Abstract: An apparatus for processing wafers in the present invention includes first and second processing chambers isolated from each other, an isolation chamber coupled to each processing chamber, a single first type vacuum pump alternatively pumping down the first and second processing chambers through the isolation chamber, wherein the first type vacuum pump can pump down the first processing chamber when a wafer is loaded or unloaded in the second processing chamber, and the first type vacuum pump can pump down the second processing chamber when a wafer is loaded or unloaded in the first processing chamber, a wafer processing source chamber having a wafer processing source, the wafer processing source chamber being coupled to the first and second processing chambers and the isolation chamber, and a plurality of second type vacuum pumps coupled to the first and second processing chambers and the wafer processing source chamber.

Abstract: A cluster tool assembly 10, 200, 300 using plasma immersion ion implantation chamber. In some embodiments, the cluster tool assembly also includes a controlled cleaving process chamber, as well as others.

Abstract: The present invention generally provides a vacuum processing system with a process chamber and a rotating member, such as a magnetron in a PVD chamber, disposed in a cooling cavity of the process chamber, where the rotating member includes a deflection member for deflecting cooling fluid in the cooling cavity toward interior portions of the rotating member. In one embodiment, a base plate of the rotating member defines an upper surface of the rotating member and a magnet retainer defines a lower surface of the rotating member. Magnets are mounted between the base plate and the magnet retainer. The deflection member is mounted between the magnets and can be coupled to the magnets on one or both ends. One end of the deflection member is disposed toward the outer perimeter of the magnetron and the other end of the deflection member is disposed toward the interior portions of the rotating member.

Abstract: A device for coating a disk-like substrate (3,3′, . . . ) with the aid of cathodic sputtering, having an essentially cylindrical transport chamber (7) and with a vacuum pump (8) connected to the transport chamber (7) and with an opening (9) that can be closed off by a plate (16) for inserting and removing the substrates (3,3′. . .

Abstract: A stationary vacuum deposition machine for use in a method for processing substrates to make magnetic hard disks includes a series of stations and a transport. The series of stations includes an entrance station for receiving substrates into the machine and a predetermined station. The transport operates in a cycle with each cycle including a transport phase and a stationary phase. The transport causes all the substrates that are in the machine to be moved during the transport phase, and be temporarily held stationary during the stationary phase, such that during each stationary phase a predetermined one of the stations is occupied by one of the substrates while each of a plurality of others of the stations is occupied by a respective one of a plurality of others of the substrates. The machine further includes a plurality of vacuum deposition stations and a scanning beam generator.

Abstract: An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

Abstract: In an air lock for continuous introduction into and/or removal of workpieces from spaces (1,4) separated atmospherically, the individual substrates (3,13) are transported through a transfer channel (24). At least one lock chamber (7a-7m) serving to accommodate the substrates (3,13) is arranged movably in the transfer channel (24). During the substrate transport in the transfer channel (24), the lock chamber (7a-7m) is atmospherically separated both from the exterior (1) having normal pressure and from the coating chamber (4). The air lock (2) includes a carrousel lock which has a carrousel housing (24) and a lock chamber wheel (10). On the periphery in the lock chamber wheel (10) individual lock chambers (7a-7m) are provided, in which the workpieces (3,13) to be brought into the chamber to be loaded (4) are inserted freely accessible on the normal pressure side.

Abstract: Apparatus and method for the vacuum deposition of at least two different layers of thin film material onto a substrate by two different vacuum deposition processes. Also disclosed is a novel linear applicator for using microwave enhanced CVD to uniformly deposit a thin film of material over an elongated substrate.

Abstract: A device for coating plate-shaped substrates by using cathode sputtering has several process chambers one after the other, each of which are bordered on the top by a chamber roof having in each case an opening. In this opening, which is covered at the top by a cathode arrangement, a frame is inserted. Screens and coolant lines of the process chamber are provided on the frame that can slide upwards out of the opening, projects into the process chamber, and is supported inside the opening of the chamber roof. A top of the cathode arrangement projects over the frame on the sides and is supported directly on the chamber roof so it seals it.

Abstract: Disclosed is a system for transporting disks in vacuum to a vacuum station whereat a lubricant film is applied uniformly to the surfaces of the disks by evaporation. Thickness uniformity is achieved by directing the evaporate through a multi-hole aperture plate. Described is equipment for manufacture, the process of manufacture and the novel disks created.

Abstract: A method of applying a coating to a metallic article (10) comprises placing the metallic article within a hollow cathode (38) in a vacuum chamber (30), evacuating the vacuum chamber (30), applying a negative voltage to the hollow cathode (38) to produce a plasma and such that the material of the hollow cathode (38) is sputtered onto the metallic article (10) to produce a coating (22). A positive voltage (V1) is applied to the metallic article (10) to attract electrons from the plasma to heat the coating (22) and so inter-diffuse the elements of the metallic article (10) and the protective coating (22) and a negative voltage (V2) is applied to the metallic article (10) to attract ions from the plasma to bombard the coating (22) to minimize defects in the coating (22).

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A process for the vacuum treatment of workpieces, includes loading the workpieces into a treatment facility, surface treating the workpieces in at least one vacuum station of the facility grouped as a station batch and controlling at least the timing of the process by a freely programmable process controller unit. At least two stations operating each on workpiece batches can be grouped as respective station batches and be different with respect to number of workpieces. The workpieces can be transported to and from the grouped stations. An embodiment of vacuum treatment system for such a process includes at least one vacuum treatment station for workpieces grouped as a station batch. A transport system supplies the vacuum station with workpieces. A process controller unit has an output operationally connected to a drive arrangement for the transport system. The unit controls operating timing of the treatment system and is freely programmable.

Abstract: Power supply lines (41, 42) connect poles of an alternating current power source (43) to respective cathodes (58, 59) in compartments (32, 39), included among a plurality of adjacent compartments (32-39′), which together form a vacuum chamber (31) and which are connected to each other by a passageway (60). The two compartments (32, 39) with the cathodes (58, 59) are separated from each other by intermediate compartments (32′-38′), at least some of which are equipped with additional sputter cathodes (61-66).