Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

Abstract: A low-hazardous electropolishing process has been developed to remove oxide layer(s) from the surface of nitinol needles. Low concentrations of citric acid and sulfamic acid are mixed with medium concentrations of sulfuric acid to use as an electrolyte solution. The process can be easily fitted into current suture needle manufacturing processes as well as into processes require electropolishing of nitinol-containing medical devices.

Abstract: The object of the present invention is such that a surface exchange of metal fine particles by Cu ions, or the like is inhibited in order to prevent formation of Artificial CuS or the like, in extraction and analysis of the metal fine particles (inclusions and precipitates) in a metal material by electrolytic corrosion in a solvent-based electrolytic solution, without significantly changing conventional extraction and analysis methods.

Abstract: A method includes forming a dielectric layer over a conductive feature, forming an opening in the dielectric layer, and plating a metallic material to form a redistribution line electrically coupled to the conductive feature. The redistribution line includes a via in the opening, and a metal trace. The metal trace includes a first portion directly over the via, and a second portion misaligned with the via. A first top surface of the first portion is substantially coplanar with a second top surface of the second portion of the metal trace.

Abstract: A method of electro-chemical plating is disclosed. The catholyte is delivered to the cathode chamber. The catholyte is controlled at a first temperature before flowing into the cathode chamber. The anolyte is provided at room temperature. The temperature of the anolyte is lowered from the room temperature to a second temperature before delivering into the anode chamber. The second temperature is equal to or lower than the first temperature. The plating surface of the substrate is immersed in the electrolyte. The substrate is biased to a direct current (DC) voltage. The biased substrate attracts ions of the metal in the electrolyte toward the plating surface so as to electroplating the metal onto the substrate.

Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

Abstract: An impedance based biosensor and method for detecting a target biomolecule in a sample are provided. The biosensor has a substrate, and first and second spaced-apart electrodes disposed at the substrate. A molecular recognition element (MRE) for binding with the target is bound to the substrate between the first and second electrodes. The biosensor also has a nanoparticle having an MRE bound to its surface. In the presence of the target, the nanoparticle is immobilized between the first and second electrodes due to binding of the target biomolecule with the first MRE and binding of the target biomolecule with the second MRE. A measurable change in electrical impedance across the first and second electrodes occurs due to the immobilization of the nanoparticle between the first and second electrodes.

Abstract: An electrolytic copper plating solution analyzer comprises an analysis container for accommodating a part of an electrolytic copper plating solution containing additives including a promoter, an inhibitor and a leveler, a working electrode immersed in the electrolytic copper plating solution accommodated in the analysis container, a reference electrode immersed in the electrolytic copper plating solution and used as a reference when a potential of the working electrode is determined, a counter electrode immersed in the electrolytic copper plating solution, a rotation drive unit for rotating the working electrode at a given speed, a current generation unit passing an electric current with a given current density between the working electrode and the counter electrode, a potential measurement unit for measuring the potential between the working electrode and the reference electrode, and an analysis unit for analyzing the relationship between an elapsed time after the current passage and the potential.

Abstract: A stationary probe having a probe holder and a probe with a probe tip. The stationary probe may be part of a stationary probe rotating disk electrode wherein the stationary probe has a passage therethrough for rotatably receiving a rotating disk electrode comprising a rotating shaft, rotatable about a longitudinal axis, and having an electrode portion extending therefrom configured to receive an electrode. The stationary probe rotating disk electrode may be part of an analytical system wherein the probe tip includes a capillary entrance spaced apart from the electrode and connected to an analyte flow path.

Abstract: Various samples are generated on a substrate. The samples each includes or consists of one or more analytes. In some instances, the samples are generated through the use of gels or through vapor deposition techniques. The samples are used in an instrument for screening large numbers of analytes by locating the samples between a working electrode and a counter electrode assembly. The instrument also includes one or more light sources for illuminating each of the samples. The instrument is configured to measure the photocurrent formed through a sample as a result of the illumination of the sample.

Abstract: A recyclable fluid cleaning system wafers includes a cleaning vessel configured to clean semiconductor wafers immersed in a bath of persulfuric acid cleaning solution, the cleaning solution circulated through a primary process tool fluid path; a secondary fluid path that diverts a portion of the persulfuric acid cleaning solution for electrolysis treatment thereof; an electrolysis reactor within the secondary fluid path that receives oxidant depleted sulfuric acid, the electrolysis reactor having electrodes that, when activated causes sulfate ions in the solution to be oxidized and form persulfate ions that are recombined with fluid from the primary fluid path and fed back to the cleaning vessel; and one or more controller devices in operative communication with the cleaning vessel and with the electrolysis reactor.

Abstract: An electroplating apparatus for filling recessed features on a semiconductor substrate includes an electrolyte concentrator configured for concentrating an electrolyte having Cu2+ ions to form a concentrated electrolyte solution that would have been supersaturated at 20° C. The electrolyte is maintained at a temperature that is higher than 20° C., such as at least at about 40° C. The apparatus further includes a concentrated electrolyte reservoir and a plating cell, where the plating cell is configured for electroplating with concentrated electrolyte at a temperature of at least about 40° C. Electroplating with electrolytes having Cu2+ concentration of at least about 60 g/L at temperatures of at least about 40° C. results in very fast copper deposition rates, and is particularly well-suited for filling large, high aspect ratio features, such as through-silicon vias.

Abstract: Disclosed herein are electroplating systems for forming a layer of metal on a wafer which include an electroplating module and a wafer edge imaging system. The electroplating module may include a cell for containing an anode and an electroplating solution during electroplating, and a wafer holder for holding the wafer in the electroplating solution and rotating the wafer during electroplating. The wafer edge imaging system may include a wafer holder for holding and rotating the wafer through different azimuthal orientations, a camera oriented for obtaining multiple azimuthally separated images of a process edge of the wafer while it is held and rotated (the process edge corresponding to the outer edge of the layer of metal formed on the wafer), and image analysis logic for determining an edge exclusion distance, wherein the edge exclusion distance is a distance between the wafer's edge and the process edge.

Abstract: For fast and secure determination of the quality of a metal coating as well as of an electrolyte for depositing a metal, in particular for electrolytic deposition of nickel such as of semi-gloss nickel and bright nickel and for analytical control of the deposition electrolyte, a method of inspecting a metal coating is provided, which involves the following method steps: a) depositing the metal coating from a deposition electrolyte onto a working electrode; b) electrolytically dissolving the metal coating through anodic polarization of the working electrode with respect to a counter electrode, which is in electrolytic contact with the working electrode; c) recording an electrical dissolution potential at the working electrode over time, said potential occurring during a dissolution of the metal coating; and d) determining a time-averaged vale of the dissolution potential.

Abstract: An in situ method for detecting alpha particles contained in a liquid medium, which uses a system which includes a counter-electrode and an alpha particle detector including a substrate made of an intrinsic semiconductor material sandwiched between two electrical contacts, wherein the contact intended to be in contact with the liquid medium is made of boron-doped diamond. By forming a particular electrolyte 8 and by causing a current to flow between counter-electrode and the boron-doped diamond contact in contact with the liquid medium, actinides or polonium present in the liquid medium may be concentrated on the boron-doped diamond contact, and by this means the detection limit of the alpha emitters may be lowered.

Abstract: Modular microfluidic channel structures for conducting liquid from a reservoir include a sensor for monitoring a parameter (such as flow rate or pressure) relating to liquid flowing therethrough. The microfluidic channel generally comprises a thermally insulating substrate made of one or more materials such as, e.g., glass, fused silica, parylene, and/or silicone.

Abstract: A method for electroplating a wafer detects plating bath failure based on a voltage change. The method is useful in plating wafers having TSV features. Voltage of each anode of a plating processor may be monitored. An abrupt drop in voltage signals a bath failure resulting from conversion of an accelerator such as SPS to it's by products MPS. Bath failure is delayed or avoided by current pulsing or current ramping. An improved plating bath has a catholyte with a very low acid concentration.

Abstract: An Sn alloy plating apparatus includes: a plating bath having a cathode chamber for holding therein an Sn alloy plating solution in which the substrate is to be immersed and an anode chamber for holding therein an anolyte containing Sn ions and an acid; an Sn anode located in the anode chamber; and an electrolytic solution supply line configured to supply an electrolytic solution containing the acid into the anode chamber such that a Sn ion concentration of the anolyte in the anode chamber is kept not less than a predetermined value and a concentration of the acid in the anolyte is kept not less than a predetermined acceptable value. The electrolytic solution supply line supplies the electrolytic solution into the anode chamber to increase an amount of the anolyte in the anode chamber and supply the anolyte into the Sn alloy plating solution by the increased amount.

Abstract: It is an object of the present invention to derive the optimum operating condition parameters for plating operation accurately and efficiently. At first, a preliminary test operation is carried out under the energized condition (S12), then in light of such result, a sequential operations such as a first test operation (step S14) in which no energization is carried out for plurality of operating pattern candidates and a second test operation (step S16) under the energized condition are carried out, and then the optimum operating conditions are registered (step S18).

Abstract: A method of analysing chemical species in a solution, the method comprising: providing an electrochemical deposition apparatus comprising a first electrode (2) formed of an electrically conductive diamond material and a second electrode (4); locating the first electrode in contact with a solution (8) to be analysed and the second electrode in electrical contact with the solution to be analysed; applying a potential difference between the first and second electrodes (2, 4) such that current flows between the first and second electrodes through the solution to be analysed and chemical species are electro-deposited from the solution onto the first electrode; applying a spectroscopic analysis technique to the electro-deposited chemical species (M1, M2, M3) on the first electrode to generate spectroscopic data about the electro-deposited chemical species on the first electrode; and using the spectroscopic data to determine the type of chemical species electro-deposited on the first electrode.

Abstract: The invention relates to a system and a method of plating metal alloys, as well as to the structures thus obtained. The system for plating metal alloys comprises an electrolytic cell containing an electrolytic solution (3) in which an anode (4,4a,4b), a cathode (5), and a plurality of metal components to be plated onto the cathode are immersed, the anode (4,4a,4b) and the cathode (5) being electrically connected to means (6) adapted to apply a potential difference between said anode (4,4a,4b) and said cathode (5). The invention is characterized in that the means (6) adapted to apply a potential difference between said cathode (5) and said anode (4,4a,4b) impose a potential difference value that changes over time according to a predefined law.

Abstract: A method for purifying tin includes exposing an electrolytic solution comprising tin to an ion exchange resin and depositing electrorefined tin from the electrolytic solution. The deposited electrorefined tin has alpha particle emissions of less than about 0.01 counts/hour/cm2 immediately after the deposition step, and an alpha emissivity of less than about 0.01 counts/hour/cm2 at least 90 days after the deposition step.

Abstract: In a process for anodising a metal object (12), the metal object (12) is contacted with an anodising electrolyte (32), and is first pre-anodised so as to grow a thin oxide film on the surface. The microscopic surface area is then deduced from electrical measurements either during pre-anodising or on the pre-anodised surface. The metal object (12) can then be anodised. This is applicable when treating an implant to provide a surface that has the ability to incorporate biocidal material such as silver ions. The pre-anodising uses a low voltage, for example no more than 2. V, and may take less than 120 seconds.

Abstract: A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer.

Abstract: A system for electroplating a substrate includes one or more controllers, with each controller having an FPGA with one or more output channels. A bulk power supply is connected to each controller. One or more transistors are associated with each output channel. An electroplating chamber has one or more electrodes, with each electrode connected to at least one output channel. The system may include a waveform capture and viewing circuit providing built-in process verification and diagnostic tools. The system may also have a throttle back mode which attempts to maintain proper anode current ratios by reducing setpoints of all anodes by the same percentage, if a fault condition causes a reduction in current to one of the anodes. Blackbox logging may also optionally be used for recording selected data values into a circular buffer having a selected amount of memory.

Abstract: Provided are a CNT plating metal composite with high conductivity and wherein metal plating is plated onto the inside of a high-density CNT aggregate, and a production method for same. Also provided is a method for patterning the CNT plating metal composite. A CNT metal composite is provided including a CNT aggregate formed by adhering a metal onto a plurality of CNTs, wherein when an X-ray diffraction analysis is performed using a Cu-K? ray as a radiation source, an intensity ratio between a peak having the greatest intensity belonging to the metal and a peak having the greatest intensity belonging to an oxide of the metal is 10 or more and the volume resistance is 2×10?6 ?cm or more and 5×10?3 ?cm or less.

Abstract: Combinatorial electrochemical deposition is described, including dividing a wafer into a plurality of substrates for combinatorial processing, immersing the plurality of substrates at least partially into a plurality of cells, within one integrated tool, including electrolytes, the cells also including electrodes immersed in the electrolytes, depositing layers on the substrates by applying potentials across the substrates and the electrodes, and varying characteristics of the depositing to perform the combinatorial processing.

Abstract: Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.

Abstract: An auxiliary leveler additive that cannot be analyzed by conventional CVS methods for acid copper plating baths is analyzed by cyclic voltammetry at a platinum rotating disk electrode from its effect on the anodic current at very positive potentials.

Abstract: One embodiment is for the close agitation of electroplating solution substantially near an electrode in an electroplating cell. The agitation occurs within the Nernst diffusion layer allowing for ion replenishment of the electroplating solution at the working electrode face. The system operates by producing a flat agitation face (180) and a working electrode (350) face that are brought to within 10 microns of one another during the plating process whilst the agitator 380 is being actuated. In one embodiment, the working electrode is rigid such as a semiconductor wafer. In another embodiment, the working electrode is a flexible material (600) such as fabric or flexible electronics. Other embodiments are described and shown.

Abstract: A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer.

Abstract: A method for forming a defect marker on a thin film of a photovoltaic device by plating to detect pinholes and/or electrical shunts during device fabrication is disclosed. Also disclosed is a system for implementing such a method.

Abstract: The present invention relates to a method of manufacturing an article having a fine concave-convex structure on a surface thereof, the structure having pores in which a pore interval is less than or equal to a wavelength of visible light, including: irradiating a surface of the article having the fine concave-convex structure on the surface, with light from an illumination device; capturing an image of reflected light from the surface of the article having the fine concave-convex structure on the surface using imaging device; acquiring color information from an image captured by the imaging device; and inspecting the article having the fine concave-convex structure based on the color information. According to the present invention, it is possible to easily inspect the depth of the pores of anodized alumina and the pitch between the pores, and to provide a method of manufacturing anodized alumina having a stable pore shape.

Abstract: Methods and systems for monitoring electrolyte bath fluids are provided. The electrolyte bath fluids can be electroplating, electroless plating or etching solutions. The monitoring systems employ microfluidic devices, which have built in microfluidic channels and microfabricated thin-film electrodes. The devices are configured with fluid pumps to control the movement and mixing of test fluids through the microfluidic channels. The microfabricated thin-film electrodes are configured so that the plating or etching bath fluid composition can be characterized by electrochemical measurements. The monitoring methods and system provide faster measurement times, generate minimal waste, and occupy dramatically reduced physical space compared to conventional bath-monitor systems. The monitoring systems and method also provide low-cost system and methods for measuring or monitoring electroless plating bath rates.

Abstract: Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings.

Abstract: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. In an embodiment of the present invention, the fillability is judged by obtaining the potential change speed in the initial stage of electrolysis and the potential convergent point from the time-dependent potential change curve for a predetermined period of time after the start of the electrolysis.

Abstract: A manufacturing method of a support for a planographic printing plate including at least an alkaline etching step of dissolving an aluminum surface layer of an aluminum web with an alkaline solution during a surface roughening treatment on a surface of the aluminum web continuously traveling, the manufacturing method comprising: a circulating step of cyclically using the alkaline solution between a treatment tank for the etching and an alkaline solution reservoir during adjusting composition concentration of the alkaline solution; and a filtering step of filtering the alkaline solution cyclically used so as to remove solid matter in the alkaline solution.

Abstract: A method of repairing damaged airfoils. The method comprises the steps of stripping thermal barrier coatings from the airfoil. After the coatings are removed, cracks are removed from the airfoil. Cracks that appear in the bond coat area over the airfoil fillet portion are removed by locally grit blasting the fillet portion of the airfoil. This operation also results in locally removing the bond coating from the fillet portion. Cracks and other damage sustained by the airfoil tip are removed and replaced by welding superalloy material. The airfoil then may be cleaned by thermal etching. The airfoil is then placed in a plating tool permitting preferential plating of airfoil areas from which plating has been removed. After plating, the airfoil is then heat treated to diffuse the platinum coating with the superalloy substrate materials. The diffusion heat treated airfoil is aluminided by any aluminiding process, forming a PtAl coating.

Abstract: The invention relates to methods and devices for forming and measuring lipid bilayers, for example, by joining lipid monolayers that self-assemble at the interface of aqueous and organic phases using sessile aqueous droplets in contact with a measurement electrode. At least one of the aqueous solution, the lower aqueous phase, and/or the upper organic phase comprise lipids. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by flowing a preconditioning electroplating solution with preconditioner species through the flow channel while applying a negative potential. Flow of liquid through the flow channel is rapidly switched from preconditioning solution to a target solution containing an organic target solute to be measured. The transient response of the system resulting from exposure of the working electrode to organic target solute is detected by measuring current density during an initial transient time period. An unknown concentration of target solute is determined by comparing the transient response with one or more transient responses characteristic of known concentrations. A preferred measuring system is operable to switch flow from preconditioning solution to target solution in about 200 milliseconds or less.

Abstract: A process for forming coatings on metallic web, the process including: immersing at least three metallic webs in an electrolytic solution contained in a reaction chamber; passing wave multiphase alternating current across said metallic webs by using back-to-back thyristors connected in parallel; moving the metallic webs through the electrolytic solution; and removing the coated webs from the reaction chamber.

Abstract: Methods and systems for screening for the effect of bath composition on the performance of electroplating, electroless-plating, electrochemical-etching, electropolishing, and chemical-etching processes are provided. The methods and systems use microfluidic channels that allow for etching or plating studies on an electrode exposed to a multitude of bath compositions at different positions on its surface. After deposition or etching, the electrode surface can be quickly and easily detached from the device for analysis of deposited or etched film properties.

Abstract: A stainless steel for a fuel cell having good corrosion resistance throughout a wide potential range and a method for producing the same are provided. In particular, a coating having an intensity ratio [(OO/OH)/(Cr/Fe)] of 1.0 or more determined by X-ray photoelectron spectroscopy analysis is formed by performing an anodic electrolyzation treatment on a surface of a stainless steel in an electrolyte solution, the stainless steel containing 16% by mass or more of Cr and preferably having a composition that includes, in terms of percent by mass, C: 0.03% or less, Si: 1.0% or less, Mn: 1.0% or less, S: 0.01% or less, P: 0.05% or less, Al: 0.20% or less, N: 0.03% or less, Cr: 20 to 40%, at least one selected from Nb, Ti, and Zr, in total: 1.0% or less, and the balance being Fe and unavoidable impurities.

Abstract: The present invention relates to novel metallic composites that are useful as coinage materials. These composites are produced through a multi-ply plating process and are designed to overcome difficulties associated with calibrating vending machines that can result in fraud. In one embodiment, the metallic composite comprises a steel core over which nickel and then a non-magnetic metal such as copper, brass or bronze is deposited as a layered pair. The magnetic and non-magnetic metals may also be applied in the reverse order, with the copper, brass or bronze applied directly over the steel and then covered by the nickel. The electromagnetic signature (EMS) of the composite is controlled by defining the thickness of the deposited metal layers. Advantageously, the invention overcomes problems associated when different coins are made from the same alloy and have similar sizes, and therefore cannot be distinguished by vending machines.

Abstract: A plating method includes supplying a plating solution into a plating bath, immersing a first substrate having a lower metal interconnection and a photoresist pattern in the plating solution, performing a first plating process and forming a first plating pattern on the first substrate, removing the first substrate from the plating solution, collecting a sample of the plating solution, analyzing a photoresist residue included in the sample, immersing a second substrate in the plating solution, and performing a second plating process and forming a second plating pattern on the second substrate.

Abstract: The invention relates to the metalworking field, particularly to electrochemical sizing machining, and can be used for manufacturing of machine workpieces having an intricate profile and shaping furniture from chromium-containing steels and alloys operating in aggressive environment under excessive friction. Technical effect: improving machining accuracy by forming a lustrous layer on the machined surface and reduction of concentration of hexavalent toxic chromium ions in a waste electrolyte solution.

Abstract: A method of verifying performance of a coated part includes calculating a deflection value as a function of a predetermined strain threshold value and a total thickness of a test coupon that comprises a coating on a substrate. The coating of the test coupon is co-deposited in a deposition process for producing a coated part. The test coupon is bent in an amount equal to the calculated deflection value and then evaluated as an indication of whether a mechanical characteristic of the coated part meets a specified level.

Abstract: The present disclosure generally addresses the problem of controlling a plating profile in multi-step recipes and addresses, in particular, the problem of compensating for variations of the plating tool state to stabilize the plating results. The compensation is done by adjustments of corrections factors for currents of a plating tool in a multi-anode configuration. The described method enables control of recipes with different current ratios in each recipe step and models different deposition sensitivities in each recipe step. Generally, the method of the present disclosure requires a measurement step, where the tool state is determined, and a data processing step, where the correction factors are set based on models describing the plating process and the tool state.

Abstract: The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurement is made directly on the undiluted plating bath so that the chloride measurement is fast and no waste stream is generated.

Abstract: Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings.