Abstract: A cooling system for cooling an interface card is provided. The cooling system comprises a thermal conductive housing wrapping around a carrier of the interface card and the electronic devices thereon. A pair of fans are set up on the housing to provide a flow of air inside the space between the housing and the carrier so that the heat generated by the operating devices are rapidly carried away. In addition, a fin type heat sink can be incorporated into the space between the housing and the electronic devices to increase the amount of heat transferred away from the operating devices.

Abstract: The present invention relates to a heat sink assembly structure having at least a heat sink fastening member combined with at least a heat sink. Each heat sink fastening member has a V-shaped protrusion, a slot, and an elastic lock member. The elastic lock member has a V-shaped cross sectional structure. The V-shaped protrusion of a first heat sink is combined tightly in the slot of a second heat sink for assembling the heat sink and for forming a V-shaped slot. The assembled heat sink is fixed in a base by adding a solder into the V-shaped slot.

Abstract: A flexible assembly system and mechanism adapted for optical projection apparatus, the flexible assembly system includes a flexible element, a heat-sink element, a digital micro-mirror device module, an optical holder and a locked element, wherein the locked element is serially connected the flexible element, the heat-sink element, the digital micro-mirror device module and the optical holder, for making each element be formed in one-piece, whereby using the flexible element to eliminate the accumulative tolerance between each assembly element, and producing a compact combination between the heat-sink element and the digital micro-mirror device module, so that the digital micro-mirror device module has a best heat dissipating effect.

Abstract: An electronic package for providing an increased density of electronic components in systems includes electronic components mounted on two surfaces of a substrate. Electrical coupling is provided by electrical contacts mounted with substantially the same arrangement and number on both surfaces of the substrate. Two conductive substrates having apertures are mounted adjacent and substantially parallel to the two component mounting surfaces such that the electrical contacts mounted on the two surfaces protrude through the apertures of the two conductive substrates. The two conductive substrates are coupled to one or more heat sinks to conduct heat away from the multiple electronic components contained between the conductive substrates. Multiple electronic packages can be coupled together to form a stacked electronic package by physically connecting the electrical contacts of the electronic packages.

Abstract: The present invention relates to a cage for holding an optical transceiver module in electrical contact with a host circuit board. The cage includes front, middle and rear sections, and facilitates the insertion of the optical transceiver into the cage, as well as providing electromagnetic shielding and facilitating thermal dissipation. Typically, the cage is for use with an optical transceiver module including an integral heat sink cover or with an optical transceiver module including an external heat sink mounted over top of the cage. Various embodiments illustrate different schemes for maximizing heat dissipation by providing large openings in the middle section of the cage, as well as mounting surfaces on the front and rear sections for mounting external heat sinks. One or more crossbars are provided for guiding the transceiver module during insertion.

Abstract: A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal. The heat sink dissipates heat generated by the packaged electronic component. Second, parallel rails are disposed adjacent the opposing ends of the pedestal, each rail having a catch. Third, a spring clip has (a) end hooks which engage the catches to retain the spring clip on the rails, and (b) a strut extending between the hooks, fitting into the space between adjacent fins, and including an apex which contacts substantially centrally the pedestal and applies a force pressing the heat sink toward the packaged electronic component. Thus, the heat sink is removably attached at least indirectly to the packaged electronic component. Also disclosed is a method of using the structure.

Abstract: A coupling mechanism for radiator aims to fasten a radiator to a heat generating element of a socket on a main board for absorbing the thermal energy generated by the heat generating element. The coupling mechanism includes a first anchor dock, a second anchor dock and a latch element. The first anchor dock and the second anchor dock are located on two opposite ends of the socket. The latch element passes through the gap of the radiation fins of the radiator and straddles the radiator. It has one end pivotally engaging with the first anchor dock and another end selectively engaging with the second anchor dock. The latch element further has an elastic section formed in the middle portion to put the radiator in close contact with the heat generating element. The coupling mechanism thus constructed can increase the surface area of the radiation fins of the radiator to achieve the maximum radiation effect.

Abstract: A system and method for detecting blank modules includes an information handling system including at least one computing component, a modular chassis, a management module, and one or more sensors. The modular chassis includes one or more slots where each slot is operable to receive either the computing module or a blank module. The computing module interfaces with the management module whereby the management module is operable to detect the presence of one or more of the computing modules in one or more of the slots. The sensors are associated with each of the slots and detect if one or more of the blank modules are installed in one or more of the slots. In addition, the sensors provide an indication to a user when one or more of the slots are empty and do contain neither a computing module or a blank module.

Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.

Abstract: An air-applying device has an impeller having a center of rotation, and a case which contains the impeller. The case includes a first edge defining an inlet port of air which exposes the center of rotation, a second edge defining an outlet port of air, and a high-pressure region which presents upon operational rotation of said impeller. The high-pressure region is located within the case along a peripheral portion of the impeller. A distance between the center of rotation of the impeller and the first edge is shorter in the direction from the center of rotation to a center of the high-pressure region than from the center of rotation to region other than the high-pressure region.

Abstract: A heat sink retention system and method secures a heat sink proximate to a packaged electronic component, such as central processing unit, by rotationally engaging the heat sink with a retaining structure secured to an information handling system planar, such as a motherboard. The retaining structure has an opening aligned with the packaged electronic component and securing lips that extend into the opening. The heat sink inserts into the opening and is rotated slightly to engage flanges extending from its base into the securing lips. The position of the securing lips relative to the planar and the thickness of the flanges results in the base of the secured heat sink having a predetermined clearance from the packaged electronic component. A locking detent biases the heat sink to contact the packaged electronic component and allows limited movement out to the predetermined clearance, thus allowing the absorption of shock without excessive heat sink movement.

Abstract: A low-cost, fan assisted cooling device is disclosed. The cooling device includes a heat mass with a taper bore therein adapted to receive a heat spreader that has a shape that complement the taper bore. The heat mass and the heat spreader are made from dissimilar materials. A fastener or the like can be used to urge the heat spreader and the mass into contact with each other. A plurality of vanes are connected with the heat mass and an inside surface of the vanes define a chamber that surrounds the heat mass. A portion of each vane is split into a plurality of fins and both the vanes and the fins have a surface area that increase in a radially outward direction from the axis of the heat mass.

Abstract: A high density vertical surface mount package and thermal carrier therefore including a heat sink.

Abstract: Fastening members such as tapping screws and rivers having a shaft are used to fasten objects such as circuit elements, a circuit board and a casing to a target object such as a heat sink of a circuit unit. The target object has a uniform cross-sectional shape along a specified direction, having grooves formed over the entire length along this direction. The fastening members are passed through the objects to be fastened and inserted into these grooves perpendicularly to be affixed to the target object so as to fasten the objects to be fastened onto the target object.

Abstract: An attaching device is provided for mounting and fixing a device for generating heat, such as a semiconductor device, and a heat sink provided on the device for generating heat on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the device for generating heat, is fixed to the board, and a press mechanism that presses the heat sink to the device for generating heat when the rotation member is rotated.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A heat sink clip (10) includes a pressing section (11) and first and second spring sections (12, 14). A first arm (15) depends from the first spring section. An operation lever (24) defines a pair of second pivot holes (244) and a pair of third pivot holes (246) at one end. The third pivot holes are closer to said one end of the lever. A connecting portion (20) has one end pivotably connected to the second spring section, and the other end pivotably connected at the third pivot holes of the lever. A second arm (25) is pivotably connected to the second pivot holes. The first and second arms define slots (18, 28) to engagingly receive posts (82) of a back plate (80). When the lever is rotated downwardly, the second arm of the clip is raised, and a heat sink (30) is thereby secured to a CPU (60).

Abstract: A heating dissipating device for electronic elements comprises a bottom plate and a plurality of heat dissipating sheets; the bottom plate being formed with a plurality of grooves. A lower end of each heat dissipating sheet is a folded end and the folded end is inserted into a respective groove to be fixed therein tightly. Each groove may be inclined with respect to the surface of the bottom plate and the fold end is also inclined. Moreover, two sides of the bottom plate are punched so that the heat dissipating sheets are tightly engaged to the bottom plate.

Abstract: In one embodiment, the invention provides a system. The system comprises using a plurality of heat absorbing fins to absorb heat from an electronic component of a substrate-mounted electronic assembly; and transporting the absorbed heat to a material of an enclosure for the electronic assembly where it is dissipated.

Abstract: A heat transporting electrical assemblage retained in a retaining unit transports heat between a heat sink and a thermal transport element in fluid communications with the heat sink. The thermal transport element is snugly arranged in a thermal gap between a coplanar thermal wall formed by a wall of both the heat sink and the electrical assemblage. Thermal transport element makes at least partial contact with a portion of the coplanar thermal wall and with a portion of the retaining unit thereby transporting heat from the hotter thermal wall to the cooler frame of the retaining unit.

Abstract: A heat sink fastener (10) includes a pressing beam (20), a clamping beam (30), and an operating lever (40). The pressing beam includes a first pivot portion (26) at one end thereof, and a hook (242) at an opposite end thereof. The clamping beam has a second pivot portion (32) at a top end thereof, and a hook (34) at a bottom end thereof. The operating lever is pivotally engaged with each of the first and second pivot portions. The operating lever includes a pair of parallel pivot plates (44), each forming a protrusion (446) on an internal face thereof. In use of the fastener, the fastener is unlocked when the protrusions and the clamping beam are disposed at a same side of the first pivot portion. The fastener is locked when the protrusions and the clamping beam are disposed at opposite sides of the first pivot portion.

Abstract: A heat sink fin assembly structure, suitable for various kinds of computer chip sets or processors, mainly has a plurality of heat sink fins assembled to form a plurality of upright and parallel heat sink fins on a base seat of the heat sink. The present invention is characterized that a lateral rim on a bottom portion of a piece-shaped main body of the heal sink fin extends to form a connection piece. A plurality of position holes are drilled on the connection piece and side rims thereof bend upwards from a plurality of position pieces and holding pieces. A second heat sink fin is assembled to the lateral sides of a first heat sink fin such that the heat sink fins fix and connect each other thereby eliminating the need of molding and extruding the heat sink so as to achieve the effect of cost saving.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: The present invention of a heat dissipating fin pieces interlocking mechanism includes a plurality of aluminum or copper fin pieces wherein the lower center protruding section is bent and folded into a base plate. Also located on center portion fin pieces is a plurality of venting openings; the center portion fin pieces extend on upper and lower ends into a plurality of locking elements where each is fitted with one or two claws. The claws are connected to the center portion fin piece by a perforated protruding section while the closer edge of the protruding section grows into a neck. The neck turns into a folding part with narrowed end. When a multitude of fin pieces are assembled, the narrowed end of folding part from the back fin piece penetrates through the corresponding perforations of the front fin piece locking elements then fold back flat into a secure interlocking position.

Abstract: A thermal management device is for a electronic apparatus, and includes a thermally conductive member, and elastic and thermally conductive material. The member is for engagement with a heat sinking portion and for conducting thermal energy. The member has two legs that are deflectable relative to each other. The first leg is configured for location proximate to an electronic component and the second leg is configured to extend toward the heat sinking portion. The member has a connecting portion interconnecting the two legs such that thermal energy can travel between the legs, and such that a spacing is provided between the two legs. The elastic and thermally conductive material is located in the spacing between the legs such that the thermal energy can travel from the first leg through the material and to the second leg, and such that the two legs may deflect relative to each other.

Abstract: It is an exemplified object of the present invention to provide a heat sink, method of manufacturing the same, and electronic apparatus having the heat sink in which a fine and inexpensive adjustment upon placement and replacement may be made to exoergic components having various shapes and calorific values, and to placement space of various shapes and dimensions. The inventive heat sink comprises a housing, a cooling fin that is separably coupled with the housing, receives heal from the exoergic components, and dissipates heat form the exoergic components, and a cooling fan that forcefully cools the cooling fin and is connected with the housing, each element can be replaced alone.

Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.

Abstract: An active heat sink structure includes at least one heat sink. Each heat sink includes a heat sink base having a top surface with a top surface periphery, a top surface center at a central portion of the top surface, and an oppositely disposed bottom surface. The top surface is preferably flat. The heat sink may be described in relation to a first reference line lying in the top surface and a second reference line lying in the top surface and perpendicular to the first reference line. Where there is more than one heat sink, the heat sinks lie adjacent to each other along the first reference line. A plurality of air flow paths are defined on the top surface of the heat sink base, preferably by fins extending perpendicular to the top surface. Substantially all of the air flow paths direct a flow of air from the top surface center toward the top surface periphery and substantially parallel to the second reference line.

Abstract: Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

Abstract: A heat dissipating device comprises a bottom plate and plurality of heat dissipating sheets. A surface of the bottom plate is formed with a plurality of inclined recesses which are spaced with an equal space. Each inclined recess is inclined to a surface of the bottom plate and has two parallel sides, and every two adjacent recesses are spaced by a respective protruding rib. One end of each heat dissipating sheet has an inclined extending portion which has two parallel sides and is inclined to other portion of the heat dissipating sheet. The extending portions are inserted into the recesses of the bottom plate. By above structure, the heat dissipating sheets are inserted into the recesses of the bottom plate.

Abstract: A heat sink for cooling electrical or electronic devices comprises a spreader plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material comprising alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle.

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprising a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract: A heat dissipation device includes a heat sink (20), heat pipes (30), a frame (40), and a fan (50). Each heat pipe has a lower first connecting portion (32) and an upper second connecting portion (34). The heat sink includes a base (21), and parallel fins (27) attached on the base. The base includes a top plate (25), and defines a hermetically sealed chamber. Apertures (23) are defined in one side wall (22) of the base, the apertures receiving the first connecting portions. Through holes (29) are transversely defined through the fins, the through holes receiving the second connecting portions. The frame includes an upper plate (41), and two side plates (47). Two arms (49) of each side plate secures the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate and to the second connecting portions by phase transition.

Abstract: A heat sink for electronic components having a heat dissipator connected to at least one electronic component and a ventilator designed to supply the heat dissipator with air. The heat dissipator includes at least one thermally conductive plate connected to the electronic component and having a plurality of openings.

Abstract: A heat sink comprises a base portion, and a multiplicity of thin plate fins erected on the base portion in parallel with each other. The fins are folded in two at their lower ends to form two-ply portions and are fixed by having the two-ply portions inserted into grooves formed in the base portion.

Abstract: A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.

Abstract: An electronic apparatus includes a housing, a circuit unit, and an external power supply module. The housing is formed with a circuit receiving space and a module receiving space. The circuit unit is disposed in the circuit receiving space. A set of first contacts is disposed in the module receiving space, and is coupled electrically to the circuit unit. The external power supply module is removably disposed in the module receiving space, and is provided with a set of second contacts to connect electrically with the first contacts so as to enable the external power supply module to supply electric power to the circuit unit when the external power supply module is disposed in the module receiving space.

Abstract: A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more components through the use of pins oriented at more than one angle with respect to the base of the tandem heat sink. An airflow across one or more electronic components is disrupted by the geometry of the different pin angles of the tandem heat sink, thereby creating turbulence which increases the efficiency of the heat sink and prevents thermal shading from occurring. When the heat sink is placed on a single component, the heat sink may be situated without any overhang relative to the component due to the turbulence induced by the different pin angles and the resulting increase in heat dissipation efficiency.

Abstract: A heat dissipation device is mounted to an edge of a circuit board for removing heat from an electronic device mounted on the circuit board. The heat dissipation device includes a contact pad made of thermally conductive material and positioned on the electronic device. A top-and-bottom fan structure includes a casing defining an air passage in fluid communication with a front opening to which a heat sink is mounted and top and bottom openings to which top and bottom fans are respectively mounted. Heat pipes extend between the contact pad and the heat sink. Air is sucked into the casing by the fans and flows through the air passage to the heat sink for carrying heat away from the heat sink. The casing is mounted to an edge of the circuit board with the top and bottom fans respectively located above and below the circuit board. Side openings are defined in the casing for discharging air into upper and lower sides of the circuit board for simultaneously cooling the upper and lower sides of the circuit board.

Abstract: A reconfigurable apparatus for thermal management of an electronics module is described. The apparatus includes a pair of fans generating airflow along respective fan axes. The apparatus also includes a beat sink having one portion disposed in the airflow of the fans and another portion adapted for thermal coupling with the electronics module. The airflows from the fans are in the same direction when the apparatus is arranged in a front-to-back airflow configuration and the airflows are in opposite directions when the apparatus is arranged in a front-to-front airflow configuration. A removable flow director is included in the apparatus when the apparatus is in the front-to-front airflow configuration to direct the airflow from the first fan towards the second fan.

Abstract: A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly each equipped with the heat sink includes a base portion fixedly attached to a circuit board, a contact portion fixedly and tightly brought into contact with one or more electronic devices, and a plurality of heat radiation fins each extended from the contact portion to a certain distance. A heat radiation fin distant from the base portion has a width shorter than of a heat radiation fin nearer to the base portion.

Abstract: A radiation apparatus for dispersing heat generated by a processor of an electronic device includes a radiator bonded to the processor and an axial fan for drawing external air into the casing. The axial fan has a nose-shaped spindle with a nose tip close to the radiator to evenly channel the wind generated by the rotating axial fan to the radiator to disperse heat. Reverse air flow is prevented at the air exit of the rotating axial fan spindle.

Abstract: The present invention relates to a thermal diffuser which having a path for close thermal coupling uniformly between an electronic component mounted in an electronic equipment and a desired thermal conductor, and also to a radiator for radiating heat generated in this electronic component via the thermal diffuser. The object of the present invention is to realize flexible adaptability to various devices which are to undergo temperature control at low cost, and to efficiently achieve the temperature control. For this purpose, the thermal diffuser of the present invention has a plate-shaped structure which can be welded or bonded to the case of the electronic component to undergo heat exchange with the exterior and has a channel formed in mesh by a plurality of protrusions with confined heat medium recirculating therethrough.

Abstract: A cooling fin assembly according to the invention includes a plurality of cooling fins joined with one another for forming a plurality of vertical and parallel cooling fins mounted on a base of a heat sink. Wherein, two sides at a bottom portion of a main body of each cooling fin are provided with a clasp piece, respectively, a bottom edge of the main body is transversely extended and formed with a connecting piece, and an edge of the connecting piece is further formed with a positioning piece by folding upward. When a second cooling fin is butted against a side edge of the positioning piece of a second cooling fin, the clasp piece of the second cooling fin is clasped at the positioning piece of the first cooling fin, thereby fastening and joining the cooling fins to one another.

Abstract: A fin structure is disclosed. The fin structure includes a first concavo-convex portion formed with a concave on a first surface of the fin in the direction of thickness and a corresponding convex on a second surface of the fin in the direction of thickness. Besides, a second concavo-convex portion formed with a first concave and second concave on the first surface of the fin in the direction of thickness and a corresponding first convex and a corresponding second convex on the second surface of the fin in the direction of thickness is included as well. Specifically, the first and second concavo-convex portions are symmetrical respect to the center of the fin. Furthermore, the second convex of the second concavo-convex portion on one fin can be exactly received by the concave of the first concavo-convex portion on another fin.

Abstract: A heat sink fastener for securing a heat sink to a CPU is described as having a holding down spring plate. The holding down spring plate has a flat bearing portion at one end, a first hook plate extended from one end of the holding down spring plate remote from the flat bearing portion, a second hook plate coupled to the flat bearing portion of the holding down spring plate, and a locking lever pivoted to the second hook plate in direction substantially perpendicular to the holding down spring plate and turnable relative to the second hook plate between a locked position and an unlocked position. The locking lever has a cam peripherally supported on the flat bearing portion of the holding down spring plate.

Abstract: The heat sink of the present invention includes a device portion, a bend portion, and a support portion that thermally couples the circuit board component to a support member, thereby allowing for heat transfer from the circuit board component to the support member. The bend portion of the heat sink allows for displacement of the device portion relative to the support portion to limit the amount of stress generated by the heat sink on the circuit board component. The geometry of the heat sink further allows placement of the heat sink within the relatively narrow space conventionally formed between the circuit board and the support member.

Abstract: Disclosed herein is an electronic apparatus that comprises a housing having an outer wall, a receptacle provided in the housing and having an opening made in the outer wall, and a heat-generating component provided in the receptacle and being removable from the receptacle through the opening. The opening is covered with a removable cover. The cover conceals the heat-generating component. A heat-conducting sheet lies between the cover and the heat-generating component. The heat-conducting sheet thermally connects the heat-generating component to the housing.

Abstract: The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion corresponding to the airflow passage. This indentation effectively increases the airflow amount and static pressure of the airflow expelled from the heat dissipation device.

Abstract: An integrated circuit attachment implementation includes a mechanism for inserting and securely holding a replaceable component to an integrated circuit. The mechanism includes a top plate, leaf springs in contact with the top plate, a leaf spring cradle that carries the leaf springs, with the cradle including upper projections that project through corresponding slots in the top plate, a pin inserted through openings in the upper projections, and a linear slide cam located on an upper surface of the top plate between the upper projections and further located below the pin. The cam operates in a first position to transfer a load the replaceable component to securely hold the replaceable component to the integrated circuit and a second position to allow placement of the replaceable component on the integrated circuit.