Abstract: A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section. The plating liquid flows spirally from the lower end of the gap to the upper end by action of a vortex producing flow path (29) communicating to the lower end of the gap. The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.

Abstract: There are provided a water treating method and water treating apparatus which can significantly improve an effect of eliminating microorganisms contained in water intended for drinking and cooking or waster water and a hydroponics system using the apparatus.

Abstract: Large quantities of low cost hydrogen free of carbon oxides are required as fuel for the hydrogen economy. Commercial quantities of hydrogen can be produced from the electrolysis of water using a diaphragm-less electrolytic cell. The electrolytic cell has an anode cell (31) and a cathode cell (32) connected by a DC power source (53) and an external conductor (52). An alternate apparatus method to produce hydrogen is to electrolyze water using unipolar activation. Unipolar activation uses separate anode and cathode circuits and can use secondary cathode (132) and anode (139) cells to recover energy and produce further hydrogen.

Abstract: A plating process apparatus (1) for small objects, including a treatment cell (2) formed by combining a base plate (23), a bottom plate (24), an electrode ring (21) and a cover (25) using bolts (26), energizes a plating solution within the treatment cell (2) while bringing the small objects (100) into contact with the electrode ring (21) and circulating the plating solution (4) from the inside of the treatment cell (2) to the outside thereof through a flow-out means by rotating the treatment cell (2) with a vertical rotation shaft (3), thereby plating the small objects (100). The apparatus (1) is characterized in that the flow-out means is a gap channel formed between adjacent sheet members (61) by sandwiching the sheet members (61), each having a dimension smaller than a minimum dimension of each small object (100), between the bottom plate (24) and the electrode ring (21) circumferentially at appropriate intervals.

Abstract: An apparatus for industrial wastewater treatment and the electrolytic recovery of metals from solutions is disclosed. It comprises two or more plates with electricity conducting surfaces arranged in parallel and separated by insulating gaskets, two heads and a hydraulic ram or other mechanical means to press the group of plates between the heads. Plates and gaskets pressed together form chambers where metal recovery and other electrochemical reactions take place. Holes bored on the plates or on the gaskets separating them allow the solutions to flow in and out of the chambers. The solutions in the chambers close the electrical circuit between the conducting surfaces of the plates and allow an electrical current to flow from one plate to the other closing also a circuit between the terminals of an electrical current source.

Abstract: An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed.

Abstract: A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink.

Abstract: A membrane electrode assembly incorporating an encapsulation assembly process that separates the counter-electrode, and the electrocoat medium from contacting the electrode, which is located behind the membrane ion exchange layer. The encapsulation process provides of method of singularly encasing independent components that comprise the membrane electrode assembly, without the assistance of first structures used in enclosure, framing, enclosure sealing or bonding the components in place, individually, and or in groups thereof from the electrocoat medium, while providing an internal chamber within the membrane electrode assembly, for independent fluid circulation.

Abstract: A thermoelectric conversion apparatus has an evaporator for heating a working medium in liquid-phase to evaporate the working medium, an electric generator for forming a concentration cell for electric power generation when it is supplied with a reactive gas and the working medium evaporated by the evaporator, and a gas-liquid separator for being supplied with a mixed gas of the working medium and a cathode off-gas discharged from the electric generator and separating the mixed gas into the working medium and the reactive gas. The thermoelectric conversion apparatus also has an anode supply passage for supplying the reactive gas separated by the gas-liquid separator to the electric generator, and a cathode supply passage for supplying the working medium separated by the gas-liquid separator through the evaporator to the electric generator.

Abstract: A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process.

Abstract: It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as copper, or metals with high hydrogen overpotential, for example tin, aimed at restoring both the concentration of said metals, and the pH in galvanic baths used in electroplating processes with insoluble anodes. The cell of the invention comprises an anodic compartment, wherein the metal to be dissolved acts as a consumable anode, and a cathodic compartment, containing a cathode for hydrogen evolution, separated by a cation-exchange membrane. The coupling of the cell of the invention with the electroplating cell allows a strong simplification of the overall process and a sensible reduction in the relevant costs.

Abstract: Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.

Abstract: A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.

Abstract: A system and method for treating ballast water within an ocean going vessel by generating hypochlorite for treating the ballast water. The system comprises one or more hypochlorite electrolytic cells in fluid communication with a stream of ballast water. A chlorine analyzer is positioned downstream from the electrolytic cells to determine the chlorine concentration of the treated ballast water. A hydrogen separator is connected to the hypochlorite electrolytic cells for venting hydrogen. In the method of this invention, water is taken aboard the ship for ballast in one port. A treatment stream is separated from the ballast water stream and piped to hypochlorite electrolytic cells. Hypochlorite is generated into the treatment stream and the hydrogen byproduct is separated by the hydrogen separators. The treatment stream is then reintroduced to the ballast water to eliminate marine species and pathogenic bacteria from ballast water.

Abstract: The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.

Abstract: An electrochemical cell design is disclosed for the particular application of the electrochemical treatment of contaminants in water. The cell is designed to allow the treatment of low concentrations of contaminants in low conductivity water efficiently, and to be simple to fabricate. The design incorporates tapered inlet and outlet fluid flow manifolds so that the cell pressure drop will be almost entirely due to fluid contacting the electrodes, thus maximising the effective use of the system pump power. A short anode to cathode distance and thin working electrodes are used to minimise resistive electrical power losses. The parallel slacked arrangement of the electrodes and the smooth inlet and outlet designs leads to relatively even distributions of current density and mass transfer resulting in maximal utilisation of the entire active electrode surface area.

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract: There is provided a water treating method which can not only improve an effect of eliminating microorganisms in water intended for cooking and drinking or waste water but also prevent a reduction in trace amounts of nutritional elements. In the method, at least a pair of carbon fibers capable of collecting at least microorganisms are immersed in for-treatment water, potentials of opposite polarities are applied to the carbon fibers, and the polarities of the potentials are switched at a predetermined time interval so as to adsorb the microorganisms on the carbon fibers. After the microorganisms are adsorbed, a positive potential is applied to one of the carbon fibers, and a negative potential is applied to the other so as to cause electrolysis. Then, an alternating voltage is applied to the carbon fibers so as to heat the for-treatment water and the carbon fibers.

Abstract: The invention relates to an apparatus for electrolytic purification, comprising: (a) a pressure vessel having at least one access opening, at least one fluid flow inlet, and at least one fluid flow outlet, wherein the fluid flow inlet and fluid flow outlet are in fluid communication with a chamber inside the pressure vessel; (b) an removable electrode assembly, at least a portion of which is disposed within the chamber inside the pressure vessel, comprising: a plurality of substantially parallel spaced planar electrodes, an electrical coupling between the electrode plates and a voltage source, and a radially extending circumferential sealing plate substantially normal to the planes of the electrodes, disposed near the electrical coupling, adapted to prevent fluid flow from the chamber to the electrical coupling; (c) a removable locking ring, comprising: a proximal portion adapted to removably attach to the access opening of the pressure vessel and retain the radially extending circumferential sealing p

Abstract: An electrocoagulation treatment device includes a plurality of spaced reaction plates disposed within a reaction chamber. A voltage is applied to selected reaction plates to create an electrical field within the electrocoagulation chamber. The plates are arranged vertically which induces a vertical flow of liquid through a device. Gases formed in the electrocoagulation process are allowed to rise and can be vented to the atmosphere. The solids which precipitate out of the liquid stream are carried by the liquid stream to secondary separation. The device includes various embodiments adapted for use as a large industrial unit, a portable unit or for use within the home. The device may be operated in a pressure controlled environment, thus eliminating the need for a pump. The voltage and amperage of the electrical field chamber may be adjusted by placing selected reaction plates in electrical contact with the voltage source.

Abstract: The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is tilted to promote turbulent electrolyte flow in a space between a bottom surface of the semiconductor wafer and top surface of the trough-shaped receptacle.

Abstract: An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.

Abstract: The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate when the mask plate surface is disposed on a surface of wafer, and out of which the electrolyte solution will freely flow. There are also at least one or a plurality of polish portions on the mask plate surface that allow for polishing of the wafer when the mask plate surface is disposed on a surface of wafer.

Abstract: A method of improving the material properties of a composite by electrodepositing various polymers, organic compounds or inorganic compounds onto each individual carbon (graphite) fiber strand, whether individual fiber or as a fabric to form an homogeneous chemically-bonded composite as opposed to the formation of a heterogeneous, non-chemically bonded composite. Thus, electrodeposition forms a unique discrete interface at the molecular layer (nanolayer) between the reinforcement (fiber) and the matrix (resin) over as opposed to any previous resin infusion process.

Abstract: An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath for processing the substrate. The band is adapted to deflect under centrifugal force to release the fluid from the substrate as the body is rotated above a predetermined rate.

Abstract: An electrolytic ion-water production apparatus in which purified water without residual chlorine is electrolyzed to produce alkaline-ion water without any chloride smell of lime in use of the apparatus, and in which a mixture of purified water treated by a water purifier and tap water containing residual chlorine is electrolyzed to produce alkaline-ion water containing sodium hypochlorous acid (NaOCl) of low concentration and to retain the produced alkaline-ion water in an introduction passage for reliably preventing propagation of microbes.

Abstract: Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a plating tank, means for supplying a plating solution into the plating tank, a plating solution outlet port which is formed in the plating tank, a cavity portion into which the plating solution which has flown out of the outlet port flows, a plating solution discharge port within the cavity portion, and a collection tank for the plating solution discharged from the discharge port, which subjects the object to be plated to plating treatment while supplying the plating solution into the plating tank, the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be changed.

Abstract: A decomposition apparatus that decomposes a decomposition target is provided. The decomposition apparatus includes a decomposition chamber having a decomposition section that continuously decomposes the decomposition target, an introducing device that continuously introduces the decomposition target into the decomposition chamber, a discharging device that discharges decomposition products produced in the decomposition chamber, and a selection section that selects a set of drive conditions from a plurality of sets of conditions for the decomposition section such that the concentration of the decomposition target within the decomposition chamber during decomposition of the decomposition target is at the predetermined concentration.

Abstract: A method for decomposing a gaseous aliphatic hydrocarbon halide compound more simply is provided. The method includes the steps of mixing the gaseous aliphatic hydrocarbon halide compound and a chlorine gas-containing gas and emitting light to a mixture gas of the gaseous aliphatic hydrocarbon halide compound and the chlorine gas.

Abstract: An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.

Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

Abstract: In a circulation system of treatment-object water (waste water), a water treating apparatus and a pH adjuster are provided. A carbon fiber that can collect at least microorganisms is disposed in the water treating apparatus. The carbon fiber is immersed in the treatment-object water, and potential is applied to the carbon fiber. Further, pH of the treatment-object water is adjusted by the pH adjuster in a direction in which adsorption of microorganisms in the treatment-object water to the carbon fiber is facilitated. As a result, the microorganisms are strongly attracted and adsorbed to the carbon fiber.

Abstract: A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.

Abstract: There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.

Abstract: An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive horizontal second chuck which receives and showers reaction solution over all portions of each substrate. During the reaction process, both chucks are substantially submerged in reaction solution within a tank. At least one of the chucks is attached and controllable from a control arm. At least one of the chucks is rotated about a vertical axis at a slow speed during the reaction process. The axes of rotation of the two chucks may be coincident, or the axes may be offset from each other, and/or one or both axes may be offset from the chuck centerpoint(s). One of the chucks may also be periodically moved in a vertical direction relative to the other chuck.

Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

Abstract: A decomposition apparatus for decomposition of decomposition targets such as organic chlorinated compounds is provided. The decomposition apparatus includes a contact section with an internal space to allow a decomposition target to come into contact with and be taken into a liquid, a flow path to lead along with the liquid the decomposition target taken into the liquid to a position different from the internal space, a decomposing device positioned along the flow path in a state cut off from the outside air to decompose the decomposition target that has been led through the flow path, and a device to introduce to the contact section a liquid that contains products produced from the decomposition of the decomposition target by the decomposing device.

Abstract: A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system. The plating electrode may be powered by a power supply which is controlled by a controller. A sensor may be connected to the controller and the sensor may be configured to sense a characteristic (for example, but not limited to: resistance, conductance or optical transmission, absorption of light, etc.) of the electrolyte bath, which tends to indicate the level of saturation. Preferably, the plating electrode is easily replaceable.

Abstract: A method for making chlorine dioxide, by passing an aqueous feed solution comprising sodium chlorite into a non-membrane electrolysis cell comprising an anode and a cathode, adjacent to the anode, while flowing electrical current between the anode and the cathode to electrolyze the aqueous feed solution and convert the halogen dioxide salt to halogen dioxide. The anode is preferably a porous anode through which the aqueous feed solution passes to maximize the conversion of chlorite to chlorine dioxide.

Abstract: The invention provides an ion exchange membrane electrolyzer ensuring a satisfactory circulation of electrolyte, high electrolytic efficiency and great ridigity. An anode chamber partition in a flat sheet form is joined to a cathode chamber partition in a flat sheet form. An electrode retainer member in a sheet form is joined to at least one partition at a belt-like junction. A projecting strip with an electrode joined thereto is located between adjacent junctions. A space on an electrode surface side of the electrode retainer member defines a path through which a fluid goes up in the electrode chamber, and a space that spaces away from the space defines a path through which an electrolyte separated from a gas at a top portion of the electrode goes down.

Abstract: A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is provided. The present invention employs the process solution to prevent or remove gas bubbles from the wafer surface during or before the electrochemical processing of the wafer surface. Accordingly, during the process, the wafer surface is initially brought in proximity of the surface of the process solution. Next, a process solution flow is directed towards the selected region of the wafer surface for a predetermined time. In the following step, the selected region of the wafer surface is contacted with the process solution flow for the predetermined time to prevent bubble formation, and the wafer surface is immersed into the process solution for electrochemical processing.

Abstract: Certain mechanisms of a plating apparatus address problems associated with interaction between plating solutions or other processing solutions and the components of the plating apparatus (such as the electrical contacts). For example, a circumferential spray skirt around the interface of a “cup” and “cone” in the plating apparatus protects these features during plating. A shield mechanism contacts the cup and/or cone at the periphery of their interface to provide a fluid resistant seal. In some cases, the cone includes an outer circumferential lip that engages a complementary surface of the cup for this purpose. Further, a mechanism is provided for raising and lowering the work piece with the cone in order to allow in situ rinsing of the work piece and/or regions of the cup.

Abstract: A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor substrate with plating metal includes performing an electroless plating process of forming an initial layer on the substrate, and performing an electrolytic plating process of filling the wiring recess with the plating metal, while the initial layer serves as a feeding layer.

Abstract: This invention is applied to any ionized solution of dissolved solids and electrolytes, such as sea water, which is forced through a conduit equipped with a magnetic wall of rectangular cross-section, which induces a magnetic field, where ions separate when passing through according to magneto-hydrodynamic physics. The conduit is made up of one continuous magnetic wall, a spiral or similar, with opposite magnetic poles on each side, where these both sides co-operate to extend magnetic fields with parallell wall in the same direction through the whole conduit. The ionized solution is pumped into the center of the spiral and further out through the spiral or similar. The charged ions in the flow stream are deflected laterally towards the open ends and as separated positive or negative ions into chambers outside the conduit.

Abstract: The present invention provides an electroionic processing system having a high frequency alternating current (AC) power source for treating potable water, process water, wastewater, biosolids, sludge, primary effluent, secondary effluent, and other biochemical processing functions, including producing hydrogen peroxide and other useful chemicals. An electromagnetic field is generated and coupled to an electrolytic treatment apparatus by a direct coupling apparatus and method, a capacitive coupling apparatus and method, and an inductive coupling apparatus and method. The present invention further comprises a process controller and a plurality of analyzers for monitoring various treatment process variables to adjust and optimize the process as necessary.

Abstract: An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the workpiece support plate, has at least one opening coupled to a source of electrolyte for receiving an electrolyte solution therethrough and placing the electrolyte solution in contact with the support plate and workpiece. A first conductive element is coupled to, a first potential and positioned proximate the metallic surface, and the carrier is configured to position the workpiece proximate the support plate.

Abstract: Disclosed is a Brown gas mass production apparatus having a line style electrolytic cell in which an electrolytic cell case having an electrolyte distribution and discharging pipe mounted on the inside bottom surface thereof is coated with insulation material on the inner surface thereof, electrode units are disposed by two or three groups in a side-by-side arrangement in the electrolytic cell case, an electrolytic cell upper plate having gas outlet nipples mounted thereon is sealingly coupled to the top surface of the cell case to form a secured sealing between edges of the upper plate and the cell case.

Abstract: The invention includes a method for dewatering and/or desalting a water-in-oil emulsion comprising introducing a plurality of streams of the emulsion into the electrostatic field under opposed flow whereby the water coalescence is enhanced. The invention also includes an improved electrostatic apparatus for dewatering and/or desalting a water-in-oil emulsion comprising a plurality of horizontally directed nozzles positioned to introduce a plurality of streams of the emulsion into the electrostatic field under opposed flow conditions.

Abstract: The present invention is an apparatus and method for disinfecting or sanitizing a desired object. The apparatus includes a container for an aqueous solution; the container may be a spray bottle. The apparatus includes an electrolytic cell, containing an electrolyte, an electrical power source, a control circuit for providing an electric charge to the electrolyte to create an oxidant, and a fluid connection between the cell and container to permit introduction of the oxidant into the aqueous solution to create a disinfectant.

Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.