Abstract: A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable reagent, and (d) electrolytically depositing at least one metal film (11) on said film (9).

Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.

Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

Abstract: A process for plating an electrically nonconductive substrate by the following sequence of steps:(1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent;(2) a step of treating the electrically nonconductive substrate from said step (1) with a solution containing an anionic surfactant;(3) a step of the electrically nonconductive substrate from said step (2) with a solution containing a palladium compound and at least one nitrogen-containing sulfur compound selected from among thiourea and its derivatives;(4) a step of treating the electrically nonconductive substrate from said step (3) with a reducing solution containing at least one member selected from among sodium borohydride, sodium hypophosphite, hydrazine, dimethylaminoborane, hydroxylamine and glyoxylic acid; and(5) a step of forming an electroplating layer on the electrically nonconductive substrate from said step (4).

Abstract: A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at least one water soluble polymer selected from the group consisting of homopolymers and copolymers, and at least one aromatic compound which chemically polymerizes the water-soluble polymer and the aromatic compound to form a conductive polymer, and electroplating the conductive polymer. Each water-soluble polymer contains uncharged structural elements or is cationic polyelectrolyte. Additionally, each water soluble polymer is capable of protonizing/deprotonizing reactions, formation of hydrogen bridge compounds and van der Waals interactions.

Abstract: Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a microemulsion of a monomeric thiophene of the formula (I) is used to form the conductive polythiophene layer, ##STR1## in which X denotes oxygen or a single bond,R.sub.1 and R.sub.2 mutually independently denote hydrogen or a C.sub.1 -C.sub.4 alkyl group or together form an optionally substituted C.sub.1 -C.sub.4 alkylene residue or a 1,2-cyclohexylene residue,and in that the conductive layer of polythiophene is produced on the walls of the through-holes by subsequent or simultaneous treatment with acid and, finally, a metal is electro-deposited on this conductive base.

Abstract: The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average particle diameter of 2 .mu.m or less or carbon black particles with an average particle diameter of 1 .mu.m or less; applying this aqueous dispersion to a surface of a nonconductive surface substrate; dipping the nonconductive surface in a strong acidic aqueous solution with pH 3 or lower to form a layer of said particles; and electroplating using the particle layer as a conductive layer.

Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

Abstract: A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of hydroxyquinoline which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.

Abstract: A process for electroplating a substrate by coating the substrate with a porous coating of conductive particles having a reducing agent within its pores and electroplating over said coating. The reducing agent causes formation of an initial electroless metal deposit over the conductive particle coating thus enhancing its conductivity. The process is especially useful for the fabrication of printed circuit boards.

Abstract: A process for electroplating a substrate by coating the substrate with a liquid dispersion of conductive particles selected from the group of metals, metal oxides and metal sulfides, drying the substrate and electroplating over said dried coating. The process is especially useful for the fabrication of printed circuit boards.

Abstract: A composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of an anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.

Abstract: An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.

Abstract: A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising:(a) contacting the substrate with a suspension comprising a noble metal colloid suspended in a polymer matrix to obtain a coated substrate;(b) optionally removing at least part or substantially all of the polymer matrix from said coated substrate;(c) electrolytically coating the substrate obtained after step (a) or (b) with a solution of the principal metal coating. The polymer matrix is selected to combine with the metal of the noble metal coating or principal metal or both. Prior to contacting the substrate with the suspension, it may be contacted with a conditioner that will combine with the noble metal or principal metal or both to obtain a conditioned substrate. The conditioned substrate is then contacted with the suspension.

Abstract: A method for electroplating a nonconducting surface using a metal oxide colloid. The process comprises contacting the surface of the nonconductor to be plated with a preformed colloid of a metal oxide to adsorb the colloid onto the surface of the nonconductor and then electroplating metal over the surface having the adsorbed metal oxide colloid. The process may include a step of reducing the metal oxide to a lower valent state prior to the step of metal plating.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

Abstract: A method for the direct metallization of non-conductors and printed circuit boards is disclosed wherein the non-conductive substrate or printed circuit board is treated with an aqueous cleaner/conditioner composition comprising a cationic surfactant, said surfactant is a quaternary ammonium ion having a molecular weight of below 1,000, thereby rendering the substrate of a printed circuit board receptive to the uniform adherence and adsorption of the noble metal catalyst deposited thereafter, which catalysts are used, directly or indirectly, as the sites of direct electroplating without the need of using electroless plating. The cleaner/conditioner is particularly useful because it does not require the use of chelating agent(s) which are commonly used in the art and thereby eliminates waste treatment problems prevalent in the industry.

Abstract: An electroplated element is formed to include an insulating substrate, a conducting polymer polymerized in situ on the substrate, and a metal layer deposited on the conducting polymer. In one application a circuit board is formed by polymerizing pyrrole on an epoxy-fiberglass substrate in a single step process and then electrodepositing a metal over the resulting polypyrrole polymer. No chemical deposition of the metal is required prior to electroplating and the resulting layer of substrate-polymer-metal has excellent adhesion characteristics. The metal deposition is surprisingly smooth and uniform over the relatively high resistance film of polypyrrole. A continuous manufacturing process is obtained by filtering the solution between successive substrates to remove polymer formed in the solution, by maintaining the solution oxidizing potential within selected limits, and by adding a strong oxidant, such as KMnO.sub.

Abstract: Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step.

Abstract: A process for coating a plastics article with a thin layer of noble metal, wherein said plastics article contains a finely particulate, homogenized filler selected from the group consisting of MnO, NiO, Cu.sub.2 O, SnO and Bi.sub.2 O.sub.3, and said plastics article is coated with an acid aqueous solution of a noble metal salt.

Abstract: Disclosed is a method and apparatus for achieving a uniform coating of metal, such as copper, on an insulating strip, such as polyimide. After activating the surface, the strip is passed through a plating cell which includes a pumped solution mixed with a gas to achieve frothing. A high current is supplied to the cathode, so a cooled cathode construction is provided to prevent burning of the strip. Further features of the apparatus include a means for splicing strips, and a cantilever beam cathode contact for improving the physical contact with the strip.