Abstract: A semiconductor device includes a case, a circuit substrate set in the case and having an electric circuit formed thereon, and a plurality of terminals arranged in the case by being spaced apart from each other, each terminal having a base portion electrically connected to the electric circuit in the case, and a trunk portion bent by forming a fold between the base portion and the trunk portion so as to rise from the base portion at the end of the base portion, the trunk portion having a press-fit portion formed at its distal end, wherein the fold is inclined relative to a longitudinal axis of the base portion, and wherein restitution directions in which the press-fit portions restitute from their contractions caused by press fitting are turned aside one from another between each adjacent pair of the terminals.

Abstract: A mold structure for a light-emitting diode (LED) package. The mold structure includes a notch, which is formed at at least an end portion of a package mold, in which a cavity is formed to mount a LED therein. Furthermore, an electrode lead, may be formed at at least an end portion of the package mold and may be closely attached to the package mold, and thus the overall size of a LED package may be reduced.

Abstract: A housing for an optoelectronic component comprises a housing body and first and second electrical terminal strips. The first and second terminal strips extend in part inside the housing body and are guided out of the housing body at a first side face. Outside the housing body the two terminal strips are bent in such a way that they comprise a first portion extending at an angle to the first side face, and a second portion (11d, 12d) extending along and spaced from the first side face. A method for producing such a housing is also described.

Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.

Abstract: An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.

Abstract: A terminal electrode body on a substrate is exposed relative to a resin layer, protruding out beyond the side of the resin layer. That is, the terminal electrode body is not covered by the resin layer. The electronic element is covered by an insulating layer and the terminal electrode body and the electronic element are electrically connected. Hence, an electric signal applied to the terminal electrode body can be transmitted to the electronic element. A cover layer covers the terminal electrode body and the boundary between the terminal electrode body and the resin layer.

Abstract: A housing cage (1) comprising walls (2) defining sides of the housing cage and having wall sections (3). A plurality of contact surfaces (4), each of which is connected to one of said wall sections, are arranged so as to support built-in modules which are held in the housing cage (1). Each of the wall sections (3) is connected only on one first side (5) to its associated wall (2) of the housing cage (1), and the other sides of the wall sections (3) are spaced from the associated wall (2) of the housing cage (1) by incisions (6) in said associated wall, so that each of the wall sections (3) can be bent along the first side (5) with respect to its associated wall (2) of the housing cage (1).