Parameter Is Current, Current Density, Or Voltage Patents (Class 205/83)
  • Patent number: 10309031
    Abstract: A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: June 4, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Charles A. Cummings, Mikael R. Borjesson
  • Patent number: 10047454
    Abstract: A plating apparatus 10 includes a rectifier 18 configured to apply a DC current to a substrate, and a plating apparatus control unit 30 that instructs the rectifier 18 on a value of the DC current. The plating apparatus control unit 30 has a setting unit 32 for setting a current value, a storage unit 34 that stores a relational expression between an instructed current value on which the rectifier 18 is instructed and an actual current value which the rectifier 18 outputs in accordance with the instructed current value, a calculation unit 38 that corrects the current value set by the setting unit 32 on the basis of the above-mentioned relational expression to calculate a corrected current value, and an instruction unit 36 that instructs the rectifier 18 on the corrected current value calculated by the calculation unit 38.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: August 14, 2018
    Assignee: EBARA CORPORATION
    Inventors: Yuji Araki, Jumpei Fujikata, Masashi Shimoyama, Mizuki Nagai
  • Patent number: 10023969
    Abstract: A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: July 17, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Charles A. Cummings, Mikael R. Borjesson
  • Patent number: 9458546
    Abstract: Disclosed articles as results of a microarc oxidation process, or plurality thereof, which are not limited by size, specifically by certain dimensions of their size, such as their length. Different sections or surfaces of articles of the invention may be subjected to a microarc oxidation process at any given time, such as by gradually subjecting a surface of an article to a microarc oxidation process, or such as by sequentially subjecting different sections of an articles to a microarc oxidation process. Furthermore, disclosed are methods for manufacturing of articles of the invention, or otherwise for subjecting articles of the invention to a microarc oxidation process, or plurality thereof. In some examples, tubes of above 6 meter in length may be coated according to methods of the invention. The coating of said tubes may be beneficial for desalination applications. In other examples, only grooves of pulleys are coated.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: October 4, 2016
    Assignee: PCT PROTECTIVE COATING TECHNOLOGIES LIMITED
    Inventor: David Amit
  • Patent number: 9428841
    Abstract: Disclosed is an apparatus wherein an electric circuit with at least a power source, two electrodes and a plating solution is established. The plating solution comprises a solvent and, dissolved in the solvent, at least a first metal and a second metal. The power source supplies a current to the electric circuit during a plating process. The amount of electric current is above that required to achieve the overpotential for plating the first metal, but below that required to achieve the overpotential for plating the second metal such that only the first metal plates. This apparatus can be implemented, for example, in conjunction with a plating apparatus or an analysis and dosing apparatus of an electrodeposition system. In the case of an analysis and dosing apparatus, additional components further allow for the addition of that specific metal back into the plating solution. Also disclosed herein are associated methods.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: August 30, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Charles L. Arvin, Stephen G. Dutka, Phillip W. Palmatier, John R. Pennacchia, Freddie Torres
  • Patent number: 9334578
    Abstract: An electroplating system is provided. The electroplating system includes a divided electrode that is arranged to simultaneously provide a plurality of line currents for an electroplating process. The system includes a current control component that is coupled to the divided electrode. The current control component is configured to determine the magnitude of each of the line currents. The current control component is also configured to regulate individual line currents based, at least in part, on the determined magnitude of each of the line currents.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: May 10, 2016
    Assignee: Cypress Semiconductor Corporation
    Inventor: Naoki Takeguchi
  • Patent number: 9304094
    Abstract: A method of co-functionalizing single-walled carbon nanotubes for gas sensors, which includes the steps of: fabricating single-walled carbon nanotube interconnects; synthesizing tin oxide onto the single-walled carbon nanotube interconnects; and synthesizing metal nanoparticles onto the tin oxide coated single-walled carbon nanotube interconnects.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: April 5, 2016
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Nosang Vincent Myung, Syed Mubeen, Ashok Mulchandani, Marc Arnold Deshusses
  • Patent number: 9187840
    Abstract: The present invention provides a method for forming an anode oxide film, in which on the assumption that a direct-current power source is used, a thick anode oxide film can be formed with good productivity within a short time without using special equipment. The method includes allowing a current A0 to pass through an aluminum base material, and includes a step of repeating a first electricity cut-off treatment multiple times, in which when a voltage reaches a voltage V1 during the formation of the film, the passage of electricity is once cut off, this electricity cut-off is continued for a period equal to or longer than an electricity cut-off time T1, and the passage of electricity is then resumed, wherein the voltage V1 and electricity cut-off time T1 satisfy the prescribed expressions.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: November 17, 2015
    Assignee: Kobe Steel, Ltd.
    Inventors: Koji Wada, Mamoru Hosokawa, Takayuki Tsubota, Jun Hisamoto
  • Publication number: 20150075994
    Abstract: The present disclosure provides methods and systems for electrorefining high-purity materials, for example, silicon. An exemplary system includes at least one cathode, an anode, and a reference electrode. At least one controller, for example a potentiostat, is used to control the potential difference between a reference electrode and a cathode or anode. The system can be operated in a single phase or multiple phase operation to produce high-purity materials, such as solar-grade silicon.
    Type: Application
    Filed: November 24, 2014
    Publication date: March 19, 2015
    Inventor: Meng Tao
  • Publication number: 20150041328
    Abstract: A method for plating electrodes includes contacting a substrate with an electrolyte, the substrate comprising a plurality of working electrodes, applying an electric potential to one or more working electrodes of the plurality of working electrodes, monitoring a separate current through each of the one or more working electrodes of the plurality of working electrodes, and in response to determining that a first current through a first electrode of the plurality of working electrodes has reached a predetermined value, interrupting the first current through the first working electrode.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 12, 2015
    Inventor: Wen Chan
  • Publication number: 20150008132
    Abstract: The invention relates to an electrochemical analysis method for monitoring and controlling the quality of electrochemical deposition and/or plating processes whereby the electrochemical analysis method uses a fingerprinting analysis method of an output signal to have an indicator of whether the chemistry and/or process is operating in the normally expected range, whereby the method utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes being analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to pro
    Type: Application
    Filed: July 2, 2014
    Publication date: January 8, 2015
    Inventors: Juerg Stahl, Norbert Schroeder, Fred Richter
  • Publication number: 20140367265
    Abstract: A measurement tool for measuring an electrical parameter of a metal film deposited on a front side of a workpiece includes an electrical sensor connected to a workpiece contact point, an energy beam source with a beam impact location on the front side, a holder and a translation mechanism capable of translating the holder relative to the workpiece support, the beam source supported on the holder, and a computer programmed to sense a behavior of an electrical parameter sensed by the sensor.
    Type: Application
    Filed: October 29, 2013
    Publication date: December 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Abraham Ravid, Dmitry A. Dzilno, Todd J. Egan, Robert O. Miller
  • Publication number: 20140367264
    Abstract: In an electroplating processor having at least one anode and one thief electrode, reference electrodes are used to measure a voltage gradient in the electrolyte near the edge of the wafer. The voltage gradient is used to calculate the current at the wafer surface using a control volume/current balance technique. The fraction of the total wafer current flowing to the edge region of the wafer is determined and compared to a target value. The processor controller changes at least one of the anode and thief currents to bring the actual edge region current toward the target current.
    Type: Application
    Filed: June 18, 2013
    Publication date: December 18, 2014
    Inventors: Gregory J. Wilson, Paul R. McHugh
  • Patent number: 8858773
    Abstract: When a controller turns on a relay, a closed circuit constituted by a power supply device, a wire, a resistance, a relay and wires is formed. This causes a current to flow through the closed circuit. The power supply device performs constant current control. The controller compares a measured voltage value output from a voltage detecting circuit with a preset reference voltage value. In the case of no connection failure of the wire, the measured voltage value substantially equals to the reference voltage value. In the case of connection failure of the wire, the measured voltage value is larger than the reference voltage value.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: October 14, 2014
    Assignee: Nitto Denko Corporation
    Inventor: Kenichirou Nishiwaki
  • Publication number: 20140224661
    Abstract: In some method and apparatus disclosed herein, the profile of current delivered to the substrate provides a relatively uniform current density on the substrate surface during immersion. These methods include controlling the current density applied across a substrate's surface during immersion by dynamically controlling the current to account for the changing substrate surface area in contact with electrolyte during immersion. In some cases, current density pulses and/or steps are used during immersion, as well.
    Type: Application
    Filed: January 7, 2013
    Publication date: August 14, 2014
    Inventors: Tighe A. Spurlin, Jian Zhou, Edward C. Opocensky, Jon Reid, Steven T. Mayer
  • Patent number: 8790503
    Abstract: An anodized layer formation method includes: (a) providing an aluminum base or an aluminum film deposited on a support; anodization step (b) in which a forming voltage is increased to a predetermined first voltage level under a predetermined condition with a surface of the aluminum base or a surface of the aluminum film being kept in contact with an electrolytic solution, and thereafter, the forming voltage is maintained at the first voltage level for a predetermined period of time, whereby a porous alumina layer which has a minute recessed portion is formed; and etching step (c) in which, after step (b), the porous alumina layer is brought into contact with an etching solution, whereby the minute recessed portion is enlarged and a lateral surface of the minute recessed portion is sloped.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: July 29, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Ichiroh Ihara
  • Publication number: 20140173889
    Abstract: Methods for reductively polymerizing vinylic based monomers from a solution thereof onto the surface of an electrode material, resulting in thin, electrically insulating solid-polymer electrolyte coatings strongly bound to the surface of the electrode material, are described. The strong bond permits a second electrode to be coated directly onto the solid-polymer electrolyte, thereby incorporating the required components for a Li-ion battery cell. At least one initiator species, which is readily reduced by accepting an electron from the electrode material, is included in electropolymerization deposition solution for permitting the polymerization of vinylic species that would otherwise not electrochemically polymerize without damage to either the electrode material or to the solvents employed.
    Type: Application
    Filed: October 21, 2013
    Publication date: June 26, 2014
    Inventors: Derek C. Johnson, Amy L. Prieto, Matthew Rawls, Daniel J. Bates, C. Michael Elliott
  • Publication number: 20140162135
    Abstract: Methods are described for forming insulating hybrid organic-inorganic solid electrolytes on conducting electrodes that are active materials in Li-ion batteries by electrochemical deposition, and for forming second conducting electrodes on the solid electrolytes using aqueous slurries, whereby Li-ion battery cells having solid electrolytes are generated. X-ray photoelectron spectroscopy is utilized for determining that the solid electrolytes are defect and pinhole free.
    Type: Application
    Filed: July 31, 2013
    Publication date: June 12, 2014
    Inventors: Amy L. Prieto, Derek C. Johnson, Matthew T. Rawls
  • Patent number: 8728294
    Abstract: An anodizing method in which a workpiece made of aluminum or aluminum alloy is immersed in an electrolytic solution, and treatment is performed in which the application of positive voltage for a very short period of time and the removal of charges are repeated alternately between the workpiece and a cathode arranged in the electrolytic solution includes a step of performing treatment in which the positive voltage application and the charge removal are repeated in a tentative cycle, measuring the control point arrival time of a current waveform at the positive voltage application period, and determining normal positive voltage application time based on the control point arrival time; and a step of performing treatment in which the application of positive voltage and the removal of charges are repeated in a cycle corresponding to the normal positive voltage application time, and forming an anodized film on the surface of the workpiece.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: May 20, 2014
    Assignee: Suzuki Motor Corporation
    Inventors: Tomoharu Yamamoto, Hiroomi Tanaka, Masahiro Fujita
  • Publication number: 20140116884
    Abstract: Disclosed herein is a system and method for controlling electroplating, the method including: measuring current applied to an object to be plated at the time of electroplating, by a current sensor; receiving current data corresponding to the current applied to the object to be plated at the time of electroplating to execute necessary processing, and transmitting the processed current data to the HMI, by the measurement system; receiving the current data from the measurement system to execute necessary processing, and transmitting the processed data to the PLC, by the HMI; receiving the data from the HMI and storing the data in a memory, and then comparing and computing the stored current measurement value and a set current value, to control an output of the rectifier, by the PLC; and controlling the current supplied to the electroplating bath according to the control of the PLC, by the rectifier.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 1, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Gu KANG, Jae Chan LEE, Yong Chan JUNG, Kwang Myung KIM
  • Patent number: 8691597
    Abstract: An automatic analyzer detects voltage applied across electrodes, and judges whether voltage value falls within set voltage range. When the detected voltage value is lower than minimum value of set voltage range, the analyzer calculates the deficient amount of base solution based on the detected voltage value, controls a valve to supply the deficient amount of base solution, then, performs operation control of the valve so as to keep the prescribed amount of plating solution in plating solution tank, and discharges plating solution. When the detected voltage value is higher than maximum value of set voltage range, the analyzer calculates the excess amount of base solution based on the detected voltage value, controls a valve, and supplies pure water into the tank so that the base solution concentration falls within prescribed range to dilute plating solution, then controls a valve, and discharges plating solution so as to keep prescribed amount.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: April 8, 2014
    Assignee: Renesas Electronics Corporation
    Inventor: Taku Kanaoka
  • Patent number: 8668817
    Abstract: The invention relates to a system and a method of plating metal alloys, as well as to the structures thus obtained. The system for plating metal alloys comprises an electrolytic cell containing an electrolytic solution (3) in which an anode (4,4a,4b), a cathode (5), and a plurality of metal components to be plated onto the cathode are immersed, the anode (4,4a,4b) and the cathode (5) being electrically connected to means (6) adapted to apply a potential difference between said anode (4,4a,4b) and said cathode (5). The invention is characterized in that the means (6) adapted to apply a potential difference between said cathode (5) and said anode (4,4a,4b) impose a potential difference value that changes over time according to a predefined law.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: March 11, 2014
    Assignee: Creat New Technology S.R.L.
    Inventor: Lorenzo Battisti
  • Publication number: 20140037919
    Abstract: A component made of carbon fiber reinforced plastic is described, consisting of or comprising a matrix material (M) and carbon fibers embedded into the matrix material (M), wherein the component has at least one surface portion (A), having one or a plurality of exposed regions of the carbon fibers, characterized in that the exposed regions(s) of the carbon fibers is or are selectively coated with a layer (S). A process for producing such a component and also an assembly comprising such a component and one or a plurality of further components comprising or consisting of a material such as steel, iron, copper, magnesium or aluminum or alloys thereof are also described.
    Type: Application
    Filed: February 24, 2012
    Publication date: February 6, 2014
    Inventors: Peter Plagemann, Andreas Brinkmann, Anja Zockoll, Armin Fangmeier, Rouven Kott, Simone Schroeder, Thomas Lemckau
  • Patent number: 8585875
    Abstract: A system for electroplating a substrate includes one or more controllers, with each controller having an FPGA with one or more output channels. A bulk power supply is connected to each controller. One or more transistors are associated with each output channel. An electroplating chamber has one or more electrodes, with each electrode connected to at least one output channel. The system may include a waveform capture and viewing circuit providing built-in process verification and diagnostic tools. The system may also have a throttle back mode which attempts to maintain proper anode current ratios by reducing setpoints of all anodes by the same percentage, if a fault condition causes a reduction in current to one of the anodes. Blackbox logging may also optionally be used for recording selected data values into a circular buffer having a selected amount of memory.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: November 19, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Charles A. Cummings, Mikael R. Borjesson
  • Patent number: 8414860
    Abstract: Methods and apparatus for controlling a catalytic layer deposition process are provided. A feed stream comprising a carbon source is provided to a catalyst layer. An asymmetrical alternating current is applied to the catalyst layer. A polarization impedance of the catalyst layer is monitored. The polarization impedance can be controlled by varying the asymmetrical alternating current. The controlling of the polarization impedance provides control over the structure and amount of carbon particles deposited on the catalyst layer. The carbon particles may be in the form of nanotubes, fullerenes, and/or nanoparticles.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: April 9, 2013
    Assignee: Catelectric Corp.
    Inventor: Victor Stancovski
  • Publication number: 20130075264
    Abstract: A system for electroplating a substrate includes one or more controllers, with each controller having an FPGA with one or more output channels. A bulk power supply is connected to each controller. One or more transistors are associated with each output channel. An electroplating chamber has one or more electrodes, with each electrode connected to at least one output channel. The system may include a waveform capture and viewing circuit providing built-in process verification and diagnostic tools. The system may also have a throttle back mode which attempts to maintain proper anode current ratios by reducing setpoints of all anodes by the same percentage, if a fault condition causes a reduction in current to one of the anodes. Blackbox logging may also optionally be used for recording selected data values into a circular buffer having a selected amount of memory.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Charles A. Cummings, Mikael R. Borjesson
  • Publication number: 20130037412
    Abstract: An anodized layer formation method includes: (a) providing an aluminum base or an aluminum film deposited on a support; anodization step (b) in which a forming voltage is increased to a predetermined first voltage level under a predetermined condition with a surface of the aluminum base or a surface of the aluminum film being kept in contact with an electrolytic solution, and thereafter, the forming voltage is maintained at the first voltage level for a predetermined period of time, whereby a porous alumina layer which has a minute recessed portion is formed; and etching step (c) in which, after step (b), the porous alumina layer is brought into contact with an etching solution, whereby the minute recessed portion is enlarged and a lateral surface of the minute recessed portion is sloped.
    Type: Application
    Filed: April 26, 2011
    Publication date: February 14, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Ichiroh Ihara
  • Patent number: 8349190
    Abstract: The object of the invention is to provide a method for cleaning circulation water, which reduces the cost of operation and maintenance as much as possible, without a cumbersome cleaning operation such as by detaching electrode plates from an electrolysis cleaning tank and removing scale from inside the tank, and to provide a device used in this method.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: January 8, 2013
    Assignee: Koganei Corporation
    Inventors: Yoshiyuki Taguchi, Takayuki Nakano, Masahito Kato
  • Publication number: 20130001198
    Abstract: An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided.
    Type: Application
    Filed: September 10, 2012
    Publication date: January 3, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Charles L. Arvin, Harry Cox, Hariklia Deligianni, George J. Scott
  • Patent number: 8329005
    Abstract: Disclosed herein is a barrel plating apparatus. The barrel plating apparatus includes a barrel plating tank filled with an electrolytic solution, a barrel container immersed in the electrolytic solution of the barrel plating tank and filled with chip parts and media, a power supply unit for supplying current to an anode part and a cathode part which transfer the current to the barrel container and the electrolytic solution of the barrel plating tank, a driving motor for rotating the barrel container, and a hall current sensor formed in at least one cathode rod of the cathode part, coming into direct contact with the chip parts, the hall current sensor measuring the current. Accordingly, in the barrel plating apparatus, the currents of respective cathode rods are measured by hall current sensors, and thus variations in plating thickness can be reduced.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: December 11, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Jae Chan Lee
  • Publication number: 20120234683
    Abstract: A method for electrochemical plating includes providing a wafer for an electrochemical plating (ECP) process, determining a wafer electrical property affecting the ECP process, adjusting a plating current or voltage applied in the ECP process based on the determined wafer electrical property, and electroplating the wafer with the adjusted plating current or voltage. A controller for controlling a power supply, and a system for electrochemical plating are also disclosed.
    Type: Application
    Filed: March 17, 2011
    Publication date: September 20, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Kuang Lien, Lun-Chieh Chiu, Yu-Min Chang
  • Publication number: 20120200308
    Abstract: The present invention relates to a method of producing an electrodeposited metal oxide coating for a supercapacitor electrode. The present invention relates to the chronoamperometric electrodeposition of the metal oxide over a period from a few seconds, up to about 30 seconds leading to superior performance as a result of an increased surface area of the deposit. According to the present invention, the capacitances achieved are typically greater than 1300 F/g, and in some instances, over 4000 F/g.
    Type: Application
    Filed: September 30, 2010
    Publication date: August 9, 2012
    Applicant: NEWCASTLE INNOVATION LIMITED
    Inventor: Scott W. Donne
  • Publication number: 20120175262
    Abstract: Methods and apparatus are described for electrodeposition of Group IIB-VIA materials out of electrolytes comprising Group IIB and Group VIA species onto surfaces of workpieces. In one embodiment a method of electrodeposition is described wherein the control of the process is achieved by measuring an initial value of the electrodeposition current at the beginning of the process and adding Group VIA species into the electrolyte to keep the electrodeposition current substantially constant, such a within +/?10% of the initial value throughout the deposition period. In another embodiment an apparatus comprising multiple deposition chambers are described, each deposition chamber containing an anode and a workpiece, and wherein two thirds of the deposition chambers within the apparatus contain anodes comprising a substantially pure Group VIA element in their composition, and the rest of the deposition chambers contain anodes free from any Group VIA element in their composition.
    Type: Application
    Filed: January 6, 2012
    Publication date: July 12, 2012
    Applicant: Encoresolar, Inc.
    Inventor: Bulent M. Basol
  • Patent number: 8187432
    Abstract: An anodizing apparatus for forming an anodized film on the surface of a workpiece (11) made of aluminum or aluminum alloy includes a treatment tank (1) for containing an electrolytic solution, a cathode plate (2) disposed in the treatment tank, a supporting means (3) for supporting the workpiece so as to be immersed in the electrolytic solution, and a power supply (4) for continuously or intermittently applying a short-period bipolar or unipolar pulse voltage or an alternating voltage to between the workpiece and the cathode plate. The cathode plate (2) is arranged in a crosswise direction with respect to the workpiece (11).
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: May 29, 2012
    Assignee: Suzuki Motor Corporation
    Inventors: Tomoharu Yamamoto, Hiroomi Tanaka
  • Publication number: 20120085653
    Abstract: A method for producing a conductive polymer film using an apparatus comprising a prism having a working electrode, a light-emitting means, a light probe disposed on both sides of the prism, a container having an electrolytic solution containing a conductive-polymer-forming monomer and a dopant, a counter electrode immersed in the electrolytic solution, a power supply connected to a working electrode and the counter electrode, and a controller connected to the light probe and the power supply means. The method comprises determining an absorption spectrum from light reflected by the conductive polymer film, storing the relation between the absorbance of the conductive polymer film obtained from the absorption spectrum and a parameter of the conductive polymer film in the controller, and controlling current supply to the electrodes based on the relation of the absorbance and the parameter to obtain a desired parameter.
    Type: Application
    Filed: September 16, 2011
    Publication date: April 12, 2012
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Pu QIAN, Kazuhiro KAGAWA, Masatoshi OSAWA
  • Patent number: 8133578
    Abstract: A microstructure that comprises an insulating base material having through micropores filled with metal at a high filling ratio and that can be used as an anisotropically conductive member is provided. The microstructure comprises an insulating base material having through micropores with a pore size of from 10 to 500 nm at a density of from 1×106 to 1×1010 pores/mm2, a metal being filled into the through micropores at a filling ratio of at least 80%.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: March 13, 2012
    Assignee: Fujifilm Corporation
    Inventor: Yusuke Hatanaka
  • Publication number: 20120043301
    Abstract: An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided.
    Type: Application
    Filed: August 19, 2010
    Publication date: February 23, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Charles L. Arvin, Harry Cox, Hariklia Deligianni, George J. Scott
  • Patent number: 8114262
    Abstract: The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: February 14, 2012
    Assignee: SiPix Imaging, Inc.
    Inventors: Gary Yih-Ming Kang, Yi-Shung Chaug
  • Publication number: 20120018309
    Abstract: The present invention provides a pre-doping system of an electrode and a system using the same. The pre-doping system includes: a doping means for performing a doping process where lithium ions are doped into an electrode; a measuring means for performing a measuring process where an open-circuit potential of the electrode is measured; a switch unit for selectively performing any one of the doping process and the measuring process; a controller for controlling the doping means, the measuring means, and the switch unit and acquiring the open-circuit potential of the electrode measured by the measuring means.
    Type: Application
    Filed: November 17, 2010
    Publication date: January 26, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Seok Min, Bae Kyun Kim, Hyun Chul Jung, Dong Hyeok Choi, Hak Kwan Kim
  • Patent number: 7985328
    Abstract: A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: July 26, 2011
    Assignee: Intel Corporation
    Inventors: Yang Cao, Yue Ma, Jir-shyr Chen, Rajiv Rastogi
  • Publication number: 20110162970
    Abstract: A monitoring method of the invention is for monitoring electrodeposition coating of an object to be coated in which a conveying mechanism that conveys the object to be coated while the object is immersed in an electrodeposition paint in an electrodeposition bath, and a plurality of electrodes arranged along a conveying direction in which the object to be coated is conveyed by the conveying mechanism are used, the method including: acquiring present position data of the object in the conveying direction; when the acquired present position data has a value corresponding to a predetermined determination position, acquiring an electric current value corresponding to a predetermined one, associated with the determination position, of the electrodes; and determining the occurrence of the abnormality for the object to be coated that is positioned at the determination position, based on whether the acquired electric current value is within a predetermined range.
    Type: Application
    Filed: September 8, 2009
    Publication date: July 7, 2011
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Kozo Sato
  • Patent number: 7935240
    Abstract: The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: May 3, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Saravjeet Singh, Manoocher Birang, Nicolay Y. Kovarsky, Aron Rosenfeld
  • Patent number: 7892410
    Abstract: To form a thick coating by a discharge surface treatment, a voltage between an electrode and a workpiece during a discharge is detected, and it is determined that a discharge surface treatment state is abnormal if it is detected that the voltage is reduced. With this arrangement, it is possible to accurately detect an unstable phenomenon in the discharge surface treatment, and take appropriate measures before a state of the coating and a state of the electrode are worsened due to the unstable phenomenon. By discriminating a stability of the discharge surface treatment, the coating and the electrode are prevented from being damaged.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: February 22, 2011
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akihiro Goto, Masao Akiyoshi, Katsuhiro Matsuo, Hiroyuki Ochiai, Mitsutoshi Watanabe, Takashi Furukawa
  • Patent number: 7837851
    Abstract: A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: November 23, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nicolay Y. Kovarsky, Bernardo Donoso
  • Publication number: 20100276291
    Abstract: Disclosed is a method for depositing an alloy and/or chemical compounds on a substrate immersed in an electrolyte (1), comprising the steps of: I) applying a first constant or varying potential to the substrate under voltage control for a first time interval (tA); II) applying a second constant or varying current to the substrate under current control for a second time interval (tB); repeating the sequence of steps (I-II). at least twice. Further the use of the method in particular for the deposition of Bi2+xTe3?x is disclosed as well as a specific device for carrying out the above method.
    Type: Application
    Filed: June 21, 2010
    Publication date: November 4, 2010
    Inventors: Lukas Durrer, Wulf Glatz, Etienne Schwyter
  • Patent number: 7794581
    Abstract: Components which are subject to operating loads can often be passed for refurbishment by means of an acid treatment. The time for which the components remain in the acid has hitherto been determined empirically, which means that individual loads are not taken into account. The process according to the invention for the surface treatment of a component proposes that at least repeatedly a measurement voltage be applied to the component, resulting in the flow of a current, the time profile of which represents the state of the surface treatment and is used to decide upon when to terminate or interrupt the acid treatment.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: September 14, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ursus Krüger, Daniel Körtvelyessy, Ralph Reiche, Jan Steinbach, Gabriele Winkler
  • Publication number: 20100122908
    Abstract: An electroplating system is provided. The electroplating system includes a divided electrode that is arranged to simultaneously provide a plurality of line currents for an electroplating process. The system includes a current control component that is coupled to the divided electrode. The current control component is configured to determine the magnitude of each of the line currents. The current control component is also configured to regulate individual line currents based, at least in part, on the determined magnitude of each of the line currents.
    Type: Application
    Filed: November 18, 2008
    Publication date: May 20, 2010
    Applicant: Spansion LLC
    Inventor: Naoki Takeguchi
  • Patent number: 7718522
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: May 18, 2010
    Assignee: UTAC Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
  • Publication number: 20100116671
    Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.
    Type: Application
    Filed: October 3, 2006
    Publication date: May 13, 2010
    Applicant: Semitool, Inc.
    Inventors: Linlin Chen, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas L. Ritzdorf
  • Publication number: 20100108526
    Abstract: This invention provides an electrochemical analysis method for accurately detecting a harmful substance such as arsenic contained in a solution. In the electrochemical analysis method, a working electrode and a counter electrode are disposed in an object electrolytic solution. A negative potential is applied to the working electrode to electrodeposit the electrolyte onto the surface of the working electrode and thus to form an electrodeposit. Next, the potential of the working electrode is sweeped in a positive potential direction to allow the electrodeposit to elute into the solution and, at the same time, to detect a current change upon a potential change and thus to analyze an object substance dissolved as an electrolyte in the object electrolytic solution. A boron-doped electroconductive diamond electrode or an electrode with gold deposited on its surface is used as the working electrode.
    Type: Application
    Filed: January 30, 2008
    Publication date: May 6, 2010
    Applicant: KEIO UNIVERSITY
    Inventors: Yasuaki Einaga, Daisuke Yamada