Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.

Abstract: A new cell assembly for semiconductor wafer electroplating in the plated-side-up configuration utilizes a narrow passageway around the perimeter of the wafer through which solution is forced so as to provide the laminar flow needed for effective Damascene copper plating. In addition, use of a cylindrical insulating cell wall whose inside diameter matches that of the wafer area being plated avoids overplating of the wafer periphery. Anode isolation in a compartment separated via a solution transport barrier prevents introduction of particulates and holds anolyte in place during wafer changes. This cell assembly is readily amendable to automated wafer plating.

Abstract: The invention discloses a method of electroplating a material onto a semiconductor substrate. A substrate is placed in a cylindrical processing chamber enclosure. A nozzle for spraying a liquid electroplating solution opposes the top surface of the substrate. The electroplating solution flows through the nozzle and outward angularly from the tip of the nozzle, so that the solution flows rotationally on the surface of the substrate.

Abstract: The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.

Abstract: An apparatus for treating wastewater comprising an electrocoagulation cell 100 including holding and isolating members 7, a top cell cover 17, a plurality of electrode plates E1 through E8 inserted within a sleeve 18 made of non-conductive material, thereby the electrode plate sets 11 and 12 offer minimum resistance to the incoming liquid. Such an electrocoagulation cell 100 including a member to break the laminar liquid flow and to maintain a turbulent state all along said cell 100. A set of electrode plates 11 and 12 connected in parallel or in series, wherein said electrode plate sets 11 and 12 have connections arranged such that it allows the electrical current be indistinctively interrupted and reversed. Such an electrode plate set 11 and 12 connected in parallel or in series, wherein a combination of non-similar metals may be made in order to have electrical connections that allow disinfection of the treated liquid.

Abstract: The invention relates to an arrangement enabling a liquid (2) to flow evenly around a surface of a sample (3); said arrangement has a flow chamber (1) through which a liquid (2) flows via inflow and outflow pipes (7, 8). The sample (3) can be rotated about an axis of rotation by means of a rotary drive (5). A filter (13) which extends crosswise to the direction of flow of the liquid (2) and which ensures a uniform flow through the inflow and outflow pipes (7, 8) is situated in front of the inflow and outflow pipes (7, 8). The arrangement is especially suitable for depositing a homogeneous layer of a nickel/iron alloy on a silicon wafer (3). The invention relates furthermore to the use of the arrangement.

Abstract: An apparatus and method for coating or treating powdered material, particularly ultra-fine powders in the nanometer or submicron range of mean diameters, by electrolytic processes. A platen is mounted for rotation upon a fixed shaft, and a rotary flow-through electrolytic cell is mounted upon a platen for rotation thereon, the cell's axis of rotation being offset from the platen's axis of rotation. The cells axis of rotation revolves around the platen's axis as the platen rotates. The electrolytic cell accordingly undergoes a planetary rotation, as the cell revolves around the platen's axis of rotation. The planetary rotation of the cell allows the powdered material to be collected by centrifugal force and constantly agitated to promote uniform electroplating.

Abstract: A vessel for contacting a plurality of objects with a fluid. An upwardly directed stream of fluid and a portion of the objects are confined in a conduit such that the fluid stream causes the objects to flow upward from a moving bed thereof to a disengaging position from where they fall onto a distribution shield and move downward to a feed position. The vessel may be used for treating electrically conductive objects wherein the fluid is an electrolyte, an electrode is positioned to contact the moving bed, and a counterelectrode is positioned in spaced relation to the moving bed. The vessel may be fixed or portable.

Abstract: In a method and an apparatus for generating a portable sterilizing water that can be easily used at, for example, hospitals, cafeterias of nursing facilities, restaurants, hair salons or homes, an electrolyzer is structured such that a tubular-shaped ferrite anode and a cathode are arranged alternately in a concentric manner with an inter-electrode distance, and integrated with a pressurizable solution container containing halogen ions and a power control apparatus so that it can be carried and operated by one hand.

Abstract: A system for electroplating a semiconductor wafer is set forth. The system comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode and the semiconductor wafer form a cathode during electroplating of the semiconductor wafer. The second electrode forms an anode during electroplating of the semiconductor wafer. A reaction container defining a reaction chamber is also employed. The reaction chamber comprises an electrically conductive plating solution. At least a portion of each of the first electrode, the second electrode, and the semiconductor wafer contact the plating solution during electroplating of the semiconductor wafer. An auxiliary electrode is disposed exterior to the reaction chamber and positioned for contact with plating solution exiting the reaction chamber during cleaning of the first electrode to thereby provide an electrically conductive path between the auxiliary electrode and the first electrode.

Abstract: Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.

Abstract: A method for removal of solid deposits from surfaces of electrodes of a DC electrolytic cell for disinfecting of water in a closed system, especially in a swimming pool, SPA or hot tub, includes simultaneous spinning the water over the electrode surfaces and electrolytic release of the deposits from the surfaces without interruption of the disinfecting process. The method further includes a) changing the polarity of the electrodes of the cell at predetermined frequency for electrochemically releasing the deposited scale from the electrode surfaces; b) circulating the water through a hydrocyclone containing a DC electrolytic cell for disinfecting of the water so that the deposits are washed off the electrodes of the cell; c) periodically removing the scale particles from a drained chamber located at the bottom of the hydrocyclone.

Abstract: A method and system for electrolysis of water to increase the dissolved oxygen content, raise oxidation reduction potential, and perform direct oxidation of dissolved contaminants in situ. This is accomplished by an electrolytic catalytic oxidation (ECO) cell having an innovative configuration of electrodes in a cartridge designed to maximize water contact with an efficiently designed affecting system. The cartridge consisting of multiple mesh electrodes arranged transversely to imposed water flow electrolyzes passing water when energized. The mesh construction of the electrodes allows water flow to be essentially through the electrodes, with a narrow gap set up between cathode and anode to reduce voltage requirements of the system. The cartridge anodes are preferably plated with a mixed metal oxide such as iridium oxide and ruthenium oxide to catalytically improve the production of oxygen.

Abstract: A method of removing a metal ion from a treating liquid for use in treating a substrate comprises the steps of: applying a first voltage via an electrode to the treating liquid that flows in a supply piping so that deposition can occur; and applying a second voltage higher than the first voltage to the electrode while distributing a cleaning liquid to the supply piping, so that ionization can occur.

Abstract: In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system, it has been known in the art to conduct at least one portion of the electrolyte fluid through one auxiliary cell provided with one insoluble auxiliary anode and at least one auxiliary cathode, a current being conducted between them by applying a voltage. Accordingly, excess quantities of the oxidized substances of the redox system are reduced at the auxiliary cathode, the formation of ions of the metal to be deposited being reduced as a result thereof. Starting from this prior art, the present invention relates to using pieces of the metal to be deposited as an auxiliary cathode.

Abstract: A process for the production of wear-resistant, coated surfaces includes the use of at least two electrodes connected to a voltages source which are mounted in, or border, a reaction space through which an electrolyte flows in which the surface to be coated is located. The process is distinguished by the fact that the direction of the flow of the electrolyte is selectively reversed at least once during the coating process to enable better control of the formation of the oxide layer.

Abstract: An apparatus for oxidatively destructing a trace injurious substance includes a structure with anodes, each integrally provided with an electrically conductive oxide on their surface and made of a metal. A partition made of a porous ceramic or resin is provided between the anodes and surrounded by cathodes made of a metal plate having inner walls on both sides to which a noble metal is fused, such that at least two chambers with spaces are formed in a plane symmetrical arrangement to provide an apparatus for oxidatively destructing a trace injurious substance contained in polluted water. The apparatus has a rectangular wave discharging device for applying an electric field to the spaces, such that polluted water flows through the inner space of one of the chambers and is subjected to the irradiation of an electric field, and the supernatant thereafter flows through the inner space of the other chamber and is subjected to the irradiation of an electric field.

Abstract: A method and apparatus for regulating fluid flows, such as flows of electrochemical processing fluids for processing microelectronic workpieces. The apparatus includes a valve body having an entrance port, an exit port, and a flow passage between the entrance and exit ports through which a first fluid flows. The valve body further includes a pressure chamber coupleable to a second fluid source and at least partially isolated from the flow passage. A regulator, movably disposed in the flow passage to change a flow area of the flow passage, has a first surface with a first projected area and a second surface with a second, larger, projected area, both of which are operatively coupled to the first fluid. A third surface of the regulator is operatively coupled to the second fluid. The regulator can adjust its position to maintain a constant or nearly constant first fluid flow rate as the fluid pressure at the entrance port changes.

Abstract: An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode, the anode shield having upwardly extending brackets with radially extending members. A diffusion plate is supported above the anode by the anode brackets using first bayonet connections. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A second bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel.

Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.

Abstract: In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.

Abstract: Embodiments of the invention generally provide an apparatus and method for replenishing organic molecules in an electroplating bath. The replenishment process of the present invention may occur on a real-time basis, and therefore, the concentration of organics minimally varies from desired concentration levels. The replenishment method generally includes conducting pre-processing depletion measurements in order to determine organic depletion rates per current density applied in the electroplating system. Once the organic depletion rates per current density are determined, these depletion rates may be applied to an electroplating processing recipe to calculate the volume of organic depletion per recipe step. The calculated volume of organic depletion per recipe step may then be used to determine the volume of organic molecule replenishment per unit of time that is required per recipe step in order to maintain a desired concentration of organics in the plating solution.

Abstract: Provided are an apparatus and a method for purification of water in which impurities in contaminated water can be removed with a reduced amount of flocculant and with high efficiency. The apparatus comprises, in the order from the side where contaminated water is introduced, an electrolysis tank (1) for electrolyzing the contaminated water, a gas mixing tank (2) for mixing carbon dioxide into the contaminated water electrolyzed, a coagulation tank (3) for mixing Fe3+ supplied from a flocculant producing device (7) to coagulate impurities in the contaminated water, and a floatation tank (4) for floating and separating the impurities coagulated. The electrolysis tank (1) electrolyzes the contaminated water to lower zeta potential of colloid particles in the contaminated water, and then the contaminated water is mixed with Fe3+ in the coagulation tank (3), thereby reducing the amount of positively charged Fe3+ to be added for neutralizing the colloid particles.

Abstract: A Kit of modular components for the manufacture of an electrochemical reactor (1) of the so-called filter-press type having a substantially tubular body (1a), closed at the opposite ends by end plates (2, 3) and in which is defined a sequence of electrolyte cells (4z, 4b) in fluid with pipes (7 to 10) extended in said body (1a), in a direction parallel to its axis (AA), for the collection and distribution of process fluids, distinguishes itself in that it comprises: a plurality of electrochemically functional flat elements (13, 13a) selected from bipolar elements and separation elements, a plurality of frames (11), all identical to each other, realized with an electrically non-conducting material and structured to enclose and support inside them, in a per se known way, respective pre-selected electrochemically functional flat elements (13, 13a), each of the frames (11) being equipped with an equal plurality of through-holes (14, 14a; 15, 15a; 211, 22; 26, 27) parallel to the axis of the respective frame (11)

Abstract: The present invention discloses an electrolyzer for electrolyzing water into a gaseous mixture comprising hydrogen gas and oxygen gas. The electrolyzer is adapted to deliver this gaseous mixture to the fuel system of an internal combustion engine. The electrolyzer of the present invention comprises one or more supplemental electrode at least partially immersed in an aqueous electrolyte solution interposed between two principle electrodes. The gaseous mixture is generated by applying an electrical potential between the two principal electrodes. The electrolyzer further includes a gas reservoir region for collecting the generated gaseous mixture. The present invention further discloses a method of utilizing the electrolyzer in conjunction with the fuel system of an internal combustion engine to improve the efficiency of said internal combustion engine.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: An apparatus and method for plating a metal onto a substrate. The apparatus generally includes an anode electrode disposed in the electrochemical cell and a cathode electrode disposed opposite the anode electrode in the electrochemical cell. The apparatus further includes an electrode lid having more than one aperture disposed between the anode electrode and the cathode electrode, the apertures configured to electrically connect the cathode electrode and the anode electrode.

Abstract: An electrolytic bath has a waterway converter that allows the ionized water outlets to discharge the same species of ionized water even if the polarity of the produced ionized water at the polar chamber has been reversed in order to prohibit the formation of the scale at the electrode. The waterway converter includes a cylinder-shaped valve housing and a cylindrical-bar shaped valve body wherein the valve body is rotated in accordance with the inversion of polarity at the chamber in such a way that the central linking pipe and linking pipe are alternatively linked to the alkaline and acid ionized water outlets.

Abstract: An electrochemical cell including a cell enclosure, a fill tube, a ball, a closing button, an anode, a cathode, and an electrolyte. The cell enclosure defines an internal volume and includes a cover forming a fillport through hole. The fill tube is separately formed, and defines a leading section, a trailing section, and a passageway. The leading section is secured within the fillport through hole. The ball is sealingly secured within the passageway. The closing button is also separately formed, and is sealingly secured within the fillport through hole adjacent the leading section of the fill tube. The anode, cathode, and electrolyte are maintained within the internal volume. By configuring the fill tube such that the leading section thereof is secured within the fillport through hole, an overall extension of the fill tube relative to the internal volume is greatly reduced, thereby maximizing a volumetric efficiency.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.

Abstract: A polishing method able to easily flatten unevenness formed on the surface of a film to be polished and able to efficiently polish the film flat while suppressing damage to an interlayer insulating film below the film, comprising, when polishing an object having a film such as an interconnection layer formed burying interconnection grooves formed in an insulating film of a substrate, supplying a polishing solution over the surface to be polished at least substantially parallel to the surface to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the processing solution or arranging a cathode member facing the surface and supplying an electrolytic solution containing a chelating agent between the surface and cathode member while supplying voltage between the film and the cathode member to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the electrolytic solution, and a polishin

Abstract: A reactor and a method of reacting a fluid are provided. The reactor comprises a chamber having an inlet and an outlet to receive and to output a fluid, respectively. A partition with a plurality of perforations is provided in the chamber to separate the fluid into fluid segments. A conductor coupled to the chamber generates a capacitance between the conductor and the partition to vibrate the partition.

Abstract: There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having, a pair of electrodes disposed at a given distance with an ion exchanger being interposed: and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.

Abstract: A flow-through electrochemical cell assembly with a disposable working electrode structure, including (a) a perimeter wall defining a sample flow channel including an inlet and an outlet, (b) a sample inlet line in fluid communication with the sample flow channel inlet, (c) a sample outlet line providing fluid communication between the sample flow channel outlet and a remote reference electrode, and (d) a disposable working electrode structure comprising an electrically conductive and electrochemically active working electrode region bound as a layer, directly or indirectly, to an electrically insulating substrate surface. The substrate surface is in fluid-sealing relationship with the sample flow channel, and the working electrode region is in fluid communication with said sample flow channel. The working electrode is vapor deposited, directly or indirectly, onto the organic polymer substrate through a mask, and a fluid seal is formed between said working electrode region and perimeter wall.

Abstract: A household appliance using water is described, in particular a washing machine, comprising a supply system of water from an external source (8,9), a softening system for at least a portion of the supplied water (10,17), and a control system of the appliance, characterized in that permanent water softening means (10,17,H,21) are provided, which are controlled by said control system and which do not periodic interventions by the user to the appliance, for adding regeneration media and/or replacing components.

Abstract: An improved chlorination system for pools, spas, potable water supplies, and the like, provides a vertically oriented electrolytic cell connected between a pump and a lightly salinated pool. The cell preferably contains a metallic electrode, such as copper, and a precious metal coated titanium electrode, and has means for passing an electric current through the cell. The present invention further provides a novel electrode stack design, conducive for forming an efficient chlorinator comprising a plurality of interconnecting electrode stacks of separate electrical cells.

Abstract: A plating processing device comprises: a plating bath, on which an object to be plated is mounted; and a sparger provided with plating nozzle and washing nozzle for jetting plating solution and washing solution, respectively, toward the object in such a manner that the used plating solution and washing solution are accumulated and collected in the plating bath. Plating solution is supplied to the plating nozzle from a plating solution tank. Washing solution is supplied to the washing nozzle from a washing solution tank. The used plating solution and washing solution are accumulated in the plating bath, are recovered to the plating solution tank and used again as a plating solution.

Abstract: An apparatus for increasing the quantity of dissolved oxygen in water. The apparatus includes an inlet for receiving untreated water. A cell housing having an electrolytic cell therein is coupled to the inlet. A resident time housing is connected to the cell housing for receiving water having oxygen and hydrogen gas therein. The resident time housing is vertically oriented and longitudinally extending for a selected vertical length above the cell housing. This provides sufficient resident time of the water in a quiet zone to permit the generated oxygen gas to transition into the dissolved state prior to reaching the top of the resident time housing. An outlet is provided at the top of the resident time housing. Treated water having a high dissolved oxygen content is delivered out of the outlet. A gas vent is provided at the outlet to permit the escape of hydrogen or other gases which have not been dissolved into the water.

Abstract: The present invention is drawn to the electrolysis of fluids in a lab-on-a-chip environment for generating gases. Various lab-on-a-chip embodiments are described along with a method of generating gas in a lab-on-a-chip environment. The method comprises the steps of (a) providing a substrate having active circuitry thereon, at least a portion of said active circuitry being readable by a computer; (b) providing an electrolytic cell configured for communication with the active circuitry, said electrolytic cell comprising an anode and a cathode in an electrolytic fluid bath; and (c) generating a gas in the electrolytic fluid bath by creating an electrical potential between the anode and the cathode through the electrolytic fluid bath.

Abstract: There is provided a method for water treatment, capable of greatly improving the effect of removing microbes contained in water for eating and drinking, or discharged water.

Abstract: A method and apparatus for anodizing a component. The component is placed in a container having a supply port, a drain port and a supply passage. The supply passage faced on a surface of the component to be anodized. A reaction medium is supplied from the supply port to the drain port. An electric current is supplied from an electrode provided on the drain port side of the surface. The apparatus prevents any hydrogen gas created by the electrode from recirculating to the surface of the component.

Abstract: The present invention is an apparatus and method for disinfecting or sanitizing a desired object. The apparatus includes a container for an aqueous solution; the container may be a spray bottle. The apparatus includes an electrolytic cell, containing an electrolyte, an electrical power source, a control circuit for providing an electric charge to the electrolyte to create an oxidant, and a fluid connection between the cell and container to permit introduction of the oxidant into the aqueous solution to create a disinfectant.

Abstract: Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.

Abstract: The present invention provides a self-replenishing liquid water source onboard an automobile for supplying liquid water to an electrolyzer, such as an on-board hydrogen generator useful for the suppression of unwanted emissions. While automobiles typically have water reservoirs resupplied by a person, the invention provides a passive means of water collection for reliable replenishment due to operations of the automobile itself. The invention provides condensate from the engine exhaust gas by cooling a region of the exhaust system using cooling fluid from the engine coolant system. The cooling fluid is circulated during a period following the engine cold start event when the heat load on the engine coolant system is low.

Abstract: An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer.

Abstract: An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

Abstract: An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubble free. The apparatus holding the work piece in a manner that facilitates electrolyte circulation patterns in which the electrolyte flows from the center of the work piece plating surface, outward toward the edge of the edge of the work piece. The apparatus holds the work piece near the work piece edges and provides a flow path for electrolyte to flow outward away from the edges of the work piece plating surface. That flow path has a “snorkel” shape in which the outlet is higher than the inlet. In addition, the flow path may have a slot shape that spans much or all of the circumference of holding apparatus. It may be made from a material that resists deformation and corrosion such as certain ceramics.

Abstract: A novel method of electrochemical treatment such as electroplating, etc. and an electrochemical reaction apparatus thereof which is high in reactability and able to be electrochemically reacted efficiently, which is small or zero in amount of generation of liquid waste such as electrolytic solution and cleaning liquid and therefore, amicable to the environment, and in which it is no more required to clean the electrode, etc. with cleaning liquid after reaction. Electrochemical reaction is executed in a reaction vessel (6) containing matter (5) which is in a supercritical or subcritical state and an electrolytic solution (1), and after reaction, the supercritical or subcritical matter (5) is shifted into a state of the matter (5) before being shifted into a critical state.

Abstract: The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath.