Etching Of Semiconductor Material To Produce An Article Having A Nonelectrical Function Patents (Class 216/2)
  • Patent number: 9786526
    Abstract: A method and an apparatus for etching microstructures and the like that provides improved selectivity to surrounding materials when etching silicon using xenon difluoride (XeF2). Etch selectivity is greatly enhanced with the addition of hydrogen to the process chamber.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: October 10, 2017
    Assignee: MEMSSTAR, LIMITED
    Inventor: Anthony O'Hara
  • Patent number: 9786489
    Abstract: A method of cleaning post-etch residues on a copper line includes providing a copper line which is divided into a first region and a second region. A dielectric layer is formed on the copper line. After that, the dielectric layer is etched to form openings in the dielectric layer. A number of openings within the first region is more than a number of openings in the second region. During the etching process, a potential difference is formed between the first region and the second region of the copper line. Finally, the dielectric layer and the copper line are cleaned by a solution with a PH value. The PH value has a special relation with the potential difference.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: October 10, 2017
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ming Sheng Xu, Ching-Long Tsai, Hua-Kuo Lee, Guangjun Huang
  • Patent number: 9764945
    Abstract: A micromechanical component and a corresponding test method for a micromechanical component are described. The micromechanical component includes at least one first region, which is elastically connected to a second region via a spring device, a resistor element, which is situated in and/or on the spring device and is at least partially interruptible in the event of damage to the spring device, and a detection device, which is electrically connected to the resistor element, for detecting an interruption in the resistor element and for generating a corresponding detection signal.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: September 19, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Sebastian Reiss, Simon Armbruster, Helmut Grutzeck, Joerg Muchow, Frederic Njikam Njimonzie, Johannes Baader, Rainer Straub, Wolfgang Heinzelmann
  • Patent number: 9766476
    Abstract: An embodiment provides a camera module comprising: a cover can which has a hollow part for exposing a lens at the upper part thereof and a fully opened surface at the lower part thereof; a base coupled to the lower part of the cover can; a housing which is disposed at the upper part of the base and moves in first and second directions which are mutually orthogonal on the surface perpendicular to an optical axis; a bobbin which is accommodated in the housing and moves in the direction of the optical axis, the bobbin comprising at least one lens; a magnet part disposed on the inner surface of the housing; a first coil pattern part disposed on the outer surface of the bobbin for moving the bobbin in the direction of the optical axis; an actuator comprising a second coil part disposed on the upper surface of the base for moving the housing accommodating the bobbin in the first and second directions; and a flexible substrate disposed between the second coil part and the base for respectively applying power to cont
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: September 19, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventor: In Jae Yeo
  • Patent number: 9753057
    Abstract: An acceleration sensor includes a fixation member, a weight member including a plate with two opposing sides parallel or substantially parallel to an X-direction and two opposing sides parallel to a Y-axis direction in a plan view, the weight member including a cutout extending in a direction about 45° relative to the X and Y axis directions, a vibrating beam linearly extending in the direction about 45° relative to the X and Y axis directions in the plan view, and one end portion is connected to the fixation member and the other end portion is connected to the weight member, the vibrating beam is partly arranged within the cutout and supporting the weight member to be displaceable in a Z-axis direction, a driver disposed on the vibrating beam and vibrating the vibrating beam, and a detector disposed on the vibrating beam and outputting a detection signal that is changed depending on deformation of the vibrating beam.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: September 5, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takuo Hada, Katsumi Fujimoto, Hideya Horiuchi, Toshimaro Yoneda
  • Patent number: 9745189
    Abstract: An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 29, 2017
    Assignee: NXP USA, Inc.
    Inventor: Aaron A. Geisberger
  • Patent number: 9735340
    Abstract: A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: August 15, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidekazu Oishibashi, Yuichiro Nagamine, Takeo Sato
  • Patent number: 9731958
    Abstract: A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: August 15, 2017
    Assignee: THALES
    Inventors: Fabien Filhol, Pierre-Olivier Lefort, Bertrand Leverrier, Régis Quer, Bernard Chaumet
  • Patent number: 9729990
    Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: August 8, 2017
    Assignee: National Tsing Hua University
    Inventors: Sun-Zen Chen, Henry J. H. Chen, Jen-Yi Chen, Kuan-Hsun Chiu, Kuang-Chien Hsieh
  • Patent number: 9696486
    Abstract: A photonic integrated circuit (PIC) is described. This PIC includes an inverse facet mirror on a silicon optical waveguide for optical proximity coupling between two silicon-on-insulator (SOI) chips placed face to face. Accurate mirror facets may be fabricated in etch pits using a silicon micro-machining technique, with wet etching of the silicon <110> facet at an angle of 45° when etched through the <100> surface. Moreover, by filling the etch pit with polycrystalline silicon or another filling material that has an index of refraction similar to silicon (such as a silicon-germanium alloy), a reflecting mirror with an accurate angle can be formed at the end of the silicon optical waveguide using: a metal coating, a dielectric coating, thermal oxidation, or selective silicon dry etching removal of one side of the etch pit to define a cavity.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: July 4, 2017
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Xuezhe Zheng, Ivan Shubin, John E. Cunningham, Ashok V. Krishnamoorthy
  • Patent number: 9696301
    Abstract: The present invention relates to a method for separating nanoparticles and analyzing a biological substance using a microfluidic chip. The microfluidic chip of the present invention is effective in more sensitively and precisely detecting an analyte. According to the present invention, the use of the microfluidic chip enables the separation of nanoparticles through separation holes on the basis of size, achieving highly reliable analysis of a biological substance. In conclusion, the microfluidic chip of the present invention uses separation holes adapted to the size of nanoparticles to greatly increase the reliability of analysis of a biological substance, which will contribute to a marked improvement in the reliability of analysis based on microfluidics and a microfluidic system.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: July 4, 2017
    Assignee: Seoul National University R&DB Foundation
    Inventors: Yong-Kweon Kim, Yoon-Sik Lee, Yul Koh, Homan Kang
  • Patent number: 9682539
    Abstract: A method for bonding a first substrate to a second substrate including the steps of: making contact of a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, as a result of which a common contact area is formed; and producing a bond interconnection between the first substrate and the second substrate outside the common contact area. The invention also relates to a corresponding device and a substrate composite of a first substrate and a second substrate, in which a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, forms a common contact area, outside the common contact area there being a bond interconnection between the first substrate and the second substrate.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: June 20, 2017
    Inventor: Erich Thallner
  • Patent number: 9678273
    Abstract: A device for propagating light is described, comprising: a substrate having a semiconductor material, an insulating layer, wherein the insulating layer is arranged on the substrate, a recess reaching through the insulating layer and into the substrate, wherein the recess is at least partially filled with a filler material, and a waveguide arranged in or on the filler material.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: June 13, 2017
    Assignee: International Business Machines Corporation
    Inventors: Jens Hofrichter, Daniel S. Jubin, Edward W. Kiewra, Antonio La Porta
  • Patent number: 9664827
    Abstract: The invention is directed to a colored composition for forming a green color filter, containing a color pigment, wherein a content of the color pigment to a total solid content of the colored composition is 60% by weight or more, and a layer having a thickness of 0.6 ?m formed from the colored composition has light transmittance of 80% or more at a wavelength of 550 nm and light transmittance of 50% or less at a wavelength of 450 nm, and a method of producing a color filter including (A) forming a first colored layer containing a first colored composition and (B) patterning with dry etching so as to from a through-hole group in the first colored layer, wherein the first colored composition is the colored composition as defined herein.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: May 30, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Naotsugu Muro, Yasuo Sugishima, Kaoru Aoyagi, Mitsuji Yoshibayashi
  • Patent number: 9663348
    Abstract: An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: May 30, 2017
    Assignee: NXP USA, Inc.
    Inventor: Aaron A. Geisberger
  • Patent number: 9646803
    Abstract: A method of making a Transmission Electron Microscopy support comprising depositing a sacrificial layer to the top side of a lacey or holey carbon structure or support or wire mesh, depositing an Atomic Layer Deposition layer to the bottom side of the sacrificial layer, removing the sacrificial layer, forming a Transmission Electron Microscopy support. The Transmission Electron Microscopy support comprises an Atomic Layer Deposition layer which is carbon-less, thin, flexible, can be thermally cleaned, can be plasma cleaned, and contains chemical functionalities to immobilize particles.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: May 9, 2017
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventor: David A. Kidwell
  • Patent number: 9640398
    Abstract: A method of forming an integrated circuit includes forming a patterned mask layer on a material layer, wherein the patterned mask layer has a plurality of first features, and a first distance between adjacent first features of the plurality of first features. The method further includes patterning the material layer to form the first features in the material layer. The method further includes increasing the first distance between adjacent first features of the plurality of first features to a second distance. The method further includes treating portions of the material layer exposed by the patterned mask layer. The method further includes removing the patterned mask layer; and removing non-treated portions of the material layer.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: May 2, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Yen Hsieh, Ming-Ching Chang, Chun-Hung Lee, Yih-Ann Lin, De-Fang Chen, Chao-Cheng Chen
  • Patent number: 9632414
    Abstract: A coating liquid to be applied to resist pattern, which can be used in place of the conventional rinsing liquid. A coating liquid to be applied to a resist pattern having a polymer having a structural unit of the following Formula (1) and a structural unit of the following Formula (2), and a weight average molecular weight of 500 to 3,500, and a solvent containing water as a main component (where R1 is a C1-8 organic group).
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: April 25, 2017
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Yasushi Sakaida, Rikimaru Sakamoto, Shuhei Shigaki
  • Patent number: 9627262
    Abstract: A method of semiconductor device fabrication including forming a mandrel on a semiconductor substrate is provided. The method continues to include oxidizing a region the mandrel to form an oxidized region, wherein the oxidized region abuts a sidewall of the mandrel. The mandrel is then removed from the semiconductor substrate. After removing the mandrel, the oxidized region is used to pattern an underlying layer formed on the semiconductor substrate.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: April 18, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chao Chiu, Chen-Yu Chen, Chih-Ming Lai, Ming-Feng Shieh, Nian-Fuh Cheng, Ru-Gun Liu, Wen-Chun Huang
  • Patent number: 9618768
    Abstract: A lens driving device is proposed, including a cover can whose upper side surface includes an opening formed to expose a lens and whose side surface extends from the upper side surface to a base, a base that is secured to the cover can; a housing that is arranged on top of the base and moves in first and second directions that are perpendicular to an optical axis, a bobbin that is housed in the housing and moves in an optical axis direction, an actuator that includes a magnet unit arranged in the housing, a first coil unit arranged in an outer side surface of the bobbin, and a second coil unit that is arranged on top of the base, and a substrate that is disposed between the second coil unit and the base so as to control the first coil unit and the second coil unit.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: April 11, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventor: In Jae Yeo
  • Patent number: 9601567
    Abstract: A semiconductor device includes first and second FETs including first and second channel regions, respectively. The first and second FETs include first and second gate structures, respectively. The first and second gate structures include first and second gate dielectric layers formed over the first and second channel regions and first and second gate electrode layers formed over the first and second gate dielectric layers. The first and second gate structures are aligned along a first direction. The first gate structure and the second gate structure are separated by a separation plug made of an insulating material. The first gate electrode layer is in contact with a side wall of the separation plug.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: March 21, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Chih-Hung Hsieh
  • Patent number: 9590001
    Abstract: A method of protecting a CMOS device within an integrated photonic semiconductor structure is provided. The method may include depositing a conformal layer of germanium over the CMOS device and an adjacent area to the CMOS device, depositing a conformal layer of dielectric hardmask over the germanium, and forming, using a mask level, a patterned layer of photoresist for covering the CMOS device and a photonic device formation region within the adjacent area. Openings are etched into areas of the deposited layer of silicon nitride not covered by the patterned photoresist, such that the areas are adjacent to the photonic device formation region. The germanium material is then etched from the conformal layer of germanium at a location underlying the etched openings for forming the photonic device at the photonic device formation region. The conformal layer of germanium deposited over the CMOS device protects the CMOS device.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: March 7, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Solomon Assefa, Marwan H. Khater, Edward W. Kiewra, Carol Reinholm, Steven M. Shank
  • Patent number: 9586207
    Abstract: A method for capillary self-assembly of a plate and a carrier, including: forming an etching mask on a region of a substrate; reactive-ion etching the substrate, the etching using a series of cycles each including isotropic etching followed by surface passivation, wherein a duration of the isotropic etching for each cycle increases from one cycle to another, a ratio between durations of the passivation and etching of each cycle is lower than a ratio for carrying out a vertical anisotropic etching to form a carrier having an upper surface defined by the region and side walls defining an acute angle with the upper surface; removing the etching mask; placing a droplet on the upper surface of the carrier; and placing the plate on the droplet.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: March 7, 2017
    Assignees: Commissariat à l'énergie atomique et aux énergies alternatives, STMicroelectronics (Crolles 2) SAS
    Inventors: Sebastien Mermoz, Lea Di Cioccio, Thomas Magis, Loic Sanchez
  • Patent number: 9568845
    Abstract: A mirror including a substrate and a reflective coating that includes a first group of layers and a second group of layers arranged between the substrate and the first group of layers. Both the first and second groups of layers include a plurality of alternating first material layers and second material layers, arranged one above another. The refractive index of the first material for radiation in the range of 5-30 nm is greater than the refractive index of the second material in that wavelength range. The first group of layers is configured to have a number of layers that is greater than 20, such that, upon irradiation with radiation having a wavelength in the range of 5-30 nm, less than 20% of the radiation reaches the second group of layers, which has a layer thickness variation for correcting the surface form of the mirror.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: February 14, 2017
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Martin Rocktaeschel, Hartmut Enkisch, Franz-Josef Stickel, Oliver Natt, Hans-Juergen Mann, Sascha Migura
  • Patent number: 9524470
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: December 20, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Patent number: 9511367
    Abstract: A device comprising a channel comprising at least one surface wherein the surface comprises a fluid-impervious base surface covered by a coating beginning at a proximal location and ending at a distal location along the at least one surface of the channel, the coating forming a surface energy gradient from the proximal location to the distal location on the surface, wherein the coating comprises a species having a functional group M1 and a species having a functional group M2 where M1 and M2 have different surface energies, wherein the functional group M2 comprises an amide or amine group, and the concentration of the species comprising functional group M2 in the coating increases relative to the concentration of the species comprising functional group M1 from the proximal location to the distal location on the surface.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: December 6, 2016
    Inventor: Brian David Babcock
  • Patent number: 9478436
    Abstract: A method for forming patterns includes forming ellipse pillars on an underlying layer. The ellipse pillar has an elongated feature and includes nose sides and long sides connecting the nose sides, and the four ellipse pillars form a diamond array around a separation space. A guide lattice attached to sides of the ellipse pillars is formed to open first windows in the separation space. Second windows are formed in the guide lattice by selectively removing the ellipse pillars. A block copolymer layer is formed to fill the first and second windows. The block copolymer layer is phase-separated to form a first domain and a first matrix in the first window and to form a plurality of second domains and second matrix in the second window. The first and second domains are selectively removed to form first openings and second openings.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: October 25, 2016
    Assignee: SK Hynix Inc.
    Inventors: Keun Do Ban, Young Sik Kim, Cheol Kyu Bok
  • Patent number: 9463615
    Abstract: A method of producing a high quality image on a blanket, including providing an image, a first piece of material having a substantially zero-nap upper surface configured to receive the image thereon, and a lower coupling surface. The method may include providing a second piece of material different than the first piece of material, the second piece of material having an upper coupling surface including a non-zero nap and a lower surface of a soft material. The method may include coupling the lower coupling surface of the first piece of material to the upper coupling surface of the second piece of material to form a single unit, while leaving the soft material of the second piece of material substantially exposed to an outside ambient environment, and incorporating the image within the substantially zero-nap upper surface of the first piece of material using a printing process.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: October 11, 2016
    Inventor: Kyle Thomas Turner
  • Patent number: 9443712
    Abstract: A method for cleaning a substrate includes supplying a treatment solution which includes a volatile component onto the front surface of a substrate, solidifying or curing the treatment solution through vaporization of the volatile component of the treatment solution such that a treatment film is formed on the entire portion of the front surface of the substrate, treating a different surface of the substrate while the entire portion of the front surface of the substrate is covered with the treatment film, and supplying to the substrate a removal solution which removes the treatment film in the amount sufficient such that the treatment film covering the entire portion of the front surface of the substrate is removed substantially in entirety after the treating of the different surface of the substrate is finished.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: September 13, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Miyako Kaneko, Takehiko Orii, Itaru Kanno
  • Patent number: 9431315
    Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: August 30, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee
  • Patent number: 9421772
    Abstract: A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 23, 2016
    Assignee: XEROX CORPORATION
    Inventors: Peter J. Nystrom, Gary D. Redding, Mark A. Cellura
  • Patent number: 9412681
    Abstract: The invention relates to an interposer device comprising a doped silicon substrate (1) having an epitaxial layer (24) on a first side and two through vias (11, 12) extending from the first side to a second side opposite to the first side of the doped silicon substrate. Each through via comprises a volume of doped silicon substrate delimited by a surrounding trench (7) extending from the first to the second side of the doped silicon substrate such that said surrounding trench is arranged so as to electrically isolate the doped silicon substrate surrounded by said trench. First and second conductive layers (121, 122) are laid respectively on first and second sides of the first through via so as to be electrically connected together and third and fourth conductive layers (112, 11) are laid respectively on surfaces of the second through via so as to be electrically connected together.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: August 9, 2016
    Assignee: IPDIA
    Inventors: Jean-René Tenailleau, Gilles Ferru
  • Patent number: 9393564
    Abstract: The present invention relates to portable systems and devices, and corresponding methods, for detecting bioagents. In particular, the present invention provides systems, devices, and methods that utilize one or more of a sample preparation component, sample analysis component employing broad range primers, and sample detection component.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: July 19, 2016
    Assignee: IBIS BIOSCIENCES, INC.
    Inventors: David J. Ecker, Steven A. Hofstadler, Rangarajan Sampath, Lawrence B. Blyn, Thomas A. Hall, Mark W. Eshoo
  • Patent number: 9373503
    Abstract: A method of forming a free-standing silicon film that includes providing a Si substrate, depositing a layered structure on the Si substrate, where the layered structure includes a Si device layer and a SiGe sacrificial layer, and removing the SiGe sacrificial layer with a spin etch process, where the Si device layer is released from the layered structure.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: June 21, 2016
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Andrei T. Iancu, Friedrich B. Prinz
  • Patent number: 9340415
    Abstract: A MEMS device is formed with facing surfaces of a contoured substrate and a layer of material having complementary contours. In one fabrication approach, a first photoresist layer is formed over a substrate. Selected regions of the first photoresist layer are exposed using a patterning mask. The exposed regions of the first photoresist layer are thermally shrunk to pattern the first photoresist layer with a contour. A layer of material is formed over the contoured first photoresist layer.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: May 17, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: James C. Baker, Patrick I. Oden, Robert S. Black
  • Patent number: 9305907
    Abstract: An optoelectronic integrated device includes a body made of semiconductor material, which is delimited by a front surface and includes a substrate having a first type of conductivity, an epitaxial region, which has the first type of conductivity and forms the front surface, and a ring region having a second type of conductivity, which extends into the epitaxial region from the front surface, and delimiting an internal region. The optoelectronic integrated device moreover includes a MOSFET including at least one body region having the second type of conductivity, which contacts the ring region and extends at least in part into the internal region from the front surface. A photodetector includes a photodetector region having the second type of conductivity, and extends into the semiconductor body starting from the front surface, contacting the ring region.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: April 5, 2016
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Luigi Arcuri, MariaEloisa Castagna
  • Patent number: 9257247
    Abstract: A motion-sensitive low-G MEMS acceleration switch, which is a MEMS switch that closes at low-g acceleration (e.g., sensitive to no more than 10 Gs), is proposed. Specifically, the low-G MEMS acceleration switch has a base, a sensor wafer with one or more proofmasses, an open circuit that includes two fixed electrodes, and a contact plate. During acceleration, one or more of the proofmasses move towards the base and connects the two fixed electrodes together, resulting in a closing of the circuit that detects the acceleration. Sensitivity to low-G acceleration is achieved by proper dimensioning of the proofmasses and one or more springs used to support the proofmasses in the switch.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: February 9, 2016
    Assignee: Meggitt (Orange County), Inc.
    Inventor: Tom Kwa
  • Patent number: 9252321
    Abstract: Technologies are generally described for manufacturing an optical device by attaching a light-emitting element to an optical element through a resin. In various examples, a method is described, where a substrate is provided to have a through-hole at a position in the substrate where an optical element is to be mounted. A resin in liquid state may be injected into the through-hole in the substrate. Further, an optical element having a light-emitting portion may be mounted on the substrate such that a center of the tight-emitting portion is self-aligned with a center of the through-hole due to a surface tension of the resin in liquid state. The resin may be cured such that the optical element is fixed to the substrate.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: February 2, 2016
    Assignee: Empire Technology Development LLC
    Inventor: Hiroshi Goto
  • Patent number: 9224916
    Abstract: According to an embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer, a dielectric film and an electrode. The first semiconductor layer is capable of emitting light. The second semiconductor layer has a first major surface in contact with the first semiconductor layer and a second major surface opposite to the first major surface, the second major surface including a first region having convex structures and a second region not having the convex structures. The dielectric film is provided at least at a tip portion of the convex structures, and the electrode is provided above the second region.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: December 29, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hironori Yamasaki, Yukie Nishikawa
  • Patent number: 9212940
    Abstract: A vacuum-cavity-insulated flow sensor and related fabrication method are described. The sensor comprises a porous silicon wall with numerous vacuum-pores which is created in a silicon substrate, a porous silicon membrane with numerous vacuum-pores which is surrounded and supported by the porous silicon wall, and a cavity with a vacuum-space which is disposed beneath the porous silicon membrane and surrounded by the porous silicon wall. The fabrication method includes porous silicon formation and silicon polishing in HF solution.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: December 15, 2015
    Inventor: Xiang Zheng Tu
  • Patent number: 9206030
    Abstract: A MEMS capacitive pressure sensor is provided. The MEMS capacitive pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate. The capacitive pressure sensor also includes a second dielectric layer having a step surface profile formed on the first dielectric layer, and a first electrode layer having a step surface profile formed on the second dielectric layer. Further, the MEMS capacitive pressure sensor includes an insulation layer formed on the first electrode layer, and a second electrode layer having a step surface profile with a portion formed on the insulation layer in the peripheral region and the rest suspended over the first electrode layer in the device region. Further, the MEMS capacitive pressure sensor also includes a chamber having a step surface profile formed between the first electrode layer and the second electrode layer.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: December 8, 2015
    Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventor: Zhongshan Hong
  • Patent number: 9201239
    Abstract: A two-dimensional electrostatic scanner with distributed springs is disclosed. The two-dimensional electrostatic scanner comprises a frame, a mirror, one or more first-directional comb drives, two or more second-directional comb drives, four or more first-directional springs, and two or more second-directional springs. The four or more first-directional springs may connect to different electrical voltage source or electrical ground.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: December 1, 2015
    Assignee: ADVANCED NUMICRO SYSTEMS, INC.
    Inventor: Yee-Chung Fu
  • Patent number: 9203134
    Abstract: A micromechanical resonator is disclosed. The resonator includes a resonant micromechanical element. A film of annealable material can be deposited on a facial surface of the element. The resonance of the element can be tuned by annealing the deposited film. Also disclosed are methods of applying a film on a resonator and annealing the film, thereby tuning one or more resonant properties of the resonator.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: December 1, 2015
    Assignee: Sandia Corporation
    Inventors: Michael David Henry, Roy H. Olsson, Karl Douglas Greth, Travis Ryan Young, Janet Nguyen, James E. Stevens
  • Patent number: 9175389
    Abstract: Systems and apparatus are described that facilitate the evaluation and characterization of ALD processes as a function of process parameters such as temperature, gas flow rate, and pressure. In some embodiments, systems and apparatus are described that allow the ALD process to be characterized at different pressures in a combinatorial manner.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: November 3, 2015
    Assignee: Intermolecular, Inc.
    Inventor: Jeremy Cheng
  • Patent number: 9156685
    Abstract: The present disclosure is directed to a device and its method of manufacture in which a protective region is formed below a suspended body. The protective region allows deep reactive ion etching of a bulk silicon body to form a MEMS device without encountering the various problems presented by damage to the silicon caused by backscattering of oxide during over etching periods of DRIE processes.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: October 13, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Hau Wu, Kuei-Sung Chang
  • Patent number: 9154886
    Abstract: A capacitive transducer and manufacturing method thereof is provided. A multifunction device including a plurality of the capacitive transducers is also provided, where the capacitive transducers are disposed on a substrate and include at least one microphone and at least one pressure sensor or ultrasonic device.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: October 6, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Jien-Ming Chen, Chin-Wen Huang, Chin-Hung Wang, Hsin-Li Lee
  • Patent number: 9142586
    Abstract: A semiconductor image sensor device includes first and second semiconductor substrates. A pixel array and a control circuit are formed in a first surface of the first substrate. An interconnect layer is formed over the first surface of the first substrate and electrically connects the control circuit to the pixel array. A top conducting layer is formed over the interconnect layer to have electrical connectivity with at least one of the control circuit or the pixel array via the interconnect layer. A surface of a second substrate is bonded to the top conducting layer. A conductive through-silicon-via (TSV) passes through the second substrate, and has electrical connectivity with the top conducting layer. A terminal is formed on an opposite surface of the second substrate, and electrically connected to the TSV.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: September 22, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin
  • Patent number: 9136303
    Abstract: A method of protecting a CMOS device within an integrated photonic semiconductor structure is provided. The method may include depositing a conformal layer of germanium over the CMOS device and an adjacent area to the CMOS device, depositing a conformal layer of dielectric hardmask over the germanium, and forming, using a mask level, a patterned layer of photoresist for covering the CMOS device and a photonic device formation region within the adjacent area. Openings are etched into areas of the deposited layer of silicon nitride not covered by the patterned photoresist, such that the areas are adjacent to the photonic device formation region. The germanium material is then etched from the conformal layer of germanium at a location underlying the etched openings for forming the photonic device at the photonic device formation region. The conformal layer of germanium deposited over the CMOS device protects the CMOS device.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: September 15, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Solomon Assefa, Marwan H. Khater, Edward W. Kiewra, Carol Reinholm, Steven M. Shank
  • Patent number: 9110237
    Abstract: A method of manufacturing an optical waveguide is provided which enables a recognition device such as a CCD camera to easily recognize an alignment mark for positioning a mold for over cladding layer formation. The method includes the steps of: forming protruding cores and a protruding alignment mark on an upper surface of an under cladding layer on a substrate by a photolithographic method; and forming the over cladding layer by use of the mold positioned using the alignment mark as a guide. For the formation of the alignment mark, a photomask is used which has an opening pattern for alignment mark formation including an opening, and a light transmission amount reduction region provided around the opening and having an aperture ratio within a range greater than 10% and less than 80%. The alignment mark is formed to have a peripheral side surface in the form of an inclined surface.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: August 18, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoki Shibata, Ryusuke Naito, Toru Mizutani
  • Patent number: 9103336
    Abstract: A micropump device including a first wafer and a second wafer attached to the first wafer. The first and second wafers are configured to define a chamber therebetween having a predetermined volume. A third wafer is attached to the second wafer to define an inlet section and an outlet section in fluid communication with the chamber. At least one of the second and third wafers are formed to define a moveable diaphragm configured to change the predetermined volume of the chamber for pumping a fluid between the inlet section and the outlet section.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: August 11, 2015
    Assignee: Wayne State University
    Inventors: Jianke Kang, Gregory W. Auner