Abstract: A heat sink assembly for a circuit board component is provided. that includes a heat sink base, a frame coupled to the base, and a cam positionable relative to the base to lock the heat base to the circuit board component. The frame includes an actuator that has a first post and a second post. Each post has an upper end, a lower end, and a shaft portion therebetween. The lower end includes a retention lug. A cross beam interconnects the shaft portions of the posts. The frame further includes a board lock and the cam includes a lever coupled to the cam. The cam engages the actuator to move the actuator relative to the frame from a first position to a second position to lock the heat sink base to the circuit board component. The heat sink remains in the locked position when the lever is rotated from the second position to the first position.

Abstract: A grounding member support forms an interference or friction fit with an opening defined by a circuit board. A compliant, electrically conductive grounding member couples to the grounding member support. The grounding member electrically couples a grounding layer of the circuit board with a support mount coupled to the circuit board. During assembly, insertion of the grounding member support within the opening defined by the circuit board creates an expansive or lateral force on the opening. Furthermore, during assembly, the support mount compresses the compliant, electrically conductive grounding member against the circuit board. The interference fit between the grounding member support and the opening along with compression of the grounding member between the circuit board and the support mount limits the amount of stress received by a surface of the circuit board.

Abstract: An apparatus and method are provided for retaining thermal transfer pins in a spreader plate adapted to transfer thermal energy from an electronic component. The spreader plate includes pin holes that slidably receive the thermal transfer pins. The apparatus includes a retention member located proximate each pin hole. The retention member interferes with a range of motion of an associated pin in order to retain the associated pin within the pin hole.

Abstract: The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.

Abstract: A modular motor controller family comprises a housing. Solid state switches are selected from one of plural switch sizes for controlling a desired voltage and current range. The switches are mounted in the housing for connection between an AC line and motor terminals for controlling application of AC power to the motor. A logic circuit board is mounted in the housing including logic circuitry for commanding operation of the solid state switches independent of the selected switch size. An interface circuit board selected from one of plural configurations is mounted in the housing and includes interface circuitry connected between the logic circuitry and the solid state switches. The interface circuitry is selected to interface with the selected switch size according to the desired voltage and current range.

Abstract: An electronic assembly that may include an integrated circuit package that is mounted to a substrate. The assembly may have a thermally conductive phase change material that couples the integrated circuit package to a thermal element. The phase change material may be assembled in a liquid phase to fill any gap between the package and the thermal element. The phase change material may exist in a solid phase during normal operation of the assembly so that the material does not bleed from the package/thermal element interface.

Abstract: A system for cooling at least two electronic components comprises a plurality of graphitic foam products which are each thermally coupled to a corresponding component, a plurality of housings which are each mounted over a corresponding foam product and which each comprise an inlet and an outlet, a source of cooling fluid, and a conduit which is connected between the fluid source and each inlet. In operation, fluid is communicated from the fluid source to each housing through the conduit to thereby cool the components.

Abstract: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.

Abstract: A stackable heat sink comprising a plurality numbers of metal heat dissipation plates, the heat dissipation plate further comprises a bottom plate, two side plates facing each other locates on both sides of the bottom plate, a bending area is bent from the top of the side plate, two standing plates stretches up from the bending area and facing another standing plate, two fastening plates each is formed on the proper location on the standing plate, the fastening plate is bendable and forms a bending line with the standing plate; two fastening crevices each is located on the junction of the bottom plate and the side plate.

Abstract: An automotive control module includes a plastic housing with a snap-fit metal cover. A printed circuit board is positioned within a cavity formed in the housing, and is attached to the housing with a plurality of fasteners. Resilient tabs are formed on side walls of the housing and grip a cover plate surface to define a snap-fit attachment. Once the cover is attached to the plastic housing, the printed circuit board is enclosed within the cavity between the cover and the housing. The cover includes a plurality of heat transfer fins and/or stamped indentations that form surfaces that are positioned in close proximity to the printed circuit board. The cover utilizes these fins and surfaces to form a heat sink for cooling electronics mounted to the printed circuit board.

Abstract: The present invention provides a radiator that consists of a plurality of f ins, one side of each fin has at least one wing parallel relative to the side, the wing is disposed spaced from the fin. The wing has protruding parts disposed approximately perpendicularly to the wing. The fin has slots positioned relative to a corresponding protruding part. The protruding parts engage with the slots and the protruding parts are bent such that the fins are combined into a radiator. The radiator has following characteristics: simple structure, easily assembled, robust, easily formed, and material-saving.

Abstract: A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. The heat dissipation plate is held in thermal contact with the other side of the channel, providing a second additional heat path to channel heat away from individual components, the circuit card and/or the heat frame.

Abstract: A variable-height thermal-interface device is provided for transferring heat from a heat source to a sink. The device comprises a first uniaxial rotary cylindrical joint comprising a first cylindrically concave surface in slidable contact with a first cylindrically convex surface. The first cylindrically concave surface and the first cylindrically convex surface share a common first radius of curvature relative to a common first cylinder axis. The first cylindrically concave surface is operable to rotate about the common first cylinder axis relative to the first cylindrically concave surface to compensate for uniaxial angular misalignment between the source and the heat sink.

Abstract: An indicia-equipped actuator assembly for removably coupling a CPU with a socket assembly, the actuator assembly comprising an engaging assembly for use in placing a socket assembly in an open or close position to couple or uncouple the CPU from said socket assembly; and an indicia portion for indicating whether the socket assembly is in an opened or closed position.

Abstract: A cooling fan device for mounting on top of parallel radiation fins of a radiator. The device includes a seat having a driving section, and an air-guiding fan pivotally connected to the driving section of the seat and including a hub and blades generally radially spaced around an outer periphery of the hub. Supporting sections are extended from two opposite sides of the driving section in directions parallel with the radiation fins of the radiator to support the driving section in the seat. With the supporting section in parallel with the radiation fins, flowing air produced by the air-guiding fan is allowed to flow toward the radiator without hindrance.

Abstract: An apparatus directs airflow adjacent a circuit board to provide cooling and provides shielding for the circuit board to reduce EMI. The apparatus comprises a barrier for directing airflow and a conductive layer, electrically grounded and physical associated with the barrier, for providing shielding for the circuit board to reduce EMI.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.

Abstract: An electronic assembly is disclosed which includes a printed circuit board. A computer processor package is centrally positioned on an upper surface of the printed circuit board. A computer processor is positioned on an upper surface of the computer processor package. A first plurality of power delivery components is positioned on an upper surface of the printed circuit board on one side of the computer processor package. One or more additional pluralities of power delivery components may be positioned on the upper surface of the printed circuit board on other sides of the computer processor package. A high frequency current may be routed from one or more of the first and/or additional pluralities of power delivery components over an elongate flex circuit to the computer processor. A series of decoupling capacitors may be coupled to the elongate flex circuit to enhance a transfer of high frequency current over the elongate flex circuit.

Abstract: A power controller generally includes a switching device and a heat sink in contact with the switching device for dissipating heat generated by the switching device. The heat sink may include a base and a plurality of fins extending from the base. The power controller may include a fan for forcing cooling air toward the heat sink and an air guide mounted to the heat sink for dividing the cooling air such that cooling air flows over the top of the heat sink and cooling air flows through the fins of the heat sink. The power controller may include multiple heat sinks and one or more temperature sensors.

Abstract: A fastening structure for dissipation device has a metal plate with at least one screw hole, a screw with an engagement part, an elastic element, and a screw cap. The screw and the elastic apparatus are assembled in the screw hole. The screw cap, whose clamp structures are fastened to the outside of the screw hole, limits movement of the screw and the elastic element in the screw hole. The screw is allowed to move upward and downward within a predetermined scope.

Abstract: A retainer directly attaches to a circuit board component and to a heat sink and secures the circuit board component to the heat sink. The retainer provides a mechanical attachment between the heat sink and the circuit board component. Such mechanical attachment maintains thermal communication between the heat sink and the circuit board component in the absence of a thermally conductive adhesive between the heat sink and the circuit board component for the operational life of the circuit board component. Furthermore, because the retainer attaches directly to the circuit board component and to the heat sink, the retainer minimizes the necessity for use of mounting holes in the circuit board associated with the circuit board component to secure the heat sink to the circuit board component.

Abstract: An embodiment of the present invention described and shown in the specification and drawings is a process and a package for facilitating cooling and grounding of a semiconductor die using carbon nanotubes in a thermal interface layer between the die and a thermal management aid. The embodiments that are disclosed have the carbon nanotubes positioned and sized to utilize their high thermal and electrical conductance to facilitate the flow of heat and current to the thermal management aid. One embodiment disclosed has the carbon nanotubes mixed with a paste matrix before being applied. Another disclosed embodiment has the carbon nanotubes grown on the surface of the semiconductor die.

Abstract: A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.

Abstract: A docking station is provided with apertures that line up with apertures in a notebook. When the notebook is docked on the docking station, air is forced out of the notebook through the openings of the docking station and the notebook.

Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.

Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins.

Abstract: In an alternator, a voltage control device includes a control circuit IC chip, a radiating fin and a case. The radiating fin 253 has a base 256 that is fixed to the IC chip and radiating portions. The radiating portions protrudes from the base 256 and have substantially U-shaped cross sections, so that tubular air passages are formed between the radiating portions and a fixed surface of the IC chip. Each radiating portion has a central trunk and alternating branches, thereby rows of air passages are formed by the central trunk and rows of branches.

Abstract: A side flow cooling device is disclosed. The side flow cooling device includes a heat mass with arms extending therefrom and a mounting surface for connecting the heat mass with a component to be cooled. The heat mass and the arms include a plurality of fins extending outward therefrom and aligned with a vertical axis of the heat mass. The fins have cooling surfaces and a slot between adjacent fins that are aligned with a longitudinal axis of the heat mass. A fan or the like can be connected with a side face of the cooling device to generate an air flow that is substantially along the longitudinal axis. The air flow wets over the cooling surfaces of the fins, on exposed portions of the heat mass, and on exposed portions of the arms to dissipate heat from the heat mass. The heat mass is not covered by the fan and therefore the fins can populate a substantial portion of a surface area of the heat mass thereby increasing the surface area available for cooling.

Abstract: The present invention includes one embodiment of a printed circuit board assembly including a printed circuit board, a microprocessor chip, a socket and an actuator for connecting the chip to the printed circuit board, a heat sink for attachment to the top surface of the chip, and a field installable thermal interface phase change pad positioned between the heat sink and the microprocessor chip. The heat sink has an actuator access opening so that the actuator is operable with the heat sink positioned on top of the microprocessor. The connection between the chip and the heat sink is free of alignment features so that they may be separated by twisting the heat sink relative to the chip. The connection between the heat sink and the circuit board is also free of alignment features.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fm members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.

Abstract: An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force therebetween as a result of the heat sink and the module formed of materials having a higher coefficient of thermal expansion (CTE) than the fastener.

Abstract: An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A heat sink is in thermal contact with the electronic device and has a footprint extending beyond both the electronic device and the socket. A locking lever pivotally connects to an arm extending from the socket to a position outside of the footprint of the heat sink.

Abstract: A heat sink includes a heat receiving part for receiving heat from the outside, a first radiating part, connected to said heat receiving part, which forms a first air channel, and radiates the heat from said heat receiving part using air that passes through the first air channel, and a second radiating part, located apart from said heat receiving part and connected to said first radiating part, said second radiating part forming a second air channel which the air that has passed the first air channel enters, the second air channel being narrower than the first air channel, said second radiating part radiating the heat from said first radiating part.

Abstract: An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.

Abstract: A cooling system and method, and a cooled electronics assembly are provided employing a thermal spreader having an inner chamber evacuated and partially filled with a liquid. A phase separator is disposed within the thermal spreader to at least partially divide the inner chamber into a boiling section and a condensing section, while allowing vapor and liquid to circulate between the sections. A heat extraction assembly is disposed at least partially within the inner chamber to extract heat therefrom. When the thermal spreader is coupled to a heat generating component with the boiling section disposed adjacent thereto, liquid within the thermal spreader boils in the boiling section, producing vapor which flows upward from the boiling section and causes liquid to flow into the boiling section from the condensing section, thereby providing circulatory flow between the sections and facilitating removal of heat from the heat generating component.

Abstract: A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

Abstract: A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.

Abstract: A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the heat generating component by absorbing heat from the heat generating component.

Abstract: A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.

Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: The present invention provides a heat exchange system for conducting heat away from high-power, heat-producing electronic components by conduction and convection. The heat exchange system comprises a metal tube that has been forged and drawn so as to define a flow channel for a cooling fluid, wherein the tube has an inner surface that comprises a plurality of integral fins that are structured and arranged to increase the available surface area of the inner surface of the metal tube exposed to the fluid and an outer surface that is in direct communication with the heat producing components. Coolant fluids are circulated through the flow channel, preferably, at turbulent flow conditions to minimize thermal resistance. The invention further provides a self-cooling, self-supporting electronic assembly that comprising one or more high-power electronic devices, the heat exchange systems, and an attaching system for attaching high-power electronic devices to the heat exchange system.

Abstract: A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip presses a thermal stud against the back of an electrical device package. The present invention is especially useful for attaching a spatial light modulator to a printed circuit board since it provides a simple, reliable heat sink without blocking the light path to and from the device.

Abstract: A heat dissipation device for dissipating heat from an electronic package (80) includes a heat sink (10) and a fan (30). The heat sink includes a base (12) and a plurality of fins (14). The base has a first surface (122) in thermal contact with the electronic package and a pair of sloped heat dissipation surfaces (126). The fins are perpendicularly attached on the heat dissipation surfaces. The fan is supported on the heat sink. During operation of the heat dissipation device, the cooling air is drawn into the heat sink by the fan and exits the heat sink along the heat dissipation surfaces.

Abstract: A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy having an increased melting point and added robustness.

Abstract: A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302) is attached to one side of a die (304). The die (304) fits into the opening (104) of the carrier (102) with the heat sink (302) abutting one side (208) of the carrier and the die being wire bonded (402) to the other side (108) of the carrier. The packaging assembly (400) can be oriented either device side up or down.

Abstract: A pin fin heat sink for use in transferring heat away from a heat generating source is described which is manufactured by fusion or stud welding of fins to a base forming a continuous thermally conductive path for heat rejection. The method permits use of a broader range of thermally conductive materials, fin geometry and fin spacing than exists in current art. Having greater flexibility in fin design enables more efficient heat sinks with greater surface area and lower thermal resistance for any given volume. Relatively long thin pins are joined autogenously to a heat sink base with closely spaced adjacent surfaces by a capacitor discharge stud welding process without the need to apply significant force to the mating parts.

Abstract: A chassis member for carrying at least one circuit board for use in a WDM add/drop multiplexer unit, wherein the chassis member is adapted, in use, to function as a heatsink for a heat generating component mounted on the circuit board.

Abstract: A cooling system for cooling an interface card is provided. The cooling system comprises a thermal conductive housing wrapping around a carrier of the interface card and the electronic devices thereon. A pair of fans are set up on the housing to provide a flow of air inside the space between the housing and the carrier so that the heat generated by the operating devices are rapidly carried away. In addition, a fin type heat sink can be incorporated into the space between the housing and the electronic devices to increase the amount of heat transferred away from the operating devices.

Abstract: The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.