Moving Workpiece Or Target Patents (Class 204/298.23)
  • Patent number: 10184172
    Abstract: A magnetron sputtering device is disclosed and includes a magnetic levitation track and a supporter which is levitated on the magnetic levitation track. The supporter includes a magnetic track fixed on the supporter via a plurality of pads; each of the pads includes a first insulation plate and a second insulation plate, the first insulation plate and the magnetic track are connected via a first fastener, the second insulation plate and the supporter are connected via a second fastener, and the second fastener and the first fastener are not in contact with each other; the first insulation plate and the second insulation plate are connected via a third fastener, the third fastener is not in contact with both the magnetic track and the supporter, and the third fastener is not in contact with both the first fastener and the second fastener.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: January 22, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Hailong Liu, Yujie Sun
  • Patent number: 9812302
    Abstract: In a magnetron sputtering apparatus configured such that a magnetic field pattern on a target surface moves with time by means of a rotary magnet group, it is to solve a problem that the failure rate of substrates to be processed becomes high upon plasma ignition or extinction, thereby providing a magnetron sputtering apparatus in which the failure rate of the substrates is smaller than conventional. In a magnetron sputtering apparatus, a plasma shielding member having a slit is disposed on an opposite side of a target with respect to a rotary magnet group. The distance between the plasma shielding member and the substrate is set shorter than the electron mean free path or the sheath width. Further, the width and the length of the slit are controlled to prevent impingement of plasma on the processing substrate. This makes it possible to reduce the failure rate of the substrates.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: November 7, 2017
    Assignees: NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY, TOKYO ELECTRON LIMITED
    Inventors: Tadahiro Ohmi, Tetsuya Goto, Takaaki Matsuoka
  • Patent number: 9758863
    Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: September 12, 2017
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Tatsuhiko Miura, Kazuhiro Murakami
  • Patent number: 9664974
    Abstract: Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: May 30, 2017
    Assignee: View, Inc.
    Inventors: Mark Kozlowski, Eric Kurman, Zhongchun Wang, Mike Scobey, Jeremy Dixon, Anshu Pradhan, Robert Rozbicki
  • Patent number: 9477129
    Abstract: Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: October 25, 2016
    Assignee: View, Inc.
    Inventors: Mark Kozlowski, Eric Kurman, Zhongchun Wang, Mike Scobey, Jeremy Dixon, Anshu Pradhan, Robert Rozbicki
  • Patent number: 9347131
    Abstract: The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and a method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: May 24, 2016
    Assignee: SINGULUS TECHNOLOGIES AG.
    Inventors: Wolfram Maass, Berthold Ocker, Jürgen Langer
  • Publication number: 20150136597
    Abstract: A system for coating a glass board is disclosed. The coating system includes a coating chamber, a conveying unit and a support module. The conveying unit is located at a lower portion of the coating chamber and has two rollers for conveying a sheet of glass to be coated. The support module is located between the rollers and has a seat and an elevator connected to the seat. A distance between the seat and the glass can be adjusted by the elevator.
    Type: Application
    Filed: October 22, 2014
    Publication date: May 21, 2015
    Applicant: CSG HOLDING CO., LTD.
    Inventors: Haifeng Chen, Zhenzhong Bai
  • Patent number: 9034156
    Abstract: Provided is a sputtering apparatus which deposits a metal catalyst on an amorphous silicon layer at an extremely low concentration in order to crystallize amorphous silicon, and particularly minimizes non-uniformity of the metal catalyst caused by a pre-sputtering process without reducing process efficiency. This sputtering apparatus improves the uniformity of the metal catalyst deposited on the amorphous silicon layer at an extremely low concentration. The sputtering apparatus includes a process chamber having first and second regions, a metal target located inside the process chamber, a target transfer unit moving the metal target and having a first shield for controlling a traveling direction of a metal catalyst discharged from the metal target, and a substrate holder disposed in the second region to be capable of facing the metal target.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: May 19, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae-Hoon Yang, Ki-Yong Lee, Jin-Wook Seo, Byoung-Keon Park, Yun-Mo Chung, Dong-Hyun Lee, Kil-Won Lee, Jae-Wan Jung, Jong-Ryuk Park, Bo-Kyung Choi, Won-Bong Baek, Byung-Soo So, Jong-Won Hong, Min-Jae Jeong, Heung-Yeol Na, Ivan Maidanchuk, Eu-Gene Kang, Seok-Rak Chang
  • Patent number: 9034151
    Abstract: An alignment film forming apparatus and a method are provided to form an alignment film for a liquid crystal in a single process of simultaneously executing a film deposition process of ion beam sputtering and an alignment process. The method greatly restricts the size of a substrate. An alignment film forming apparatus includes a target disposed on a top surface side of a substrate and having a sputtering surface defining a sharp angle to the top surface of the substrate, a transfer table that transfers the substrate in a predetermined direction, and an ion source disposed on the top surface side of the substrate in such a way that an ion beam is irradiated on the sputtering surface of the target. An ion beam reflected at the sputtering surface is irradiated on a sputtering film formed on the substrate.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: May 19, 2015
    Assignee: International Business Machines Corporation
    Inventors: Shoichi Doi, Tatsuya Nishiwaki
  • Publication number: 20150114562
    Abstract: Any particle adhesion onto the surface of a substrate to be processed is prevented. There is provided a substrate processing apparatus characterized by including a transfer chamber for, via a gate to which a substrate accommodating container for accommodation of the substrate is set, performing transfer of the substrate between the same and the substrate accommodating container, a processing chamber for applying a specific process to the substrate, a load-lock chamber for linking the processing chamber with the transfer chamber, and a temperature control unit for at the stage of transferring the substrate into at least one of the transfer chamber and the load-lock chamber, so as for the temperature of the substrate just before the transfer thereof to be higher than the temperature of the interior of the chamber, into which the substrate will be transferred, controlling at least one of the temperature of the substrate and the temperature of the interior of the chamber.
    Type: Application
    Filed: December 24, 2014
    Publication date: April 30, 2015
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Akitake TAMURA, Teruyuki Hayashi
  • Publication number: 20150101924
    Abstract: A plasma deposition assembly for use in coating an interior surface of an object is provided. The assembly includes a head portion including an anode and a cathode adjacent to the anode. The cathode is fabricated from a coating material. The cathode also includes an outer surface adjacent to the interior surface of the object, wherein current is supplied to the cathode to form an arc on the outer surface such that the coating material is directed substantially radially outward from the outer surface of the cathode towards the interior surface of the object. The assembly also includes a moveable arm coupled to the head portion and configured to translate the head portion relative to the interior surface of the object as the arc deposits the coating material on the interior surface of the object.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 16, 2015
    Applicant: General Electric Company
    Inventors: Scott Andrew Weaver, Dennis Michael Gray
  • Patent number: 8992749
    Abstract: Provided is a sputtering apparatus which deposits a metal catalyst on an amorphous silicon layer at an extremely low concentration in order to crystallize amorphous silicon, and particularly minimizes non-uniformity of the metal catalyst caused by a pre-sputtering process without reducing process efficiency. This sputtering apparatus improves the uniformity of the metal catalyst deposited on the amorphous silicon layer at an extremely low concentration. The sputtering apparatus includes a process chamber having first and second regions, a metal target located inside the process chamber, a target transfer unit moving the metal target and having a first shield for controlling a traveling direction of a metal catalyst discharged from the metal target, and a substrate holder disposed in the second region to be capable of facing the metal target.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: March 31, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae-Hoon Yang, Ki-Yong Lee, Jin-Wook Seo, Byoung-Keon Park, Yun-Mo Chung, Dong-Hyun Lee, Kil-Won Lee, Jae-Wan Jung, Jong-Ryuk Park, Bo-Kyung Choi, Won-Bong Baek, Byung-Soo So, Jong-Won Hong, Min-Jae Jeong, Heung-Yeol Na, Ivan Maidanchuk, Eu-Gene Kang, Seok-Rak Chang
  • Publication number: 20150075979
    Abstract: There is described an intaglio printing plate coating apparatus (1) comprising a vacuum chamber (3) having an inner space (30) adapted to receive at least one intaglio printing plate (10) to be coated, a vacuum system (4) coupled to the vacuum chamber (3) adapted to create vacuum in the inner space (30) of the vacuum chamber (3), and a physical vapour deposition (PVD) system (5) adapted to perform deposition of wear-resistant coating material under vacuum onto an engraved surface (10a) of the intaglio printing plate (10), which physical vapour deposition system (5) includes at least one coating material target (51, 52) comprising a source of the wear-resistant coating material to be deposited onto the 32 engraved surface (10a) of the intaglio printing plate (10).
    Type: Application
    Filed: April 12, 2013
    Publication date: March 19, 2015
    Inventors: François Gremion, Laurent Claude
  • Patent number: 8968538
    Abstract: A magnetic film having excellent uniformity in in-plane distribution of film thickness or sheet resistance is formed when the film is formed by forming a magnetic field on a processing surface of a substrate (21) and performing oblique incidence sputtering by using high discharge power. A sputtering apparatus (1) is provided with a substrate holder (22) for holding rotatably the substrate (21) in the surface direction of the processing surface of the substrate; a substrate magnetic field forming device (30) which is disposed to surround the substrate (21) and forms a magnetic field on the processing surface of the substrate (21); cathodes (41) which are arranged diagonally above the substrate (21) and are supplied with electric discharge power; a position detecting device (23) for detecting a rotation position of the substrate (21); and a control device (50) which adjusts the rotation speed of the substrate (21) in accordance with the rotation position detected by the position detecting device (23).
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: March 3, 2015
    Assignee: Canon Anelva Corporation
    Inventors: Toru Kitada, Naoki Watanabe, Motonobu Nagai, Masahiro Suenaga, Takeo Konno
  • Patent number: 8956515
    Abstract: Provided is a sputtering apparatus which can form a multilayer film giving high productivity and with less spiral pattern by effective use of targets, and a method of forming multilayer film using the apparatus. An embodiment is a multilayer-film sputtering apparatus comprising: a rotatable cathode unit (30) having cathodes (7a and 7b) arranged on the same circumference with respect to the rotational center, and having a power-supply mechanism for supplying power to each cathode; a sensor (14) for detecting the position of cathode; and a rotation mechanism for rotating the cathode unit (30).
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: February 17, 2015
    Assignee: Canon Anelva Corporation
    Inventor: Masahiro Shibamoto
  • Patent number: 8906206
    Abstract: The invention provides a coater, and methods of using the coater, for depositing thin films onto generally-opposed major surfaces of a sheet-like substrate. The coater has a substrate transport system adapted for supporting the substrate in a vertical-offset configuration wherein the substrate is not in a perfectly vertical position but rather is offset from vertical by an acute angle. The transport system defines a path of substrate travel extending through the coater. The transport system is adapted for conveying the substrate along the path of substrate travel. Preferably, the transport system includes a side support for supporting a rear major surface of the substrate. The preferred side support bounds at least one passage through which coating material passes when such coating material is deposited onto the substrate's rear major surface. Preferably, the coater includes at least one coating apparatus (e.g.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: December 9, 2014
    Assignee: Cardinal CG Company
    Inventor: Klaus Hartig
  • Patent number: 8894522
    Abstract: A drive end block for a rotatable magnetron comprises a housing, which has a vacuum-tight rotary feedthrough extending through a wall of the housing, and a drive apparatus for generating a torque. An output end of the rotary feedthrough lies outside the housing for connection to the rotatable magnetron and a drive end of the rotary feedthrough lies inside the housing for introducing a torque. The drive apparatus is situated outside the housing of the drive end block and is connected using a torque transmission apparatus to the drive end of the rotary feedthrough so that the drive apparatus is electrically insulated from the housing and the rotary feedthrough of the drive end block.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: November 25, 2014
    Assignee: VON ARDENNE Anlagentechnik GmbH
    Inventors: Hans-Juergen Heinrich, Goetz Grosser, Thorsten Sander
  • Patent number: 8882976
    Abstract: A magnetron unit moving apparatus for preventing magnetization and magnetron sputtering equipment having the same. The magnetron unit moving apparatus includes a magnetron unit disposed adjacent to a target, to generate a specific magnetic field, and a movement unit to space the magnetron unit and the target apart such that a strength of a magnetic field generated over the target is within a predetermined reference strength range. It is possible to space the target and the magnetron unit apart so as to prevent the target from being magnetized when a process is not performed.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: November 11, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yun-Mo Chung, Min-Jae Jeong, Jong-Won Hong, Eu-Gene Kang, Heung-Yeol Na, Ki-Yong Lee
  • Publication number: 20140238849
    Abstract: Sputtering chambers including one or more first sputtering targets within the sputtering chamber and one or more second sputtering targets are generally provided. Each first sputtering target comprises a source material, and each second sputtering target comprises the source material and a dopant. A conveyor system is configured to transport a plurality of substrates through the sputtering chamber to deposit a thin film onto a surface of each substrate. A power source is electrically connected to each of the first sputtering targets and the second sputtering target. A target shield can also be included within the sputtering chamber, and can be positioned between a portion of the second sputtering target and the conveyor system. The dopant can be present within the second sputtering target as a discrete insert within a cavity defined by the source material. Methods are also provided for making a sputtering target and depositing a thin film.
    Type: Application
    Filed: February 25, 2013
    Publication date: August 28, 2014
    Applicant: First Solar, Inc.
    Inventors: Scott Daniel Feldman-Peabody, Stacy Ann Black, Robert Dwayne Gossman, Patrick Lynch O'Keefe
  • Patent number: 8808514
    Abstract: A magnetron sputtering apparatus comprising: a deposition chamber; a processing chamber in communication with the deposition chamber, wherein a target area composed of targets is located at the place where the processing chamber is connected with the deposition chamber; a transfer chamber provided adjacent to the processing chamber, wherein a first gas-tight gate is provided on a wall of the transfer chamber, the first gas-tight gate being opened or closed so as to control the vacuum degree in the transfer chamber and to replace the targets; a transfer device which is provided in the processing chamber and/or the transfer chamber, transfers the target between the transfer chamber and the processing chamber via a second gas-tight gate provided on the adjacent walls of the transfer chamber and the processing chamber for replacement when the transfer chamber is in a set vacuum degree state.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: August 19, 2014
    Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
    Inventor: Zhenyu Xie
  • Patent number: 8784622
    Abstract: A system is provided for etching patterned media disks. A movable non-contact electrode is utilized to perform sputter etch. The electrode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The material to be etched may be metal, e.g., Co/Pt/Cr or similar metals. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched. An isolation valve is disposed between the two chambers and the disk carrier moves the disks between the chambers. The carrier may be a linear drive carrier, using, e.g., magnetized wheels and linear motors.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: July 22, 2014
    Assignee: Intevac, Inc.
    Inventors: Michael S. Barnes, Terry Bluck
  • Patent number: 8758579
    Abstract: A chamber for physical vapor deposition is provided. The chamber includes a housing, a door for opening and closing the housing, and a bearing for receiving a target, wherein the bearing is oriented in a first direction. Further, the chamber is adapted so that the target is at least partially removable from the chamber in the first direction. According to an embodiment, a chamber for physical vapor deposition is provided. The chamber is adapted for receiving at least one target and a substrate. The chamber includes a housing, a door, and at least one bearing for mounting the target, wherein the bearing is attached to the door.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: June 24, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Reiner Hinterschuster, Lothar Lippert
  • Publication number: 20140170338
    Abstract: A method for making low emissivity panels, including control the ion characteristics, such as ion energy, ion density and ion to neutral ratio, in a sputter deposition process of a layer deposited on a thin conductive silver layer. The ion control can prevent or minimize degrading the quality of the conductive silver layer, which can lead to better transmittance in visible regime, block more heat transfer from the low emissivity panels, and potentially can reduce the requirements for other layers, so that the overall performance, such as durability, could be improved.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: Intermolecular Inc.
    Inventors: Guowen Ding, Brent Boyce, Mohd Fadzli Anwar Hassan, Minh Huu Le, Zhi-Wen Wen Sun, Yu Wang
  • Patent number: 8673125
    Abstract: An apparatus includes a chamber configured to form a reduced-pressure space, a carrier which holds a substrate, and a conveyer which conveys the carrier in the chamber. The chamber includes a side wall including an opening portion, and a partition wall arranged in the opening portion, the conveyer includes a permanent magnet provided on the carrier, and a driving magnet arranged outside the partition wall so as to drive the carrier, and the partition wall includes a first portion arranged between the driving magnet and a path through which the carrier passes, and a second portion arranged to connect the first portion to the side wall, the first portion having a smooth surface in a portion in which the first portion faces the path, and the first portion including a plurality of ribs arranged on a surface thereof on a side on which the driving magnet is arranged.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: March 18, 2014
    Assignee: Canon Anelva Corporation
    Inventors: Kazunari Aoki, Kazuhito Watanabe
  • Patent number: 8636882
    Abstract: Disclosed is a producing method of a semiconductor device, comprising: loading a substrate into a reaction furnace; forming a film on the substrate in the reaction furnace; unloading the substrate from the reaction furnace after the film has been formed; and forcibly cooling an interior of the reaction furnace in a state where the substrate does not exist in the reaction furnace after the substrate has been unloaded.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: January 28, 2014
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Kenichi Suzaki, Jie Wang
  • Patent number: 8623765
    Abstract: A processed object processing apparatus which enables a plurality of processes to be carried out efficiently. A plurality of treatment systems are communicably connected together in a line and in which the objects to be processed are processed. A load lock system is communicably connected to the treatment systems and has a transfer mechanism that transfers the objects to be processed into and out of each of the treatment systems. At least one of the treatment systems is a vacuum treatment system, and the load lock system is disposed in a position such as to form a line with the treatment systems.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: January 7, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Jun Ozawa, Gaku Takahashi
  • Patent number: 8605292
    Abstract: A method and device are provided for cleaning of an optical position measurement system in a coating installation. The optical position measurement system includes a cantilever, and a sensor head having a radiation inlet and/or outlet for the reception and/or emission of an optical signal, at a free end of the cantilever. For tempering of the sensor head, a local thermoregulation is applied using a heater and/or cooling device for heating and/or cooling of the sensor head depending on thermal conductivity of material of at least the sensor head and depending on secondary heat in the coating installation.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: December 10, 2013
    Assignee: VON ARDENNE Anlagentechnik GmbH
    Inventors: Damir Muchamedjarow, Hubertus Von Der Waydbrink, Michael Hentschel, Marco Kenne, Reinhardt Bauer, Steffen Leβmann, Thomas Bock, Reinhard Jaeger
  • Publication number: 20130284590
    Abstract: The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one rotatable target over the substrate; varying the relative position between the at least one target and the substrate. In addition, the present disclosure describes varying the distance between a target and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.
    Type: Application
    Filed: July 22, 2011
    Publication date: October 31, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Marcus Bender, Markus Hanika, Evelyn Scheer, Fabio Pieralisi, Guido Mahnke, Ralph Lindenberg, Andreas Lopp, Konrad Schwanitz, Jian Liu
  • Patent number: 8568577
    Abstract: Provided is a magnetron sputtering apparatus that increases an instantaneous plasma density on a target to improve a film forming rate. The magnetron sputtering apparatus includes a substrate to be processed, a target installed to face the substrate and a rotary magnet installed at a side opposite to the substrate across the target. In the magnetron sputtering apparatus, plasma loops are formed on a target surface. The plasma loops are generated, move and disappear in an axis direction of the rotary magnet according to a rotation of the rotary magnet.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: October 29, 2013
    Assignees: National University Corporation Tohoku University, Tokyo Electron Limited
    Inventors: Tadahiro Ohmi, Tetsuya Goto, Takaaki Matsuoka
  • Publication number: 20130270111
    Abstract: A sputtering device, including a chamber providing a reaction space, a sputter unit including a target disposed in the chamber, and a conveying unit including a plurality of rollers for supporting a substrate and for conveying the substrate relative to the target along a first direction, the conveying unit including fixed roller units having a predetermined diameter, and a variable roller unit having a diameter that changes in a second direction at both ends thereof, the second direction being orthogonal to the first direction.
    Type: Application
    Filed: January 14, 2013
    Publication date: October 17, 2013
    Inventors: Bo-Hwan PARK, Woo-Su LEE
  • Patent number: 8535496
    Abstract: A sputter-coating apparatus is configured for forming coatings on a plurality of workpieces, and includes a deposition chamber defining a cavity, a plurality of targets received in the cavity, and a plurality of supporting assemblies. Each target includes a first target plate and an opposite second target plate. The supporting assemblies are received in the cavity and arranged between the first target plates and the second target plates. Each supporting assembly includes a hollow rotating post for rotating about a first axis substantially parallel to a lengthwise direction thereof, at least one support extending from the post, and at least one driving unit. Each support includes a connecting arm rotatably connected to the post and a fixing portion attached to the connecting arm for supporting a workpiece. The driving unit is configured for driving each connecting arm to rotate relative to the corresponding post about a second axis.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: September 17, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chung-Pei Wang
  • Patent number: 8524054
    Abstract: A sputtering device includes a main body and a loading device received in the main body. The main body includes a top portion, a bottom portion, and a sidewall connected between the top portion and the bottom portion, an upper bearing mounted on the top portion, and a lower bearing mounted on the bottom portion. The loading device includes an outer frame, an inner frame received in the outer frame, and a gear device arranged between the outer frame and the in inner frame. The outer frame is rotatably connected to the upper bearing and includes a plurality of first rods arranged in a first circle. The inner frame is rotatably connected to the lower bearing and includes a plurality of second rods arranged in a second circle. The gear device is configured for bringing the outer frame and the inner frame to rotate in opposite directions.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: September 3, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chung-Pei Wang
  • Patent number: 8512530
    Abstract: A sputtering apparatus includes a process chamber having first and second regions, a metal target inside the process chamber, a target transfer unit inside the process chamber, the target transfer unit being configured to move the metal target between the first and second regions, a substrate holder in the second region of the process chamber, and a magnetic assembly in the first region of the process chamber, the magnetic assembly being interposed between the target transfer unit and a wall of the process chamber.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: August 20, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventors: Heung-Yeol Na, Jong-Won Hong, Seok-Rak Chang, Ki-Yong Lee
  • Patent number: 8500978
    Abstract: A composite coating apparatus includes a main body, two carrying boards, and two actuators. The main body defines a first chamber and a second chamber with a separating board intervening therebetween. The separating board defines a coating opening intercommunicating with the chambers. The carrying boards are received in the first chamber and rotatably connected to the separating board at two sides of the coating opening. Each carrying board defines a receiving groove for holding a substrate. The actuators are configured for driving the carrying boards to rotate between a first coating position, in which the substrate is exposed to the second chamber for a first coating process carried out in the second chamber via the coating opening, and a second coating position, in which the substrate faces away from the separating board for a second coating process carried out in the first chamber.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: August 6, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei
  • Patent number: 8500974
    Abstract: A carrier for use during sputtering includes a main body and support members. The main body defines a receiving space and includes a lateral surface defining at least one groove extending along a longitudinal direction. The receiving space and the at least one groove communicate with each other. The at least one groove is defined by a first surface and a second surface. The first surface defines recessed portions along the longitudinal direction and communicates with the receiving space. The support members are used for hanging workpieces. Each of the support members includes at least one support arm protruding from the lateral surface and is selectively and movably retained by one of the recessed portions.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: August 6, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chung-Pei Wang
  • Patent number: 8500977
    Abstract: A coating apparatus includes a housing, a sputter mechanism, an evaporation mechanism, and a workpiece transport assembly. The housing defines a receiving space. The workpiece transport assembly includes a fixing plate, a first transport member, and a first shaft. The fixing plate is secured to the housing via the receiving space and divides the receiving space into a sputter chamber and an evaporation chamber. The sputter mechanism is mounted in the sputter chamber, and the evaporation mechanism is mounted in the evaporation chamber. The fixing plate defines a through hole. The sputter chamber communicates with the evaporation chamber via the through hole. The first transport member is configured to transport at least one workpiece. The first shaft is secured to the first transport member and rotatably mounted to the housing.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: August 6, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei
  • Patent number: 8485128
    Abstract: A movable ground ring of a movable substrate support assembly is described. The movable ground ring is configured to fit around and provide an RF return path to a fixed ground ring of the movable substrate support assembly in an adjustable gap capacitively-coupled plasma processing chamber wherein a semiconductor substrate supported in the substrate support assembly undergoes plasma processing.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: July 16, 2013
    Assignee: Lam Research Corporation
    Inventors: Michael C. Kellogg, Alexei Marakhtanov, Rajinder Dhindsa
  • Patent number: 8480865
    Abstract: The present invention relates to a magnetron sputtering device including a large ring cathode having a defined inner radius. The position of the ring cathode is offset in relation to a center point of a planetary drive system. An anode or reactive gas source may be located within the inner radius of the ring cathode. Lower defect rates are obtained through the lower power density at the cathode which suppresses arcing, while runoff is minimized by the cathode to planet geometry without the use of a mask.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: July 9, 2013
    Assignee: JDS Uniphase Corporation
    Inventor: Georg J. Ockenfuss
  • Patent number: 8460519
    Abstract: Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: June 11, 2013
    Assignee: Applied Materials Inc.
    Inventors: Mengqi Ye, Zhendong Liu, Peijun Ding
  • Patent number: 8454804
    Abstract: Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: June 4, 2013
    Assignee: Applied Materials Inc.
    Inventors: Mengqi Ye, Zhendong Liu, Peijun Ding
  • Patent number: 8449678
    Abstract: A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: May 28, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Rick Endo, Kurt Weiner, Indranil De, James Tsung, Maosheng Zhao, Jeremy Cheng
  • Publication number: 20130115764
    Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.
    Type: Application
    Filed: November 8, 2012
    Publication date: May 9, 2013
    Applicant: INTEVAC, INC.
    Inventor: Intevac, Inc.
  • Patent number: 8430964
    Abstract: A coating apparatus includes a chamber device and a transporting device. The chamber device defines two separated coating chambers, two coating channels, which are alternately arranged, two coating slots communicating the coating chambers with the coating channels respectively, and a transportation channel extending to intersect the coating chambers and the coating channels and communicate with the coating channels. The transporting device includes a carrying board for carrying a substrate to be coated and an a driver for driving the carrying board to move along the transportation channel and to rotate the carrying board into one of the coating channels so that the substrate faces and aligns a corresponding coating chamber via a corresponding coating slot.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: April 30, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei
  • Patent number: 8414968
    Abstract: An in-line film forming apparatus capable of conveying a carrier at a high speed, increasing the exhaust capability within a film forming chamber, and easily realizing a high vacuum degree in a short time is provided. A conveyor mechanism has a linear motor drive mechanism which drives the carrier in a noncontact state, a horizontal guide mechanism which is provided so as to be able to contact a side portion of the carrier, and guides the carrier driven by the linear motor drive mechanism in a horizontal direction, and a vertical guide mechanism which is provided so as to be able to contact a lower end of the carrier, and guides the carrier driven by the linear motor drive mechanism in the vertical direction.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: April 9, 2013
    Assignee: Showa Denko K.K.
    Inventor: Satoru Ueno
  • Patent number: 8387563
    Abstract: A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: March 5, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Rick Endo, Jeremy Cheng, Indranil De, James Tsung, Kurt Weiner, Maosheng Zhao
  • Patent number: 8388753
    Abstract: A coating apparatus includes a deposition case, a reaction assembly, two precursors, a target, and a driving assembly. The deposition case includes a housing defining a cavity for receiving workpieces. The reaction assembly receives in the cavity and includes an outer barrel, an inner barrel, a plurality of nozzles, and a plurality of pipes. The outer barrel includes a main body and two protruding bodies. The main body and the inner barrel cooperatively define a first room therebetween. Each protruding body defines a second room communicating with the first room. The inner barrel defines a third room. The nozzles extend from the main body and communicate with the first room. The pipes extend from the inner barrel and communicate with the third room. The precursors receive in the second rooms. The target receives in the third room. The driving assembly drives the housing to rotate relative to the reaction assembly.
    Type: Grant
    Filed: May 31, 2010
    Date of Patent: March 5, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei
  • Patent number: 8377270
    Abstract: The present invention is to reduce the variation in axis of easy magnetization of a magnetic thin film with respect to a large diameter substrate. A plasma processing apparatus (1) includes: a substrate holder (11) that supports a substrate (10); a magnet holder (31) that is provided around the substrate holder and supports a magnet (30); a cathode unit (50) that is provided above the substrate, and applied with a discharge voltage; a rotating mechanism (20, 40) that is capable of rotating one or both of the substrate holder and the magnet holder along the planar direction of the process surface of the substrate; a rotational position sensor (25, 45) that detects the rotating positions of the substrate and the magnet; and a control device (60) that controls an operation of each operation element.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: February 19, 2013
    Assignee: Canon Anelva Corporation
    Inventor: Koji Tsunekawa
  • Patent number: 8349156
    Abstract: Disclosed invention uses a coaxial microwave antenna to enhance ionization in PVD or IPVD. The coaxial microwave antenna increases plasma density homogeneously adjacent to a sputtering cathode or target that is subjected to a power supply. The coaxial microwave source generates electromagnetic waves in a transverse electromagnetic (TEM) mode. The invention also uses a magnetron proximate the sputtering cathode or target to further enhance the sputtering. Furthermore, for high utilization of expensive target materials, a target can rotate to improve the utilization efficiency. The target comprises dielectric materials, metals, or semiconductors. The target also has a cross section being substantially symmetric about a central axis that the target rotates around. The target may have a substantially circular or annular a cross section.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: January 8, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Michael W. Stowell, Richard Newcomb
  • Patent number: 8308915
    Abstract: Systems and methods are disclosed for face target sputtering to fabricate semiconductors by providing one or more materials with differential coefficients of expansion in the FTS chamber; and generating a controlled pressure and size with the one or more materials during sintering.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: November 13, 2012
    Assignee: 4D-S Pty Ltd.
    Inventor: Makoto Nagashima
  • Patent number: 8293081
    Abstract: A physical vapor deposition device includes a chamber; a cathode and an opposite anode, a target material, and supporting device arranged in the chamber. The target material and the supporting device are positioned between the cathode and the anode. The supporting device includes a rotatable device and a hollow supporting plate. The hollow supporting plate is configured for securing the workpiece and exposing part of the workpiece where is needed to be coated. The hollow supporting plate is movably fastened to the rotatable device. A distance from the hollow supporting plate to the rotatable device can be adjusted when the hollow supporting plate is rotated together with the rotatable device in order to align workpiece with the target material.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: October 23, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei