Abstract: A container for holding a plurality of wafers in an axially aligned, generally parallel spaced apart arrangement includes an enclosure portion having a top, a bottom, a pair of opposing sides, a back and an open front. At least one wafer support is provided in the enclosure along with a kinematic coupling on the bottom of the enclosure. The container has a door for sealingly closing the open front which includes a chassis and an operable latching mechanism on the chassis. The latching mechanism includes a cam selectively rotatable to shift the latching mechanism between a first favored position and a second favored position and at least one vibration dampener for dampening vibrations generated when the latching mechanism is shifted between the first and second favored positions.

Abstract: In a pod used in an FIMS system, diffusion of dust particles or the like adhering on the lid of the pod to the interior of the system is reduced. An engaged portion is provided inside the outer surface of the lid of the pod, and a flange portion provided around a pod opening to which the lid can be fitted is provided with an insertion hole that allows access to the engaged portion from the exterior space. A latch mechanism is supported on the pod body side surface of the flange portion in such a way that the latch mechanism can slide along a direction parallel to the side wall of the flange. An engagement portion of the latch mechanism reaches the engaged portion through the insertion hole, and the state of the latch mechanism changes between an engaged state and a disengaged state with movement of the latch mechanism.

Abstract: A carrier includes an enclosure for storing articles sensitive to electrostatic discharge (ESD) and a replacement component that is affixed to the enclosure as an integral component of the carrier. The replacement component includes a housing that provides an enclosure for a device having a sensor for sensing one or more environmental parameters. At least one of the sensed environmental parameters is an ESD parameter.

Abstract: A wafer carrying structure is provided that allows more efficient operation of the opening and closing mechanisms. More specifically, the wafer carrier includes pressure relief structures that provide appropriate pressure equalization during the opening and closing operations of the wafer carrier. This allows doors on the wafer to be more easily opened and closed while also providing significant environmental isolation for the wafers during transport operations. Relief structures specifically designed to remain closed except for those brief periods of time where pressure relief is necessary to equalize pressure during opening and closing of the carrier.

Abstract: A container body 1 for accommodating a multiple number of precision substrates in alignment, a door element for opening and closing the open front of container body 1 and a multiple number of positioning parts 40 arranged on the bottom of container body 1 are provided. Each positioning part 40 is formed as a concave portion with a pair of parallel ribs 2 formed on the bottom surface of container body 1 and inner surfaces 9 of curved portions 8 of a track 6 formed in a bottom plate 4. Inner surfaces 9 of track 6 are formed to be inclined linearly becoming gradually wider downwards from their top while the upper ends of inner surfaces 9 are extended to an opposing area 2a located between the lower ends of paired parallel ribs 2.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting wafers and an open front is formed on one sidewall of which for importing and exporting said plurality of wafers, and a door with an outer surface and an inner surface, which is joined with opening of the container body with its inner surface for protecting the plurality of wafers within the container, the characteristic in that: at least one latch component including a cam and a pair of moving bars is disposed between outer surface and inner surface of the door, wherein a pair of cam grooves are disposed on the cam for being connected with guide bar on one end of the pair of moving bars, and each moving bar includes a slide groove for being fixed in by roller disposed between outer surface and inner surface of the door, which in turn allows the rotation of the cam to cause to-and-fro movement of another end of the moving bars.

Abstract: A wafer container includes a container body, which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which for importing and exporting the plurality of wafers, and a door with an outer surface and an inner surface, which is assembled with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: at least one latch component is disposed in the door, which includes an oval cam, a pair of moving bars contacting two ends of the oval cam, at least one roller disposed in the door and fixed in a slide groove of the moving bars, and at least one locating spring being an integral part of the moving bars.

Abstract: A door structure that is detachably fitted into an opening portion of a container body for storing substrates includes a casing to be fitted to the opening portion of the container body, a locking mechanism provided in the casing for locking the casing by causing an engaging piece to project out from the peripheral wall of the casing in a retractable manner based on rotation of a rotator so as to interfere with the inner periphery of the opening portion of the container body, a cover for enclosing the locking mechanism, and an operational window formed in the cover so as to oppose the rotator.

Abstract: A substrate storage container includes a container body for accommodating and aligning semiconductor wafers, a door which opens and closes the front of the container body and a pair of valve units disposed at the bottom of the container body for controlling gas flow. Each valve unit includes a fixed sleeve for gas flow, fitted in a rib of a through-hole of the container body, a holding sleeve fitted in the through-hole of the container body with an o-ring interposed therebetween and mated and threaded with the fixed sleeve, a check valve built between the fixed sleeve and the holding sleeve, leaving a clearance, an elastically deformable element for opening and closing the check valve, an interior lid sleeve for gas flow, opposing the check valve and supporting the elastically deformable element, and a filter interposed between the holding sleeve and the interior lid sleeve.

Abstract: A substrate storage container includes a container body for accommodating and aligning semiconductor wafers, a door which opens and closes the front of the container body and a pair of valve units disposed at the bottom of the container body for controlling gas flow. Each valve unit includes a fixed sleeve for gas flow, fitted in a rib of a through-hole of the container body, a holding sleeve fitted in the through-hole of the container body with an o-ring interposed therebetween and mated and threaded with the fixed sleeve, a check valve built between the fixed sleeve and the holding sleeve, leaving a clearance, an elastically deformable element for opening and closing the check valve, an interior lid sleeve for gas flow, opposing the check valve and supporting the elastically deformable element, and a filter interposed between the holding sleeve and the interior lid sleeve.

Abstract: It is an object of the present invention to easily and securely perform the removal operation of contaminant or the like from a wafer housed in a FOUP. To achieve the object, a purging apparatus of the present invention removes contaminant or the like from a wafer by moving a gas supply nozzle along a direction in which wafers are superimposed at the front of an opening while a lid of the FOUP is separated from a body and spraying clean gas on each wafer from the gas supply nozzle.

Abstract: A uniquely shaped gasket (6) suitable for a container for storage of substrate plates requiring precision packaging. When such plates are stored into a container body (2), and a container lid (3) is closed and then a lid lock is applied, a gasket's outward ledge (6b, 6c, 6d) is pressed downward by an outward adjacent surface (3f) and deformed; consequently, the end of the ledge's tip (6d) will extend to fall in a seal channel (2d), in other words, to abut on a sectionally downward concave (2d), wherein the gasket (6) still keeps its elastic resiliency. As a result, if an air pressure difference occurs, the tip end (6d) will shift its abutting point. While the tip end (6d) moves, a minimum gap between the tip end (6d) and the channel surface (2d) occurs, and this gap will act as ventilation route to equalize the air pressure difference.

Abstract: The present invention provides a drain device for a transporting box with an input/output opening which can be blocked by a box door and which contains substrate wafers stacked according to parallel planes. The drain device comprises a volume limited by a sealed wall divided into at least an upper part with a purging gas inlet orifice and a lower part with a purging gas outlet orifice, with the two parts being separated by a sealed partition, and a range of guides defining the openings arranged parallel to those of the wafers and connecting with the volume of the drain device to direct the purging gas towards the transporting box.

Abstract: A fastening structure of a clean container is combined on a cover of the clean container with a dismountable fastener member, such that the cover is closed or opened on a base of the clean container. The fastener member includes a body, a positioning portion, and an elastic fastening arm, that are one-piece formed. The positioning portion extends from one side of the body to form a flat spring. A flange is formed on the flat spring to fasten the fastener member on the cover. The elastic fastening arm has an elastic arm, and a lateral flange is formed on one end of the elastic arm, and extends into the base to be buckled. The fastener member further includes an elastic auxiliary arm formed between the elastic arm and the body, so as to increase an elastic strength of the elastic fastening arm.

Abstract: It is an object of the invention to provide a wafer storage carrier that makes it possible to prevent wafers from being damaged or broken, regardless of the state of wafer warpage. A top plate and two side wall plates secured to left and right edges of the top plate describe two rectangular open-ended sides. One of these rectangular open-ended sides is closed off by a rear wall plate. At least two support rods constituting a wafer support shelf are affixed to a central portion of the rear wall plate with respect to the transverse direction, extending toward the other rectangular open-ended side.

Abstract: A disk processing device holds and rotates a disk with a spindle. Processing tapes are supplied out and wound up by a tape reel unit so as to sandwich and be pressed on both surfaces of the disk through contact rollers. As a crankshaft is rotated, a sliding plate rotates around it and a slidable shaft rotates around a fulcrum part while sliding along the sliding plate such that the contact roller undergoes a reciprocating motion in a radial direction of the disk together with a slider rotatably attached to the slidable shaft.

Abstract: A buckle serves to fix together a lower container part and an upper container part of a thin plate storage container. The buckle includes a plate-shaped main body, an upper hook having a groove engaged with a locking plate of the upper container part, a lower hook having a groove engaged with a locking plate of the lower container part, spring mounting recesses formed at center positions of the upper hook and the lower hook, leaf springs which are fitted in the spring mounting recesses, and locking protrusions at the middle of the leaf springs and fitted into notches formed in the locking plates of the lower container part and the upper container part to position and support the lower container part and the upper container part. The upper hook and the lower hook are vertically and horizontally symmetric.

Abstract: Arbitrary pieces of semiconductor wafers are supported flexibly on either the upper side or the lower side. The present invention is a thin plate container for supporting plural semiconductor wafers for use in carriage, storage, processing, etc. It comprises processing trays plurally stacked in a state of each supporting at least one semiconductor wafer individually and a coupling mechanism for integrally coupling the processing trays in a state where the processing trays are plurally stacked and separating the processing trays at an arbitrary location. Each processing tray has a one-side support for supporting at least one semiconductor wafer on its one side and the other-side support mutually fitted to the one-side support of the other processing tray on the other side to form a housing space sealed off from the external environment for constraining and supporting the thin plate.

Abstract: Embodiments of apparatus for thermally conditioning probe cards prior to use in a testing system are provided herein. In some embodiments, a probe card thermal conditioning system may include an enclosure configured to support a probe card and a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober. The heat transfer element may be a heating and/or cooling element. A controller may be provided for controlling operation of the heat transfer element, optionally with temperature feedback. Multiple enclosures may be provided for independently conditioning multiple probe cards. The enclosure may be contained in a cart or may be part of shipping container for shipping a probe card. A fan may be provided for circulating air within the enclosure. The fan may facilitate providing a dry purge gas to prevent condensate from forming on the probe card.

Abstract: Disclosed is a six-bar linkage positioning mechanism mounted inside a clean container formed of a locating member and a four-bar linkage and a driving module which, when moved, has the slide of the driving module stopped at the base of the cleaning container and be forced to move upwards relative to a sliding way inside the locating member and to cause the driving link of the driving module to drive the four-bar linkage upwards and to further force the second link of the four-bar linkage to push workpieces in respective insertion slots in a cassette on the clean container. The six-bar linkage positioning mechanism has only one degree of freedom so that it moves workpieces horizontally in the cassette into position by means of contact at a point, preventing contamination due to friction and also improving moving stability.

Abstract: A package of a thin plate container 1 is prevented from being broken when vacuum packed. A top flange protective cover for a thin plate container detachable to the top flange which is provided on the thin plate container so as to protrude outward therefrom includes: an outside surface having no edges thereon; and a surface facing the top flange, including: a pair of abutting portions abutting against a flange portion of the top flange, for positioning in one direction; and a pair of fitting pawls abutting against the flange portion in one direction perpendicular to each of the abutting portions, for positioning in the other direction, wherein the protective cover is formed to cover the entire outside surface of the top flange when attached to the top flange. The thin plate container is desirably provided with the top flange protective cover for the thin plate container.

Abstract: This describes a procedure for replicative fabrication and packaging of at least one microstructured molded part as one magazine/molded part composite as well as a magazine with at least one microstructured molded part as one magazine/molded part composite. The first step covers fabrication of at least one microstructured molded part using an initially closed tool which consists of at least one first and one second tool half. In the second step, both tool halves are opened, whereby the molded part remains in the first tool half. In the third step, at least the second tool half is replaced with at least one additional tool half. In the fourth step, the replicative fabrication of the magazine is carried out using the first tool half containing the molded part and the additional tool half. Finally in the fifth step, magazine and molded part are demolded simultaneously as one magazine/molded part composite.

Abstract: A substrate accommodating apparatus 10 is constituted by stacking a plurality of accommodation bodies 20 on an upper surface of a rigid plate 15. Each accommodation body 20 is provided with a buffer 21 having elasticity and some conductivity and a load receptacle 22 having a frame-shaped body, while an upper surface of the buffer 21 is provided with a substrate protect layer 23 made of cellulose. The substrate accommodating apparatus 10 is arranged to enclose a substrate S therein by stacking the accommodation bodies 20 where the substrates are placed, and when the accommodation bodies 20 are stacked, each load receptacle 22 places the load of the respective accommodation body 20 on a periphery of the adjacent lower accommodation body 20 so that any load is not placed on the central portion of the lower accommodation body 20 where the substrate S is placed.

Abstract: A transfer container for transferring an object between environments is described. The transfer container comprises an enclosure; a purifier comprising a purification material, the purifier attached to the enclosure, the purifier configured to purify fluid flowing into the enclosure; and a fluid propelling means, attached to the enclosure, for propelling fluid through the purifier and into the enclosure.

Abstract: A system of moving magnets for sealing a container may include a plurality of moveable magnets disposed near a perimeter of a container door and a rotatable linkage hub positioned within the perimeter of the container door. In addition, the system may include a plurality of control linkages connecting each of the plurality of moveable magnets to the linkage hub so that rotating the linkage hub causes the control linkages to move the moveable magnets between a sealed position and an open position. Alternatively, the moveable magnets may be connected to each other by a magnet positioning mechanism to physically move the magnets along a path near the perimeter. A plurality of static magnets may be disposed near an opening sized to receive the container door and positioned to form a magnetic seal with the moveable magnets when the moveable magnets are positioned at the sealed position.

Abstract: A wafer protective sheet 1 is made of a synthetic resin sheet with a thickness of 80 to 130 ?m having a large number of projected parts and recessed parts on its front and rear surfaces. The large number of projected parts and the large number of recessed parts are respectively disposed so that each part is positioned at intersections of lattice stripes, and the projected part and the recessed part are disposed alternately each other. The sheet has such a water-like cross section that the recessed parts in the rear surface match the projected parts on the front surface and the projected parts on the rear surface match the recessed parts in the front surface. The wafer protective sheet 1 has a bending resistance of 30 to 80 mm. The wafer protective sheet 1 of the present invention is sufficiently thin. When the wafer protective sheets are interposed between stacked wafers to protect them, the sheets do not adhere to the wafers.

Abstract: A substrate container has a container main body to contain a substrate and a check valve which has a cylindrical housing and a valve disc installed in the housing and controls gas flowing from and to the interior and the exterior of the container main body, and is formed by inserting the housing into a through-hole of the container main body.

Abstract: A wafer container with wafer-mounting cushion sheets prevents breaking and damage of semiconductor wafers due to impacts or repetitive warping by maintaining the semiconductor wafer in a flat state and enables the semiconductor wafer to be removed safely and easily without damage. The surface of each wafer-mounting cushion sheet includes a self-sucking portion for exerting a removable vacuum on the semiconductor wafer and a non-sucking portion for enabling separation of the semiconductor wafer.

Abstract: The present invention provides a reticle container that is equipped with a secondary container which houses the reticle and is housed in the primary container. The secondary container is held within the primary container with shock and vibration isolation members so that the secondary container has multiple degrees of freedom of motion within the primary container. The reticle is secured inside the secondary container such that shock and vibration transmission from the reticle container to the reticle is substantially attenuated.

Abstract: A packing insert for disc-shaped objects comprising a ring and a deformable contacting portion supported by the ring and extending from a circumference of the ring. The contacting portion can comprise one or more solid portions extending from the circumference. The solid portions can define a plurality of radially arranged members separated by a plurality of void regions, where the solid portions extending radially from a circumference of the ring.

Abstract: An electronic component accommodating device which can be stacked in plural, the electronic component accommodating device includes an upper surface side wall part extending from an upper surface of the electronic component accommodating device, the upper surface side wall part being positioned close to a flange extending from a lower surface of another electronic component accommodating device stacked on the electronic component accommodating device, wherein a side surface of the upper surface side wall part a side end part of the electronic component accommodating device is formed in a taper shape and has an inclination angle from a horizontal surface, the inclination angle being equal to or less than 60 degrees.

Abstract: A wafer-retaining cushion sheet (5) has a wafer suction-adhering surface (5C) formed on a surface thereof, which adheres by suction to a semiconductor wafer (W). A wafer tray (1) is provided with a plurality of bottom openings (17) opening to the reverse side of the wafer-retaining cushion sheet (5), an air chamber (16) communicating with the bottom openings, and an air inlet (11) for supplying pressurized air into the air chamber (16) from the outside. Consequently, when pressurized air is supplied into the air chamber (16) through the air inlet (11) to increase the air pressure in the air chamber (16), the wafer-retaining cushion sheet (5) is elastically deformed into an inflated form at regions facing the bottom openings (17), thus causing separation between the semiconductor wafer (W) and at least a part of the wafer suction-adhering surface (5C) of the wafer-retaining cushion sheet (5).

Abstract: A closed container in which a reticle etc. is stored and kept is provided with a pressure sensor, transmission means for transmitting data on the pressure, a controller that controls the operation of them, and a battery serving as a power source of the above elements. The controller has a sleep mode in which it causes the transmission means to transmit the data on the pressure at regular intervals and an active mode in which it causes the transmission means to transmit the data on the pressure when necessary in response to an externally supplied command. By the above described configuration, the pressure in the interior of the container can be checked appropriately.

Abstract: A packaging system, hereinafter referred to as the Critical Packaging System, relates to critical issues that associate with sensitive articles such as IC wafers before, during and after shipment phases. The system employs a choice of two or more specialty designed containers, and any one selected design having choices of two or more methods by which to avoid, reduce and/or eliminate wafer damage from breakage, scratches and/or corrosion during shipment phases. For the purpose of maximizing product yield during packaging phases a special apparatus is used to insert wafers within containers without scratch damage. The following programs are used in packaging: (1) Quality Assurance/Certification, (2) Critical Factor Monitoring, and (3) a Recycle and Refurbish Program. These programs are specifically designed to achieve new levels of product yields, reduce product cost, and landfill impact.

Abstract: One aspect provides a carrier tape configured to transport semiconductor packages having a semiconductor package thickness. The carrier tape includes a film having a film thickness extending between a first major surface and a second major surface that is less than the semiconductor package thickness. The film is structured to define at least a first structure and a second structure extending between the first and second major surfaces, the first and second structure(s) each having a structure height that is at least equal to the semiconductor package thickness. A hole is punched entirely through the film thickness to define a pocket positioned between the first and second structures, the pocket having a depth equal to the structure height.

Abstract: A clip is provided for holding a stack of at least one tray and tray cover. Stack compressive forces applied by the clip are substantially limited to tray and cover perimeter rail portions. The clip has a channel base with left and right side retaining walls attached for restricting movement of a stack in left and right directions. Left and right rods protrusions above the base extend inward towards the walls of the channel from the left and right side walls respectively for captivating the stack in an upward direction. Spring protrusions extend upward from the base on input and output ends of the channel, and are configured for applying an upward spring force on opposing bottom edge areas of the stack.

Abstract: The semiconductor wafer containment device or wafer box includes a base with a planar floor and a double concentric cylindrical wall structure arising therefrom. The double concentric cylindrical wall structure includes slots through which latch elements pivot radially. The latch elements include an inward padded spacer element. The latch elements pivot between an outward position wherein the padded spacer elements are relatively away from the wafer containment space and an inward upright position wherein the padded spacer elements impinge into the wafer containment space and are urged against the semiconductor wafers therein. Ramps on the lid capture the latch elements in the outward position and urge the latch elements to pivot to the inward upright position and be detent engaged in this position by slots formed on the lid.

Abstract: A wafer holding device for a wafer pod is disclosed. The disclosed wafer holding device includes a support frame mounted on one side of the housing of the wafer pod, an actuating frame, two rotating arms and two wafer retainers. When the housing and the base of a wafer pod are assembled, the actuating frame moves and forces the wafer retainers to rotate in a direction perpendicular to the edge surface of the wafers.

Abstract: A storage container comprises: a container main body having an opening through which a stored object is placed in or taken out; a lid which fits the opening; a latch mechanism provided on the lid, the latch mechanism having a rotating body rotatably supported by the lid and a pair of longitudinally slidable latch arms operably connected to the rotating body; and a lock mechanism which locks the rotating body when the lid is bolted by the latch mechanism.

Abstract: Techniques for minimizing contamination by particles that wear off of components that come into and out of contact with each other. The invention involves forming at least one of the components out of a magnetic material so that the particles that wear off of the component are magnetic themselves. Then a magnetic field is used to attract the particles. In one embodiment, the particles are attracted to and collected by a magnet. In this way, the particles are drawn away from any components that might be contaminated. In some embodiments, the magnetic component is also magnetized. In other embodiments, a magnet is placed in contact with the magnetic component. In other embodiments, each of the components that come into contact with each other are formed of a magnetic material.

Abstract: A carrier apparatus for holding a shaped sheet material includes a first frame structure with a first front surface including a first outer peripheral region and a first inner peripheral region separated by a first step. The apparatus further includes a second frame structure with a second front surface including a second outer peripheral region and a second inner peripheral region separated by a second step. The second front surface is configured to engage with the first front surface so that the second outer peripheral region is at least partially in contact with the first outer peripheral region and the second step circumferentially mates the first step with the second inner peripheral region opposing to the first inner peripheral region by a gap. The carrier apparatus further includes one or more locking mechanisms and a shaped wing structure extended from outer peripheral edge of the first frame structure.

Abstract: A cap member capable of alleviating degradation of reliability and improving fabrication yields is provided. The cap member has a cylindrical side wall portion, a top face portion closing one end of the side wall portion and having a light exit hole formed therein to allow extraction of laser light from a semiconductor laser chip; a light transmission window fitted to the top face portion to stop the light exit hole, and a flange portion arranged at the other end of the side wall portion and welded on the upper face of a stem on which the semiconductor laser chip is mounted. A groove portion is formed in an inner surface of the top face portion, and this groove portion makes part of the top face portion in a predetermined region less thick than the other part thereof.

Abstract: The present invention provides a storage apparatus for storing a semiconductor element or a reticle. The storage apparatus comprises a first cover, a second cover and a flange. The first cover has a top and a plurality of laterals around the top. The second cover is for being assembled with the first cover to form an inner space for accommodating the reticle. As to the flange, it is provided on the first cover for being mechanically held and placed. The characteristic of the disclosed storage apparatus is that the flange and the first cover are integrally formed.

Abstract: A wafer storage container includes an outer peripheral portion located outside an outer peripheral edge of a wafer, and a placing portion which extends from a position lower than an uppermost surface of the outer peripheral portion to a radial inside of the wafer and on which the wafer is placed at a position lower than the uppermost surface of the outer peripheral portion. The placing portion includes a first inclined surface which descends toward the radial inside of the wafer and can be brought into contact with only the outer peripheral edge of the wafer when the wafer is placed and a second inclined surface which is on a rear side of the first inclined surface, ascends toward the radial inside of the wafer, and can be brought into contact with only the outer peripheral edge of a lower wafer when a plurality of wafer storage containers are stacked.

Abstract: The present invention provides a reticle storage apparatus and a semiconductor element storage apparatus each equipped with a filtering device. The reticle storage apparatus or the semiconductor element storage apparatus is constructed from a first cover and a second cover, which are assembled together to form an inner space therebetween for accommodating a reticle or a semiconductor element. The second cover of the reticle storage apparatus or the semiconductor element storage apparatus comprises at least one aperture for communicating the inner space and an outer of the reticle storage apparatus or the semiconductor element storage apparatus and a filtering device for covering the aperture.

Abstract: The present invention is a pod for containing a particulate sensitive substrate and for providing pressure equalization between the exterior and an interior environment of the pod and for minimizing gaseous fluid flow inside adjacent to the particulate sensitive substrate. The pod comprises a primary pod, a diaphragm positioned in a cover, the diaphragm having a normal undeflected position, the diaphragm deflectable from the normal undeflected position. Preferably, the pod comprises a secondary pod disposed in the primary pod defining a second enclosure for containing the particulate sensitive substrate. The pod may comprise a filter attached to the pod and providing gaseous fluid communication between the exterior of the pod and the interior of the pod. The diaphragm is responsive to rapid pressure changes and the filter is responsive to slower pressure changes and allows the diaphragm to return to its normal undeflected position.

Abstract: A wafer container providing improved wafer restraint during physical shock events. In embodiments of the invention, a secondary wafer restraint structure defining a plurality of notches is interposed between opposing wafer restraint members on the door of the container. The notches may be defined by one or more converging edges or surfaces meeting at a junction. The junctions are positioned so as to align with the wafer receiving portions of each opposing pair of wafer restraint member so that when the door is fully sealingly engaged with the enclosure of the container, the edge of the wafer is contacting the junction. In this position, any vertical movement of the wafer due to shock imparted to the container causes the wafer to contact the converging surfaces or edges, thereby limiting such movement.

Abstract: The precision substrate storage container includes a bottom plate 20 removably attached to the bottom of a container body 1 in which a multiple number of semiconductor wafers are accommodated in alignment; a holder 50 removably supported on bottom plate 20; and a RFID system transponder 60 held in holder 50. Bottom plate 20 includes a base plate 21 opposing the rear bottom of container body 1 and a wall plate 30 erected on base plate 21. The base plate 21 is formed with a first supporting structure 40 for supporting holder 50 that is oriented in the horizontal direction and a second supporting structure 43 for supporting holder 50 that is oriented in the vertical direction so as to selectively change the position of holder 50 taking one of the two directions, longitudinal and transverse.

Abstract: The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.