Abstract: A wafer container for supporting semi-conductor wafer disks and for interfacing with processing equipment and methods for constructing the same. Wafer supports are positioned within an enclosure portion, the wafer supports having a plurality of vertically stacked shelves for defining slots. The wafer supports are secured within the enclosure portion rigidly at the bottom margin and resiliently at the top margin. In preferred embodiments resilient plastic spring members extend between the closed top and the wafer supports to substantially constrain lateral or forward-back movement of the wafer supports with respect to the closed top and to permit some vertical movement of the wafer support with respect to the closed top. The spring members may be configured as a leaf spring integral with an extending from the top margin of each wafer support.

Abstract: A wafer container comprises a housing with a door frame, defining an opening for insertion and removal of wafers, and a door for insertion into the door frame. The door includes a wafer enclosure sealing arrangement for hermetically sealing the door with the door frame of the housing. The wafer enclosure sealing arrangement includes a first groove disposed about a perimeter of the interior surface of the door and a second groove disposed adjacent to the first groove and spaced laterally from the perimeter of the door. The sealing arrangement includes a support member disposed between the first and second grooves. The sealing arrangement also includes an elastomeric seal member having a first portion that is frictionally inserted into the second groove and extends around the door and a second portion that cantilevers downward into the second groove when the door and housing are joined.

Abstract: Containers (19) are provided for packaging flexible substrates (13) such as the glass substrates used in the manufacture of liquid crystal displays. The containers include arc-shaped grooves (25) which apply an elastic strain to the substrates. The elastic strain stiffens the substrates and thus reduces the likelihood of damage to the substrates as a result of vibration during transport or sagging when held horizontally. Through the use of such grooves, dense packaging of large, thin substrates is achieved.

Abstract: The present invention provides a holder that prevents a glass substrate from deforming during a chemical reinforcing process. The holder includes supporting members, each of which has a plurality of supporting concave portions. The supporting members are formed from a flat plate having a constant thickness so as not to have a portion having high thermal capacity. When the glass substrate is cooled, a thermal stress is not applied to the glass substrate.

Abstract: The present invention discloses a semiconductor wafer cassette, which is able to receive at least one wafer, comprising: a first side wall, a second side wall opposite to the first side wall, a front surface, and a back surface opposite to the front surface; the cassette further comprising a body, the body defining an internal bay portion with slots for vertically receiving a plurality of wafers, each slot of the internal bay portion having one support slab. Moreover, the body also includes two parallel legs for supporting the cassette and a handle for handling the wafer cassette.

Abstract: The present invention discloses a frame cassette comprising a case, a hollow parallelepiped with an front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and a plurality of frames for adhering and fixing cut wafers; characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall to fix the frame cassette on a personal guided vehicle.

Abstract: A lens housing container for housing a plurality of lenses, comprising a long carrier tape having a supporting portion for supporting one ring-shaped surface of the flange portion of the lens, and a plurality of lens housing portions; and a long cover tape to be stuck on the carrier tape so as to cover the lens housed in the lens housing portion, wherein the supporting portion supports the one ring-shaped surface of the flange portion of the lens, so as not to come into contact with the one lens surface of the lens, the lens housing portion houses the lens so that a part of the other lens surface of the lens is projected from or is flush with the upper surface of the carrier tape, the cover tape restrains the lens housed in the lens housing portion from moving in the optical axis direction.

Abstract: A data package assembly comprises a substrate which includes a panel portion and a data card portion detachable from each other. The data card portion has an exposed face and a concealed face on opposite sides of the substrate, with personal identifying indicia on the concealed face correlated with a prepaid account. The data card portion is folded into an overlapping relationship with the panel portion so that the panel portion faces the concealed face of the data card portion and thereby conceals the personal identifying indicia without requiring folding of the panel portion. The data card portion is detachably retained in overlapping relationship with the panel portion, at least a major portion of the exposed face of the data card portion being visibly exposed.

Abstract: A semiconductor wafer retaining structure includes a container made of a conductive material in which a plurality of semiconductor wafers is stacked and contained, spacer sheets put between the semiconductor wafers, and end-cushioning materials put to the upper and bottom end portions of the semiconductor wafers thus stacked and contained. Slits are formed in the container for transferring the semiconductor wafers in and from the container by a robot.

Abstract: A wafer retainer is disclosed to be fastened to the inner surface of the door panel of a wafer carrier without making openings in the inner surface of the door panel, the wafer retainer having at least one frame bar, retaining portions and positioning elements respectively extended from the at least one frame bar for fastening to respective locating elements at the inner surface of the door panel and retaining portions at the lateral sidewall of a recessed area, and a plurality of spring arms respectively extended from the at least one frame bar at different elevations and adapted to hold a corresponding storage wafer in the wafer carrier, each spring arm having a smoothly arched top end adapted to contact one point of the corresponding storage wafer to minimize friction.

Abstract: Containers (19) are provided for packaging flexible substrates (13) such as the glass substrates used in the manufacture of liquid crystal displays. The containers include arc-shaped grooves (25) which apply an elastic strain to the substrates. The elastic strain stiffens the substrates and thus reduces the likelihood of damage to the substrates as a result of vibration during transport or sagging when held horizontally. Through the use of such grooves, dense packaging of large, thin substrates is achieved.

Abstract: A modular carrier system uses a shell portion to house semiconductor wafer disks or similar inventory. The modular carrier system uses an external frame with accessories attached to the frame so that multiple configurations of accessories are possible with each shell portion and the accessories can be recycled when the shell portion is disposed.

Abstract: A cassette for supporting substrates and an elongated rib therefor is described and represents a further improvement in the previously proposed elongated rib systems of the prior art and is designed particularly to preclude deflection and dampen vibrations of loaded substrates. The elongated ribs for the cassette project from side panels utilizing an elongated rib structure including three segments; namely, a base resin body, a bar-like intermediate resin body extending from the base resin body, and a terminal resin body disposed at the forward end of the intermediate resin body. Preferably, the elongated rib structure includes a linearreinforcing member inserted fromthe base resin body to the intermediate resin body or, alternatively, from the base resin body through the intermediate resin body to the terminal resin body.

Abstract: A carrier for receiving and holding a plurality of semiconductor wafers and permitting surfaces of the wafers to receive maximum exposure to ultrasonic waves during a wafer cleaning process in which the carrier and the wafers are immersed in a liquid medium and ultrasonic waves are generated in the liquid medium. The carrier includes two vertical sidewalls and at least three horizontal supporting rods that interconnect the sidewalls and that are collectively positioned for supporting wafers in generally upright, face to face position generally parallel to each other. At least one stabilizing rod extends horizontally between the sidewalls for limiting wafer motion relative to the carrier to steady the wafers. A series of spaced apart teeth on the stabilizing rod define troughs for receiving wafers loosely therein to prevent substantial vibratory deflections of the wafers.

Abstract: A low tolerance build-up wafer carrier and method for assembling the same for supporting semiconductor wafer disks and for interfacing with processing equipment. Press-fit fasteners are used to assemble composite carriers and attach equipment interface portions to the carrier. Each press-fit fastener comprising a first fastener portion integral with a first element and a second fastener portion integral with a second element. The first and second fastener portions interferingly engaging each other when pressed together thereby connecting first and second elements without significant tolerance build-up. A further embodiment of the invention is to provide a wafer carrier having interface contact portions positioned to accept carrier contact portions, from processing equipment, through a guide plate or kinematic coupling. The interface contact portions acting to align the carrier and prevent tolerance build-up due to the flexing of the guide plate.

Abstract: The disk carrier is used to house and secure a plurality of disks and comprises a disk cassette having an open top, an open bottom, and end wall ingresses; a top cover; and a bottom cover. The top cover has flaps to cover the end wall ingresses. To reduce particulation from opening and closing the disk carrier, one embodiment of the disk carrier implements an articulation in the flaps. Another embodiment implements a living hinge on the bottom cover. The disk carrier also has a path to ground for dissipating static and other electrical charge away from the disks.

Abstract: The kinematic coupling of the present invention may comprise a wafer carrier or carrier base plate comprising a first material. The base plate or carrier is provided with a contact component comprising a second material having a lower co-efficient of friction than the first material. The contact component may be provided to the base plate or directly to the bottom of a wafer carrier as part of an overmolding, snap-in-place, staking, ultrasonic weld or adhesive operation and may additionally be held in place by mechanical interlocking of the respective components. The method of manufacturing may include providing a contact component comprised of a first material to a carrier component comprised of a second material via one or more of the processes listed above, wherein the second material has a higher coefficient of friction than the first.

Abstract: A carrier for storing and transporting disks, includes grooves in the sidewalls of the carrier for aligning disks. A top cover used with the carrier includes at least one longitudinal, downward extending support, which contacts the outside diameter of any disks held in the grooves in the carrier when the top cover is attached to the carrier. A bottom cover similarly includes at least one longitudinal, upward extending support that contacts the outside diameter of any disks held in the grooves in the carrier when the bottom cover is attached to the carrier. The top cover and the bottom cover apply minimal pressure to the disks, but advantageously serve to secure the disks within the carrier.

Abstract: The present invention is a support structure for supporting a reticle or silicon wafer. The support structure includes a support column and a retaining structure. In addition to retaining a wafer, the present invention also creates a discharge path to remove electrostatic charges from the wafer. The retaining structure mechanically engages each support column to create a discharge path from the wafer to a ground. Specifically, electrostatic charges that dissipate from the wafer travel along the support structure to the support column and exit the SMIF pod through the pod door.

Abstract: There are provided a dust generation preventing structure of a wafer storage case and a process for preventing dust generation thereof, wherein dust generation is effectively prevented by blocking or suppressing free movement of particles constantly generated from a surface of a wafer storage case of a synthetic resin with a coating layer of a surfactant, and a wafer storing method using the wafer storage case. The wafer storage case of synthetic resin housing wafers, wherein a surface of the wafer storage case is coated with a coating layer of a coating agent to prevent dust generation from the surface.

Abstract: A wafer carrier for carrying a plurality of axially aligned thin circular wafers. The wafer carrier has a framework portion formed from a pair of end members connected by a plurality of side support members. A pair of opposing sidewall assemblies is positioned between the pair of end members, and is attached to at least one side support member. Each sidewall assembly has a plurality of shelves defining a plurality of slots for receiving a wafer. The sidewall assemblies are formed from a plurality of stacked together individual shelf members. Each shelf member has a body portion with an upper surface and a lower surface. The lower surface has a plurality of pegs which are positioned to be received by a plurality of apertures formed in the upper surface of an immediately adjacent individual shelf member.

Abstract: A cassette, particularly suitable for storing film frames, in a preferred embodiment utilizes an integral shell portion with a plurality of shelves to support a plurality of axially aligned horizontally stacked film frames. A door, preferably vacuum-formed, covers the open front of the shell to enclose the film frames therein. The cassette may have a robotic top and collapsible handles. In a preferred embodiment the handles are U-shaped and slideably engaged with a pair of brackets integral with the sidewall. In another embodiment the handles pivot about an axis parallel to the top of the cassette and attach by a pair of split prongs insertable into a pair of receiving holes. A pair of film frame retention members are pivotally and rotatably attached at the sides of the shell inside the front opening.

Abstract: A support device for a wafer shipping container, to constrain the flexure of a multiple number of backgrind-processed wafers when the wafers are stored in alignment in the wafer shipping container. For this support device, stoppers are projected inwards from the front and rear sides of a container body as a part of the wafer shipping container. The support device is comprised of: a pair of opposing walls, which are positioned on the bottom side of the container body and inserted into, and fixed by, the stoppers; a pair of connecting bars across the spacing between the paired opposing walls; a multiple number of partitioning supporters arranged with a predetermined pitch in the longitudinal direction of the paired connecting bars. The wafers are inserted and held between adjoining partitioning supporters, whereby they are prevented from flexing.

Abstract: Disclosed is a thin-plate accommodating/transporting container including a container body for accomodating and supporting a plurality of thin plates while keeping the interior of the container clean, comprising: positioning means, provided at the container body, for accurately adjusting a placement position of the container body; lid receiving portion which is provided in the container body and to which the lid is attached; and engagement means, provided at the lid receiving portion, for engaging with various types of lids of different attachment methods.

Abstract: A transportation container comprises: a container body for housing a plurality of semiconductor wafers; a detachable lid adapted to engage in and cover an open front face of the container body via a seal gasket; and a locking mechanism adapted to fix the lid engaged into the open front face of the container body. The locking mechanism has a pair of protrusions formed at the opposing sides of a rim of the open end face of the container body. The locking mechanism also has a pair of clamp plates which are pivotally supported on the opposing sides of the lid to clamp the protrusions. Each protrusion has, on the back thereof, a groove with a semi-circular cross-section to be clamped. Each clamp plate has attachment shafts for the lid formed in one end of the clamp plate. The clamp plate also has operated parts for automatized operation formed in the other end of the clamp plate. The operated part has a Y-shape in cross-section.

Abstract: A package for framed and unframed single mirrors is disclosed. The package includes a recess projecting past the single mirror on all sides and in which the single mirror is to be so received that it is held in a substantially coplanar relation to the face delimiting the recess at the bottom of the package. The recess has dimensions such that there is a clearance between the delimiting edges of the recess and that of the single mirror. The clearance is adapted to allow for possible movement of the single mirror following a blow or impact. The package further includes a counter-abutment member that has a surface for contacting an external face of the mirror to retain the mirror between the recessed face and the counter-abutment member. There is also included a fastening mechanism for use in locating and mounting the counter-abutment member and the single mirror in the recess.

Abstract: The present invention relates to a thin-plate supporting container 1 having a container body 2, and a thin-plate supporting unit 3 for supporting the semiconductor wafers from both sides thereof in the container body. There are provided a lid 4, and an easy attach/detach mechanism for attaching and detaching the lid 4. The easy attach/detach mechanism 31 is composed of a lid engaging claw 32 provided on the circumference of the lid 4, and object engagement part 28, provided on the container body 2, for engaging with the lid engagement claw 32 so as to secure the lid 4 to the container body 2, an arm 34 for releasing the lid engagement claw 32 from the object engagement part 28; and an elevating mechanism for slightly elevating the lid 4 from the container body 2 when the lid engagement claw 32 is released by means of the arm 34. The thin-plate supporting unit 3, the top flange 5, the carrying handle 6 are detachably mounted. The thin-plate supporting unit 3 is formed with a V-shaped groove 38.

Abstract: A semiconductor wafer carrier has an enclosure with a door frame defining an opening for insertion and removal of wafers, a door for closing and sealing said opening, and separately formed door guides for controlling the interface between said door and the enclosure. In a preferred embodiment, the door guides each comprise a first body and a second body connected to each other by a web. Each body includes a door contacting portion and a door frame contacting portion. The door frame contacting portion has a sloped segment configured to a slidingly, progressively, and cooperatively engage the door frame to properly position the door within the door frame during closure with minimal particle generation by such contact. In this preferred embodiment, the guide is configured to be attached onto a corner edge of a door.

Abstract: A spacer adapted, in use, to space materials, (for example sheets of glass) comprising a spacer element having on at least one face an adhesive wherein at least a portion of the edge of said adhesive carrying face is adhesive free. The spacer is fabricated from a relatively flexible material so that the portion which does not adhere to the material being spaced (because there is no adhesive on that portion) can be bent from out of the plane of the spacer. Once the unadhered portion is so bent a finger hold is provided.

Abstract: A silicon tower or boat for removably supporting a plurality of silicon wafers during thermal processing. A preferred embodiment of the tower includes four legs secured on their ends to two bases. A plurality of slots are cut in the legs allowing slidable insertion of the wafers and support for them. The legs preferably have a rounded wedge shape with a curved front surface of small radius cut with the slots and a back surface that is either flat or curved with a substantially larger radius. Preferably, the legs are machined from virgin polysilicon formed by chemical vapor deposition from silane. The bases may be either virgin poly or monocrystalline silicon and be either integral or composed of multiple parts. Virgin polysilicon is preferably annealed to above 1025° C. before machining. Silicon parts may be joined by applying a spin-on glass between the parts and annealing the assembly. After assembly, the surface of a tower is subjected to sub-surface working.

Abstract: A transportation container comprises: a container body for housing a plurality of semiconductor wafers; a detachable lid adapted to engage in and cover an open front face of the container body via a seal gasket; and a locking mechanism adapted to fix the lid engaged into the open front face of the container body. The locking mechanism has a pair of protrusions formed at the opposing sides of a rim of the open end face of the container body. The locking mechanism also has a pair of clamp plates which are pivotally supported on the opposing sides of the lid to clamp the protrusions. Each protrusion has, on the back thereof, a groove with a semi-circular cross-section to be clamped. Each clamp plate has attachment shafts for the lid formed in one end of the clamp plate. The clamp plate also has operated parts for automatized operation formed in the other end of the clamp plate. The operated part has a Y-shape in cross-section.

Abstract: A data package assembly includes at least one data card having a first substrate with opposite faces, and indicia correlated with a prepaid account. A package has a second substrate separate from the first substrate, the data card being detachably connected to the second substrate. Personal identifying indicia correlated with the account are concealed by the package. In addition, first account verification indicia on the card, and second account verification indicia on the package, both different from the personal identifying indicia and both correlated with the same account, are visibly exposed, the package including an aperture visibly exposing the first account verification indicia.

Abstract: A front opening wafer container has a container portion with a transparent shell and a door to close the open front. The container portion has a machine interface on the bottom of the shell, such as a kinematic coupling, and a receptacle at the top of the shell to receive an accessories, in particular a robotic lifting flange or an adaptor plate. The adaptor plate will ideally have a cooperating machine interface portions to allow stacking of the wafer carriers. The receptacle has, in preferred embodiments, sliding support guides with undercut portions for retention of the robotic lifting flange or the adaptor plate. The accessory will ideally have a detent positioned on the accessories to releaseably lock said accessory in place on the container portion.

Abstract: An electronic device workpiece carrier includes a body; and a plurality of workpiece receivers defined by the body, individual workpiece receivers being configured to hold an electronic device workpiece and at least some of the workpiece receivers being spaced from immediately adjacent workpiece receivers at different distances.

Abstract: An article carrier and a blank for an article carrier for holding an article, for example a tray, comprising a top wall, opposed side walls and a base wall hingedly connected together to form a tubular structure and wherein there further comprises an article retention structure hingedly connected to the top wall and the base panel. The article retention structure is formed by a pair of interconnected panels formed from adjacent carton walls and inwardly folded to retain the article within the carrier.

Abstract: The method of the present invention is capable of adhering a wafer to a prescribed position of the carrier plate, which has been correctly positioned, in a short time. The method comprises the steps of: heating a carrier plate; detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed; positioning the carrier plate on the basis of a position of the detected mark; conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in the positioning step; and adhering the wafer at a prescribed position of the carrier plate.

Abstract: Containers (19) are provided for packaging flexible substrates (13) such as the glass substrates used in the manufacture of liquid crystal displays. The containers include arc-shaped grooves (25) which apply an elastic strain to the substrates. The elastic strain stiffens the substrates and thus reduces the likelihood of damage to the substrates as a result of vibration during transport or sagging when held horizontally. Through the use of such grooves, dense packaging of large, thin substrates is achieved.

Abstract: An assembly for storing semiconductor wafers includes a container, a wafer carrier and a plate. The container may be a box having a substantially rectangular bottom surface. The wafer carrier fits in the container. The wafer carrier has a plurality of slots. Each slot is capable of receiving a semiconductor wafer. The plate has a size and shape so as to snugly fit in a predetermined position in the container. The plate substantially prevents motion of the wafer carrier relative to the container. The plate may be an insert formed of a separate piece of material from the wafer carrier. The insert has a substantially rectangular shape so as to fit snugly on the bottom surface of the box. The insert has at least one mounting feature to snugly hold the wafer carrier. For example, the insert may have at least one groove shaped to receive a tab extending from a bottom of the wafer carrier. The insert may be formed of an acetyl homopolymer, polypropylene, polyethylene, or other soft plastic.

Abstract: The present invention is a support structure for supporting a reticle or silicon wafer. The support structure includes a support column and a retaining structure. In addition to retaining a wafer, the present invention also creates a discharge path to remove electrostatic charges from the wafer. The retaining structure mechanically engages each support column to create a discharge path from the wafer to a ground. Specifically, electrostatic charges that dissipate from the wafer travel along the support structure to the support column and exit the SMIF pod through the pod door.

Abstract: The present invention is referred to a packing frame and a system for packing and handling glass sheets. The structure being formed for at least two supporting sections, each supporting section including at least two structural profiles which are connected in the upper part and are separated in the lower part. In lower part of each profile is attached a support profile, in a horizontal position, which is connected to the lower part of the structural profiles, forming a base for each one of the supporting sections. The horizontal profile having a first supporting section and a second supporting section, both supporting section being of a major extent, on each side of the supporting section in order to support a series of glass sheet packages. Each one of the supporting sections being placed in a relation one in front to the other, which are joined by crossing members forming the assembly of the supporting frame.

Abstract: Disclosed is a container box for storage and transportation of wafer materials or other precision substrate plates in the electronic industries as well as for automatic loading of the wafer materials on a wafer-processing machine. Several accessory parts can be mounted on the container box as selected according to the usage conditions of the container box so as to accomplish improvements in the weight decrease, handleableness and storage. The wafer container box consists of a box body having a front opening and a covering thereon and comprises an upper mounting means provided on the top wall of the box body for supporting a robotic flange, a lower side mounting means provided on the outer surface of each of the side walls of the box body for supporting a side rail, and a side mounting means provided on the outer surface of each of the oppositely facing side walls of the box body for supporting a manual handle, each in a demountable fashion.

Abstract: The present invention has an object to provide, in a container having packing to be used in an environment which produces the difference in the air pressure inside and outside the container due to air transportation and the like, with a configuration that prevents the containment of a negative pressure inside the container. By means of using packing with superior adhesion provided with minute uneven shapes at one or more places of the packing, a container can be obtained which exhibits airtightness in an environment not having a difference in the air pressure inside and outside the container, and which will not cause containment of a negative pressure inside the container at the time of the ambient air pressure fluctuations, for example during the above-mentioned air transportation and the like. Furthermore, the same effect can be obtained even if a minute uneven part is provided at one or more places on the surface of the container main body or the cover that makes contact with the packing.

Abstract: The system and method for molecular contamination control permits purging a SMIF pod to desired levels of relative humidity, oxygen, or particulates. The SMIF pod includes an inlet port including a check valve and filter assembly for supplying a clean, dry gaseous working fluid to maintain low levels of moisture, oxygen, and particulate content around materials contained in the SMIF pod. The SMIF pod outlet port, which also includes a check valve and filter assembly, is connected with an evacuation system. Flow of purge gas inside the SMIF pod can be directed with one or more nozzle towers to encourage laminar flow inside the pod, and one or more outlet towers., having a function similar to that of the inlet tower, may also be provided. The purge gas can be dried by exposure to a desiccant, heated to temperatures between about 100° C. and about 120° C., and can be tested for baseline constituent levels prior to or after introduction into a SMIF pod.

Abstract: Disclosed is a container box for storage and transportation of wafer materials or other precision substrate plates in the electronic industries as well as for automatic loading of the wafer materials on a wafer-processing machine. Several accessoty parts can be mounted on the container box as selected according to the usage conditions of the container box so as to accomplish improvements in the weight decrease, handleableness and storage. The wafer container box consists of a box body having a front opening and a covering thereon and comprises an upper mounting means provided on the top wall of the box body for supporting a robotic flange, a lower side mounting means provided on the outer surface of each of the side walls of the box body for supporting a side rail, and a side mounting means provided on the outer surface of each of the oppositely facing side walls of the box body for supporting a manual handle, each in a demountable fashion.

Abstract: A rail for use as a support in an apparatus for holding semiconductor wafers during heat treatment of the wafers in a furnace comprises a plurality of teeth arranged such that the space between adjacent teeth can receive a portion of a semiconductor wafer. The teeth contain a raised support structure, such as a ledge, located on their top surface for supporting a wafer. Each tooth usually has a length greater than about 20 millimeters, and the raised support structure typically occupies greater than about 50% of the length of a tooth.

Abstract: A rack-holding device with an attachment surface (1), which device has as least two side guides (2) and at least one stop (3), the stop (3) being arranged in each case in front of the at least two side guides (2), and the two side guides (2) being arranged parallel to and at a distance form one another. The two side guides (2) are designed in such a way that they have a bearing surface at essentially the same height. The two side guides (2) are each connected to the attachment surface (1). A sensor (7) is located on the attachment surface (1) and the sensor detects if a rack is in the position in the rack-holding device.

Abstract: Disclosed is a container box for storage and transportation of wafer materials or other precision substrate plates in the electronic industries as well as for automatic loading of the wafer materials on a wafer-processing machine. Several accessory parts can be mounted on the container box as selected according to the usage conditions of the container box so as to accomplish improvements in the weight decrease, handleableness and storage. The wafer container box consists of a box body having a front opening and a covering thereon and comprises an upper mounting means provided on the top wall of the box body for supporting a robotic flange, a lower side mounting means provided on the outer surface of each of the side walls of the box body for supporting a side rail, and a side mounting means provided on the outer surface of each of the oppositely facing side walls of the box body for supporting a manual handle, each in a demountable fashion.

Abstract: A container for holding substrates such as a wafer cassette for holding semiconductor wafers is provided. The container is equipped with dividers on the interior sidewalls of the container which are of different lengths or different colors such that an operator when inserting a substrate into the container can easily identify the corresponding pairs of dividers to avoid the cross-slot misplacement of and the subsequent damage to the substrate.

Abstract: A fixturing device which supports a substrate or a plurality of substrates in a vertical orientation during cleaning, drying, and coating processing steps while minimizing the contact surfaces between the fixture and each substrate so that a maximum of the substrate surface is exposed. The fixturing device utilizes converging support surfaces that terminate at the closest point in a gap with a distance less than the thickness of a substrate. The converging support surfaces counter surface tension, cohesion of the liquid molecules, and the adhesion of the liquid molecules on the surface of the fixturing device. The gap in the converging support surfaces prevents the fixturing device from retaining liquid at the interface of the substrate and the fixture. In conjunction, the contoured passages enhance the drawing of liquid away from the fixturing device and prevents pooling and staining the substrate.

Abstract: A semiconductor wafer carrier has an enclosure with a door frame defining an opening for insertion and removal of wafers, a door for closing and sealing said opening, and separately formed door guides for controlling the interface between said door and the enclosure. In a preferred embodiment, the door guides each comprise a first body and a second body connected to each other by a web. Each body includes a door contacting portion and a door frame contacting portion. The door frame contacting portion has a sloped segment configured to a slidingly, progressively, and cooperatively engage the door frame to properly position the door within the door frame during closure with minimal particle generation by such contact. In this preferred embodiment, the guide is configured to be attached onto a corner edge of a door.