Abstract: Transportable, medical construction unit with a casing for receiving essentially electronic components with at least two casing parts surrounding the components. For the connection of adjacent casing parts rings are shaped onto the inner wall of the casing parts and coincide with the rings of the adjacent casing part. Locking pins are passed through coinciding rings arranged in aligned manner on a casing wall formed from the two partial casing walls. This ensures a reliable, mechanical connection of the casing parts with a minimum space requirement for the connecting elements.

Abstract: The present invention is to provide an electronic part mounting device including: a lamination body composed of a circuit board and a structural member; an electronic part attached in an opening formed in the lamination body; and an encapsulant layer to encapsulate the electronic part, wherein an outer circumferential line of the opening is arranged inside an outer circumferential line of the encapsulant layer. Due to the foregoing arrangement, in the electronic part mounting device of the present invention, even if the device is bent, the encapsulant layer to encapsulate the electronic part is engaged with the circuit board or the structural member arranged inside the outer circumferential line of the encapsulant layer, so that electronic parts are prevented from coming off. Further, the manufacturing process is simple. Therefore, the cost of the electronic part mounting device can be greatly reduced.

Abstract: A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the peripheral side of a ceramic plate. The solder layer has a portion of an increased solder thickness and a portion of a reduced solder thickness extending along the peripheral direction. When sealing the semiconductor package, a gas confined within the inside of the semiconductor chip mounting site of the package substrate may be discharged from the semiconductor package for realizing hermetic sealing.

Abstract: A sealable housing for electrical components comprises an extruded main body having a first end and a second end, the extruded main body defining a longitudinal axis and having an outer wall and a substantially cylindrical bore. Two end caps are removably sealably attached to a respective one of the first and second ends of the extruded main body to define, together with the substantially cylindrical bore, an electrical component chamber. Thickened longitudinal outer wall segments extend radially outwardly from the cylindrical bore. The electrical components are mounted within the electrical component chamber by being conventionally attached to a trolley, which trolley is longitudinally interfitted to a mounting track contiguous with the extruded main body. The extruded main body is preferably constructed from aluminum.

Abstract: An aluminum nitride housing is molded which includes open holes that pass through the walls. A lead frame is formed by machining or chemically milling individual leads and details therein to form desired circuitry patterns. The lead frame is inserted through the open holes in the aluminum nitride housing and chemically and mechanically bonded thereto using active braze The active braze attaches the lead frame not only to the open holes in the package, but also to the wall of the housing over a larger area. Active braze forms a strong bond between the aluminum nitride and the lead frame, and also forms an excellent and highly reliable thermal junction therebetween. Several different package constructions are illustrated. In one design the aluminum nitride takes on a bathtub configuration onto which a flat cover may be attached.

Abstract: An electrical device package includes an aluminum header having a gold-coated sealing surface and an electrical device mounted within the boundary defined by the sealing surface. An annular gold-coated stainless steel seal ring registers with the sealing surface of the header. An annular bonding layer of a gold-tin alloy lies between, and registers with, the sealing surface of the aluminum header and the stainless steel seal ring. The electrical device is fastened to the header using an electrically and thermally conductive epoxy adhesive. A stainless steel cover has a flange which is welded to the seal ring to form a hermetically sealed package.

Abstract: A printed circuit board carries a microcircuit package electrically connected to bare copper connector pads on the printed circuit board microcircuit package by aluminum wires. The copper connection pads are encapsulated by a material such as low stress liquid encapsulant having a thermal expansion coefficient approximately equal to that of the printed circuit board substrate material. Preferably the printed circuit board laminate comprises cellulose epoxy mat such as CEM-1.

Abstract: A hermetically sealed housing for plural GaAs chips includes a body made from Al/SiC. The body defines a peripheral seal ring support surface, an electrical connector insert support surface and an end wall to which a ceramic insert is mounted. The insert includes a first portion with an upper surface within the sealed housing, Which upper surface is coplanar with the upper surface of the body, for convenient HDI film connections to the chips and electrical connector inserts. The refractory electrical conductors extend from the upper surface of the first portion of the insert to an exterior terminal portion of the insert. The terminal portion of the insert is spaced from the first portion of the insert by a non-terminal portion containing no terminals. The non-terminal portion of the insert is coplanar with the seal ring support surface of the body, and contiguous therewith.

Abstract: A circuit package for a varistor chip includes a housing made of an electrical insulating and burn-resistant composition. The housing includes a surrounding wall with upright front and rear wall portions and opposite side wall portions which interconnect the front and rear wall portions and which have lower sections that are formed with aligned pairs of wire holes, and a bottom wall connected to a bottom end of the surrounding wall. Each of two electrical contact pieces is disposed inside the housing and is located adjacent to a respective one of the front and rear wall portions of the surrounding wall. The contact pieces receive the varistor chip therebetween and are provided with contact portions that abut against the varistor chip. Each of the contact pieces has opposite sides formed with a pair of contact tabs. Each of the contact tabs is juxtaposed with a respective one of the wire holes and is used to establish external electrical connection with the varistor chip.

Abstract: An enclosure for protecting a heat sensitive item from high temperatures and shock which includes: (a) an outer housing including an inner cavity for containing at least one heat sensitive item; (b) a thermal insulator located within the inner cavity defining at least a portion of a second interior cavity, with the at least one heat sensitive item being located within the second interior cavity; and (c) a boiler located within the second interior cavity including at least one containment compartment for containing a thermal mass and at least one protective compartment within which the at least one heat sensitive item is located. The invention finds particular utility in the Flight Recorder field where heat sensitive components, such as solid state memories, may be subject to fire and shock often resulting from an aircraft crash. The invention also features a corrosion protection capability which is effective when the item being protected is in close proximity to a source of moisture.

Abstract: A thin hermetically sealed electrical feedthrough suitable for implantation within living tissue permits electrical connection between electronic circuits sealed within an hermetically sealed case and electrical terminals or contacts on the outside of the case. The hermetically sealed case is made by hermetically bonding a cover to an insulating layer. The hermetically sealed electrical feedthrough is made by depositing a conductive trace on the insulating layer and then depositing another insulating layer thereover, so that the conductive trace is hermetically encapsulated within the insulating layers. At least two spaced-apart openings are formed in the insulating layers before bonding the cover thereto, exposing the conductive trace. Additional conductive material is then inserted within each of the openings or holes so as to form conductive vias that make electrical contact with the conductive trace.

Abstract: An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via an adhesive (15). The cap (14) is permeable to gases including water vapor. The side-walls (18) of the cap (14) are made of a porous ceramic material which absorbs a portion of the adhesive (15) via capillary action while curing the adhesive (15).

Abstract: A sensor for detecting the angular velocity of a rotating member. The sensor includes a bobbin having an exterior defining an annular recess and a coil within the recess. The bobbin also has a generally cylindrical aperture and supports a probe and a permanent magnet in the aperture. The housing is secured to the bobbin and the housing and bobbin include tapered inner and outer surfaces, respectively, that are made to form a wedge fit seal between the bobbin and the housing to prevent the introduction of molding material during the overmolding process. The bobbin also includes supports for supporting the lead wires extending between the coil and the terminals.

Abstract: A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first of the main surfaces of the circuit board; molding said circuit board and said functional part in a resin with a second main surface of said circuit exposed and forming a battery lodging section in the resin molding defined by the through-hole; and mounting a battery in said battery lodging section and electrically connecting the circuit pattern to the battery.

Abstract: A personal data storage device for storing information and a system for storing and reading such information from the storage device. A programmable memory is encapsulated in a potting compound which includes a plurality of channels enclosing leads of the memory package. The channels extend to the outside of the encapsulated memory to permit exterior contact with the memory leads. A conductive sealant placed in the channels for sealing the channels of the encapsulated flash memory makes electrical contact with the leads. A device for reading the information from the data storage device includes a PCMCIA interface which can read and write data to and from the personal data storage device and a computer. The computer further includes programming for compressing and decompressing data which is stored and read from the personal data storage device.

Abstract: The internal space of the case is divided into first housing portions and a second housing portion separated from the first housing portions by a partitioning wall. A positive characteristic thermistor element is housed in the second housing portion. At least two terminal members are provided, each with a contact terminal portion, a conductive portion and a lead-out terminal portion. The contact terminal portions are positioned in the second housing portion each in contact with one of the electrodes of the positive characteristic thermistor element. The conductive portions are electrically continuous to the contact terminal portions and are led to the first housing portions through the partitioning wall. The lead-out terminal portions positioned in the first housing portions, are electrically connected to the conductive portions and led out to the outside at the first housing portions.

Abstract: An electronic control module (10) includes a package substrate (12) having an interior cavity (28) through which a package lead (22) traverses. The interior cavity (28) is filled with an expandable polymer material (34). The expandable polymer material (34) is constrained within the cavity by a pressure resistive layer (32, 35) that overlies expandable polymer material (34) In one embodiment, an epoxy layer (32) forms an upper surface of the interior cavity (28). The expandable polymer material (34) is responsive to a fluid, such that upon contact with a fluid diffusing along the package lead (22), the expandable polymer material (34) will swell and form a fluid-tight pressure seal around the package lead (22). The fluid-tight pressure seal prevents the fluid from diffusing to interior portions of the electronic control module (10) and causing the failure of electronic components (18) mounted within the electronic module (10).

Abstract: An enclosure for electronic circuits intended to operate at great depths beneath the sea in which the circuits are protected from stresses induced by the accumulation of mechanical tolerances during assembly, from shock during transportation, and from deformation of the enclosure at great pressure. The circuits being accessible in their final configuration during testing before insertion into the enclosure and sealing. Cable lengths within the enclosure are minimized to ensure reliability.

Abstract: A splashproof construction for a portable electronic device, comprising an electronic device main unit, and a battery pack to be mounted on the electronic device main unit, whereby one of either the electronic device main unit or the battery pack has a boundary surface formed along a combined surface and a peripheral edge and with a graded step with respect to the combined surface, and a guide rail provided adjacent to the boundary surface, and the other of either the electronic device main unit or the battery pack has a peripheral wall aligned with the boundary surface and a guide groove to be slidably engaged with the guide rail, or a bottom wall of the peripheral wall has a notch abutting on a lower surface of the graded step on the boundary surface, or a water-repellent sheet is provided at the bottom of the guide groove, or a seal plate made of a highly elastic material is provided either on an end surface of the battery pack abutted on the electronic device main unit at an end point of sliding when the

Abstract: A method and apparatus for hermetically sealing implantable devices, such as a microstimulator, moicrotransducer, microtelemeter, or the like, prevents entrapment of water vapors and other volatile gases, and allows hermeticity testing at all manufacturing levels. The venting of water vapors and other volatile gases is accomplished with a tubular feedthrough that allows such gases trapped within the sealed device to vent during the manufacturing process. The tubular feedthrough also establishes a conduit through which leakage tests or other hermeticity tests can be conducted prior to and after sealing the feedthrough. The tubular feedthrough, when made from conductive materials, also provides for electrical connections between electronic circuits sealed within the device and electrodes and other electrical terminals on the outside of the capsule.

Abstract: The hermetically sealed package for an electronic device of the present invention comprises a body containing an electronic device therein and a covering member, such as a cap or a lid, for covering the body. The package is characterized in that the covering member of the package comprises a metal foil, and the covering member and the body are sealed together with a resin adhesive.

Abstract: A digital multimeter is provided with a highly reliable seal at a connection interface between an upper and lower enclosure forming an enclosure. The multimeter also has a highly reliable seal at peripheral boundaries of operating elements disposed on a surface of the enclosure thereby providing a highly-reliable, water-proof and dust-proof mechanism at a low cost. A packing serves as an elastic sealing material and is disposed at the connection interface between the upper enclosure and the lower enclosure. The packing is pressed and crushed in a slant direction relative to the direction of the thickness of the enclosure thereby providing a sealing mechanism at the connection interface. The periphery of a rubber key serving as an operating element is sealed by a double sealing mechanism comprising an uneven face formed on a peripheral side and an even face formed on the upper enclosure.

Abstract: This invention is a magnetic-field sensor assembly comprising a preformed housing shell having a first end which includes an opening, and a second end which includes a window and having a cylindrical shape with a flattened portion to produce a truncated circular cross-section, a sensor package including an integrated-circuit magnetic-field-sensor chip encapsulated in a protective body with first and second opposite and mutually parallel faces and a plurality of integral conductive leads, each lead having a proximal portion, a distal portion, and a central portion, the proximal portion of each of said plurality of leads extending from said body, the central portion of said plurality of leads extending away from the body and positioned substantially normal the faces of the body, said sensor-package body being positioned in said housing shell part way through said window with said one body face extending outwardly from said housing shell and with said lead distal portions extending from said housing shell throug

Abstract: A water-proof sealing structure for an electric junction box including a main box having a first fitting portion and a water-proof covering having a second fitting portion to be mated with the first fitting portion; wherein either the first or second fitting portion is integrally formed with an elastomer-made fitting groove having a narrowed portion therein, while the other fitting portion is formed with a locking projection wall provided with a stopper; wherein the locking projection wall is suppressed by the narrowed portion when inserted into the fitting groove, forming simultaneously an air-keeping section between a top end of the locking projection wall and an innermost portion of the fitting groove.

Abstract: A variable reluctance sensor including a close-ended hollow housing which contains and thereby protects the operative components of the sensor. The sensor includes a bobbin portion interconnected with a connector member attachable to a submersible connector. An elongated pole piece extends through a bore in the bobbin barrel and press fits into a cavity in the connector member. A magnet is disposed at the end of the pole piece, and a magnet wire coil is wound around the bobbin barrel and electrically connected with conductors in the connector member. An outer hollow housing, which surrounds the bobbin portion, includes an open end portion which is ultrasonically welded to the connector member. After ultrasonic assembly of the housing to the connector member, the magnet rests against the opposite, close-ended portion of the housing. In an alternative embodiment, the housing and bobbin portion may be keyed to ensure proper assembly, and further a leaded sensor may be provided.

Abstract: Telecommunications overvoltage protectors are sealed from environmental degradation by a gel. The gel is inserted in such a way as not to interfere with moving parts or air gaps in the protectors.

Abstract: A sealable, latchable door assembly for use with a hand-held, portable electronic device that has a housing adapted to removably receive a memory card in a receiving chamber through an opening. The door assembly includes a door shaped and sized to removably cover and seal the opening in the housing to retain and protect the memory card. The door has an engaging face adapted to sealably engage the housing around the opening. A connecting member attached to the door is slidably mounted within the housing to allow the door assembly to be slid between an extended, disengaged position and a retracted position with the door in a closed, sealed position. A latch attached to the door is adapted to releasably engage the housing to secure the door in the closed, sealed position. A hinge connected between the door and the connecting member enables the door to be pivoted downward to an open position to allow uninhibited passage of the memory card through the opening in the housing.

Abstract: An environmentally sealed electronic test instrument having a three-part case enclosing an electronic testing circuit of conventional design. The three parts are open-ended top and bottom parts, and an end part covering the open ends of the top and bottom parts. The top and bottom parts have adjoining sidewalls between which is positioned a first resilient seal. Respective inwardly extending flanges are formed at the open ends of the top and bottom parts. The flanges are received by a second, U-shaped seal that is, in turn, received by a U-shaped channel formed along a marginal edge of the end plate. A pair of fingers integrally formed in the second gasket project into the U-shaped channel and are positioned between the first seal and top part of the case. The side marginal edge of the bottom part of the case are recessed within the sidewall of the top part of the case to enclose the first gasket.

Abstract: A seamless, light weight container that provides two levels of liquid and gaseous containment. The container has removable covers that have a double seal which allows confirmation of seal integrity prior to shipment by applying a vacuum or pressure to the internal space between the inner and outer seals. This close-out vacuum or pressure test can be completed within minutes and it provides certification that the container seals meet design criteria for quick turn-around in spacecraft environments.

Abstract: The components (13, 14) are mounted on a two-faced printed circuit (22) fened to a metal heat-conductive substrate (12) which is integral with the housing and to which a connector (8) is electrically connected which is also integral with the housing and is arranged on the same side of the substrate (12) as the printed circuit (22). The metal heat-conductive substrate (12) has a cutout to serve as support for the connector (8) which is soldered on the face of the printed circuit (22) facing the substrate (12) at the place of the cutout. The invention is advantageous for switches associated with computer controlled actuators.

Abstract: A sealing construction for an electrical connection box, in which a waterproof cover is mounted on a main body, including a packing which is fitted into a packing groove of the waterproof cover so as to be brought into pressing contact with a contact portion of the main body; the packing being formed by hardening liquid packing compound injected directly into the packing groove of the waterproof cover, and a method of forming the packing.

Abstract: The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body or a metal or metal containing body. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform by molten matrix metal, the infiltrated material is bonded to said second material, thereby forming a macrocomposite body. The macrocomposite body may then be coated by techniques according to the present invention to enhance its performance or bonding capabilities.

Abstract: This invention relates to an article comprising a potted electrical component in a structure, wherein the electrical component is potted in a polyimide composition. The invention also relates to a method of potting electrical components comprising the steps of (1) adding a polyimide precursor to a structure including an electrical component, (2) curing the polyimide precursor to form a polyimide composition encapsulating the electrical component.

Abstract: An electronic circuit equipment including a substantially box-shaped case body 30 for defining a sealed interior space therein and an electronic circuit board 11 having a plurality of electronic components 12 mounted thereon. The case body comprises a pair of cup-shaped sections 30a clamped together at their opposite ends, and sandwiching between them the circuit board, surrounded and sealingly enclosed by a gas-impermeable flexible sheet 32. A vent hole 20 is provided in one of the sections 30a such that the sheet 32 flexes to absorb pressure fluctuations, and prevents the circuit board from bending.

Abstract: A penetrator and flexible circuit apparatus comprises a penetrator housing having a passageway through which at least one elongated flat flexible circuit having a plurality of parallel electrical traces is placed. A retention material substantially occupies the passageway to retain the flexible circuit in the passageway, to establish a hermetic seal of the flexible circuit within the penetrator and to thereby seal the interior of a computer which is cooled by cooling fluid from its exterior environment.

Abstract: A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.

Abstract: A multichip electronic module comprising a base for holding various components and a lid for sealing the module, is temporarily closed by a reworkable seal made from a thermoplastic material. The seal is hermetic so that the module can be tested under ambient conditions approximating actual use. If the module fails the functional test, the lid is easily removed for repair. The thermoplastic material is located in a special grove near the periphery of the base or lid next to the mating surfaces which form part of a final seal for the module. After a module has been repaired, the lid is finally soldered or welded to the base using portions of these mating surfaces which are free of the thermoplastic material. There is no need to remove the thermoplastic material used for the temporary seal.

Abstract: There are provided polymer plugs for sealing the vent hole of an adhesively sealed electronic package. The polymer vent hole plug is selected to be either an ultraviolet curable polymer or a thermosetting polymer resin. One effective vent hole plug is a cylindrical plug having a diameter under 1.4 millimeters formed from a UV-curable epoxy.

Abstract: An electronic device (100) comprises a circuit carrying substrate (300) having an electronic circuit pattern (301) formed thereon, at least one component (302) having leads (304) for electrically coupling the at least one component (302) to the electronic circuit pattern (301) formed on the circuit carrying substrate (300), and a thermoplastic coating (200, 200') for covering the leads (304) of the at least one component (302) to insulate the leads (304) thereof.

Abstract: An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is used to provide reinforcement for the solder-lead connections, the encapsulant material being dispensed only along opposing sides of the package's housing which do not include projecting leads (and which are oriented substantially normal to the stresses imposed on the package during operation wherein high temperatures are attained). This dispensing may follow solder reflow and solidification. The invention is particularly useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

Abstract: According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.

Abstract: An electronic device (100) has a heatsink (116) and electrical contacts (120) which are originally all part of a support frame (200). After assembly, the border of the support frame (202) is broken off, thereby electrically isolating the electrical contacts (120) from one another, and from the heatsink (116). The electrical contacts (120) and the heatsink (116) are coplanar. In one version, the electrical contacts (120) do not extend past the circuit board (102) of the device (100).

Abstract: The present invention provides a new and effective method for the sealing and electrical testing of electronic devices; and particularly for surface acoustic wave devices. In accordance with the present invention, the cost and size of making hermetically sealed packages for electronic devices and of electrically testing each device is significantly reduced over the prior art by making use of mass simultaneous sealing and electrical connection at the wafer level, and by using substrates with hermetically sealed and electrically conductive via holes. Further, cost reduction is effected by making use of final electrical testing with wafer probe test techniques before dicing.

Abstract: An electronic circuit equipment including a substantially box-shaped case main body (10) for defining a sealed interior space therein and an electronic circuit board (11) having a plurality of electronic components (12) thereon. The case main body (10) comprises a case body (13) and a flat plate-shaped lid (17) positioned properly with respect to the case body (13) to seal the interior space. A vent hole (20) is formed in the bottom wall of the case body (13) for communicating the interior of the case body (13) with ambient atmosphere. A cover member is attached to the case body (13) to cover the vent hole hermetically. By using a cover member, the interior space of the case body (13) is sealed for protecting electronic components (12) on the electronic circuit board (11) from moisture and rainwater and, for absorbing a pressure fluctuation therein. A mounting flange extends from the case body and surrounds the vent hole. The cover member is a flexible diaphragm with a circumferential bulge.

Abstract: The front panel of a control panel is provided with a recess for receiving a keypad. The recess is larger than the keypad to define a channel between the edges of the keypad and the sides of the recess. A sealant fills the channel to provide a smooth transition between the front panel and the keypad that protects the edges of the keypad and prevents the entry of moisture and debris into the channel. The control panel can be assembled by fixing the keypad within the recess, placing a temporary barrier over the top surface of the channel, and introducing the sealant into the channel. The sealant can be introduced through one or more ports in either the front panel or the temporary barrier. The temporary barrier is removed when the sealant hardens within the channel.

Abstract: A method for manufacturing a hybrid circuit-type charge-coupled device image sensor includes the steps of: forming a lead wire unit on a first layout surface of a ceramic base; attaching a charge-coupled device image sensor die on the first layout surface; wire bonding the charge-coupled device image sensor die to the lead wire unit; mounting a window frame on the first layout surface to enclose the charge-coupled device image sensor die by applying a layer of sealing material on a lower peripheral end of the window frame; mounting a glass lid on the window frame by applying another layer of sealing material on an upper peripheral end of the window frame; and heating an assembly of the glass lid, the window frame and the ceramic base in an oven so as to cure and harden the layers of sealing material and bond together the glass lid, the window frame and the ceramic base.

Abstract: A high frequency IC package includes a dielectric package body having a surface, a high frequency signal transmission line and a power supply line disposed on the surface of the package body, a high frequency IC chip disposed on the surface of the package body and electrically connected to the high frequency signal transmission line and the power supply line by wires, and a lid hermetically sealing and shielding the IC chip. The lid includes a plane part parallel to the surface of the IC chip and side walls, perpendicular to the plane part, surrounding the IC chip. Since the side wall is not present on the surface of the package body but included in the lid, during the wire-bonding process of the IC chip, unfavorable contact between the cavity wall and bonding tool is avoided, reducing the lengths of bonding wires and signal transmission lines. As the result, reflection loss, conductor loss, and cavity resonance are reduced.

Abstract: An apparatus (105, 301) for enclosing a microfabricated component (225) includes a package base (120, 405, 910), a package lid (110, 510, 950) and a seal (215) coupled to the package base (120, 405, 910) and to the package lid (110, 510, 950). The apparatus (105, 301) further includes a conductive loop (210, 610, 920) thermally coupled to the seal (215). Electrical energy is supplied to the conductive loop (210, 610, 920) to heat the conductive loop (210, 610, 920) and seal (215) to melt the seal (215) and thereby to seal the package base (120, 405, 910) to the package lid (110, 510, 950), providing a sealed environment for the microfabricated component (225).

Abstract: A magnetic sensor is provided with a housing in which a carrier is inserted. The carrier is particularly shaped to retain a permanent magnet in a particular position relative to a plurality of electrical conductors and a substrate on which a magnetically sensitive component is attached. The carrier and its associated components is inserted into a housing which can be deformed to permanently retain the carrier within a cavity of the housing. All of the components of the sensor are designed to be easily assembly along a common axis to facilitate automatic assembly and manufacture of the sensor. The magnetically sensitive component can be a Hall effect element that is associated with other electrical components which are also attached to a substrate that is disposed proximate a front end of the carrier.

Abstract: The present invention pertains to an electronic package. The package has an internal portion having reinforcement, which is infiltrated with metal. There is a pure metal skin about the internal portion such that the internal portion is hermetically sealed. The metal skin is comprised purely of the metal infiltrated within the reinforcement and forms a continuum with the metal within the reinforcement.