Abstract: A variety of deep structured decorative patterns originate with mechanical relief or etching. The present method incorporates a deeply patterned or textured etching or relief into a thin film embossing shim to simulate the look of the deep pattern or texture when used to emboss thin film or material. A transparent mold of the relief surface (such as brushed metal, engine-turned patterns, and textured glass) is formed using UV curable liquid and a transparent substrate. The relief copy in the transparent mold or overlay is mapped onto a photoresist surface or plate by shining or expanding one or more laser lights or laser beams through the transparent mold. The different heights of the relief copy of the transparent mold will cause the light to diffract/refract to form a corresponding patterned etching in the photoresist plate. The resulting photoresist plate is then metalized and electroplated to form a thin film embossing shim.

Abstract: The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

Abstract: Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity 115 for a bump on one surface 111 of a carrier 110, (B) forming a bump 130 in the cavity 115 for the bump through an electroplating process, (C) laminating an insulating layer 140 on one surface 111 of the carrier 110 so as to apply the bump 130, (D) forming a circuit layer 150 including a via 155 connected with the bump 130 on the insulating layer 140, and (E) removing the carrier 110, whereby the process of forming separate solder balls is removed by forming the cavities 111 for the bumps in the carriers 110 to form the bumps, thereby simplifying the process of manufacturing a circuit board and reducing the lead time.

Abstract: Electronic assemblies including coreless substrates having a surface finish, and their manufacture, are described. One method includes electrolytically plating a first copper layer on a metal core in an opening in a patterned photoresist layer. A gold layer is electrolytically plated on the first copper layer in the opening. An electrolytically plated palladium layer is formed on the gold layer. A second copper layer is electrolytically plated on the palladium layer. After the electrolytically plating the second copper layer, the metal core and the first copper layer are removed, wherein a coreless substrate remains. Other embodiments are described and claimed.

Abstract: The present invention provides a method of fabricating a mask for forming wood grain patterns, the method comprising: subjecting a metal plate to an etching process to process a selected pattern on the metal plate; producing a pattern sheet using the etched metal plate an a flexible sheet; attaching the produced pattern sheet to the surface of a product; and subjecting the product to an electroforming process to thereby fabricate the mask. With the method, the time and cost for production of the mask can be remarkably reduced.

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract: Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrode-position cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

Abstract: A process for fabricating a metallic component is disclosed. The process includes performing multiple electroforming steps on an object to form metallic layers. The process includes performing between the electroforming steps masking and patterning steps using a non-conductive material. The resulting metallic component has either a single layer or multiple layers of cooling or heat transfer channels, which may be at right angles in adjacent layers. The non-conductive material can be removed during the process by a solvent or by melting. The object on which the metallic component is formed may be a flat or shaped mandrel from which the metallic component can be removed. The metallic component is particularly useful in forming optical components for use in extreme ultraviolet (EUV) systems and in cooling and heat transfer systems.

Abstract: An apparatus and method is disclosed for simultaneously electroplating at least two parts in a series electrical configuration in an electroplating system using a shared electrolyte with excellent consistency in thickness profiles, coating weights and coating microstructure. Parts in high volume and at low capital and operating cost are produced as coatings or in free-standing form.

Abstract: Provided is a method of fabricating a continuous nanostructured material having an electrodeposited surface layer. A conductive master drum having a relief pattern on its surface that exposes only a portion of the master drum surface is immersed into a plating bath. An electrodepositable material is coated onto the exposed surface of the drum. A support material is coated over the deposited layer and the relief structure. Removal from the drum yields the nanostructured material.

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed.

Abstract: A device for fabricating micro articles, which includes a first electrode plate, a second electrode plate, and a spacing component. The first electrode plate has a forming electrode, where the forming electrode correspondingly matches a cross-section of the micro article. The spacing component is disposed in between the first electrode plate and the second electrode plate, with the thickness corresponds to the thickness of the micro article. Thereby, the device is able to store the solidifiable liquid therein, where the solidifiable liquid is controlled for shaping according to the forming electrode. After the solidifiable liquid has shaped and solidified, the finished product of the micro article is attained. The present disclosure also provides a method for fabricating micro articles.

Abstract: Methods and structures including a release mechanism for use with the formation and then separation of a multi-layered structure are provided. The methods and structures provide for a master substrate on which is formed a temperature-sensitive release layer. A releasable structure is then formed on top of the temperature-sensitive release layer. The releasable structure can be freed from the master substrate by exposing the temperature-sensitive release layer to a temperature sufficient to soften or melt of the release layer.

Abstract: A method includes placing a conductive mold in a first bath of electroforming solution, the solution including metal and having a selected temperature. A current is provided to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly. The method further includes removing the composite assembly from the electroforming solution and transferring the composite assembly to a second bath having the same selected temperature. Thereafter, the electroformed element is separated from the mold while the composite assembly is in the second bath.

Abstract: The method of fabricating metal microstructures includes the following steps: a) taking a substrate (1, 2) that has a conductive strike surface (2); b) to d) forming a first resin mould (3b) by UV photolithography, the apertures in the first resin mould revealing the conductive strike surface (2) of the substrate; e) electroforming the first element (5) by galvanic deposition of a first metal material in the apertures of the first resin mould (3b), f) removing the first mould (3b) around the first element (5) to expose the conductive strike surface (2) of the substrate; g) to i) forming a new resin mould (7b) by UV photolithography, the apertures in the new resin mould revealing the first element (5), and the conductive strike surface (2) of the substrate; j) electroforming the second element (10) by galvanic deposition of a second metal material in the apertures of the new resin mould (7b) to form said metal microstructure; k) separating said metal microstructure from the substrate (1) and from said new m

Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Abstract: Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a first conductive material while the low aspect ratio openings are only partially filled with the first conductive material. Additional material may then be selectively plated over the first conductive material within the low aspect ratio openings relative to the first conductive material within the high aspect ratio openings. In some embodiments, the additional material may be activation material that only partially fills the low aspect ratio opening, and another conductive material may be subsequently plated onto the activation material to fill the low aspect ratio openings.

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract: The present invention relates to a mesoporous platinum electrode for detecting biochemical substrate, comprising an electrode and a mesoporous platinum layer covering the surface thereof, and a method for detecting a biochemical substrate using the mesoporous platinum electrode. Using the present invention, glucose concentration can be selectively determined while excluding interference of interfering agents.

Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

Abstract: The invention relates to a method of producing nanotubes from coaxial jets of immiscible liquids or poorly-miscible liquids. The purpose of the invention is to produce hollow fibers (nanotubes) or composite fibers having diameters ranging from a few micras to tens of nanometers and comprising walls, in the case of nanotubes, with a thickness ranging from hundreds of nanometers to a few nanometers. The inventive nanotube-formation method involves the generation of coaxial nanojets of two liquids using electrohydrodynamic technology.

Abstract: Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required.

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 ?m range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract: A method for manufacturing a structure including tungsten as a main component and tungsten carbide is provided. In the structure, the content of carbon is at least 0.1% by mass and the total content of cobalt, nickel, and iron is 3% or less by mass, respectively based on the structure.

Abstract: An electroformed tool has an integrated base with channels contacting the tool with heat exchange fluids flowing through the channels during molding or embossing. A blank base is machined with a network of interconnected open channels on a top surface and end flow through passageways communicating with the channels. The tool is used as an electrode to erode the top surface of the blank base using plunge electro discharge machining by lowering the uneven deposit on the bottom of the electroformed tool down onto the top surface of the blank base in the electro discharge machining environment to form a top contoured surface to mate with the uneven deposit on the non-molding side of the substrate. Thermal management fluid channels are thereby conformal to the mold cavity. The tool and base are sealed together.

Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

Abstract: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed.

Abstract: Disclosed is a method of duplicating a nano-pattern texture of the surface of an object through electroforming using an imprint mold, including selecting the object having the surface texture to be duplicated; disposing the selected object and pre-treating the surface thereof; nano-imprinting the surface of the pretreated object, thus duplicating it on a plastic mold; metallizing the surface of the plastic mold through vapor deposition, and performing electroforming, thus manufacturing metal module master molds; trimming the edges of the metal module master molds, performing micro-processing, connecting the metal module master molds, and then performing electroforming, thus manufacturing a large-area metal unit master mold; and electroforming the metal unit master mold, thus producing a duplicate having the surface texture, thus exhibiting an effect in which the skin of a selected natural object can be duplicated on metal having a uniform thickness.

Abstract: A method for use in producing a stator for a progressing cavity apparatus which includes the use of electroforming to produce the stator tube. A stator tube for a progressing cavity apparatus which is produced using electroforming and a stator for a progressing cavity apparatus which includes a stator tube produced using electroforming.

Abstract: The invention relates to a timepiece component, such as a balance (1), an oscillating mass (12) or a wheel (20), that comprises a structure (2) made according to a micro-manufacturing technique, such as the DRIE technique. The component is characterised in that it further comprises at least one member (3) formed in or at the periphery of the structure (2) and made of a material different from that of the structure (2). This member (3) is typically metal and is formed by electro-forming using a cavity (7) of the structure (2) as a mould.

Abstract: The invention concerns an electroformed gold alloy part, characterized in that the gold alloy is made up of 88 to 94% by weight of gold, x % by weight of copper and/or silver, and 2x % by weight of zinc, x being comprised between 2 and 4.

Abstract: A multi-level mandrel is used to locate an electrode in a pixel well. A display includes an electrode recessed in a floor of a pixel well.

Abstract: An article for protecting an airfoil component includes a sheath having an outer side and an inner side that forms a cavity for receiving a leading edge of the airfoil component. The sheath is made of cobalt and phosphorous to protect the leading edge of the airfoil component from erosion.

Abstract: A method for manufacturing a master disk for magnetic transfer, comprising the steps of electroforming a master substrate of a metal disk with a surface on which an convexoconcave pattern corresponding to information to be transferred is transferred using a reverse die with a reversed convexoconcave pattern, and forming a magnetic layer on the convexoconcave pattern of the master substrate, the method comprising the steps of: a conductive layer forming step to form a conductive layer with a thickness t1 on a surface of the reverse die; an initial electroforming step to form a first plated layer with a thickness t2 equal to or more than the thickness t1 of the conductive layer by plating a surface of the conductive layer at a current density of 0.35 A/dm2 or less; and a main electroforming step to form a second plated layer by plating a surface of the first plated layer at a current density of 0.35 A/dm2 or more.

Abstract: A method for manufacturing an electrolyte includes coupling a substrate to a charged electrode and electrodepositing a polymeric electrolyte on the substrate.

Abstract: A method includes placing a conductive mold in a first bath of electroforming solution, the solution including metal and having a selected temperature. A current is provided to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly. The method further includes removing the composite assembly from the electroforming solution and transferring the composite assembly to a second bath having the same selected temperature. Thereafter, the electroformed element is separated from the mold while the composite assembly is in the second bath.

Abstract: A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

Abstract: The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete metal contact pad located on the substrate surface, an inter-level dielectric (ILD) layer over both the discrete metal contact pad and the substrate, and a metal via structure extending through the ILD layer onto the discrete metal contact pad. Next, a vertical via is formed in the template structure, which extends through the ILD layer onto the discrete metal contact pad. A vertical conductive structure is then formed in the vertical via by electroplating, which is conducted by applying an electroplating current to the discrete metal contact pad through the metal via structure. Preferably, the template structure comprises multiple discrete metal contact pads, multiple metal via structures, and multiple vertical vias for formation of multiple vertical conductive structures.

Abstract: The invention provides composite nanofiltration membranes (FIG. 5) with lyotropic liquid crystal (LLC) polymer porous membranes (30) attached to a porous support (20). The LLC membranes are prepared from LLC monomers which form the inverted hexagonal or bicontinuous cubic phase. The arrangement, size, and chemical properties of the pores can be tailored on the molecular level. The composite membrane of the invention is useful for separation processes involving aqueous and nonaqueous solutions as well as gases. Methods for making and using the composite nanofiltration membranes of the inventions are also provided.

Abstract: A process for making a mould piece having a main curved surface bearing an utilitary microstructure which comprises transferring a utilitary microstructure from a master piece main surface to a main surface of a flat cured elastomeric film; pressing the cured elastomeric film and a master article against each other so as to conform the overall shape of said cured elastomeric film to the curved shape of the main surface of the master article and to spread over a curable coating composition between the curved main surface of the master article and the main surface bearing the replica of the said utilitary microstructure of the cured elastomeric film; curing the coating composition; removing the cured elastomeric film and depositing a layer of a metal or a metallic alloy on the exposed main surface of the hard coating of the master article; and recovering said metal or metallic alloy layer to obtain a mould piece having a curved main surface bearing a replica of said transferred utilitary microstructure.

Abstract: A method of forming an electrolyte includes removably coupling a perimeter support to a temporary substrate, and electrodepositing an electrolyte composite film on the temporary substrate.

Abstract: A high-density data storage medium, a method of manufacturing the data storage medium, a high-density data storage apparatus, and methods of writing data on, and reading and erasing data from the data storage medium by using the data storage apparatus are provided. The data storage medium includes a lower electrode, an insulation layer deposited on the lower electrode, a photoelectron emission layer deposited on the insulation layer and having a plurality of protrusions from which photoelectrons are emitted due to collisions between the protrusions and photons, and a dielectric layer deposited on the photoelectron emission layer and storing the photoelectrons emitted from the photoelectron emission layer.

Abstract: Sulfonate-, sulfate-, or carboxylate-capped, alkoxylated anti-misting agents having the structure: R((AO)nX)m((AO)nH)p, and methods of suppressing mist from electrolyte solutions by adding a mist-suppressing amount of one or more compounds selected from the group consisting of compounds of the Formulas R((AO)nX)m((AO)nH)p and R3N+(CH3)2R4, and mixtures thereof, to electrolyte solutions.

Abstract: A master information carrier for magnetic transfer includes a master substrate made of metal, including an embossed pattern corresponding to information to be transferred. The master substrate is produced by laminating a metal disk with a predetermined thickness on an original disk, on which an embossed pattern is formed, by electroforming, peeling off the metal disk and die-cutting a disk in a desired size. An outer diameter of the metal disk is at least 1.7 times longer than an outer diameter of the die-cut master substrate. When the metal disk is peeled off from the original disk, deformation due to the forces acting from the side of the outer circumference is reduced. The flatness of the metal disk is ensured and the transfer qualities are improved. Further, a step of removing distortion of the metal disk, caused at the time of peeling off the metal disk, may also be provided.

Abstract: A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.

Abstract: A structure including tungsten as a main component and tungsten carbide and a method of manufacturing the structure are provided, wherein the content of carbon is at least 0.1% by mass and the total content of cobalt, nickel, and iron is 3% or less by mass, respectively based on the structure.

Abstract: The invention is directed to methods for direct patterning of silicon. The invention provides the ability to fabricate complex surfaces in silicon with three dimensional features of high resolution and complex detail. The invention is suitable, for example, for use in soft lithography as embodiments of the invention can quickly create a master for use in soft lithography. In an embodiment of the invention, electrochemical etching of silicon, such as a silicon wafer, for example, is conducted while at least a portion of the silicon surface is exposed to an optical pattern. The etching creates porous silicon in the substrate, and removal of the porous silicon layer leaves a three-dimensional structure correlating to the optical pattern.

Abstract: An ion-implanted electroformed structural material is made of an electroformed body formed by electroforming and has an ion-implanted layer formed by implanting ions into the electroformed body. In the electroformed structural material, the microstructure is modulated at a position deeper than the ion-implanted layer, and the hardness becomes higher than that of the original electroformed body even at a position deeper than the ion-implanted layer.

Abstract: The present invention demonstrates the synthesis by electropolymerization of a new stable n-doping conjugated polymer poly(3,4-difluorothiophene) that may easily be electrochemically characterized.