Abstract: A separate supporting body for supporting semiconductor wafers of ?450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.

Abstract: The present invention relates to a photomask case structure, and more particularly to a photomask case able to firmly fix position of a photomask, which includes an upper cover, a lower cover, supporters and position fixing pieces. Accordingly, when a photomask is retained within the photomask case, then elastic holding portions of the position fixing pieces are used to elastically hold one side of the photomask, beveled edges of the position fixing pieces are used to hold another side of the photomask, and finally press portions of the elastic holding portions are used to elastically press down on the surface of the photomask, thereby firmly retaining the photomask within the photomask case, and preventing impact damage to the photomask from occurring.

Abstract: A substrate storage container that can be highly accurately positioned and produced at increased productivity, and a method of producing the substrate storage container are provided. The substrate container (10) comprises a container body (11) having an opening through which a substrate can be taken in and out thereof and a plurality of positioning members (16) arranged at a bottom of the container body (11). Each positioning member (16) includes a housing (17) and a plate-like member (18), the housing (17) having on one side thereof a pair of positioning slope faces (17c, 17d) and an opening on the other side thereof, the plate-like member (18) closing the opening. The container body (11) is insert-molded with the positioning members (16) used as inserts, and the positioning members (16) are integrally fixed to the container body (11).

Abstract: A wafer storage container including a container body having an opening adapted to store wafers is disclosed. The container body includes a window and wafer support parts. Delivery components are attached to the exterior face part of the container body. The delivery components includes a bottom plate disposed at a bottom of the container body, a pair of side handles disposed at both sides of the container body, and a robotic flange disposed at a top of the container body. The container further is provided with a lid adapted to seal the opening of the container body. The lid includes a lid main body, a pair of latch mechanism disposed within the lid main body, a retainer member disposed at an inner surface of the lid main body, a seal gasket member disposed at a periphery of the lid main body such that it contacts a periphery of an opening part of the container body and a lid cover.

Abstract: A wafer container comprising a base and a cover that nest together. The base includes a staggered wall structure composed of inner and outer walls. The staggered wall structure is arranged so that forces from side impacts are absorbed principally by outer wall segments. A rib on the cover restrains the outer wall segments from flexing beyond the inner wall diameter. Reference tabs on the base facilitate alignment of the base to the cover.

Abstract: The wafer container includes a container body, which is disposed with a plurality of slots for receiving a plurality of wafers therein and an opening is formed by one sidewall of which for importing and exporting the plurality of wafers, and a door includes an outer surface and an inner surface, which is joined with the opening of the container body via the inner surface for protecting the plurality of wafers within the container body. A latch component is disposed in a platform of the inner surface of the door, which includes an oval cam, a pair of moving bars contacting two ends of the oval cam, at least a pair of roller disposed in the platform and each of roller fixed in a slide groove of each moving bar, and a locating spring being an integral part of each moving bar for controlling the turning of the oval cam to drive the each moving bar.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which, and a door, which is joined with opening of the container body for protecting the plurality of wafers in the container body, the characteristic in that: a magnetic member is formed at the inner edge of the opening of the container body and a magnet is disposed at the inner surface of the door corresponding to the magnetic member, the magnet being disposed in a magnetic yoke with recessed cross section, with the design of which the magnet on the door attracts the magnetic member at the opening of the container body for the door and the container body to be lock-fastened to each other.

Abstract: A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.

Abstract: Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The latching mechanism is located in a protective latch well that minimizes accidental opening of the latch(s). The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation.

Abstract: An elastic wafer-retaining cushion sheet is disposed at a wafer retaining position on the top of a wafer tray. The wafer-retaining cushion sheet has a releasably suction-adhering surface that releasably adheres by suction to the wafer tray. Consequently, there is no likelihood of the semiconductor wafer being damaged during transport or the like. In addition, the wafer-retaining cushion sheet can be readily attached to and detached from the wafer tray for washing or replacement according to need.

Abstract: In some aspects, a method is provided for mapping contents of a substrate carrier. The method includes (1) moving a carrier to a sensor; and (2) determining, with the sensor, a presence or an absence of a substrate in the carrier based upon a position of a substrate clamp in the carrier. Numerous other aspects are provided.

Abstract: A wafer container comprising a base and a cover that nest together. The base includes a staggered wall structure composed of inner and outer walls. The staggered wall structure is arranged so that forces from side impacts are absorbed principally by outer wall segments. A rib on the cover restrains the outer wall segments from flexing beyond the inner wall diameter. Reference tabs on the base facilitate alignment of the base to the cover.

Abstract: A front opening wafer carrier formed principally of plastic and comprising an enclosure portion (20) and a door (24) has a path to ground with respect to the wafers (22), the path to ground effectuated by the door (24). The base “ground” may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door (24).

Abstract: In one embodiment, a method can include providing first and second intermediate structures, each having first and second surfaces. Also, the method can include placing the first surface of the first intermediate structure adjacent to the first surface of the second intermediate structure, such that the first and second intermediate structures are in a stacked relationship. Additionally, the method can include simultaneously removing at least a portion of each of the second surfaces of the first and second intermediate structures while in the stacked relationship. Furthermore, the method can include forming a plating layer on each of the first and second surfaces of each of the first and second intermediate structures. Moreover, the method can include forming a magnetic layer on the second surface but not the first surface of each of the first and second intermediate structures.

Abstract: A wafer box for transporting solar cell wafers includes a bottom and guide elements for positioning the solar cell wafers. Four guide angles having centering ridges are provided coaxially with a centric axis on the upper side of the bottom, wherein the fronts of the centering ridges are oriented toward the inserted solar cell wafers. The distance between the fronts of two opposing centering ridges corresponds to the width of the solar cell wafers. A stacking wall having a grip opening is provided on each of two opposing sides of the bottom, and a support bottom is provided, so as to be guided at least on the centering ridges. The bottom has an opening on the centric axis, and has four apertures, for lifting rams for raising the solar cell wafers on the supporting bottom, on a concentric pitch circle at points of intersection with the diagonals of the bottom.

Abstract: The present invention includes a ceiling portion 8, bottom portion 9, a substrate housing portion 3 formed by a side walls 5 to 7, a plurality of wafer slots 11 arrayed in parallel on the inner surface of the side walls 6 and 7, a slit portion 12 formed in an extended manner along the array direction of the wafer slots 11 on each of a second side wall 6 and a third side wall 7, a slide portion 18 movably arrayed along each of the slit portions 12, a plurality of substrate securing pieces arrayed with substantially the same intervals with the intervals of the wafer slots 11 on the inner surface of the slide portion 18, in which, with the slide portion being in a substrate securing position, the substrate housing pieces press and secure the substrate on the wafer slot 11, and in a substrate securing releasing position, the substrate housing pieces move separately from a circumferential portion of the substrate and releases a securing state of the substrate.

Abstract: When the position of a substrate is shifted, the substrate is made to return to an original position by enabling the position of the substrate to be controlled using an elastic piece which protrudes inside from a vertical direction part of a frame. Further, a coupling piece is provided extending in a vertical direction and having both ends thereof coupled to a horizontal direction part of the frame, and a protruding part protruding inside a substrate container is provided on the coupling piece. Then, this protruding part is configured to have an inclined face which is inclined in a direction intersecting the substrate and enabled to come into contact with the periphery of the substrate, and thereby this inclined face guides the substrate to reduce the friction of the substrate and to control the position of the substrate.

Abstract: A front opening unified pod (FOUP) for holding wafers is invertible and compatible with process machines in an inverted orientation. The FOUP can safely transport and store wafers while in a non-upright orientation. The shelves within the FOUP are capable of collapsing and constraining the wafers. Further, a method of holding wafers for processing is provided.

Abstract: A semiconductor wafer storage case is disclosed that includes plural support members that are spaced at predetermined intervals with respect to each other and are each configured to come into contact with a peripheral edge region of a first face of a semiconductor wafer, and an elastic member that elastically supports the support members with respect to each other and is configured to elastically deform to come into contact with a second face of the semiconductor wafer and press the semiconductor wafer onto a corresponding support member.

Abstract: A loading tray 13 supports at least one thin plate safely and reliably. It comprises a first loading portion 18, provided on one side thereof, on which at least one thin plate is loaded; a second loading portion 19, provided on the other side thereof, fitted to the first loading portion 18 of adjacent loading tray 13 to form a housing space sealed off from the external environment, for sandwiching the thin plate within the housing space, and for loading the thin plate on the loading tray when the loading tray is placed upside-down; a hook 30, provided on one side thereof, for coupling with an adjacent loading tray 13; and a hook locking mechanism 31, provided on the other side thereof, for coupling with the hook 30 of an adjacent loading tray 13. As many loading trays 13 as the number of the thin plate is stacked to constitute a thin plate container 11. The thin plate container 11 can support the thin plate from both upper and lower sides.

Abstract: Tubular silicon members advantageously formed by extrusion from a silicon melt or by fixing together silicon staves in a barrel shape. A silicon-based wafer support tower is particularly useful for batch-mode thermal chemical vapor deposition and other high-temperature processes, especially reflow of silicate glass at above 1200° C. The surfaces of the silicon tower are bead blasted to introduce sub-surface damage, which produces pits and cracks in the surface, which anchor subsequently deposited layer of, for example, silicon nitride, thereby inhibiting peeling of the nitride film. Wafer support portions of the tower are preferably composed of virgin polysilicon. The invention can be applied to other silicon parts in a deposition or other substrate processing reactor, such as tubular sleeves and reactor walls. The tower parts are preferably pre-coated with silicon nitride or polysilicon prior to chemical vapor deposition of these materials, or with silicon nitride prior to reflow of silica.

Abstract: A clean container having an elastic positioning structure includes a support element and a back positioning element on a base. A cover is disposed for covering the base, and a positioning part is disposed between the cover and the base, which has two elastic arms extended laterally, and each elastic arm extends with a pushing surface respectively. When a plate of brittle material is placed on the base, and the cover is closed, the pushing surfaces are elastically pressed against and push the plate respectively, so that the plate moves backwards and presses against the back positioning element. Therefore, the plate is prevented from being damaged. Additionally, the base, the cover, and the positioning part are made of a conductive material, so that the electrostatic charges for the plate is conducted out of the clean container, and has a protective function of an electrostatic discharge.

Abstract: The present invention provides a manufacturing method by which a substrate (typically, a TFT substrate) can be installed directly in a treatment apparatus by using a transfer container without shifting the substrate from the transfer container to another container. It is possible to use the container efficiently and transfer different substrates in size with one container. A manufacturing method in which a substrate is directly installed in an electrostatic-protected transfer container by a substrate supplier, and then the container is directly installed in a treatment apparatus by a substrate demander after transferring can be realized, thereby making it possible to transfer substrates such as a TFT substrate. A contamination of a substrate due to particles and electrostatic discharge damage of a TFT substrate can be avoided because a transferring operation is not needed.

Abstract: A curtain nozzle is located above an opening portion (10) in a FIMS. A gas curtain formed of inert gas for closing the opening portion is formed. A cover is so provided as to cover a part of the curtain nozzle so as to prevent peripheral gas around an opening of the curtain nozzle from being involved in the gas curtain of the inert gas emitted from the curtain nozzle.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which, and a door, which is joined with opening of the container body for protecting the plurality of wafers in the container body, the characteristic in that: a magnetic member is formed at the inner edge of the opening of the container body and a magnet is disposed at the inner surface of the door corresponding to the magnetic member, the magnet being disposed in a magnetic yoke with recessed cross section, with the design of which the magnet on the door attracts the magnetic member at the opening of the container body for the door and the container body to be lock-fastened to each other.

Abstract: A substrate storage container which includes: a front-opening box type container body for storing a multiple number of substrates in alignment therein; a door for opening and closing the open front of the container body in a sealing manner; and inner-pressure adjustment devices attached to the mounting ports in the container body and the door for adjusting the pressure inside the container body closed with the door. The inner-pressure adjustment device is configured of an elastic attachment cylinder, a filter support structure fitted into, and protected by, the attachment cylinder and a multiple number of filters held inside the filter support structure. Since the inner-pressure adjustment device can be set by mounting an attachment cylinder of a simple structure by use of elastic deformation to the attachment hole, which is provided for the container body and/or the door, there is no need of forming screw holes which need time and effort.

Abstract: A wafer container with wafer-mounting cushion sheets prevents breaking and damage of semiconductor wafers due to impacts or repetitive warping by maintaining the semiconductor wafer in a flat state and enables the semiconductor wafer to be removed safely and easily without damage. The surface of each wafer-mounting cushion sheet includes a self-sucking portion for exerting a removable vacuum on the semiconductor wafer and a non-sucking portion for enabling separation of the semiconductor wafer.

Abstract: A platform for securely mounting a wafer cassette holder thereon is provided which includes a wafer cassette holder that has a flat bottom surface and four sidewall panels, a platform that has a flat top surface larger than and for mating to the flat bottom surface of the wafer cassette holder, And a securing device mounted in the flat top surface of the platform juxtaposed to each side of the four sidewalls of the wafer cassette holder for preventing the holder from accidentally slipping off the platform, the securing device may include either a plurality of engagement pins that slidingly engages the wafer cassette holder for securely holding the holder on the platform, or a plurality of side panels mounted along the peripheral edge of the platform for preventing the holder from slipping off the platform.

Abstract: In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.

Abstract: Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

Abstract: A substrate container includes: a container main body including an opening and containing a substrate; a lid body closing the opening; and a pair of handles provided on a pair of opposing side walls of the container main body, and the handle is secured to an edge portion of the side wall.

Abstract: Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain one or more environmentally sensitive devices associated with semiconductor manufacture, the enclosure comprising a liquid crystal polymer (LCP) to provide a barrier against at least water and oxygen and to reduce purging requirements, and a door coupled with the enclosure.

Abstract: The attaching-and-detaching operation of a lid unit is automated using an existing attaching-and-detaching device. A lid unit for closing a container body of a thin-plate supporting container for use in storing semiconductor wafers therein is provided. A simplified attaching-and-detaching mechanism allows the lid unit to be attached and detached by easy locking and unlocking with respect to the container body. The simplified attaching-and-detaching mechanism includes a locking member engageable with a second receiving device of the container body, and a guiding member disposed at the extremity of the locking member, which guiding member reaches the second receiving device and guides the locking member into the second receiving device in a state in which the main body fits lightly in the container body. The guiding member includes a reaching portion that first reaches the second receiving device, and a guiding portion that guides the locking member to the second receiving device.

Abstract: A substrate storage container includes a locking mechanism, provided in a lid for opening and closing an opened front portion of a container body which stores a substrate of three sheets or less, for locking the lid fitted into the front portion of the container body. The locking mechanism is supported by the lid which is substantially laterally long when viewed from the front. The locking mechanism includes an advance/retreat engaging body that opposes an inner periphery of the front portion of the container body when the lid is fitted into the front portion of the container body, and a spring member that causes the advance/retreat engaging body to advance from the lid to the inner periphery of the front portion of the container body and thus causes a tip end portion side thereof to interfere when the lid is fitted into the front portion of the container body.

Abstract: A semiconductor reticle transportation container includes a box and a base, the box having an opening and the base including a reticle support. The reticle is placed on the support and the box is placed on the base so that the reticle passes through the opening while being lifted off of the support by plungers contacting the lower edge of the reticle. After the box is closed, the reticle is compliantly constrained horizontally and vertically and is held away from the support.

Abstract: A reusable sample-holding device for readily loading very small wet samples for observation of the samples by microscopic equipment, in particular in a vacuum environment. Embodiments may be used with a scanning electron microscope (SEM), a transmission electron microscope (TEM), an X-ray microscope, optical microscope, and the like. For observation of the sample, embodiments provide a thin-membrane window etched in the center of each of two silicon wafers abutting to contain the sample in a small uniform gap formed between the windows. This gap may be adjusted by employing spacers. Alternatively, the thickness of a film established by the fluid in which the sample is incorporated determines the gap without need of a spacer. To optimize resolution each window may have a thickness on the order of 50 nm and the gap may be on the order of 50 nm.

Abstract: A reusable microplate kit for use in the life sciences industry includes a microplate and a removable lid. The microplate includes a sample area with a plurality of individual wells and a hollow outer frame formed around the sample area, the frame being shaped to include a plurality of openings in its top surface. The lid includes a plate, a plurality of latches formed on the underside of the plate and a compressible gasket affixed to the underside of the plate. In use, the lid is mounted on the microplate by inserting each latch through a corresponding opening until the latch snaps into engagement with the frame. In this manner, the plate and gasket together serve to seal off each well from the outside environment. The microplate kit additionally includes a tool for disengaging the lid from the microplate and thereby assist in their separation.

Abstract: A load lock includes a chamber including an upper portion, a lower portion, and a partition between the upper portion and the lower portion, the partition including an opening therethrough. The load lock further includes a first port in communication with the upper portion of the chamber and a second port in communication with the lower portion of the chamber. The load lock includes a rack disposed within the chamber and a workpiece holder mounted on a first surface of the rack, wherein the rack and the workpiece holder are movable by an indexer that is capable of selectively moving wafer slots of the rack into communication with the second port. The indexer can also move the rack into an uppermost position, at which the first surface of the boat and the partition sealingly separate the upper portion and the lower portion to define an upper chamber and a lower chamber. Auxiliary processing, such as wafer pre-cleaning, or metrology can be conducted in the upper portion.

Abstract: A packaged body includes: a prism-shaped packaging box 1 having a bottom; a pair of top and bottom shock absorbers 30 accommodated inside packaging box 1 for sandwiching a substrate storage container 10; elastic members 50 disposed between substrate storage container 10 and each shock absorber 30; and reinforcements 60 for reinforcing each of shock absorbers 30. Further, shock absorber 30 is formed as a shock absorbing element 31 that fits substrate storage container 10, a surrounding wall 32 of the shock absorbing element 31 is constructed of an inner wall 35 that is bent and formed along the periphery of shock absorbing element 31, a protrusion 36 that is formed from inner wall 35 so as to project outwards and an outer wall 37 that is formed from protrusion 36 so as to be spaced from, and oppose, inner wall 35 of shock absorbing element 31.

Abstract: A reticle pod, comprising an upper cover having a first accommodating space and a lower cover having a second accommodating space, a third accommodating space being formed after the upper cover and the lower cover close together, wherein the characteristic of the reticle pad is in that: the reticle pod includes a plurality of supporting pieces respectively and suspendingly disposed at each corner of the inner surfaces of the upper cover and of the lower cover, and two ends of each of the plurality of supporting pieces are respectively connected to two neighboring sides of corner of the inner surface to form a closed sheet body and a gap is formed at the bend of the closed sheet body.

Abstract: A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).

Abstract: A curtain nozzle is located above an opening portion (10) in a FIMS. A gas curtain formed of inert gas for closing the opening portion is formed, and at the same time, the inert gas is also supplied to an inside of a FOUP. Here, the direction of supply of the inert gas supplied to the inside of the FOUP is such that it does not have a flow component directing toward the gas flow forming the gas curtain. The above-mentioned structure prevents increase over time in a partial pressure of oxidizing gas in the FOUP fixed by a FIMS system in an open state.

Abstract: A thin-plate container comprises a container body with an opening and an interior area and being pivotally connected to at least a pair of swing hooks near its opening; a container door for closing the opening of the container body; and a latch component disposed in the container door, which is movable in a to-and-fro direction between a first position and a second position when the container door closes the opening of the container body, wherein in the first position, the latch component is contained in the container door, and in the second position, the latch component extends beyond the container door and is in contact with the pair of swing hooks of the container body for making the container door to move in a sealing direction by using the swing hooks to achieve a sealed status between the container door and the container body.

Abstract: The present invention provides a storage apparatus for storing a semiconductor element or a reticle. The storage apparatus comprises a first cover, a second cover and a flange. The first cover has a top and a plurality of laterals around the top. The second cover is for being assembled with the first cover to form an inner space for accommodating the reticle. As to the flange, it is provided on the first cover for being mechanically held and placed. The characteristic of the disclosed storage apparatus is that the flange and the first cover are integrally formed.

Abstract: An improved substrate transport pod for storing or transporting semiconductor wafer substrates during semiconductor wafer processing has a main body defined by a plurality of side panels. A substantial portion of at least one of the side panels being formed of a semi-permeable membrane allowing any corrosive gas molecules introduced to the interior of the pod to diffuse out of the transport pod through the semi-permeable membrane while preventing particulate contaminants from entering the transport pod.

Abstract: In a load port portion of a conventional clean device, it can happen that cleanliness is reduced by dust caused by wear of bellows and a lid is not separated by its weight from a main body. In order to solve such problems, a clean device is structured as follows: a lid of a clean box has a non-circular reception hole, a load port portion of the clean device has an opening/closing mechanism with a projection fittable in the receiving hole and has a buffer chamber, one end of bellows of the buffer chamber is connected to the bottom surface of the buffer chamber, and the other end of the bellows is fixed, on the outside of the buffer chamber, to raising/lowering means of a port door.

Abstract: A wafer carrier positioning structure including a carrier body having a bottom face and a frame body provided in a peripheral part of the bottom face to project downwardly, for housing a wafer therein so that the wafer is parallel to the bottom face. Further, the wafer positioning structure includes a guide member detachably attached to the bottom face of the carrier body, a guide groove provided in the guide member, for engaging with a positioning pin projecting from a mounting face upon mounting the carrier body to the mounting face, so as to guide the carrier body to a regular mounting position, and a locking portion provided in the guide member, locking to an inside face of the frame body while elastically having contact with the inside face.

Abstract: A substrate storage container includes a container body capable of storing a plurality of substrates in array, a lidding body, and a retainer for retaining substrates therebetween. The retainer includes a plurality of flexible and elastic pieces that are extended from the interior side of the lidding body in the direction of substrates stored in the container body and arranged in the direction of the array of the plurality of substrates, and holding groove pieces each formed with the elastic piece for touching and holding the rim of the substrate. The elastic piece with holding groove piece is gradually curved outwardly with respect to the width direction of the substrate from the interior side of the lidding body toward the substrate, so as to reduce the contact-holding area of the holding groove piece with the rim of the substrate.

Abstract: An object is to restrict vibration from being transmitted to a shelf member and thus to prevent a substrate supported on the shelf member from being damaged. An FOUP main body 3a is formed into a member separated from a shelf member 3e provided in the FOUP main body 3a, and then an elastic member 3g is interposed between the FOUP main body 3a and the shelf member 3e, thereby allowing the shelf member 3e to be elastically supported to the FOUP main body 3a.

Abstract: A wafer shipping container has a first housing subcontainer. A second housing subcontainer mates with the first housing subcontainer to form a housing. The first housing subcontainer is substantially the same as the second housing subcontainer. A process carrier fits inside the housing.