an active area of the fan to allow air flow generated by the fan to reach the heat sink.

Abstract: The present invention is related to an extendible and flexible heat-dissipation air conduit base as computer heat dissipation device. The invention mainly comprises an air conduit and fixtures. The air conduit is hollow and flexible with fixtures at both ends. Each fixture is in rectangle shape and connects with the air conduit through a circular hole. The fixture also has several positioning holes and through holes for metal wire to pass through and secure the air conduit with the fixture. By this design, the fixture at one end of the air conduit connects to a heat dissipation fan for CPU. Thus, it provides an excellent heat dissipation channel for computer CPU and helps to achieve the desirable heat dissipation effect.

Abstract: Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

Abstract: Described are devices for cooling a component, and methods thereof. The device includes a base that can be coupled to the component so that heat is transferred from the component to the base. The device also includes fins coupled to the base. The fins are arranged to funnel air from an air intake end of the device toward a location on the base.

Abstract: An electric machine for converting electrical energy to mechanical energy is disclosed. The electric machine includes a stator having an outer layer, a first intermediate layer, a second intermediate layer, and an inner layer. The electric machine further includes a rotor axially aligned and positioned within the stator. The rotor has at least one permanent magnet, and at least one busbar. The busbar is attached to the first intermediate layer. The busbar includes at least one bare power die in electrical communication therewith.

Abstract: The present invention provides a combined member of aluminum-ceramics. The combined member comprises a ceramic board, a conductive member holding electronic parts thereon, formed on one surface of the ceramic board, and a water cooling jacket of aluminum or aluminum alloy bonded directly on the other surface of the ceramic board.

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprises a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract: An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body. The aluminum body includes inwardly directed tabs extending from opposing cooled edges of the cold plate, the inwardly directed aluminum tabs having orifices therethrough. The opposing aluminum skins also includes orifices therethrough aligned with the orifices in the tabs of the aluminum body to reduce the conductivity of the cooled edges of the cold plate thus reducing the temperature gradient between edge mounted heat sources and inwardly mounted heat sources without adversely affecting the structural integrity of the graphite core layer.

Abstract: A heat sink assembly (20) includes a number of parallel first fins (40) and a number of parallel second fins (60) each having a main body (44, 64). A number of latch slots (46) is defined in the main body of each first fin. A number of latches (66) extends from the main body of each second fin in opposite directions. The first fins and the second fins are assembled together in interleaved fashion, so that the latches of each second fin engage in the latch slots of two adjacent first fins respectively.

Abstract: The present invention is a heat sink with guiding fins comprising a base with a plate part, wherein each side of a pair of two opposite sides of the plate part comprises a declining part; and two groups of fins expanded upwardly from each said declining part, wherein a channel whose top width is wider than its bottom width is form by the tow groups of fins and the base and there is a gap properly set between each two fins. By doing so, the heat sink can guide the flow generated by a fan to form a streamline with pressure and so obtains smaller wind resistance and better heat dissipation for the heat sink.