Abstract: A laminated metal thin plate produced by electrodeposition is composed of a plurality of metal layers provided by at least two kinds of materials different in composition from each other. The laminated metal thin plate includes a first layer excellent in mechanical characteristics and/or chemical resistance and a second layer excellent in electrical characteristics such as electrical conductivity. The first and the second layers are adhered to each other in atomic level directly at their interface, with composition gradient at their interface, or with an adherence buffer layer such as a copper thin film interposed therebetween. The first layer is at first deposited on an electrode substrate. The second layer is deposited on the first layer. Deposition is repeatedly carried out in such a way that the first layers on opposite sides of the second layer are equal in thickness. Finally, the electrode substrate is dissolved and removed.

Abstract: An electrode is described. The electrode includes a substrate having a first and a second surface, a conductive layer, multilayer structure having alternating layers of at least one polymer layer and at least one electroactive chemical bound nanoparticle layer. The conductive layer is disposed on the second surface of the substrate, and the multilayer structure is disposed on the conductive layer.

Abstract: Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy layer.

Abstract: Disclosed herein are mounting plates and methods for making an electroforms. In one embodiment, the master comprises an edge, a back, a master area, and a pattern having a pattern area. The mounting plate comprises a cutout having a cutout size that is smaller than the master area and larger than the pattern area, and an electrically conductive over-plate area extending around the cutout, between the cutout and an outer edge of the mounting plate. In one embodiment the method comprises: attaching a master to a mounting plate, masking the edge and the back of the master and portions of the mounting plate that will be exposed to plating material, other than the over-plate area, plating the pattern to form the electroform having an edge thickness, and removing the electroform from the master.

Abstract: A method of manufacturing a metal microstructure (1) by using a resin mold (13).

Abstract: An insulated vibration-stirring apparatus comprising a vibration generating means containing a vibration motor and a vibrating member attached to that motor, and a vibrating rod attached by an installation piece to allow vibration linked with the vibration generating means, and vibrating vanes installed on this vibrating rod. An electrical insulation area made from hard rubber is installed on a section nearer to the installation section to the installation piece than the section where the vibrating vanes are mounted on the vibrating rod. An electrical line is connected to the lower section of the vibrating rod on the electrical insulation area side where the vibrating vanes are installed. This electrical line conducts power to the vibrating vanes by way of the lower section of the vibrating rod.

Abstract: An apparatus of manufacturing a biochip and manufacture method of biochip tip array. The invention provides an apparatus for manufacturing a biochip from a substrate. The apparatus comprises a tip array, a reservoir tank and a conduit connecting the tip array and the reservoir tank. When the substrate is placed over the tip array, the agent in the reservoir tank can be applied to the substrate by moving upward and downward the reservoir tank with respect to the tip array.

Abstract: An electroformed tool has an integrated base with channels contacting the tool with heating and cooling fluids flowing through the channels during injection molding or hot embossing. A blank base is machined with a network of interconnected open channels on a top surface and end flow through passageways communicating with the channels. The tool is used as an electrode to erode the top surface of the blank base using plunge electro discharge machining by lowering the uneven deposit on the bottom of the electroformed tool down onto the top surface of the blank base in the electro discharge machining environment to form a top contoured surface to mate with the uneven deposit on the non-embossing side of the substrate. The tool and base are sealed together.

Abstract: A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.

Abstract: The invention discloses a forming method including the steps of: (1) providing a nonconductor; (2) vacuum-sputtering a first metal layer onto the nonconductor; (3) plating an outer metal layer onto the first metal layer, wherein the material of the outer metal layer is different from that of the first metal layer. The invention also discloses a model including a first metal layer formed by a vacuum-sputtering process and an outer metal layer plated onto the first metal layer. The forming method of the invention involves vacuum-sputtering a metal layer onto the nonconductor, such that the surface quality is better. Consequently, the surface quality of other materials plated onto the metal layer will also be better. Furthermore, the method of the invention is simple to operate and will not pollute the environment.

Abstract: A process for producing a master carrier contains steps of: forming a desired pattern on a support to form a resist pattern support; forming a first ferromagnetic thin film on the resist pattern support by a vacuum film forming method; forming a third ferromagnetic thick film on the first ferromagnetic thin film by an electroplating; and peeling the support from the resist pattern support provided with the first ferromagnetic thin film and the third ferromagnetic thick film.

Abstract: Manufacturing a reflex insert tool includes the steps of assembling optical pins in a bundle, and inserting same into a mold clamp assembly. The mold clamp assembly is placed into a vat, wherein an electroformed skin is developed which in turn is removed from the bath. A cold spraying technique is utilized applying a build up of material on the back surface of the electroformed skin. The back surface of the reflex insert is then machined and through wire EDM, configured to a desired shape and thereafter ready for insertion into a tool for injection molding plastic parts therefrom.

Abstract: A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.

Abstract: The present invention provides a mold for fine electroforming M having a simple structure. In order to improve the productivity of a metal product, an electrode portion can be arranged with a much higher density, and a metal thin film formed on the electrode portion can easily be peeled off. The present invention provides a manufacturing method for manufacturing the mold M with a higher accuracy and by an easier way. The mold for fine electroforming M has a conductive substrate 1 to function as a cathode during electroforming and insulation layer 2 having an opening 21, which has a shape corresponding to a shape of a plane shape of the metal product P and is through to the conductive substrate 1, and composed of an inorganic insulation material having a thickness T2 of not less than 10 nm and less than one-half the thickness T1 of the metal product P. The surface of the conductive substrate 1 exposed at the opening 21 is adapted to serve as the electrode portion.

Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 ?m range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract: Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 ?m. The sensing element is produced by electrolytic deposit of a tin film on an insulating support in an electromechanical cell, where the anode is comprised of tin and the cathode is a conductive film applied on the surface of the insulating support at one of its ends, the two electrodes being separated by an electrolyte comprised of a tin salt solution, and by passing a constant current through said cell. The deposit step is followed by an oxidizing step.

Abstract: A method of manufacturing a metal microstructure by using a resin mold.

Abstract: A continuous electroforming process to form a strip for battery electrodes, comprising the steps of providing a mandrel having on its surface a reusable pattern subdivided into conductive and non-conductive areas; moving said mandrel through an electroforming bath to deposit a metal layer on said mandrel while it moves through the electroforming bath until the metal layer has assumed the shape of the conductive pattern and a thickness at least sufficient to provide strength for the layer to be removed from said mandrel; and separating said layer from said mandrel; is characterised by moving said strip through at least one subsequent bath in which electrodeposition of metal takes place on both sides of said strip while it is moved through said subsequent bath, applying a current density of at least 10 A/dm2 and up to 300 A/dm2 to the conductive surface of the moving mandrel and to the metal surface of the strip in each of the subsequent baths; and directing a forced flow of electrolyte onto the surface of the

Abstract: A method of producing metal ferrules and an apparatus therefore enable metal ferrules to be produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core wires. A jig receives a metal to be electroformed and is placed in an electroforming tank, a holding unit in which a plurality of core wire holder for holding core wires are held in circumferential array is installed in the electroforming tank, and the core wire holders and the holding unit are rotatable on their respective axes. It is preferable that the resistivity of the core wires be 5×10?6 ?cm or less. A core wire plated within a thin layer of metal having a resistivity of 5×10?6 ?cm or less may be used. A conductive electric discharge body may be provided on the front end of the core wire.

Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.

Abstract: A method for manufacturing a metal mask that facilitates easy dimensional control in the manufacturing process and can manufacture multiple metal masks having high and consistent precision. A Cr film 2 having a mask pattern 2a is formed on the surface of a glass plate 1, a dry film 4 is formed on the Cr film 2, the dry film 4 is exposed from the glass plate 1 side with the Cr film 2 as a mask, a mask pattern 4a having the same shape as that of the mask pattern 2a is formed on the dry film 4, and a metal plating layer 6 is formed on the Cr film 2. The metal plating layer 6 is separated to form a metal mask 7.

Abstract: A two-layered anode (1?) has a lower layer (2) including a non-conductive carrier material to which a conductive electrode layer (3?) is applied. Non-conductive areas, formed by partial removal of the electrode layer, have a predetermined structure corresponding to the structure of a structured polymer film (11) to be formed. The anode (1?) is connected with a platinum cathode in an electrolyte into which compounds of low molecular weight, preferably monomers of the polymer film (11), are introduced. During current flow, a conductive polymer film (11) of the predetermined structure is formed on conductive areas brought into contact with the electrolyte. A non-conductive substrate layer (13) is applied to the structured polymer film (11). The structured polymer film (11) adheres to the non-conductive substrate layer (13) and can be released from the electrode (1?) without damaging the electrode.

Abstract: An insert for a mold, particularly a thermoplastic injection mold, including a stamper having an impression surface and a backing surface. The insert also has a support block having a facing surface having a plurality of projections thereon, with the plurality of projections in contact with the backing surface. A quantity of adhesive is disposed between the sides of the projections adhering the facing surface to the backing surface. A method for fabricating such an insert for a mold is also disclosed.

Abstract: Methods and apparatus employ the use of arrays (301, 902) of two or more electronically-discrete electrodes (1, 2, 3 . . . ) to facilitate high-throughput preparation and testing of materials comprising two or more elements. High rates of deposition, synthesis and/or analysis of materials are achieved with the use of arrays of electrodes whereby desired materials are developed. The high rate synthesis and/or analysis of an array of materials uses deposition control techniques in conjunction with the electrode array to develop a meaningful array of materials and to analyze the materials for desired characteristics to develop one or more materials with desired characteristics. The use of an array of electrodes enables high-throughput development of materials having scientific and economic advantages.

Abstract: A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Abstract: Disclosed is a fabrication method of a printed circuit board, consisting of plating a metal on a pattern-formed metallic substrate to form a conductive metal line; forming a polymer layer as a base substrate over the conductive metal line-formed metallic substrate and drying the formed polymer layer; forming a via hole in the polymer layer, followed by plugging the formed via hole by electroplating; and removing the metallic substrate. The method is advantageous in terms of maximum efficiency of use of the surface area of PCB, and fineness and high integration of circuits because of not requiring an additional etching process.

Abstract: In a method for manufacture of prosthetic moulded parts for the dental sector with the aid of galvanic metal deposition, deposition at least partly takes place by pulse current. Deposition is preferably ended in a period of less than 5 hours, particularly within 1 to 2 hours. Deposition preferably takes place in the method of a precious metal or precious metal alloy, particularly gold or a gold alloy. Aqueous gold sulphite baths are more particularly used.

Abstract: A process for making a microdevice that includes the steps of providing a base member and selectively electroforming a support member for supporting a microplatform with respect to the base member. The process also includes the steps of selectively electroforming the microplatform and forming a flexible hinge member for hingedly connecting the microplatform to the support member and allowing relative movement of the microplatform with respect to the support member. This microdevice, when compared to prior art devices, can have improved mechanical strength, rigidity, low deformation, and high planarity.

Abstract: A molten salt bath for electroforming containing lithium bromide, cesium bromide and a halide of an alkali metal and/or a halide of an alkaline-earth metal is provided. In addition, a method of manufacturing a metal product including the steps of: forming a resist pattern on a conductive substrate and exposing a portion of the conductive substrate; immersing the conductive substrate having the resist pattern formed into the molten salt bath for electroforming, the molten salt bath for electroforming containing a metal to be precipitated and/or a compound of a metal to be precipitated; and precipitating the metal at a portion where the conductive substrate is exposed, is provided. Further, a molten salt bath for electroforming obtained by mixing lithium bromide, cesium bromide, and a halide of an alkali metal and/or a halide of an alkaline-earth metal is provided.

Abstract: An electroforming apparatus and an electroforming method that are capable of performing high-precision electroforming are provided. An electroforming tank 1 accommodated in an outer tank 2 is continuously supplied with an electrolyte 3 from a control tank 5, and electroforming is carried out in an overflow layer 10 of electrolyte 3 formed over the electroforming tank 1. A bus 25 for electroforming that is retained by a retaining jig 30 is carried along the overflow layer 10 by a jig transfer device 20. The electrolyte 3 overflowing the electroforming tank 1 is collected into a control tank 5 from the outer tank 2 and supplied to the electroforming tank 1 again after being filtered.

Abstract: A method and apparatus for maintaining electro-deposition of metal on a cathode in an electrolytic cell. The cell comprises a metal anode, a cathode, an electrolytic bath and a main power supply to apply an electric potential across the anode and cathode resulting in a forward current and deposition of metal from said anode to the cathode. An auxiliary power supply is also provided for connection to the cell. In cases where the mains power supply falls below a predetermined value, the auxiliary power supply maintains a predetermined direction and quantity of current flow in the cell. The auxiliary power supply may be continuous or activated only when the current flow and/or direction of current falls below said predetermined value.

Abstract: A process for making a microdevice that includes the steps of providing a base member and selectively electroforming a support member for supporting a microplatform with respect to the base member. The process also includes the steps of selectively electroforming the microplatform and forming a flexible hinge member for hingedly connecting the microplatform to the support member and allowing relative movement of the microplatform with respect to the support member. This microdevice, when compared to prior art devices, can have improved mechanical strength, rigidity, low deformation, and high planarity.

Abstract: A V-groove mold fabrication method is disclosed. The method for fabricating a V-groove mold includes the following steps: (a) providing a matrix substrate having a plurality of V-grooves, and then forming a metal layer on said matrix substrate; immersing said matrix substrate having said metal layer thereon with an electroforming metal ion solution and forming a father mold by an electroforming process; and separating said father mold from said matrix substrate.

Abstract: In a method for producing two-membered or multi-membered all-ceramic dental shaped parts, such as framework elements for bridges and the like, a model is first produced from the basic structure for which the dental shaped part is intended. With the aid of this model and a suspension of ceramic particles, a ceramic green body is formed, in particular by electrophoretic deposition, and is subsequently sintered. In said method, at least some of the dimensions of the model are selected so that the shrinkage which occurs during sintering of the green body is compensated, in order in this way to achieve the desired fit between dental shaped part and basic structure.

Abstract: A method of manufacturing a ferrule includes the steps of electroforming on a metallic wire used as a mother mold to produce an elongated cylindrical rod, by providing grooves on the circumferential surface of the rod, breaking the groove portion and drawing the wire, and machining the rod with respect to at least length and size (diameter), such that the method omits the step of sealing the wire with an electric insulator and an elongated electroformed rod can be manufactured and variation in sizes of diameter and off-center failure are decreased.

Abstract: A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethanethiol; N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole; 4,6-dihydroxy-2-mercaptopyrimidine; and mercapto-nicotinate; as a compound forming a complexing compound with gold. Chloroaurate or gold sulfite is preferably used as a gold salt.

Abstract: A microstructured mold is produced from a solid body (metal, ceramic, glass, stone or monocrystalline material) by precision mechanical machining, additive or subtractive structuring. The mold insert is filled and covered by a flowable material and the solidified material is separated from the mold insert giving a microstructure element. The microstructure elements produced by the process have good material properties and can be prepared in a broad range of shapes and structures.

Abstract: A method of replicating a structured surface that includes providing a tool having a structured surface having a surface morphology of a crystallized vapor deposited material; and replicating the structured surface of the tool to form a replicated article. A replicated article includes at least one replicated surface, wherein the replicated surface includes a replica of a crystallized vapor deposited material. A replication tool includes: a tool body that includes a tooling surface; and a structured surface on the tooling surface, wherein the structured surface includes crystallized vapor deposited material or a replica of crystallized vapor deposited material.

Abstract: It is known to apply a pulse current during electrodeposition of nickel. In the invention, pulse current waveforms have ramp-down spikes leading to improvements in surface finishes of electroforms created by the process.

Abstract: A system and method are provided for fabricating an orifice plate for use in an ink jet printing system. Initially, a substrate base is provided, and a controlled-release layer is applied to a surface of the substrate base. A conductive metal layer is adherently coated on the controlled-release layer. At least one dielectric peg is created on a portion of the conductive metal layer, and a nozzle layer is applied on the conductive metal layer to partially cover the dielectric peg. Photolithography is used to define a trench that covers the nozzles prior to formation of a second reinforcing layer. The controlled-release layer is removed to separate the orifice plate from the substrate base. The conductive metal layer is selectively etched from the nozzle layer to produce a completed multi-layer orifice plate.

Abstract: A method for fast thickening electroforming stamper, in which a substrate is placed in an electroforming tank and electroforming to form a first electroforming layer on the face of the substrate. A first thickening material is connected with a face of the first electroforming layer distal from the substrate. The first thickening material, the first electroforming layer and the substrate together form a combination body. After the substrate is separated from the first electroforming layer, at least the first electroforming layer and the first thickening material together form a stamper.

Abstract: One or more fractal antennas are produced in an electroforming circuit. A stainless steel on glass mandrel is covered with a dielectric in an inverse image of a fractal antenna to be formed. The portion of the stainless steel uncovered by the dielectric is chemically washed so that a fractal antenna formed thereon can be more efficiently removed. The mandrel is made a cathode in an electroforming circuit, which results in a fractal antenna being formed on the mandrel. The fractal antenna is separated from the mandrel and mounted on a rigid or semi-rigid substrate.

Abstract: Steel cabinet parts and other steel objects are electrocoated in a cationic resin-containing bath. The steel objects are chromium-coated, free of phosphate and preferably free of chromium oxide. The products are not significantly subject to filiform corrosion, and the process is economically beneficial because throwpower is more easily controlled than in previous processes.

Abstract: Electrolytic solutions containing organic additive(s) selected from a described class of additives (e.g., 4,6-dihydroxypyrimidine) reduce overall applied electrical potential of electrolytic cells and/or reduce gas formation at the anode(s) or increase copper production rate. Benefits include reducing overall power consumption and reducing acid mist during electrolytic processes.

Abstract: A method for depositing a coating of a nanostructure material onto a substrate includes: (1) forming a solution or suspension of containing the nanostructure material; (2) selectively adding “chargers” to the solution; (3) immersing electrodes in the solution, the substrate upon which the nanostructure material is to be deposited acting as one of the electrodes; (4) applying a direct and/or alternating current electrical field between the two electrodes for a certain period of time thereby causing the nanostructure materials in the solution to migrate toward and attach themselves to the substrate electrode; and (5) subsequent optional processing of the coated substrate.

Abstract: A method of manufacturing a ferrule comprising the steps of electroforming on a wire such as a metallic wire used as a mother mold to produce an elongated cylindrical rod, by providing grooves 7 on the circumferential surface of the rod, breaking the groove portion and drawing the wire, and machining the rod with respect to at least length and size (diameter). An object of the present invention is to provide a method of manufacturing a ferrule that can improve productivity and quality by omitting the step of sealing the wire with an electric insulator or the like whereby an elongated electroformed rod can be manufactured and variation in sizes of diameter and off-center failure are decreased.

Abstract: A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.

Abstract: An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To attain the object, in electroforming, a titanium material having a grain size number of 6.0 or more is employed as a copper deposition surface of the rotating drum cathode, and glue and/or gelatin is added in an amount of 0.2-20 mg/l to a copper sulfate solution, thereby producing a drum foil. An electrodeposited copper foil obtained from the drum foil, wherein 20% or more of the crystals present in a shiny side surface of the electrodeposited copper foil have a twin-crystal structure, is used for producing copper-clad laminates.

Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.