Abstract: An integrated circuit package utilizing low temperature sealing glass and having reduced lead capacitance. Voids in the glass material on the base substrate and the cap substrate result in the formation of glass-free cavities when the base substrate is fused to the cap substrate. A lead frame extending from and passing through the glass material which couples the base substrate to the cap substrate also passes through the glass-free cavities, resulting in a reduced parasitic capacitance of the package leads.

Abstract: A water-tight structure for a multicore cable includes a sealed vessel in which electrical components are arranged, and a grommet having an insertion hole disposed at a multicore cable lead portion of the sealed vessel. The multicore cable is held in the insertion hole of the grommet and has a solder-dipped portion in the grommet which has been bent, a portion of the solder-dipped portion being covered with a metal sleeve.

Abstract: Electronic circuits (11,12) are mounted on a metal base (13). The metal base is covered by a mold resin case (16) at the peripheral portion thereof. A projected portion (29) is formed along all the peripheral edge portion of the metal base. A step portion is formed to the metal base next to the projected portion of the metal base. A groove (28) is formed along all the peripheral portion of the bottom surface of the mold resin case. The projected portion is engaged to the groove which is filled with a bonding material (33). The bottom surface of the step portion is also covered by the bonding material when the projected portion is thrust into the groove of the mold resin case.

Abstract: A box-like or sleeve-like piezoelectric resonator housing which can be sealed hermetically having connection conductors suitable for surface mounting, consisting of two housing parts which can be connected together, connection conductors being led through a housing part in an insulated manner and at least one further connection conductor being connected to the housing part. The housing is divided into two parts along a diagonal plane to render components mounted in the lower part accessible after the lower part is mounted on a surface and before the upper part is joined to the lower part.

Abstract: A chip carrier including a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect the pads. The chip carrier also includes an integrated circuit chip having a plurality of leads connected to corresponding ones of the pads. A first metal frame is included which is soldered to the upper surface of the substrate so as to surround the integrated circuit chip. The chip carrier also includes a second metal frame which is seam-welded to the upper end of the first metal frame so as to surround the integrated circuit chip and a plate is soldered to the upper end of the second metal frame so as to cover the integrated circuit chip.

Abstract: A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion.

Abstract: A device for the external connection of electrical cables electrically connected to component elements disposed within a container body comprising ordered housing means through which pass these cables which extend out of the container body.

Abstract: Capacitor bodies are usually carried in open ended containers. The open ends are then closed with a cover or capacitor top after the capacitor body is inserted in the container. Electrical leads are then attached to terminals carried by the capacitor top. Prior art methods of forming such tops involved insert molding. The present invention starts with a preformed plastic disc with two apertures for terminals and a boss for positioning lead attachment. The terminals and a positioning lead are then applied to the disc through a combination of riveting and ultrasonic swaging.

Abstract: A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallization that adheres to the ceramic and is wet by solder. The metallized ceramic lid is sealed to the metallization ring on the sidebrazed ceramic body by means of the conventional gold-tin solder. The resultant hermetic seal can be inspected by observing the solder fillet in the lid recess. Such a closure seal is fully hermetic and can readily survive repeated thermal cycling.

Abstract: In a shield structure of an electronic equipment including a printed circuit board on which electronic parts are mounted, a box having an upper opening for receiving the printed circuit board, and a shielding planar cover for shieldably covering the upper opening of the box, the cover being soldered at its peripheral edge to a side wall of the box; the improvement is characterized in that the peripheral edge of the cover is arcuately downwardly bent.

Abstract: A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers so that a surface of each of the deformed spacers lies within a single plane. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded.

Abstract: A printed circuit device including semiconductor IC chips on the surface of a printed circuit board made of insulating material. The printed circuit board includes on the surface thereof semiconductor mounting regions and conductive layers. The semiconductor IC chips are respectively fixedly mounted on the semiconductor element mounting regions disposed on the printed circuit board. Thin metal wires interconnect electrodes of the IC chips with the conductive layers. A sealing cover plate having a plurality of recesses formed therein is fixedly mounted onto the surface of the printed circuit board with adhesive for hermetically sealing each of the IC chips and electric wires with a respective one of the recesses in the cover plate. The cover plate can comprise a composite of a thermoplastic resin material layer and a metal layer, such as aluminum or an aluminum alloy.

Abstract: A housing suitable for an electrical or electronic component such as a relay, including a wall having apertures (5, 6) and gaps (7) wherein distribution ribs running on the outside form with the housing surface a sharp inner edge (10). Due to these sharp inner edges, capillary action of the sealing compound is developed on the distribution ribs whereby the sealing compound is transported from a dispensing site to the apertures (5, 6) and housing gaps (7).

Abstract: An integrated down converter and interdigital filter apparatus having a down converter and the interdigital filter mounted on the same printed circuit board and installed in the watertight housing. The housing of the interdigital filter is cut from sheet metal and a conductive surface on the printed circuit board as one side. A method for construction of the interdigital filter is also set forth.

Abstract: A sealed enclosure is provided for electrical circuitry to be located in a moist environment, as near a spa. The enclosure includes a housing of electrical insulating material, a display overlay adhesively bonded to the housing and covering certain openings in the housing for switches and displays, and a retaining bezel over the graphic overlay. Relief porting is provided in the bezel, and preferably also through a flange in a contiguous portion of the housing for assuring that water deposited on the display overlay will be drained away and thus not degrade the seal between the overlay and the housing.

Abstract: A housing having an inner part radially inside of an outer part so as to form a hollow space therebetween. The outer part has two opposite end portions which radially extend inward toward the inner part so as to further define the hollow space. The end portions and the inner part form interengaging projections and grooves. The inner and outer parts are composed of different materials with different heat expansion coefficients. The interengaging projections and grooves are thermally expanded against each other to effect a moisture-tight sealing of the hollow space.