Abstract: A wafer plating system horizontally transporting vertically oriented wafers into one or more process cells. The wafer processing system includes a carrier rotatable from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

Abstract: An improvement to a cathode used in an electrorefining or electrowinning of copper. The cathode has a solid copper head bar with a horizontal groove on its undersurface. The upper edge of a stainless steel flat sheet has several holes along its width and is vertically inserted into the groove. The stainless steel sheet is then mechanically attached to the copper head bar by pressing the copper head bar against the stainless steel at the perforated points along the head bar. To increase the joint strength, the stainless steel sheet may be welded to the copper head bar at its upper edges at the underside of the head bar.

Abstract: The invention concerns a motorized device for adjusting the interelectrodic gap in mercury cathode electrolysis cells, mainly consisting of a frame, to which a number of anodes are suspended, movable in the vertical direction by means of a single jackscrew driven by a gear motor acting on double levers. The jackscrew with the motor and the lever system are fixed to a main frame, supported on the cell bottom by means of supports positioned on adjustable columns, while the above mentioned movable frame (also called sub-frame) carrying the anodes, is connected to the lever arms by means of four hinged supports. The shifting of the movable frame and, consequently, of the anodes can be controlled by a centralized and computerized system (which is not part of the invention) as a function of voltage and current variation measurements.

Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

Abstract: An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.

Abstract: An electroplating tool, which includes at least of a deposition cassette which is installed on a negative electrode and copper piece in an electroplating tank, or a copper rod is installed on the positive electrode of the electroplating room. 25 wafers are installed in the electroplating room, and both ends of each of the wafers are respectively fixed in place by a wafer clamp. The wafer clamp is in contact with the negative electrode, and is electrically connected to the wafer. The copper rod or copper piece that connects to the positive electrode can be a big piece that is installed on the outer side of the deposition cassette opening. It can also assume a comb-like arrangement of 25 pieces, respectively interlocked and extending into the gaps between the wafers. Moreover, in order to increase the even distribution during copper deposition, the present invention further adds a sound wave vibration apparatus at the bottom of and on the two sides of the electroplating tank.

Abstract: Apparatus for metal plating an article comprising a frame having a plurality of sealing members positioned thereon, the frame being capable of conducting an electrical current between sealing members, each sealing member being adapted to be in close contact with part of an article to be located thereon, and to thereby substantially prevent fluid from touching that part of the article or entering into a bore or recess of the article, each sealing member further being adapted to conduct current between the frame and the article.

Abstract: This device for lifting the anode frame of an electrolysis cell for the production of aluminium comprises:

Abstract: In equipment for powder-coating, workpieces such as escalator steps are subjected to a current treatment in an anodizing unit. A conveying means advancing carriers for the workpieces is lowered over a tank so that the workpieces in transit are immersed in and continue transit within a bath and after a specific dwell time are lifted back out of the bath at the end of the tank. Arranged in the tank region is a current feed, such as a bus bar, which extends parallel to the travel path of the conveying means. Each carrier is provided with a current take-off which connects the carrier with the current feed. The current connection is produced on lowering the carrier into the bath and interrupted on raising the carrier from the bath.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further includes a rotating mechanism coupling a processing head to the body, and for rotating the process head with respect to the body. The rotating mechanism includes a motor, wherein the motor is located within the processing head and the shaft of the motor is coupled to and rotationally fixed with respect to the body. The lift and rotate assembly further includes a lift mechanism for lifting the process head with respect to the body. A cable assembly within the lift and rotate assembly includes a common cable loop for feeding additional length of cable along both the lift direction and the rotational direction of movement.

Abstract: An electroplating rack includes a cathode flight bar from which depends an insulated rack bar over an acid bath. A clamp is fixed to the rack bar, and has a bridge electrically connected to the flight bar through a conducting core inside the insulated rack bar. The clamp has a main body made of plastic, which includes a slot in which protrudes the bridge. An electrically conducting spring clip is installed in the slot, and is formed of two arms continuously biased into a spreaded, opened condition in the slot. A screw carried by the main body, when rotated in a first direction, can force the spring clip into a closed condition, in which it can hold an article to be electroplated between its two arms, and in which one of the spring clip arms is forced against the bridge member. Thus, electrical current can pass through the rack flight bar and conducting core, then through the bridge member, the spring clip and finally into the article to be electroplated.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further includes a rotating mechanism coupling a processing head to the body, and for rotating the process head with respect to the body. The rotating mechanism includes a motor, wherein the motor is located within the processing head and the shaft of the motor is coupled to and rotationally fixed with respect to the body. The lift and rotate assembly further includes a lift mechanism for lifting the process head with respect to the body. A cable assembly within the lift and rotate assembly includes a common cable loop for feeding additional length of cable along both the lift direction and the rotational direction of movement.

Abstract: This invention comprises a driven conveyor for transporting work pieces into one or more flood plating cells for electroplating a metal onto the planar surfaces and surfaces of the through holes of the work piece. An electrolyte solution is pumped by one or more recirculating pumps into the flood cell at such a rate as to maintain the liquid at a desired level covering the anodes and work pieces while work pieces are moved through the cells. One or more power sources provide direct current to the anodes and to the electrified contactors to transmit electrical current to the work pieces. The electrified contactors are positioned across the path of the work piece and spaced outside of the flood cell such that the electrolyte solution does not contact the contactors. Plating will occur so long as the work piece is in contact with one or more of the electrified contactors and the electrolyte.

Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotate assembly is removably and pivotally mounted to an exposed outer surface of the frame. The lift and rotate assembly has a body, a process head movably connected to the body, and control components mounted within the body and configured to move the process head relative to the body. The lift and rotate assembly in one embodiment is positionable in a forward, operating position with the body adjacent to the frame, and in a tilted, service position with the body tilted away from the frame.

Abstract: A system for electroplating a semiconductor wafer is set forth. The system comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode and the semiconductor wafer form a cathode during electroplating of the semiconductor wafer. The second electrode forms an anode during electroplating of the semiconductor wafer. A reaction container defining a reaction chamber is also employed. The reaction chamber comprises an electrically conductive plating solution. At least a portion of each of the first electrode, the second electrode, and the semiconductor wafer contact the plating solution during electroplating of the semiconductor wafer. An auxiliary electrode is disposed exterior to the reaction chamber and positioned for contact with plating solution exiting the reaction chamber during cleaning of the first electrode to thereby provide an electrically conductive path between the auxiliary electrode and the first electrode.

Abstract: Electrolytic plating of a workpiece is enhanced by providing a resistor between the workpiece and electrically conductive support member.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further includes a rotating mechanism coupling a processing head to the body, and for rotating the process head with respect to the body. The rotating mechanism includes a motor, wherein the motor is located within the processing head and the shaft of the motor is coupled to and rotationally fixed with respect to the body. The lift and rotate assembly further includes a lift mechanism for lifting the process head with respect to the body. A cable assembly within the lift and rotate assembly provides at least one of signals, gases and fluids to the process head.