Abstract: The present invention discloses a sapphire substrate structure for pattern etching and method of forming a pattern sapphire substrate (PSS). The sapphire substrate after pattern etching is suitable to be used as the substrate of a light-emitting device. The sapphire substrate structure comprises a photoresist layer, an underlayer, and a sapphire substrate. The photoresist layer is a uniform layer made of G-line photoresist, I-line photoresist, 248 nm DIN photoresist, or 193 nm Arf photoresist and comprises a flat surface. The underlayer is a uniform layer made of an organic or inorganic compound and comprises a flat surface. The sapphire substrate is formed by epitaxy, while the photoresist layer and the underlayer are formed by coating. After the sapphire substrate structure is formed, it is step by step transformed into a pattern sapphire substrate through an exposure/development process, an etching process, and a cleaning process subsequently.

Abstract: A scattering enhanced thin absorber for a EUV reticle and a method of making thereof is disclosed. Embodiments include forming a multilayer on the upper surface of a substrate, forming a capping layer over the multilayer, forming one or more diffuse scattering layers over the capping layer, and etching the diffuse scattering layers to form a stack.

Abstract: The disclosed methods enable the production of plasmonic near-field transducers that are useful in heat-assisted magnetic recording. The plasmonic near-field transducers have an enlarged region and a peg region. The peg region includes a peg region in proximity to an air-bearing surface above a recording medium and also includes a flared region between and in contact with the enlarged region and the peg region. The flared region can act as a heat sink and can lower the thermal resistance of the peg portion of the near-field transducer, thus reducing its temperature.

Abstract: Embodiments described herein may take the form of a textile fabric, including: a first region defined by a first plurality of textile fibers; a second region adjacent the first region and being formed from a second plurality of textile fibers and a hot melt material adjacent the second plurality of textile fibers; wherein the first region is free of hot melt material. Other embodiments may take the form of a method for fabricating a textile product, including the operations of: applying heat to a textile having associated hot melt fibers, thereby melting the hot melt fibers; modifying a mechanical property of a portion of the textile by introducing a solvent to the textile; and stopping an action of the solvent on the textile when the mechanical property reaches a target.

Abstract: An optical coupling system having an optical coupler and a light-transmissive external medium, the optical coupler comprising a light guide which extends parallel to a main plane of the optical coupler, a mirror surface which is inclined relative to the main plane by an angle of inclination and an outer surface of the coupler which abuts on the medium, the waveguide.

Abstract: A laser device is disclosed that provides at least an ultraviolet laser beam and preferably both an ultraviolet laser beam and a visible laser beam. The laser device includes a semiconductor laser device (e.g. a laser diode) to generate visible laser light which is coupled into a frequency doubling crystal taking the form of a single crystal thin film frequency-doubling waveguide structure. The single crystal thin film frequency-doubling waveguide converts a portion of the visible light emitted by the laser diode into ultraviolet light. Both visible and ultraviolet laser light is emitted from the waveguide. As an example, the single crystal thin film frequency-doubling frequency doubling waveguide includes a frequency doubling crystal region composed of ?-BaB2O4 (?-BBO), a cladding region composed of materials that are transparent or nearly transparent at the wavelength of the ultraviolet laser light beam and a supporting substrate composed of any material.

Abstract: An optical sensor has a waveguide having a core, a cladding having an outer surface and a long period fiber grating. The core, the cladding and the long period fiber grating collectively provide at least two resonant wavelengths. The optical sensor also has binding sites on the outer surface of the cladding for binding to elements to be detected to the outer surface of the cladding. The cladding may be thinned down to a thickness sufficiently low produce the resonant wavelengths. The binding sites include agents for binding to the elements to be detected with the agents being covalently bonded to the surface of the cladding. Example binding sites can include bacteriophages for detecting E. coli bacteria, Palladium for detecting hydrogen, or synthetic DNA for detecting viruses of certain molecules for example.

Abstract: An optical deflector has: a movable plate having a reflecting surface and a side surface; and a support portion that supports the movable plate in such a manner that the movable plate is able to rotate around a predetermined axis, in which the side surface of the movable plate is recessed toward the axis.

Abstract: A method of manufacturing an optical element module in which an optical element and a semiconductor circuit element are mounted on one surface of a silicon substrate, a mirror surface inclined at approximately 45 degrees is formed on the other surface, and an optical fiber facing the mirror surface is disposed in a V groove formed along the other surface, the method of manufacturing includes the steps of forming the mirror surface and V-shaped side surfaces of the V groove simultaneously by first crystal anisotropic etching on the other surface, and forming an attaching surface substantially perpendicular to the one surface and the other surface, which is formed at an end side of the V groove, and for attaching an end of the optical fiber, by second crystal anisotropic etching in a crystal plane orientation different from that of the first crystal anisotropic etching.

Abstract: The disclosure relates to a method for making a grating. The method includes the following steps. First, a substrate is provided. Second, a patterned mask layer is formed on a surface of the substrate. Third, the substrate with the patterned mask layer is placed in a microwave plasma system. Fourth, a plurality of etching gases are guided into the microwave plasma system simultaneously to etch the substrate through three stages. The etching gas includes carbon tetrafluoride (CF4), argon (Ar2), and sulfur hexafluoride (SF6). Finally, the patterned mask layer is removed.

Abstract: A method, system or device for configuring an optical coupling device including obtaining characteristics of an optical signal and ambient conditions for storage in memory, utilizing a processor for identifying an optimum effective subwavelength area refractive index and a grating period for the input signal and ambient characteristics stored in memory, and utilizing the processor for identifying a preferred filling factor for a transverse polarization.

Abstract: A method of preparing an optical preform includes the steps of: a) etching an optical preform to remove a portion of an oxide material deposited on the preform by using a gas comprising an etchant gas containing fluorine at a sufficient temperature and gas concentration to create a redeposited germanium containing compounds contamination such as GeOx in the remaining oxide material; and b) cleaning the etched preform using a cleaning gas containing at least one halogen gas at a sufficient temperature and gas concentration to remove the redeposited germanium containing compound contamination without any substantial further contamination of the remaining deposited oxide material. Preferably the halogen is either chlorine or bromine.

Abstract: A method for fabricating a patterned dichroic film is provided, wherein the method comprises steps as follows: A patterned material layer comprising at least one inorganic layer is firstly provided on a substrate. A film deposition process is then performed to form a dichroic film on the patterned material layer and the substrate. The patterned material layer is subsequently removed, whereby a portion of the dichroic film disposed on the patterned material layer can be removed simultaneously.

Abstract: A method (300) for etching a silicon surface (116) to reduce reflectivity. The method (300) includes electroless deposition of copper nanoparticles about 20 nanometers in size on the silicon surface (116), with a particle-to-particle spacing of 3 to 8 nanometers. The method (300) includes positioning (310) the substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) is filled (340) with a volume of an etching solution (124) so as to cover the silicon surface (116). The etching solution (124) includes an oxidant-etchant solution (146), e.g., an aqueous solution of hydrofluoric acid and hydrogen peroxide. The silicon surface (116) is etched (350) by agitating the etching solution (124) with, for example, ultrasonic agitation, and the etching may include heating (360) the etching solution (124) and directing light (365) onto the silicon surface (116). During the etching, copper nanoparticles enhance or drive the etching process.

Abstract: A process for preparing a subassembly, the process comprising: (a) defining the location of one or more grooves for receiving optical conduits on the top planar surface of a wafer or panel, the grooves corresponding to multiple interposers on the wafer or panel; and (b) etching the grooves into the wafer or panel, each groove having sidewalls and first and second terminal ends and a first facet at each terminal end perpendicular to the side walls, each first facet having a first angle relative to the top planar surface, each groove being shared by a pair of transmitting and receiving interposers on the wafer or panel prior to being diced such that the first and second terminal ends of each groove correspond to transmitting and receiving interposers, respectively.

Abstract: A method for manufacturing a glass cover is provided, which includes following steps. A glass substrate is provided, wherein the glass substrate has a front surface and a back surface opposite to the front surface, and the front surface has a display region and a non-display region adjacent to the display region. The non-display region of the glass substrate is hazed. A glass cover and an electronic device are also provided. The glass cover is adapted to be disposed at an installation opening of a casing of the electronic device. The glass cover includes a glass substrate. The glass substrate has a front surface and a back surface opposite to the front surface, and the front surface has a display region and a non-display region adjacent to the display region, and the non-display region is hazed.

Abstract: Compositions, structures and methods that relate to films having switchable reflectivity and anti-reflectivity depending on ambient conditions, such as temperature. A film with switchable reflectivity and anti-reflectivity includes a nanostructured first layer having nanopillars associated with nanowells. A hydrogel occupies at least a portion of the nanowells. As the hydrogel moves from a dehydrated state to a hydrated state, the surface of the film switches from being reflective to being anti-reflective in a repeatable and reversible process.

Abstract: An in-mold transfer film includes a release layer, a scent-emitting hard layer, a color-changing print layer and an adhesive layer formed sequentially in one direction on one side of a base layer, wherein the scent-emitting hard layer includes aromatic microcapsules, and the color-changing print layer changes its color according to the temperature. An method for manufacturing an in-mold transfer film includes the following steps: forming a release layer on one side of a base layer; forming a scent-emitting hard layer on an upper surface of the release layer; forming a print primer layer on an upper surface of the scent-emitting hard layer; forming a color-changing print layer formed on an upper surface of the print primer layer; forming an adhesive primer layer on an upper surface of the color-changing print layer; and forming an adhesive layer on an upper surface of the adhesive primer layer.

Abstract: Provided is an etching method including: (1) bringing a material containing at least one organic compound having an N—F bond into contact with the surface of a solid material; and (2) a step of heating the solid material; whereby etching can be performed safely and in a simple manner, at a higher etching rate, without the use of a high-environmental-load gas that causes global warming or highly reactive and toxic fluorine gas or hydrofluoric acid. The etching method may further include: (3) a step of exposing the solid material to light from the side of the material containing at least one organic compound having an N—F bond; and (4) a step of removing the material containing at least one organic compound having an N—F bond together with the residue remained between said material and the solid material.

Abstract: The present invention relates to a method for microstructuring a substrate. In the method according to the invention a substrate with a region to be structured is provided, and then by applying colloid spheres into this region, a colloid sphere monolayer is formed. The thus applied colloid sphere monolayer exhibits a certain geometrical symmetry. Said colloid sphere monolayer is then illuminated with a beam of spatially modulated intensity distribution synchronized to said monolayer, thereby performing mechanical structuring in said region in conformity with a desired pattern through concentrating beam intensity via near-field effect behind said colloid sphere monolayer in the propagation direction of light.

Abstract: The present application relates to a substrate for an organic electronic device, an organic electronic device, a method of preparing the substrate or the device, and a lighting apparatus. The substrate for an organic electronic device of the present application may, for example, be used to fabricate an organic electronic device, to which foreign substances such as moisture and oxygen are not permeated, and which has enhanced durability and superior light extraction efficiency. If the organic electronic device includes an encapsulation structure, the substrate may be stably attached to the encapsulation structure, and a surface hardness of outside connector part of the organic electronic device may be maintained to an appropriate level.

Abstract: An optical modulator unit, an optical modulator, and a method of fabricating are provided. The optical modulator unit includes a first contact layer transmitting infrared rays, a lower reflection layer disposed on the first contact layer, an active layer, including a multiple quantum well, disposed on the lower reflection layer, and an upper reflection layer disposed on the active layer. The optical modulator includes a plurality of optical modulator units sharing the first contact layer. The method includes sequentially stacking a first contact layer, a lower reflection layer, an active layer, an upper reflection layer, and a second contact layer on a substrate; etching the second contact layer, the upper reflection layer, the active layer, and the lower reflection layer, exposing a surface of the first contact layer; forming a first electrode on the first contact layer; and forming a second electrode on the second contact layer.

Abstract: A method for making grating is provided. The method includes following steps. A substrate is provided. A mask layer is located on the substrate. The mask layer is patterned, and a number of bar-shaped protruding structures are formed on a surface of the mask layer, a slot is defined between each of two adjacent protruding structures of the number of protruding structures to expose a portion of the substrate. The protruding structures are etched so that each of two adjacent protruding structures begin to slant face to face until they are contacting each other. The exposed portion of the substrate is etched through the slot. The mask layer is removed.

Abstract: A light scanner includes: a base part; a shaft part that swingably supports the base part around a first axis; an optical unit including a light transmission part that is supported by the base part and has light transmissivity, and a first light reflection reduction part that is provided on the light transmission part and reduces light reflection, wherein light enters the first light reflection reduction part.

Abstract: A reticle for use in an extreme ultraviolet (euv) lithography tool includes a trench formed in the opaque border formed around the image field of the reticle. The trench is coated with an absorber material. The reticle is used in an euv lithography tool in conjunction with a reticle mask and the positioning of the reticle mask and the presence of the trench combine to prevent any divergent beams of radiation from reaching any undesired areas on the substrate being patterned. In this manner, only the exposure field of the substrate is exposed to the euv radiation. Pattern integrity in neighboring fields is maintained.

Abstract: An optical device according to an embodiment includes a laser light source, a first optical waveguide that propagates light being output from the laser light source, a first distribution device that distribute the light into n lights, n second optical waveguides that propagates the n lights being output from the first distribution device, n second distribution devices that distribute each of the n lights into m lights, n×m third optical waveguides arranged in a matrix form and propagates the n×m lights being output from the m second distribution devices, a control electrode that apply a voltage or current to each of the third optical waveguides, and control phase of the light propagating through the third optical waveguides, and an output end surface that output the n×m lights.

Abstract: A light concentrator or distributor is provided, which includes a plurality of light conducting cells that are lined up in a transparent light conducting body. The light conducting cells are defined by boundary faces, which are produced within the light conducting body using laser radiation.

Abstract: A light coupling structure, a method of manufacturing a memory cell, and a magnetic recording head are provided. The light coupling structure includes a light coupling layer having a cavity; a waveguide having a cladding layer and a core layer; wherein the cladding layer of the waveguide is disposed in the cavity of the light coupling layer and the core layer of the waveguide is disposed over the light coupling layer and the cladding layer of the waveguide; wherein the light coupling layer is configured to receive light from a light source and couple the received light into the core layer of the waveguide.

Abstract: There is provided a pattern forming method, including: forming an organic film layer on a substrate; forming a patterned photoresist mask on the organic film layer; and performing a specific dry etching process to form a pattern on the organic layer.

Abstract: A method for providing waveguide structures for an energy assisted magnetic recording (EAMR) transducer is described. The waveguide structures have a plurality of widths. At least one waveguide layer is provided. Mask structure(s) corresponding to the waveguide structures and having a pattern are provided on the waveguide layer(s). The mask structure(s) include a planarization stop layer, a planarization assist layer on the planarization stop layer, and a hard mask layer on the planarization assist layer. The planarization assist layer has a low density. The pattern of the mask structure(s) is transferred to the waveguide layer(s). Optical material(s) that cover the waveguide layer(s) and a remaining portion of the mask structure(s) are provided. The optical material(s) have a density that is at least twice the low density of the planarization assist layer. The method also includes performing a planarization configured to remove at least a portion of the optical material(s).

Abstract: An optical element structure and a fabricating process for the same are provided. The optical element fabricating process includes providing a substrate forming thereon a protrusion; and forming an over coating layer over the protrusion and the substrate by a deposition scheme to form an optical element.

Abstract: To provide cover glass for mobile terminals exhibiting high strength in a thin plate thickness state to enable reductions in thickness of apparatuses when inserted in the apparatuses, cover glass (1) for a mobile terminal of the invention is cover glass (1) that is obtained by forming a resist pattern on main surfaces of a plate-shaped glass substrate, then etching the glass substrate with an etchant using the resist pattern as a mask, and thereby cutting the glass substrate into a desired shape and that protects a display screen of the mobile terminal, where an edge face of the cover glass (1) is formed of a molten glass surface, and as surface roughness of the edge face, arithmetic mean roughness Ra is 10 nm or less.

Abstract: The ferroelectric substrate 11 of ferroelectric crystals, while being supported by the support plate 14 which is thicker than the ferroelectric substrate 11, is integrated with the support plate 14 by letting the junction 13 mediate between one major surface S1A of the ferroelectric substrate 11 and one major surface S1B of the support plate 14, and therefore, it is possible through the flat surface polishing to perform thinning of the ferroelectric substrate 11, namely, the ferroelectric crystals, and as a result, it is possible to obtain the thin periodically poled structure. By the voltage application method, the domain inverted region is formed in the ferroelectric substrate 11 which is made thin.

Abstract: A semiconductor pointed structure formed at an end portion of the core structure of a semiconductor photonic wire waveguide has a sloped side wall on at least one of the sides that constitute the pointed structure. The semiconductor pointed structure decreases in width and thickness towards the distal end. A method for fabrication of the structure is also disclosed.

Abstract: The present disclosure provides a process for manufacturing a solar cell by selectively freeing an epitaxial layer from a single crystal substrate upon which it was grown. In some embodiments the process includes, among other things, providing a first substrate; depositing a separation layer on said first substrate; depositing on said separation layer a sequence of layers of semiconductor material forming a solar cell; mounting and bonding a flexible support on top of the sequence of layers; etching said separation layer while applying an agitating action to the etchant solution so as to remove said flexible support with said epitaxial layer from said first substrate.

Abstract: A patterned article includes a substrate support having planar substrate surface portions including a substrate material having a substrate refractive index. A patterned surface is on the substrate support including a plurality of features lateral to the planar substrate surface portions protruding above a height of the planar substrate surface portions. At least a top surface of the plurality of features include an epi-blocking layer including at least one of (i) a non-single crystal material having a refractive index lower as compared to the substrate refractive index and (ii) a reflecting metal or a metal alloy (reflecting material). The epi-blocking layer is not on the planar substrate surface portions.

Abstract: Material comprising sub-micrometer particles dispersed in a polymeric matrix. The materials are useful in article, for example, for numerous applications including display applications (e.g., liquid crystal displays (LCD), light emitting diode (LED) displays, or plasma displays); light extraction; electromagnetic interference (EMI) shielding, ophthalmic lenses; face shielding lenses or films; window films; antireflection for construction applications; and construction applications or traffic signs.

Abstract: An optical device includes a substrate and a first optical waveguide including a mesa. The mesa includes a first lower clad layer portion, a first core layer portion, and a first upper clad layer portion. The first lower clad layer portion, the first core layer portion, and the first upper clad layer portion are disposed in this order from the substrate side. The optical device also includes a first etch stop layer configured to stop etching when the first optical waveguide is formed. The first etch stop layer being laminated over the substrate. The first optical waveguide is laminated on the first etch stop layer.

Abstract: A method for producing a polarizing element includes: forming particulate materials of a metal halide on a glass substrate; forming a protective film that covers the particulate materials in a non-plasma environment; stretching the particulate materials by heating and stretching the glass substrate; and forming acicular metal particles by reducing the metal halide constituting the stretched particulate materials.

Abstract: A method and system for cleaning lithography components including contacting a substrate having residue including organic compounds and graphitic carbon deposited on a surface thereof with hydrogen peroxide vapor. The hydrogen peroxide vapor is irradiated with electromagnetic radiation having a wavelength in the range of 100 nm to 350 nm forming hydroxyl radicals. The hydroxyl radicals react with the residue to remove the residue from the surface of the substrate.

Abstract: A method of taper-etching a layer to be etched that is made of a dielectric material and has a top surface. The method includes the steps of: forming an etching mask with an opening on the top surface of the layer to be etched; and taper-etching a portion of the layer to be etched, the portion being exposed from the opening, by reactive ion etching so that a groove having two wall faces intersecting at a predetermined angle is formed in the layer to be etched. The step of taper-etching employs an etching gas containing a first gas contributing to the etching of the layer to be etched and a second gas contributing to the deposition of a sidewall protective film, and changes, during the step, the ratio of the flow rate of the second gas to the flow rate of the first gas so that the ratio increases.

Abstract: This disclosure relates to a method for manufacturing a color filter being capable of suppressing a surface of a colored pattern from being rough in a penalization treatment, a color filter and a solid-state imaging device.

Abstract: Disclosed herein are a window glass having an inlay printing part in a bezel area and a method for manufacturing the same. The window glass includes: a glass body providing a display surface in a touch screen module and having a trench intaglio-formed in an inactive area of an edge part of an inner surface thereof; the inlay printing part made of an ink displayed to a front surface of the glass body in a state in which the ink is filled in the trench; and a bezel area laminated in the inactive area in a state in which it covers the inlay printing part.

Abstract: Systems and methods may couple on-chip optical circuits to external fibers. An SOI waveguide structure may include mirror structures and tapered waveguides to optically couple optical circuits to fibers in a vertically oriented external connector. The mirror structure(s) may be angularly disposed at the ends of the silicon waveguide structure. An oxide layer may cover a buried oxide layer and the silicon waveguide structure. The tapered waveguide(s) may have a narrow end and a wide end. The narrow end of the tapered waveguide(s) may be disposed above the mirror structures. The tapered waveguide(s) may extend through the oxide layer from the narrow end in a direction perpendicular to the silicon waveguide structure. An external connector may fit over the tapered waveguide(s) and uses a fiber array traveling through a connector body to optically couple to the external fiber.

Abstract: There is provided a coloring composition including: a colorant; and a resin, wherein a content of the colorant is 50% by mass or more based on total solids of the coloring composition, and a solid acid number of a resin having a highest solid acid number among all kinds of resins contained in the coloring composition, is 80 mg KOH/g or less.

Abstract: A method of manufacturing a sub-wavelength extreme ultraviolet metal transmission grating is disclosed. In one aspect, the method comprises forming a silicon nitride self-supporting film window on a back surface of a silicon-based substrate having both surfaces polished, then spin-coating a silicon nitride film on a front surface of the substrate with an electron beam resist HSQ. Then, performing electron beam direct writing exposure on the HSQ, developing and fixing to form a plurality of grating line patterns and a ring pattern surrounding the grating line patterns. Then depositing a chrome material on the front surface of the substrate through magnetron sputtering. Then, removing the chrome material inside the ring pattern. Then, growing a gold material on the front surface of the substrate through atomic layer deposition.

Abstract: The application relates to methods of manufacture of improved optical containment structures. The invention relates to arrays of zero-mode waveguide structures comprising nanoscale apertures having non-reflective coatings on their walls. The methods provide for selectively coating the walls of the zero mode waveguides, allowing for selective functionalization of the bases.

Abstract: An optical interposer includes grooves (310) for optical fiber cables (104) coupled to a transducer (120). The grooves are formed by etching a cavity (410) in a substrate (130), filling the cavity with some layer (520), then etching the layer to form the grooves. The cavity has outwardly sloped sidewalls on which mirrors (144) are later formed. The groove etch is selective not to damage the sidewalls. The groove depth is uniform due to high etch selectivity of the layer, and also because of good control over the cavity etch due to the low aspect ratio of the cavity. Electrical circuitry for connection to the transducer is fabricated after the cavity filling but before the groove etch. The cavity filling leaves the wafer planar, facilitating fabrication of the electrical circuitry. Grooves can be provided on top and bottom of the interposer. Other features are also provided.

Abstract: In a method for manufacturing a ridge-type waveguide, a substrate is provided. An etching resistance stripe is coated on the substrate. The substrate with the etching resistance stripe is subjected to a wet etching process to form a ridge under the etching resistance stripe. The etching resistance stripe is removed. A titanium stripe is then coated onto the ridge and diffused into the ridge to form a waveguide in the ridge by a high temperature diffusing process.

Abstract: A movable substrate of a wavelength variable interference filter includes a movable portion and a groove which is provided outside of the movable portion, in a plan view when the movable substrate is seen from a substrate thickness direction, the groove includes a bottom surface having an even groove depth dimension and a side surface which is continued to the bottom surface, and the side surface is configured with arc-like first curved surface portion and second curved surface portion, in a cross-sectional view when the movable substrate is cut along the substrate thickness direction.