Abstract: A front opening wafer container suitable, for large diameter wafers, 300 mm and above, utilizes a removable robotic flange that attaches vertically, without separate fasteners, using detents having resilient bending members that extend vertically to attach to an upwardly extending flange on the top wall of the container portion. A multiplicity of upwardly and outwardly extending strengthening ribs extend upwardly from the top wall of the container portion and extend along the top wall toward the left and right sides and the back side of the container portion, and each of all four sides of the attachment flange. A further locking piece or core may be inserted and retained at the neck of the robotic flange to lock the resilient deflectable portions in their retention position. The locking piece further may be secured in place with a detent mechanism formed by part of the core and flanges.

Abstract: A wafer boat for holding a plurality of semiconductor wafers in a spaced apart relationship during processing, comprising at least one support member defining a plurality of sets of at least two vertically spaced apart wafer holding provisions, each of which wafer holding provisions is configured to independently hold a wafer in a substantially horizontal orientation, and wherein said sets are arranged such that the wafer boat is configured to accommodate a plurality of juxtaposed stacks of substantially horizontally oriented, vertically spaced apart wafers.

Abstract: Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.

Abstract: A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween. The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.

Abstract: A container for storing semiconductor devices is revealed. The container includes a receiving body, a seal plate, and a cover. At least one fastener and at least one driver are mounted in the receiving body. The seal plate is fastened under the receiving body and against the driver so as to fix the driver on the receiving body. When the driver is rotated, the fastener is driven to move in the receiving body by the driver. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. By the fixing part locked in the fastening part, the cover is fixed on the receiving body. Thus a force opposite to the rotating shaft will not be generated around a periphery of the driver. Therefore stability of the rotating driver is improved and the container is opened and closed smoothly.

Abstract: A container for holding a plurality of substrates includes an enclosure portion defining an interior space. The enclosure has a pluralit of slots for receiving the substrates, and a door (26) for sealingly closing an open side A cushion (62) is received on the door.

Abstract: Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

Abstract: Disclosed is a cassette for loading a substrate, which includes a cassette main body which includes upper and lower frames spaced apart at upper and lower sides, a plurality of internal support bars for supporting the substrate, side frames provided at opposite sides of the upper and lower frames and forms a box shape to internally receive the substrate; a center frame which includes a plurality of internal support bars for supporting the substrate and is vertically disposed in a back of the upper and lower frames; and a connecting member which is provided between the center frame and the cassette main body and detachably connects the center frame to the cassette main body, wherein the connecting member comprises a first fixing unit fixed to the cassette main body, and a second fixing unit fixed to the center frame and detachably coupled to the first fixing unit, the first fixing unit being installed at each of a front and a back of the cassette main body.

Abstract: In a pod used in an FIMS system, diffusion of dust particles or the like adhering on the lid of the pod to the interior of the system is reduced. An engaged portion is provided inside the outer surface of the lid of the pod, and a flange portion provided around a pod opening to which the lid can be fitted is provided with an insertion hole that allows access to the engaged portion from the exterior space. A latch mechanism is supported on the pod body side surface of the flange portion in such a way that the latch mechanism can slide along a direction parallel to the side wall of the flange. An engagement portion of the latch mechanism reaches the engaged portion through the insertion hole, and the state of the latch mechanism changes between an engaged state and a disengaged state with movement of the latch mechanism.

Abstract: The substrate storage pod includes a pod case which includes a hollow inner space for storing a substrate, and an opening; a lid member which is capable of sealing the opening; an exhaust port for exhausting a replacement gas in the hollow inner space of the pod case; and an exhaust space which is defined in the hollow inner space so as to communicate to the exhaust port. The exhaust space is defined in the hollow inner space by a multi-hole partition member including multiple holes and by an inner surface of the pod case. In the substrate storage pod, back pressure on an exhaust side can be lowered, and hence dust in the pod can be collected to the exhaust side.

Abstract: A wafer container, comprising: a container body, the container body having a plurality of slot portions on two opposite sidewalls of the interior of the container body for horizontally sustaining a plurality of wafers, each slot portion having a horizontal carrying portion, an opening being formed on one side of the container body for exporting and importing a plurality of wafers; and a door, said door having an inner surface and a outer surface, the inner surface being joined with the opening of the container body for protecting the plurality of wafers therein, the characteristic in that: an elasticity module is disposed on the inner wall of the rear end of the container body opposite to the opening, the elasticity module having a rectangular body and a convex portion bending toward the interior of the container body being respectively formed on two longer opposite sides of the rectangular body.

Abstract: A check valve disposed inside a semiconductor device container. The check valve includes a cylinder and a check component. With opening and closing of the check component that is elastic, particles are minimized to prevent polluting objects stored in the semiconductor device container.

Abstract: A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween, The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.

Abstract: A storage Pod for semiconductor substrates includes a top cover formed from a non-air permeable (NAP) material having faces including a top and a plurality of sides. A bottom base plate has a locking structure configured for providing a locking position for locking the sides, and for providing an unlocked position where the sides are detached from the bottom base plate. The top cover includes at least one aperture in the NAP material for allowing surrounding gases in an environment around the storage Pod to flow into the storage Pod to permit a gas sensor within the storage Pod to sense the target gas.

Abstract: Arbitrary pieces of semiconductor wafers are supported flexibly on either the upper side or the lower side. The present invention is a thin plate container for supporting plural semiconductor wafers for use in carriage, storage, processing, etc. It comprises processing trays plurally stacked in a state of each supporting at least one semiconductor wafer individually and a coupling mechanism for integrally coupling the processing trays in a state where the processing trays are plurally stacked and separating the processing trays at an arbitrary location. Each processing tray has a one-side support for supporting at least one semiconductor wafer on its one side and the other-side support mutually fitted to the one-side support of the other processing tray on the other side to form a housing space sealed off from the external environment for constraining and supporting the thin plate.

Abstract: Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.

Abstract: In a transfer system for wafers, etc., a coupling chamber corresponding to a port is formed only when a transfer box comes in tight contact with an apparatus as a transfer target in the transfer box is transferred into the apparatus, so that the transfer target will be transferred into the apparatus together with the coupling chamber, thereby simplifying the structures of the transfer box and apparatus and also allowing the transfer target to be transferred into the apparatus without fail.

Abstract: When a lid (20) is attached to a substrate removal/insertion opening (2) in a container body (1), a placement piece forcible displacement means (22) forcibly moves a substrate placement piece (4), which is provided in a region in the vicinity of the substrate removal/insertion opening (2), to a displacement position which does not overlap with a disc-shaped substrate (W). Thus, even if the disc-shaped substrate (W) is increased in diameter, there is no risk of the stored disc-shaped substrate (W) coming into contact with the substrate placement piece (4) due to factors such as vibration or impact, thus the disc-shaped substrate (W) can be stored more safely.

Abstract: A Front Opening Unified Pod (FOUP) has a pair of latch structures, and the latch structures install in a door of the FOUP. The latch structures use a circular rotary turntable to drive a pair of sliding devices, let the latch structures can lock or unlock more stabilized, and use sliding rollers respectively disposed on the sliding devices to prevent the generation of dusts.

Abstract: A disk placement and storage assembly for storage of disks includes a disk cassette and a disk slotter. The disk cassette includes a pair of side wall portions spanning between a pair of end portions, defining a disk receiving region. The side wall portions include a plurality of vertical slots for holding the disks. The disk slotter includes a top plate having a plurality of horizontal slots spanning across top surfaces of the disk cassette when the disk slotter is releasably coupled to the disk cassette, each one of the horizontal slots arranged and dimensioned to receive a disk as the disk is inserted through a horizontal slot in the disk slotter and into a pair of laterally opposing vertical slots of the disk cassette, each one of the plurality of horizontal slots located above and aligned with a pair of laterally opposing vertical slots in the disk cassette.

Abstract: Wafer protecting grooves (10) are provided on an innermost wall (1b) of a container body (1). The wafer protecting grooves have a cross-sectional configuration in the shape of undulations having bottoms (10b), which are most distant from an opening (1a), at respective positions facing the outer edges of semiconductor wafers (W), and having an opening width wider than the thickness of each semiconductor wafer (W). In a normal state, an imaginary line (Q) connecting together the tops of the undulations is inward of or at the same position as the outer edges of the semiconductor wafers (W) facing the imaginary line. Thus, it is possible to obtain superior impact resistance that makes the semiconductor wafers (W) in the container body (1) unlikely to be damaged even when a large impact is applied thereto by a fall or other handling errors.

Abstract: A damping body for packaging includes, between an abutment adapted to abut against a precision substrate storage container upon packaging and an outer peripheral wall rising from an outer peripheral edge of a bottom part having the abutment, an outer peripheral bottom formed at a position distanced more from the abutment than is the precision substrate storage container, and a stepped part formed between the outer peripheral bottom and the abutment. Consequently, in the event of an impact from the outside, the stepped part collapses, so that the abutment favorably moves with respect to the outer peripheral bottom and thus can efficiently absorb the impact. This can prevent large impacts from instantaneously being exerted on the precision substrate storage container and efficiently damp drop impacts.

Abstract: A wafer carrier comprises a supporting body having a height and comprising an opening, wherein a bottom surface of the opening is a curved surface; and a plurality of supporting rods formed around a periphery of the supporting body. Another aspect of the present application provides a manufacturing method of the wafer carrier. The method comprises forming an epitaxial layer on a growth substrate to form a wafer structure; measuring a curvature radius of the wafer structure; and providing the wafer carrier described above in accordance with the curvature radius of the wafer structure.

Abstract: An EUV pod with pressure sensors disposed between its inner container and outer container, wherein pressure sensors disposed on the inner side of the outer container are used to detect the pressure between the outer container and the inner container, and the pressure data are used to determine whether the inner container is firmly fastened by the outer container.

Abstract: A Front Opening Unified Pod (FOUP) having a purgeable supporting module disposed at the junction of each sidewall and the backwall of the container, the characteristic of the FOUP being in that: the purgeable supporting module has a buffer gas chamber and a gas inlet is disposed at one end of the buffer gas chamber and connected to a gas valve on the bottom surface, an outgassing channel is disposed on the purgeable supporting module facing the opening of the FOUP, and a long slot is disposed on one side of the outgassing channel, an airflow channel being disposed between and thus connecting the outgassing channel and the buffer gas chamber, and a plurality of supporting ribs being vertically disposed on one side of the long slot at intervals.

Abstract: A Front Opening Unified Pod (FOUP) having a purgeable supporting module disposed at the junction of each sidewall and the backwall of the container, the characteristic of the FOUP being in that: the purgeable supporting module has a buffer gas chamber and a gas inlet is disposed at one end of the buffer gas chamber and connected to a gas valve on the bottom surface, an outgassing channel is disposed on the purgeable supporting module facing the opening of the FOUP, a long slot is disposed on one side of the outgassing channel and a kind of porous material is disposed in the long slot, an airflow channel being disposed between and thus connecting the outgassing channel and the buffer gas chamber, and a plurality of supporting ribs being vertically disposed on one side of the long slot at intervals.

Abstract: An arrangement comprising: at least one power semiconductor module and a transport packaging. The power semiconductor module has a base element, a housing and connection elements. The transport packaging has a cover layer, an interlayer with a respective cutout assigned to the power semiconductor module, and a cover film. The cover layer is generally planar, and has a first main surface facing the power semiconductor module. The interlayer is arranged on the first main surface of the cover layer. The power semiconductor module is arranged in the cutout, on the first main surface of the cover layer, wherein the base element of the power semiconductor module is disposed on the first main surface of the cover layer. The cover film bears on and covers substantial parts of the housing of the power semiconductor module. The cover film is connected to the first main surface of the interlayer.

Abstract: A reticle storing container is disclosed to include an outer container, an inner container, and a purging valve. The outer container comprises a container body and a container base on which at least a first through-hole is disposed, and a first inner space is formed between the container body and the container base for storing the inner container. The inner container comprises a top cover and a bottom base on which at least a second through-hole connected to the first through-hole is disposed, and a second inner space is formed between the top cover and the bottom base for storing a reticle. The purging valve is disposed in the first through-hole on the outer container base and connected to the second through-hole of said inner container, wherein the purging valve comprises a spring and a valve part. Thus, when the valve part is propped up by a purging head, the valve part compresses the spring for the purging valve to be connected to the purging head.

Abstract: A FOUP (front opening unified pod) is disposed with a plurality of supporting pieces, the positions of which are calibrated to be symmetrical for the supporting pieces to horizontally support wafers in the pod, and with an OHT pad (Overhead Hoist Transport pad), a major function of which is to evenly distribute the weight of the FOUP and the wafers so that the transportation of the FOUP and the wafers by the OHT head can be further stabilized and more weight can be loaded to meet the demands of the process.

Abstract: A wafer-retaining unit has a plurality of vertically superimposed single-wafer retaining sections, each having a wafer-retaining frame abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer, a wafer-securing frame disposed vertically movably relative to the wafer-retaining frame to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer, and wafer lift members that lift the semiconductor wafer to a position where it is upwardly separate from the wafer-retaining frame and keeps the semiconductor wafer in this position. Consequently, a plurality of semiconductor wafers can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers. At the same time, the semiconductor wafers can be loaded and unloaded satisfactorily.

Abstract: A described packing insert for disc-shaped objects has a ring and a deformable contacting portion supported by the ring and extending from a circumference of the ring. The contacting portion has one or more solid portions extending from the circumference. The solid portions define a plurality of radially arranged members separated by a plurality of void regions, where the solid portions extend radially from a circumference of the ring.

Abstract: A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.

Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.

Abstract: A curtain nozzle is located above an opening portion (10) in a FIMS. A gas curtain formed of inert gas for closing the opening portion is formed. A cover is so provided as to cover a part of the curtain nozzle so as to prevent peripheral gas around an opening of the curtain nozzle from being involved in the gas curtain of the inert gas emitted from the curtain nozzle.

Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.

Abstract: The present invention is directed to a tray for semiconductor integrated circuits that enables a BGA semiconductor integrated circuit to be repositioned appropriately in a pocket even if a corner part thereof may fall in a corner part of the recess on the inner bottom surface of a packing pocket. Tapered inner side walls 9 are tilted downward to the inner bottom surface at an angle within the range suggested in FIG. 10 and the ends of adjacent tapered inner side walls 9 are connected by a curving line in the recess 5 provided in a packing pocket 2 of the tray 1 for semiconductor integrated circuits.

Abstract: The present invention discloses a pod which includes a lower cover member, an upper cover member and a guiding locking piece. The guiding locking piece deployed on one side of the upper cover member of pod, the overall structure of which is formed by a flat base linking to a first slope that links to a second slope, two openings deployed on two side areas of the overall structure, and an upper locking piece and a lower locking piece deployed in each of two openings. When the mask is placed into the lower cover member of pod and is covered by the upper cover member, the mask is pushed to certain position and supported and locked by the upper locking piece and the lower locking piece.

Abstract: Embodiments of apparatus for thermally conditioning probe cards prior to use in a testing system are provided herein. In some embodiments, a probe card thermal conditioning system may include an enclosure configured to support a probe card and a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober. The heat transfer element may be a heating and/or cooling element. A controller may be provided for controlling operation of the heat transfer element, optionally with temperature feedback. Multiple enclosures may be provided for independently conditioning multiple probe cards. The enclosure may be contained in a cart or may be part of shipping container for shipping a probe card. A fan may be provided for circulating air within the enclosure. The fan may facilitate providing a dry purge gas to prevent condensate from forming on the probe card.

Abstract: A wafer transfer system includes a bidirectional wafer carrying pod, an over-head transport (OHT) rail, an OHT, two platforms, and two loading ports respectively connected to the two platforms. The bidirectional wafer carrying pod has a loading housing and two doors respectively and detachably installed on the two opposite sides of the loading housing. The OHT rail has a single rail section and a double rail section. The two ends of the double rail section are connected to the single rail section. The platforms are respectively disposed beside the double rail section. The loading ports are disposed under the double rail section. Through the OHT, The bidirectional wafer carrying pod can selectively be transferred to one rail of the double rail section and disposed on the loading port of the tool corresponding to the one rail of the double rail section.

Abstract: The dimensions of the deformation margins (Xh, Xp) of a gasket (8), in a state wherein an opening (2) for transferring a wafer into/from a container is closed with a covering body (5) and a gap between the end portion of the covering body (5) and the end portion of the opening (2) is sealed by means of the gasket (8), are formed smaller in a region which seals an end portion (2p) perpendicular to the surface of the semiconductor wafer (W) than those in a region which seals an end portion (2h) parallel to the surface of the semiconductor wafer(W), said regions being the parts of the end portion of the opening (2). Thereby the semiconductor wafer (W) is not contaminated due to dusts and the like sucked from the outside at a moment when the covering body (5) is opened.

Abstract: In a pod used in an FIMS system, an engaged portion is provided on the outer surface of the lid of a pod. A through hole is provided in a flange portion that is provided around the pod opening and in which the lid is to be received. The through-hole allows access to the engaged portion from the external space. A latch mechanism is supported on the pod body side surface of the flange portion in such a way that it can slide in a direction parallel to the side wall of the flange. The engagement portion of the latch mechanism reaches the engaged portion through the aforementioned through-hole. Movement of the latch mechanism brings the engagement portion into an engaging state and a disengaged state.

Abstract: A wafer storage container including a container body having an opening adapted to store wafers is disclosed. The container body includes a window and wafer support parts. Delivery components are attached to the exterior face part of the container body. The delivery components includes a bottom plate disposed at a bottom of the container body, a pair of side handles disposed at both sides of the container body, and a robotic flange disposed at a top of the container body. The container further is provided with a lid adapted to seal the opening of the container body. The lid includes a lid main body, a pair of latch mechanism disposed within the lid main body, a retainer member disposed at an inner surface of the lid main body, a seal gasket member disposed at a periphery of the lid main body such that it contacts a periphery of an opening part of the container body and a lid cover.

Abstract: A semiconductor tray carrier has a base part and first and second side parts. The first and second side parts are movable between a stowed position and a deployed position in which the side parts extend from the base part to form side walls. Multiple tray carriers can be stacked one upon the other when the side walls are in either the stowed or deployed positions. When stacked in the stowed position, the tray carriers require very little storage space. Windows are provided for attaching details on the contents of the tray carriers.

Abstract: A method for pressurizing a substrate carrier including pressurizing a chamber that is of unitary construction with the carrier and/or a substrate cassette within the carrier and maintaining a pressure within the carrier by releasing gas from the chamber into the carrier.

Abstract: A semiconductor chip holding tray, includes: a base substrate; a first projection provided on the front surface of the base substrate, and disposed on a short edge side of the perimeter of a holding area, has a depression; a first raised portion provided on the front surface, and is disposed on a long edge side of the perimeter; a triangular cross-section second projection provided on the rear surface of the base substrate, and is disposed on a short edge side of the perimeter of a holding area; and a second raised portion provided on the rear surface, and is disposed on a long edge side of the perimeter of the holding area. The tray is arranged such that when two trays are stacked the second projection is fitted in the depression of the first projection.

Abstract: A substrate container is generally comprised of a cover, a base, a latching mechanism, and a substrate retention system. Substrate container has corners with flanges disposed at the corners. Each flange has a hole there through to enhance shock absorption capability by the container, and thus provide greater protection to the substrate.

Abstract: A container includes: a container body for storing substrates of semiconductor wafers; a door element detachably fitted to an open front portion of the container body; and a compressively deformable gasket for sealing between the container body and the door element. While a sealing surface for the gasket is formed on an inner periphery of an open front portion of the container body so that the difference between the maximum and minimum of a flatness is less than 0.50 mm, a fitting portion for the gasket is formed in a frame shape. The gasket is formed of a base fitted to the fitting portion; a flexible sealing part extended from the base toward the sealing surface; and a contact portion that is curvedly formed at a distal end of the sealing part and put in press-contact with the sealing surface.

Abstract: Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

Abstract: A front opening wafer carrier formed principally of plastic and comprising an enclosure portion and door has a path to ground with respect to the wafers, the path to ground effectuated by the door. The base “ground” may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door.

Abstract: A wafer container includes a container body and a door joined with opening of the container body for protecting wafers therein. At least one latch component is disposed in the door, and each latch component includes an oval cam and a pair of moving bars, a first end of each moving bar connecting to one of the two opposite sides of the oval cam and a second end of each moving bar having a guiding structure, a pair of moving grooves being disposed between the first end and the second end of each moving bar, at least a pair of rollers being disposed on the door and each roller being embedded in each moving groove of moving bar, and a locating spring being formed as an integral part of the moving bars.