Abstract: An Sn--Bi alloy-plating bath comprises (i) Bi ions, (ii) Sn ions, (iii) ions of one metal selected from the group consisting of Cu, Co and Ag, and (iv) one member selected from the group consisting of carboxylic acids, lactone compounds, alkanesulfonic acids, alkanolsulfonic aicds, phenolsulfonic acids and salts thereof and is substantially free of lead ions. The bath permits the formation of an Sn--Bi alloy-plated film, does not form any plated film having impaired quality even at a temperature higher than about 100.degree. C. and does not form any whisker.

Abstract: A Sn--Bi alloy plating bath comprises at least one compound selected from the group consisting of polyoxy monocarboxylic acids, polyoxy lactones, polycarboxylic acids and salts thereof. A plating method comprises the step of applying a Sn--Bi alloy plating film to a substrate in the foregoing plating bath. The plating bath permits the formation of a Sn--Bi alloy plating film having a bismuth content ranging from 0.1 to 75% over a wide current density range. Moreover, the plating bath never forms precipitates, does not become turbid, does not cause any change of the bath composition and is, therefore, quite stable even when it is stored over a long period of time.

Abstract: An electroplating solution (A), comprises an aqueous solution consisting essentially of lead phenolsulfonate: 1 to 250 g/liter in terms of Pb content; tin phenolsulfonate: 0.1 to 250 g/liter in terms of Sn content; phenolsulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene alkylamine: 1 to 50 g/liter; a 1-naphthaldehyde derivative: 0.001 to 1 g/liter; and an aldol sulfanilic acid derivative: 0.1 to 30 g/liter; or an aqueous solution (B) consisting essentially of lead methanesulfonate: 1 to 250 g/liter in terms of Pb content; tin methanesulfonate: 0.1 to 250 g/liter in terms of Sn content; methanesulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene alkylamine: 1 to 50 g/liter; and an aldol sulfanilic acid derivative: 0.1 to 30 g/liter.

Abstract: A tin-zinc alloy electroplating bath comprises an amphoteric surfactant, a water-soluble stannous salt, a water-soluble zinc salt and a balance of water. When the tin-zinc alloy plating bath of the present invention is used, the formed coating film comprises a uniform alloy composition even in case where the current density varies over a wide range. Therefore, the coating film having the uniform alloy composition can be formed even on the substance having a complicated shape and the chromate treatment becomes satisfactory. As a result, the effect of the coating is improved, the resultant product is stable and the productivity is improved. Thus the tin-zinc alloy coating film having a high quality can be provided.

Abstract: The present invention relates to a fluoroborate solder electroplating solution containing lead (Pb) and tin (Sn) ions, in which the total Pb and Sn ion content is 35.5 to 150 g/l, and 70 wt % of them is Sn. The fluoroborate solder electroplating solution further contains 0.05-5 g gelatin per liter of the solder electroplating solution as an additive for increasing the deposition of Sn ions and enhancing the microstructural fineness of the solder plating. A suitable current density is 1 to 3 A/dm.sup.2 in electroplating the present solder electroplating solution.

Abstract: Incorporating an additive into a tin electroplating bath substantially inhibits soluble ferrous ions, ferric ions, and stannous ions from reacting thus minimizing the formation of stannic tin which is lost in the plating sludge.

Abstract: In order to produce bright to brilliant, leveled copper-tin alloy coatings, galvanic baths are used which contain 1 to 60 g/l copper in the form of copper(I) cyanide, 1 to 50 g/l tin in the form of alkali stannate, 0 to 10 g/l zinc in the form of zinc cyanide, 1 to 200 g/l of one or several complex binders (e.g., oligosaccharides and/or polysaccharides), 1 to 100 g/l free alkali metal cyanide, 1 to 50 g/l free alkali metal hydroxide, 0 to 50 g/l alkali metal carbonate 0.01 to 5 g/l brightener (e.g., alkene sulfonate, alkyne sulfonate, pyridine compounds or sulfur-containing propane sulfonates) and 0 to 100 mg/l lead as lead(II) acetate or lead(II) sulfonate.

Abstract: Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.

Abstract: A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.

Abstract: A process for acidic electrolytical deposition of lead layers and predominantly lead-containing layers onto surfaces using an electrolyte containing lead salts and acids, in particular alkanesulfonic acid, borofluoric acid or silicofluoric acid, with non-ionic surfactants and cationic or amphoteric surfactants being added to the electrolyte. The process can be operated at current densities of from 0.5 to 20 A/dm.sup.2 and at a pH value below 1.

Abstract: A composition for forming an electrodeposited tin-lead alloy of controlled composition comprising:(a) about 1.5 to 1.8 percent by weight lead fluoroborate;(b) about 2.5 to 2.75 percent by weight tin fluoroborate;(c) about 91 to 92 percent by weight fluoroboric acid;(d) about 2.7 to 3.4 percent by weight boric acid; and(e) about 0.3 to 0.9 percent by weight Peptone,wherein the alloy comprises 62-64 weight percent tin and 36-38 weight percent lead.

Abstract: The invention describes a novel electrolyte additive for a sulfuric acid tin(II) containing colorant bath for the alternating current coloring of anodized aluminum surfaces, consisting of a synergistic mixture of at least one antioxidant of one of the general formulas (I to IV) and at least one throwing power improver of general formula (V), and to a process for the alternating current coloration of anodized aluminum surfaces using the electrolyte additive of the invention.

Abstract: A manufactured stannous sulfate granulate is suitable for electrolytically coloring anodized aluminum with metallic salts, where the granulate particles have a linear extension from 0.1 to 10 mm. Also disclosed are a process for manufacturing the same and using it for electrolytically coloring anodized aluminum with metallic salts. The manufactured stannous sulfate granulate is characterized by technical advantages, such as storage stability, easy dispensibility, and absence of dust, compared to conventionally used stannous sulfate powders.

Abstract: Tin-zinc alloys can be electroplated from an aqueous alkaline solution containing an alkali metal zincate, an alkali metal stannate, and an alkali metal tartrate. The electroplating bath is alkaline with a pH of 11 to 14, preferably 12.0 to 13.5.

Abstract: This invention relates to additives for methanesulfonic acid based tin and tin alloy plating formulations. Specifically, the invention involves the use of gallic acid in the multiple roles of antioxidant, grain refiner, selective precipitant, and selective chelator in methanesulfonic acid based tin or tin alloy plating formulations.

Abstract: Baths and methods for the electroplating of tin, tin-lead, tin-antimony, and/or tin-bismuth are described. Specifically, electrodeposition solutions, based on alkanesulfonic acids, soluble metal salts, other additives, and at least one nonionic surfactant terminated with a ketone group, have been developed. The use of ketone (e.g., --OCH.sub.2 COCH.sub.3) terminated polyoxyalkylene surfactants results in electrodeposition solutions with reduced foam, and the tin and tin alloy electrodeposits from such plating baths are of superior quality.

Abstract: A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.

Abstract: A bath for electrodepositing tin, lead or an alloy thereof, containing a tin and/or lead ion and a sulfate ion becomes stable at pH 1 or higher when a condensed phosphate ion is added thereto. The bath is effective for depositing tin-lead alloy films on sealing glass-metal integrated articles.

Abstract: A process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, preferably of an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of six carbon atoms or less. After electroplating, the tinplate is rinsed and the rinse water only needs to be treated for removal of tin ions prior to discharge by normal procedures.

Abstract: A brightener is added in the ratio of 0.5-5 g per 1 l of electric plating bath of pH 4-8 containing citric acid or citrate for tin or tin alloy plating. The brightener contains a water soluble reaction product obtained by reacting polyamine such as pentaethylenehexamine, aliphatic aldehyde such as formaldehyde, and aromatic carboxylic acid such as methyl benzoate.