Electroforming Or Composition Therefor Patents (Class 205/67)
  • Publication number: 20030038033
    Abstract: A process for embossing high aspect ratio microstructures is provided, wherein the microstructures provide decreased surface reflection and increased transmission through an optical component. The process comprises etching columnar pits in a silicon substrate using inductively coupled plasma, followed by reactive ion etching of the columnar pits to create relatively pointed obelisks. The silicon substrate is then preferably rinsed prior to vapor depositing a conductive layer thereon. Further, a metal is electroformed over the conductive layer to form an embossing tool. The embossing tool is then used to form microstructures, for example in a polymer sheet, having aspect ratios greater than 5 to 1.
    Type: Application
    Filed: August 27, 2001
    Publication date: February 27, 2003
    Inventors: Alan B. Harker, Jeffrey F. DeNatale, Dennis Strauss
  • Patent number: 6503382
    Abstract: A method of preparing a porous film comprises electrodepositing material from a mixture onto a substrate, the mixture comprising: (I) a source of metal, inorganic oxide, non-oxide semiconductor/conductor or organic polymer, (II) a solvent such as water; and (III) a structure-directing agent such as octaethylene glycol monododecyl ether in an amount sufficient to form an homogeneous lyotropic liquid crystalline phase in the mixture. Electrodepositing the film from a lyotropic liquid phase in this manner provides a porous film having a substantially regular structure and substantially uniform pore size. Following deposition, the porous film may be treated to remove the structure-directing agent.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: January 7, 2003
    Assignee: University of Southampton
    Inventors: Philip Nigel Bartlett, John Robert Owen, George Simon Attard, Joanne Elliott
  • Patent number: 6503383
    Abstract: An optical mounting for an optical component includes an inner, preferably multi-part, portion that abuts the optical component and an outer frame, which are connected together by a plurality of spring hinge beams. The spring hinge beams and other portions of the optical mounting are produced galvanoplastically.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: January 7, 2003
    Assignee: Carl-Zeiss-Stiftung
    Inventors: Hubert Holderer, Ulrich Bingel, Frits Zernike
  • Publication number: 20020179449
    Abstract: A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
    Type: Application
    Filed: January 17, 2002
    Publication date: December 5, 2002
    Inventors: Linda A. Domeier, Alfredo M. Morales, Marcela G. Gonzales, Patrick N. Keifer
  • Publication number: 20020146214
    Abstract: Electroforming is performed in an electroforming bath with a cathode of a metal wire member immersed in an electroforming solution to electrodeposit nickel around the aluminum alloy wire member. The aluminum alloy wire member is removed by dissolution with an alkaline solution from an obtained nickel electroformed product. Accordingly, a nickel cylinder is obtained, which has a through-hole formed corresponding to the wire member. The cylinder is cut into those having a predetermined length. The outer circumference is subjected to cutting based on the through-hole to obtain a ferrule. The inner diameter accuracy of the through-hole of the ferrule is determined by the outer diameter accuracy of the wire member. Therefore, it is unnecessary to perform polishing for the through-hole. The highly accurate ferrule is obtained in accordance with the simple process at low cost. The PC polishing for the ferrule for effecting PC junction of optical fibers is extremely easy, because the ferrule is made of metal.
    Type: Application
    Filed: June 4, 2002
    Publication date: October 10, 2002
    Applicant: Tetsuo Tanaka
    Inventors: Tetsuo Tanaka, Shinichi Okamoto
  • Patent number: 6409902
    Abstract: This invention describes a rapid tooling process that integrates solid freeform fabrication (SFF) with electroforming to produce metal tools including molds, dies, and electrical discharge machining (EDM) electrodes. An SFF part is metalized by electroless plating and then placed in an electroplating solution, where metal is deposited upon the part by electrolysis. When the desired thickness of metal has been reached, the SFF part is removed from the metal shell. The shell is then optionally backed with other materials to form a mold cavity, and EDM electrode, or other desired parts for tooling. Thermomechanical modeling and numerical simulation with finite element analysis (FEA) is used to determine the geometry of the SFF part and the electroform thickness for minimizing the manufacturing time and cost while satisfy the tooling requirement.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: June 25, 2002
    Assignee: New Jersey Institute of Technology
    Inventors: Bo Yang, Ming C. Leu
  • Patent number: 6406607
    Abstract: An inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the nozzle plate. In the method a metal masking layer is deposited on a glass substrate, the masking layer having an opening therethrough for passage of light only through the opening. Next, a negative photoresist layer is deposited on the masking layer, the negative photoresist layer being capable of photochemically reacting with the light. A light source passes light through the substrate, so that the light also passes only through the opening in the form of a tapered light cone. This tapered light cone will define the tapered contour of a nozzle plate orifice wall to be formed. The negative photoresist layer photochemically reacts with the light only in the light cone to define a light-exposed region of hardened negative photoresist.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: June 18, 2002
    Assignee: Eastman Kodak Company
    Inventors: Jeffrey I. Hirsh, Edwin A. Mycek, Larry L. Lapa
  • Patent number: 6402921
    Abstract: A nozzle plate assembly of micro-injecting device and a method for manufacturing the same in which a master plate which defines a nozzle region is dipped into an electrolyte in which NiH2/SO3/H, NiCl2, H3BO3, C12H25SO4/NaS and deionized water are mixed in a predetermined ratio. Then, current having a predetermined density is applied several times, to thereby form a nozzle plate having a plurality of nozzles. The nozzle plate so formed has different roughnesses at inner and outer surfaces, to thereby eliminate ink-crosstalk and the generation of air bubbles in the ink feed channel.
    Type: Grant
    Filed: November 2, 1999
    Date of Patent: June 11, 2002
    Assignee: SamSung Electronics, Co., Ltd.
    Inventors: Byung-sun Ahn, Dunaev Boris Nikolaevich, Smirnova Valentina Konstantinovna
  • Patent number: 6402922
    Abstract: A method for the electrolytic production of injection moulding moulds (6) made of nickel for the production of CDs with the nickel, preferably in the form of pellets (2), being switched as anode and a workpiece (3), forming the counterpart to the injection moulding mould to be produced, being switched as cathode and both the nickel as well as the workpiece being held in an electrolytic solution (1) which has been added with a combination of halogens.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: June 11, 2002
    Assignee: Sony Dadc Austria AG
    Inventor: Johannes Goller
  • Publication number: 20020068148
    Abstract: In carving a decorative groove (7) formed in V-shape cross section extending from inside to outside on a dial plate (2) of a timepiece as a decorative plate, the slant angle of an inner slanted side (7A) forming the V-shape of the decorative groove (7) is made gentler than an outer slanted side (7B) at an inner part of the spiral, so that action of light reflected on the flat surface of the dial plate (2) macroscopically becomes similar to the light reflected on a bulging surface to give the central portion of the dial plate (2) a bulging appearance, whereby a three-dimensional effect is provided by the decorative groove (7) even when the dial plate (2) is made of a thin plate, thereby adding depth and a luxurious touch or aspect.
    Type: Application
    Filed: October 18, 2001
    Publication date: June 6, 2002
    Inventors: Yuichi Nakamura, Sachio Kasahara
  • Publication number: 20020063061
    Abstract: Provided are a method of reproducing a die that enables reproducing a long-life of die in large number and a property check method of a die that enables determining within a short period of time whether the property of a master die is good. The method of reproducing a die includes a deposition film forming process that forms a deposition film on the surface of a concavities/convexities pattern of a product that has been molded using a stamper die and an electroforming process that manufactures a second stamper die equipped with a reverse concavities/convexities pattern, through the electroforming, on the surface of the concavities/convexities pattern of the product having formed thereon the deposition film.
    Type: Application
    Filed: November 8, 2001
    Publication date: May 30, 2002
    Inventors: Yasuhiro Doi, Yukifumi Uotani
  • Patent number: 6383357
    Abstract: A three-dimensional formed metallic structure with varying thickness including sloping flanks is formed on a substrate. A conductive layer is applied to the substrate initially, in the form of laterally spaced electrically isolated conductive islands. A cathodic potential is connected to at least one of the islands, leaving others unconnected, and deposition proceeds due to the cathodic potential. As metallic material is deposited and builds up, it eventually contacts adjacent islands, thereby coupling the cathodic potential to a wider area where deposition commences. Deposition is thickest at the at least one island initially coupled to the cathodic potential and thinner progressing away, forming flanks that are linearly sloped, curved or similarly formed by thickness variations the vary proceeding away from the initially coupled island or islands.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: May 7, 2002
    Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung, E.V.
    Inventor: Andreas Maciossek
  • Patent number: 6379773
    Abstract: A laminated substrate is prepared, the laminated substrate having two layers including a first film and a second film in tight contact with the first film, the second film being made of a material capable of being etched with synchrotron radiation light. A mask member with a pattern is disposed in tight contact with the surface of the second film of the laminated structure or at a distance from the surface of the second film, the pattern of the mask member being made of a material not transmitting the synchrotron radiation light. The synchrotron radiation light is applied on a partial surface area of the second film via the mask member to etch the second film where the synchrotron radiation light is applied and to expose a partial surface area of the first film on the bottom of an etched area.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: April 30, 2002
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventors: Takanori Katoh, Yanping Zhang
  • Patent number: 6372112
    Abstract: A method of manufacturing a flexible abrasive member, includes the steps of providing a porous substrate, impregnating the substrate with an electrically isolating material, treating a side of the impregnated substrate so as to provide areas with different properties as to water or solvent resistance, washing the impregnating substrate with water or solvent so as to wash away the areas with relatively low water or solvent resistance for obtaining a prepared substrate with discrete areas, placing the prepared substrate in a metal deposition math, and depositing metal in the discrete areas in the presence of abrasive particles so as to form abrasive metal deposits.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: April 16, 2002
    Inventor: Sandro Giovanni Giuseppe Ferronato
  • Publication number: 20020023843
    Abstract: Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically forming the stent with desired pattern of meshes and implanting the stent into patient. The method comprises using a cathode with desired pattern of meshes and a tubular blank, from which the stent is formed. Between the cathode and the blank is delivered an electrolyte and the cathode and the blank are simultaneously rotated during electrochemical forming process.
    Type: Application
    Filed: September 13, 2001
    Publication date: February 28, 2002
    Inventor: David Cherkes
  • Patent number: 6350360
    Abstract: The invention is a method for the fabrication of an imprint tool master. The process begins with a metallic substrate. A layer of photoresist is placed onto the metallic substrate and a image pattern mask is then aligned to the mask. The mask pattern has opaque portions that block exposure light and “open” or transparent portions which transmit exposure light. The photoresist layer is then exposed to light transmitted through the “open” portions of the first image pattern mask and the mask is then removed. A second layer of photoresist then can be placed onto the first photoresist layer and a second image pattern mask may be placed on the second layer of photoresist. The second layer of photoresist is exposed to light, as before, and the second mask removed. The photoresist layers are developed simultaneously to produce a multi-level master mandrel upon which a conductive film is formed. A tool master can now be formed onto the conductive film.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: February 26, 2002
    Assignee: Sandia Coroporation
    Inventors: William D. Bonivert, John T. Hachman
  • Patent number: 6350361
    Abstract: Precise control of deposition or etching of thin films on a transparent substrate is particularly useful for electroformation of nozzles and formation control. A computer based measuring system is used to measure, in real time, a test feature such as one such nozzle. The rate of material deposition and removal is controlled based on the measured value of the test feature. In particular, a video camera and microscope are used to produce images of the test feature. During the electroplating process, metal is plated onto a conductive layer, and as the plated metal layer grows up from the conductive layer of the mandrel, the plated layer can also encroach on transparent openings produced by the absence of the mandrel conductive layer. The amount of encroachment on the transparent openings is directly related to the thickness of the plated layer.
    Type: Grant
    Filed: February 17, 1999
    Date of Patent: February 26, 2002
    Assignee: Scitex Digital Printing, Inc.
    Inventors: Richard W. Sexton, James E. Harrison, Jr., Randy L. Fagerquist
  • Patent number: 6346052
    Abstract: The disclosed invention comprises a novel golf club head and method of manufacturing the golf club head. The golf club head comprises a multilayer construction having a soft nickel alloy core and a hard chrome coating. The process used to produce the golf club heads involves an investment casting process in which the soft nickel alloy core is cast and the hard chrome coating is plated to the core. This multilayer design produces a golf club iron that is durable and consistent from iron to iron with feel characteristics which are generally equal to or better than traditional clubs formed from forged mild carbon steel.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: February 12, 2002
    Assignee: Dunlop Slazenger Group Americas
    Inventor: Chris Chappell
  • Patent number: 6306274
    Abstract: Disclosed are an apparatus and method for making both coarse-sided electrodeposition blades for cutting, for instance, semiconductor wafers. The apparatus comprises at least an electrolyte bath containing an electrodeposition object and pulverized grindstone in the electrolyte, an electrolytic metal immersed in the electrolyte, and an electric source whose positive and negative terminals are connected to the electrolytic metal and electrodeposition object, and the surface of the electrodeposition object, on which a required electro-deposit is to be formed, is of a predetermined coarseness.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: October 23, 2001
    Assignee: Disco Corporation
    Inventor: Keiichi Kajiyama
  • Publication number: 20010027922
    Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.
    Type: Application
    Filed: April 26, 2001
    Publication date: October 11, 2001
    Inventors: Szuchain Chen, Julius Fister, Andrew Vacco, Nina Yukov, A. James Brock
  • Publication number: 20010014409
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ion onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Application
    Filed: March 29, 2001
    Publication date: August 16, 2001
    Inventor: Adam L. Cohen
  • Patent number: 6274021
    Abstract: The invention relates to a method and an apparatus for producing an electrode coating. The fundamental idea of the invention is to regulate in a time-defined manner at any instant during an electrolytic deposition process the concentration of the electrolyte constituents and additives in that in the electrolytic bath are provided additional electrodes, through which specific electrolyte constituents and/or additives can be taken up and/or delivered in time-controlled manner.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: August 14, 2001
    Assignees: Stadtwerke Karlsruhe GmbH, EnBW Regional GmbH
    Inventor: Hans Juergen Pauling
  • Patent number: 6251248
    Abstract: A microfabrication process for making a microstructure product comprises: micromachining a polymer substrate for forming a three-dimensional microstructure pattern with deep cavities; shrinking and minimizing the diameter or width of each cavity of the microstructure pattern by steadily swelling the polymer, which is prefixed on a cathode of an electroforming system, by saturating the electrolyte solution into the polymer; electroforming in the electroforming system electrically connected with an anode and the cathode for filling metal in the cavities in the polymer; and desorption of the electrolyte from the polymer to shrink the polymer to be separated from an electroformed microstructure product, and demolding for obtaining the microstructure product having a high aspect ratio of 100 or even higher. The diameter or width of each cavity is shrunk to be smaller, thereby increasing the aspect ratio of the microstructure product.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: June 26, 2001
    Inventor: Ching-Bin Lin
  • Patent number: 6235177
    Abstract: A method for forming an aperture plate comprises providing a mandrel that is constructed of a mandrel body having a conductive surface and a plurality of non-conductive islands disposed on the conductive surface. The mandrel is placed within a solution containing a material that is to be deposited onto the mandrel. Electrical current is applied to the mandrel to form an aperture plate on the mandrel, with the apertures having an exit angle that is in the range from about 30° to about 60°.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: May 22, 2001
    Assignee: Aerogen, Inc.
    Inventors: Scott Borland, Gary Baker
  • Publication number: 20010000890
    Abstract: A writable optical disc has an information writing track, and a guiding track for introducing a laser beam to the information writing track. The guiding track has prepit information recorded thereon, the prepit information including at least address information of the optical disc. The prepit information is recorded on the guiding track at a position where interference of adjacent guiding tracks with the prepit information is prevented. The information writing track is a groove track, and the guiding track is a land track.
    Type: Application
    Filed: December 15, 2000
    Publication date: May 10, 2001
    Applicant: Pioneer Electronic Corporation
    Inventors: Kazuo Kuroda, Toshio Suzuki, Eiji Muramatsu
  • Patent number: 6221227
    Abstract: A microfabrication process comprises the swelling of at least a hydrophilic polymer in order for shrinking each cavity size of a micromachined microstructure pattern from three-dimensional orientations, whereby upon filling or deposition of metal into each cavity of the pattern when performing an electroforming step, a supermini microstructure with slim, fine, thin and small size can be obtained as geometrically miniaturized from three-dimensional orientations.
    Type: Grant
    Filed: November 2, 1999
    Date of Patent: April 24, 2001
    Inventors: Ching-Bin Lin, Shung-Wen Kang, Mau-Kuo Wei
  • Patent number: 6203732
    Abstract: A generally tubular device (e.g., a stent or catheter) for placement in a lumen of a patient's body is made by forming a depressed pattern in an external surface of a mold. The depressed pattern corresponds to a desired shape of the generally tubular device. A material is deposited in the depressed pattern for the material to form the generally tubular device conforming to the depressed pattern. The generally tubular device is separated from the mold.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: March 20, 2001
    Assignee: Intra Therapeutics, Inc.
    Inventors: Elizabeth A. Clubb, Thomas L. Clubb, James V. Donadio, III
  • Patent number: 6183622
    Abstract: A method of electrowinning, electrorefining or electroforming of ductile copper deposits. The method uses an adduct of a tertiary alkyl amine with polyepichlorohydrin in amounts effective for ductilizing a copper deposit form a copper electrolyte.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: February 6, 2001
    Assignee: Enthone-OMI, Inc.
    Inventor: Robert Janik
  • Patent number: 6179978
    Abstract: A mandrel for forming an inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the mandrel. A metal masking layer is deposited on a glass substrate, the masking layer having an opening therethrough for passage of light only through the opening. Next, a negative photoresist layer is deposited on the masking layer, the negative photoresist layer being capable of photochemically reacting with the light. A light source passes light through the substrate, so that the light also passes only through the opening in the form of a tapered light cone. This tapered light cone will define the tapered contour of a nozzle plate orifice wall to be formed. The negative photoresist layer photochemically reacts with the light only in the light cone to define a light-exposed region of hardened negative photoresist.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: January 30, 2001
    Assignee: Eastman Kodak Company
    Inventors: Jeffrey I. Hirsh, Edwin A. Mycek, Larry L. Lapa
  • Patent number: 6099710
    Abstract: A method of controlling excessive electroforming portion of an oscillating plate for an ink-jet printer includes steps of supplying a direct current power to electroform a first layer for a first time period, supplying an alternating current power to electroform a second layer on the first layer for a second time period to form an oscillating layer, coating the second layer with a photoresistive agent at positions where no projection is to be formed and supplying the alternating current power to electroform for a third time period so as to form desired projections on the second layer, whereby no excessive electroforming portion will be formed on the projections.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: August 8, 2000
    Assignee: DBTEL Incorporated
    Inventor: Michael Mou
  • Patent number: 6019883
    Abstract: The invention relates to a process for the production of an electro-chemical deposit (8-1, . . . , 8-4) with the aid of a substrate (2) having connection pieces (4-1, . . . , 4-5), said pieces being used as electrodes, the deposit taking place on the surface of a removable support (6) and which can be subsequently separated from the substrate on areas of said surface in electrical contact with the pieces of the substrate.
    Type: Grant
    Filed: March 25, 1997
    Date of Patent: February 1, 2000
    Assignee: Commissariat a l'Energie Atomique
    Inventor: Patrice Caillat
  • Patent number: 6004447
    Abstract: This invention relates to an electroforming device and a process used to electroform a metal layer on an inner surface of a female mandrel. The electrolytic solution flows only through an electrolytic solution passageway that defines the inner surface as the walls of the passageway. The mandrel may include more than one electrolytic solution passageway, or multiple mandrels may be used in a sequential order to mass produce the electroforms.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: December 21, 1999
    Assignee: Xerox Corporation
    Inventors: Patricia Bischoping, Robert P. Altavela, Lawrence Kotowicz, Peter J. Schmitt, William G. Herbert, Ronald E. Jansen, John H. Lennon, Henry G. Grey
  • Patent number: 5976340
    Abstract: A method is disclosed for fabricating a low cost, elevated-temperature resistant part with a serrated surface and elevated-temperature structural properties similar to (within fifty percent (50%)) a superalloy material comprising the steps of: forming a master tool having the desired serrated surface; electro-forming the elevated-temperature resistant part by depositing three alloying elements comprising nickel, cobalt and manganese onto the master tool in the amounts of about 60%-70% nickel, 40%-30% cobalt and 0.05%-0.10% manganese; and separating the elevated-temperature resistant part from master tool.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: November 2, 1999
    Assignee: Lockheed Martin Corporation
    Inventors: Robert G. Sheldon, Eric G. Smith
  • Patent number: 5976339
    Abstract: The dimensional boundaries of a part are determined in a computer CAD/CAM system, including x, y, and z dimensions. A reference surface is provided and a first incremental layer of mold material is formed on the reference surface. The first incremental layer of mold material is selectively interrupted to define at least one dimensional boundary of the object. A first incremental layer of object material is formed upon at least the reference surface and assumes the dimensions defined by the interruption in the layer of mold material. The steps of forming incremental layers of mold and object material are repeated until the object or part is fully fabricated and all dimensional boundaries are defined.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: November 2, 1999
    Inventor: Larry Edward Andre, Sr.
  • Patent number: 5932360
    Abstract: A hollow thin walled shell with integral internal baffles is formed by a multilayer coating process. A series of mandrels is designed to be assembled to form the outer surface of the desired shell. The mandrel surfaces hidden during assembly include the areas intended to form the internal baffles. The mandrels are coated separately, assembled, and the assembly is given a continuous overcoating that holds the assembly together and provides the shell with mechanical integrity. The assembly is machined to remove all internal and external coated surfaces not intended to be included in the shell and the mandrel is dissolved or otherwise removed, leaving the thin coatings as the desired shell with baffles at the areas where the coated mandrel surfaces were hidden during assembly.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: August 3, 1999
    Assignee: Servometer Corporation
    Inventors: Paul Hazlitt, Edward Howanice
  • Patent number: 5924193
    Abstract: The present invention generally includes a process in which a mandrel for semi-additive construction of circuitry is fabricated by laminating shim stock or foil of stainless steel onto a suitable deformable substrate such as a polyimide glass board. Dimples for making raised features on circuitry are formed in the mandrel with a tool. The use of shim stock makes the mandrel relatively light and suitable for automated processing similar to that used to construct circuits on circuit boards.
    Type: Grant
    Filed: February 10, 1997
    Date of Patent: July 20, 1999
    Assignee: Packard Hughes Interconnect Company
    Inventors: William R. Crumly, David Swarbrick, Haim Feigenbaum
  • Patent number: 5908285
    Abstract: An electroformed sheath is disclosed for protecting composite components of a part, such as a fan blade of a modern gas turbine engine. The electroformed sheath includes a sheath body having a leading edge; a pressure side and an opposed suction side of the body that meet at the leading edge and extend away from the leading edge to define a sheath cavity therebetween; a head section of the body between the leading edge and the sheath cavity; and an electrically conductive mandrel insert positioned between the pressure and suction sides of the body. In manufacture of the electroformed sheath, the mandrel insert is secured in an appropriate mandrel having an exterior surface approximating the blade's airfoil configuration. The leading edge, head section and pressure and suction sides are electroplated around the mandrel insert so that the insert remains in the sheath body after removal of the mandrel.
    Type: Grant
    Filed: March 10, 1995
    Date of Patent: June 1, 1999
    Assignee: United Technologies Corporation
    Inventor: John M. Graff
  • Patent number: 5891285
    Abstract: A process for manufacturing electroformed patterns includes the following steps: forming electroformed closed line graphic patterns and an electroformed line surrounding said patterns (optionally together with an electroformed island) on a surface of a conductive substrate; peeling the electroformed patterns and the electroformed line (optionally together with the electroformed island) from the conductive substrate to transfer them onto a pressure-sensitive adhesive layer provided on a support; injecting or printing a coating material inside the closed line graphic electroformed patterns and converting the coating material to coating films; forming a firmly bonding adhesive layer on a whole surface of the support on its side where the electroformed patterns, the coating films and the electroformed line (optionally together with the electroformed island) are retained; removing the electroformed line (optionally together with the electroformed island); separating the electroformed patterns and the coating films
    Type: Grant
    Filed: May 8, 1997
    Date of Patent: April 6, 1999
    Assignee: Tefco International Co., Ltd.
    Inventor: Hajime Nakayama
  • Patent number: 5826516
    Abstract: A squeegee (K1-K3) for screen printing, comprising: a squeegee body (1) which is formed by a metal sheet and has a squeegeeing face (1a) and a convexly curved pressing edge (3) on the squeegeeing face (1a); wherein when the squeegee (K1-K3) is set for squeegeeing such that the squeegeeing face (1a) is oriented in a travelling direction (X) of the squeegee (K1-K3), a center (O) of curvature of the convexly curved pressing edge (3) extends substantially horizontally.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: October 27, 1998
    Assignee: Kyushu Hitachi Maxell, Ltd.
    Inventors: Hiroshi Shimazu, Yoshihiro Kobayashi, Eiji Sakata
  • Patent number: 5807472
    Abstract: A method of separating an electroformed metal substrate from a mandrel includes establishing a parting gap between the electroformed metal substrate and the mandrel, attaching the electroformed metal substrate at a parabolic end of the mandrel to a parting fixture, and introducing a fluid through the parting fixture into an opening of the mandrel to effect separation of the electroformed metal substrate from the mandrel. The parting fixture includes a parabolically shaped outer cup with a fluid inlet tube extending through the bottom thereof. The parting fixture also preferably includes an inner cup for containing the fluid introduced through the fluid inlet tube and a vacuum device to effect attachment of the electroformed metal substrate to the parting fixture.
    Type: Grant
    Filed: January 13, 1997
    Date of Patent: September 15, 1998
    Assignee: Xerox Corporation
    Inventors: Loren E. Hendrix, William G. Herbert, Gary J. Maier, Ernest F. Matyi
  • Patent number: 5785837
    Abstract: A process for the preparation by electrodeposition of metal oxide film and powder compounds for ferroelectric memory materials and ferrites wherein the metal oxide includes a plurality of metals. The process comprises providing an electrodeposition bath, providing soluble salts of the metals to this bath, electrically energizing the bath to thereby cause formation of a recoverable film of metal on the electrode, recovering the resultant film as a film or a powder, and recovering powder formed on the floor of the bath. The films and powders so produced are subsequently annealed to thereby produce metal oxide for use in electronic applications. The process can be employed to produce metal-doped metal oxide film and powder compounds for transparent conductors. The process for preparation of these metal-doped metal oxides follows that described above.
    Type: Grant
    Filed: January 2, 1996
    Date of Patent: July 28, 1998
    Assignee: Midwest Research Institute
    Inventors: Raghu Nath Bhattacharya, David S. Ginley
  • Patent number: 5762736
    Abstract: There is disclosed a method for parting an electroformed article from a mandrel including: (a) solidifying a liquid that is disposed between a parting device and the article, thereby joining the parting device to the article via the solidified liquid; and (b) moving the parting device in a direction of separation of the article from the mandrel while the parting device is joined to the article via the solidified liquid to assist in separation of the article from the mandrel.
    Type: Grant
    Filed: January 21, 1997
    Date of Patent: June 9, 1998
    Assignee: Xerox Corporation
    Inventors: William G. Herbert, Loren E. Hendrix, Gary J. Maier, Ernest F. Matyi
  • Patent number: 5723037
    Abstract: There is disclosed a method for separating an electroformed article from a mandrel wherein the article is more attracted to a magnetic force than the mandrel comprising employing the magnetic force on the article in separating the article and the mandrel.
    Type: Grant
    Filed: February 3, 1997
    Date of Patent: March 3, 1998
    Assignee: Xerox Corporation
    Inventors: William G. Herbert, Loren E. Hendrix, Gary J. Maier, Ernest F. Matyi
  • Patent number: 5698086
    Abstract: An electroforming process and apparatus for forming an electroform with a roughened surface. The present invention roughens the surface of the mandrel using a sandblasting device in the center region of the mandrel allowing the two end regions to remain smooth. The intersection of the roughened center region and each of the two end regions form a step. This step on either side of the roughened center region facilitates sealing while the roughened center region enables toner distribution. The electroform created using the step roughened mandrel surface is separated from the mandrel without destroying the mandrel. The step roughened mandrel can then be reused to create another electroform with a roughened surface.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: December 16, 1997
    Assignee: Xerox Corporation
    Inventors: William G. Herbert, Gary J. Maier
  • Patent number: 5681440
    Abstract: An electroforming process and apparatus for creating a nickel or like substrate encapsulated by another material to prevent wear to the nickel substrate. The encapsulation of the nickel substrate requires encapsulation of the inner and outer diameter of the nickel substrate. The encapsulating material must adhere to the nickel substrate. Encapsulation of the nickel substrate prevents exposure of the nickel and thus avoids the hazardous nickel dust particles that can occur when the nickel is exposed.
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: October 28, 1997
    Assignee: Xerox Corporation
    Inventors: William G. Herbert, Geoffrey M. T. Foley, Huoy-Jen Yuh
  • Patent number: 5676814
    Abstract: Disclosed is a method of producing an electrically conductive polymer composite comprising a general-purpose resin layer and an electrically conductive layer, wherein the conductive layer is formed on at least one surface of the general-purpose resin layer, the method comprising the steps of forming the conductive layer on at least one internal surface of a mold, introducing into the mold a raw solution of the general-purpose resin comprising a monomer polymerizable without condensation reaction, and subjecting said monomer to polymerization in said mold to provide the general-purpose resin layer.
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: October 14, 1997
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Honda, Hideaki Matsuura
  • Patent number: 5674370
    Abstract: Electroformed shield having a first part and a second part, the first part having a leg portion and a leading portion and the second part having a leg portion and a leading portion. The leading portions being bonded to form a wedge and a saddle area between the leg portion. The saddle portion accommodating a blade useful in a low-pressure fan for a turbofan jet engine.
    Type: Grant
    Filed: March 31, 1995
    Date of Patent: October 7, 1997
    Assignee: Optical Radiation Corporation
    Inventor: Donald G. DuPree
  • Patent number: 5667658
    Abstract: A plate made of silicate glass (glass master) (3) is provided with a pressing surface (surface coat) carrying the sound recording in the form of raised contours formed from a photoresist (5) with a layer of primer (adhesion promotor) (4) to hold the photoresist layer (5) to the glass plate (3). A first metal layer (6) is deposited on the photoresist (5) from a sputter target which consists of a NiV alloy; and a protective layer (7) of nickel is electrolytically deposited on the first layer. The metal master (8) consisting of first layer (6) and protective layer (7) is pulled from the photoresist layer (5).
    Type: Grant
    Filed: March 15, 1996
    Date of Patent: September 16, 1997
    Assignee: Leybold Aktiengesellschaft
    Inventors: Hermann Koop, Wolf-Eckhart Fritsche, Bernd Hensel
  • Patent number: 5647966
    Abstract: A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of the conductive base plate by electroforming using a plating liquid which substantially maintains the pattern of the mask layer; and transferring the conductive pattern onto a support layer without removing the mask layer.
    Type: Grant
    Filed: October 2, 1995
    Date of Patent: July 15, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Patent number: 5643433
    Abstract: A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that a connecting portion interconnects the tip ends of inner leads of the electro-deposition pattern formed in the cavity. The connecting piece is maintained while the electro-deposition pattern is separated from the matrix and the resist.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: July 1, 1997
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Katsuya Fukase, Takahiro Iijima, Masao Nakazawa, Shinichi Wakabayashi