Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

Abstract: Apparatus and method for the amplification of a laser beam by pumping a homogenous composite source beam through an amplification medium. A slab crystalline active medium is side-pumped via a pump module having a laser diode bar and an optical assembly. The optical assembly has a fast axis collimator and a lens in the fast axis and an array of slow axis collimators and the lens in the slow axis. The lenses are spaced so that the individual source beams from the emitters are: imaged upon a first facet of the amplification medium; have a beam waist at or near the first facet; are sized to fill the first facet; substantially overlap on the first facet; and are directed so that peripheral source beams undergo total internal reflection on entering the amplification medium. Embodiments of multiple laser diode bars and optical assemblies are described together with double side pumping arrangements.

Abstract: A method for making a conductive film includes the steps of: depositing a conductive metal film on a substrate to form a metal-coated substrate; depositing a fiber pattern on the conductive metal film of the metal-coated substrate to form a masked substrate, the fiber pattern defining protected metal and exposed metal of the conductive metal film; removing the exposed metal from the conductive metal film of the masked substrate to form a protected conductive film; and removing the fiber pattern from the protected conductive film to expose the protected metal and provide a metal pattern on the substrate. An annealing step con be employed after depositing the fiber pattern to increase the surface area of contact between the fiber pattern and the conductive metal film.

Abstract: A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or micro-electromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.

Abstract: Liquid crystal molecules have a pretilt angle to the left-and-right direction in a plane perpendicular to the up-and-down direction, so that an end part of a first side as one side of a left side and a right side of the liquid crystal molecules is set closer to a backlight than an end part of a second side as the other side. Second edge parts of a black matrix adjacent to an upper side and a lower side of an opening have a straight line shape extending by inclination to mutually the same side in the left-and-right direction, so that an end part of the same side as a first side as one side of the left side and the right side of the second edge parts is positioned above the end part of the same side as the second side as the other side.

Abstract: An identifier made using a silicon film. The silicon film has a varying optical index of refraction. The varying optical index of refraction reflects one or more spectral peaks when illuminated with light. The one or more spectral peaks includes a reference peak. The silicon film is fragmented and then oxidized.

Abstract: Methods and apparatus to form biocompatible energization elements are described. In some examples, the methods and apparatus to form the biocompatible energization elements involve forming pellets comprising active cathode chemistry. The active elements of the cathode and anode are sealed with a biocompatible material. In some examples, a field of use for the methods and apparatus may include any biocompatible device or product that requires energization elements.

Abstract: A method of cleaning post-etch residues on a copper line includes providing a copper line which is divided into a first region and a second region. A dielectric layer is formed on the copper line. After that, the dielectric layer is etched to form openings in the dielectric layer. A number of openings within the first region is more than a number of openings in the second region. During the etching process, a potential difference is formed between the first region and the second region of the copper line. Finally, the dielectric layer and the copper line are cleaned by a solution with a PH value. The PH value has a special relation with the potential difference.

Abstract: A method and an apparatus for etching microstructures and the like that provides improved selectivity to surrounding materials when etching silicon using xenon difluoride (XeF2). Etch selectivity is greatly enhanced with the addition of hydrogen to the process chamber.

Abstract: An embodiment provides a camera module comprising: a cover can which has a hollow part for exposing a lens at the upper part thereof and a fully opened surface at the lower part thereof; a base coupled to the lower part of the cover can; a housing which is disposed at the upper part of the base and moves in first and second directions which are mutually orthogonal on the surface perpendicular to an optical axis; a bobbin which is accommodated in the housing and moves in the direction of the optical axis, the bobbin comprising at least one lens; a magnet part disposed on the inner surface of the housing; a first coil pattern part disposed on the outer surface of the bobbin for moving the bobbin in the direction of the optical axis; an actuator comprising a second coil part disposed on the upper surface of the base for moving the housing accommodating the bobbin in the first and second directions; and a flexible substrate disposed between the second coil part and the base for respectively applying power to cont

Abstract: A micromechanical component and a corresponding test method for a micromechanical component are described. The micromechanical component includes at least one first region, which is elastically connected to a second region via a spring device, a resistor element, which is situated in and/or on the spring device and is at least partially interruptible in the event of damage to the spring device, and a detection device, which is electrically connected to the resistor element, for detecting an interruption in the resistor element and for generating a corresponding detection signal.

Abstract: An acceleration sensor includes a fixation member, a weight member including a plate with two opposing sides parallel or substantially parallel to an X-direction and two opposing sides parallel to a Y-axis direction in a plan view, the weight member including a cutout extending in a direction about 45° relative to the X and Y axis directions, a vibrating beam linearly extending in the direction about 45° relative to the X and Y axis directions in the plan view, and one end portion is connected to the fixation member and the other end portion is connected to the weight member, the vibrating beam is partly arranged within the cutout and supporting the weight member to be displaceable in a Z-axis direction, a driver disposed on the vibrating beam and vibrating the vibrating beam, and a detector disposed on the vibrating beam and outputting a detection signal that is changed depending on deformation of the vibrating beam.

Abstract: An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.

Abstract: A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

Abstract: A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: The present invention relates to a method for separating nanoparticles and analyzing a biological substance using a microfluidic chip. The microfluidic chip of the present invention is effective in more sensitively and precisely detecting an analyte. According to the present invention, the use of the microfluidic chip enables the separation of nanoparticles through separation holes on the basis of size, achieving highly reliable analysis of a biological substance. In conclusion, the microfluidic chip of the present invention uses separation holes adapted to the size of nanoparticles to greatly increase the reliability of analysis of a biological substance, which will contribute to a marked improvement in the reliability of analysis based on microfluidics and a microfluidic system.

Abstract: A photonic integrated circuit (PIC) is described. This PIC includes an inverse facet mirror on a silicon optical waveguide for optical proximity coupling between two silicon-on-insulator (SOI) chips placed face to face. Accurate mirror facets may be fabricated in etch pits using a silicon micro-machining technique, with wet etching of the silicon <110> facet at an angle of 45° when etched through the <100> surface. Moreover, by filling the etch pit with polycrystalline silicon or another filling material that has an index of refraction similar to silicon (such as a silicon-germanium alloy), a reflecting mirror with an accurate angle can be formed at the end of the silicon optical waveguide using: a metal coating, a dielectric coating, thermal oxidation, or selective silicon dry etching removal of one side of the etch pit to define a cavity.

Abstract: A method for bonding a first substrate to a second substrate including the steps of: making contact of a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, as a result of which a common contact area is formed; and producing a bond interconnection between the first substrate and the second substrate outside the common contact area. The invention also relates to a corresponding device and a substrate composite of a first substrate and a second substrate, in which a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, forms a common contact area, outside the common contact area there being a bond interconnection between the first substrate and the second substrate.

Abstract: A device for propagating light is described, comprising: a substrate having a semiconductor material, an insulating layer, wherein the insulating layer is arranged on the substrate, a recess reaching through the insulating layer and into the substrate, wherein the recess is at least partially filled with a filler material, and a waveguide arranged in or on the filler material.

Abstract: The invention is directed to a colored composition for forming a green color filter, containing a color pigment, wherein a content of the color pigment to a total solid content of the colored composition is 60% by weight or more, and a layer having a thickness of 0.6 ?m formed from the colored composition has light transmittance of 80% or more at a wavelength of 550 nm and light transmittance of 50% or less at a wavelength of 450 nm, and a method of producing a color filter including (A) forming a first colored layer containing a first colored composition and (B) patterning with dry etching so as to from a through-hole group in the first colored layer, wherein the first colored composition is the colored composition as defined herein.

Abstract: An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.

Abstract: A method of making a Transmission Electron Microscopy support comprising depositing a sacrificial layer to the top side of a lacey or holey carbon structure or support or wire mesh, depositing an Atomic Layer Deposition layer to the bottom side of the sacrificial layer, removing the sacrificial layer, forming a Transmission Electron Microscopy support. The Transmission Electron Microscopy support comprises an Atomic Layer Deposition layer which is carbon-less, thin, flexible, can be thermally cleaned, can be plasma cleaned, and contains chemical functionalities to immobilize particles.

Abstract: A method of forming an integrated circuit includes forming a patterned mask layer on a material layer, wherein the patterned mask layer has a plurality of first features, and a first distance between adjacent first features of the plurality of first features. The method further includes patterning the material layer to form the first features in the material layer. The method further includes increasing the first distance between adjacent first features of the plurality of first features to a second distance. The method further includes treating portions of the material layer exposed by the patterned mask layer. The method further includes removing the patterned mask layer; and removing non-treated portions of the material layer.

Abstract: A coating liquid to be applied to resist pattern, which can be used in place of the conventional rinsing liquid. A coating liquid to be applied to a resist pattern having a polymer having a structural unit of the following Formula (1) and a structural unit of the following Formula (2), and a weight average molecular weight of 500 to 3,500, and a solvent containing water as a main component (where R1 is a C1-8 organic group).

Abstract: A method of semiconductor device fabrication including forming a mandrel on a semiconductor substrate is provided. The method continues to include oxidizing a region the mandrel to form an oxidized region, wherein the oxidized region abuts a sidewall of the mandrel. The mandrel is then removed from the semiconductor substrate. After removing the mandrel, the oxidized region is used to pattern an underlying layer formed on the semiconductor substrate.

Abstract: A lens driving device is proposed, including a cover can whose upper side surface includes an opening formed to expose a lens and whose side surface extends from the upper side surface to a base, a base that is secured to the cover can; a housing that is arranged on top of the base and moves in first and second directions that are perpendicular to an optical axis, a bobbin that is housed in the housing and moves in an optical axis direction, an actuator that includes a magnet unit arranged in the housing, a first coil unit arranged in an outer side surface of the bobbin, and a second coil unit that is arranged on top of the base, and a substrate that is disposed between the second coil unit and the base so as to control the first coil unit and the second coil unit.

Abstract: A semiconductor device includes first and second FETs including first and second channel regions, respectively. The first and second FETs include first and second gate structures, respectively. The first and second gate structures include first and second gate dielectric layers formed over the first and second channel regions and first and second gate electrode layers formed over the first and second gate dielectric layers. The first and second gate structures are aligned along a first direction. The first gate structure and the second gate structure are separated by a separation plug made of an insulating material. The first gate electrode layer is in contact with a side wall of the separation plug.

Abstract: A method of protecting a CMOS device within an integrated photonic semiconductor structure is provided. The method may include depositing a conformal layer of germanium over the CMOS device and an adjacent area to the CMOS device, depositing a conformal layer of dielectric hardmask over the germanium, and forming, using a mask level, a patterned layer of photoresist for covering the CMOS device and a photonic device formation region within the adjacent area. Openings are etched into areas of the deposited layer of silicon nitride not covered by the patterned photoresist, such that the areas are adjacent to the photonic device formation region. The germanium material is then etched from the conformal layer of germanium at a location underlying the etched openings for forming the photonic device at the photonic device formation region. The conformal layer of germanium deposited over the CMOS device protects the CMOS device.

Abstract: A method for capillary self-assembly of a plate and a carrier, including: forming an etching mask on a region of a substrate; reactive-ion etching the substrate, the etching using a series of cycles each including isotropic etching followed by surface passivation, wherein a duration of the isotropic etching for each cycle increases from one cycle to another, a ratio between durations of the passivation and etching of each cycle is lower than a ratio for carrying out a vertical anisotropic etching to form a carrier having an upper surface defined by the region and side walls defining an acute angle with the upper surface; removing the etching mask; placing a droplet on the upper surface of the carrier; and placing the plate on the droplet.

Abstract: A mirror including a substrate and a reflective coating that includes a first group of layers and a second group of layers arranged between the substrate and the first group of layers. Both the first and second groups of layers include a plurality of alternating first material layers and second material layers, arranged one above another. The refractive index of the first material for radiation in the range of 5-30 nm is greater than the refractive index of the second material in that wavelength range. The first group of layers is configured to have a number of layers that is greater than 20, such that, upon irradiation with radiation having a wavelength in the range of 5-30 nm, less than 20% of the radiation reaches the second group of layers, which has a layer thickness variation for correcting the surface form of the mirror.

Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.

Abstract: A device comprising a channel comprising at least one surface wherein the surface comprises a fluid-impervious base surface covered by a coating beginning at a proximal location and ending at a distal location along the at least one surface of the channel, the coating forming a surface energy gradient from the proximal location to the distal location on the surface, wherein the coating comprises a species having a functional group M1 and a species having a functional group M2 where M1 and M2 have different surface energies, wherein the functional group M2 comprises an amide or amine group, and the concentration of the species comprising functional group M2 in the coating increases relative to the concentration of the species comprising functional group M1 from the proximal location to the distal location on the surface.

Abstract: A method for forming patterns includes forming ellipse pillars on an underlying layer. The ellipse pillar has an elongated feature and includes nose sides and long sides connecting the nose sides, and the four ellipse pillars form a diamond array around a separation space. A guide lattice attached to sides of the ellipse pillars is formed to open first windows in the separation space. Second windows are formed in the guide lattice by selectively removing the ellipse pillars. A block copolymer layer is formed to fill the first and second windows. The block copolymer layer is phase-separated to form a first domain and a first matrix in the first window and to form a plurality of second domains and second matrix in the second window. The first and second domains are selectively removed to form first openings and second openings.

Abstract: A method of producing a high quality image on a blanket, including providing an image, a first piece of material having a substantially zero-nap upper surface configured to receive the image thereon, and a lower coupling surface. The method may include providing a second piece of material different than the first piece of material, the second piece of material having an upper coupling surface including a non-zero nap and a lower surface of a soft material. The method may include coupling the lower coupling surface of the first piece of material to the upper coupling surface of the second piece of material to form a single unit, while leaving the soft material of the second piece of material substantially exposed to an outside ambient environment, and incorporating the image within the substantially zero-nap upper surface of the first piece of material using a printing process.

Abstract: A method for cleaning a substrate includes supplying a treatment solution which includes a volatile component onto the front surface of a substrate, solidifying or curing the treatment solution through vaporization of the volatile component of the treatment solution such that a treatment film is formed on the entire portion of the front surface of the substrate, treating a different surface of the substrate while the entire portion of the front surface of the substrate is covered with the treatment film, and supplying to the substrate a removal solution which removes the treatment film in the amount sufficient such that the treatment film covering the entire portion of the front surface of the substrate is removed substantially in entirety after the treating of the different surface of the substrate is finished.

Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.

Abstract: A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.

Abstract: The invention relates to an interposer device comprising a doped silicon substrate (1) having an epitaxial layer (24) on a first side and two through vias (11, 12) extending from the first side to a second side opposite to the first side of the doped silicon substrate. Each through via comprises a volume of doped silicon substrate delimited by a surrounding trench (7) extending from the first to the second side of the doped silicon substrate such that said surrounding trench is arranged so as to electrically isolate the doped silicon substrate surrounded by said trench. First and second conductive layers (121, 122) are laid respectively on first and second sides of the first through via so as to be electrically connected together and third and fourth conductive layers (112, 11) are laid respectively on surfaces of the second through via so as to be electrically connected together.

Abstract: The present invention relates to portable systems and devices, and corresponding methods, for detecting bioagents. In particular, the present invention provides systems, devices, and methods that utilize one or more of a sample preparation component, sample analysis component employing broad range primers, and sample detection component.

Abstract: A method of forming a free-standing silicon film that includes providing a Si substrate, depositing a layered structure on the Si substrate, where the layered structure includes a Si device layer and a SiGe sacrificial layer, and removing the SiGe sacrificial layer with a spin etch process, where the Si device layer is released from the layered structure.

Abstract: A MEMS device is formed with facing surfaces of a contoured substrate and a layer of material having complementary contours. In one fabrication approach, a first photoresist layer is formed over a substrate. Selected regions of the first photoresist layer are exposed using a patterning mask. The exposed regions of the first photoresist layer are thermally shrunk to pattern the first photoresist layer with a contour. A layer of material is formed over the contoured first photoresist layer.

Abstract: An optoelectronic integrated device includes a body made of semiconductor material, which is delimited by a front surface and includes a substrate having a first type of conductivity, an epitaxial region, which has the first type of conductivity and forms the front surface, and a ring region having a second type of conductivity, which extends into the epitaxial region from the front surface, and delimiting an internal region. The optoelectronic integrated device moreover includes a MOSFET including at least one body region having the second type of conductivity, which contacts the ring region and extends at least in part into the internal region from the front surface. A photodetector includes a photodetector region having the second type of conductivity, and extends into the semiconductor body starting from the front surface, contacting the ring region.

Abstract: A motion-sensitive low-G MEMS acceleration switch, which is a MEMS switch that closes at low-g acceleration (e.g., sensitive to no more than 10 Gs), is proposed. Specifically, the low-G MEMS acceleration switch has a base, a sensor wafer with one or more proofmasses, an open circuit that includes two fixed electrodes, and a contact plate. During acceleration, one or more of the proofmasses move towards the base and connects the two fixed electrodes together, resulting in a closing of the circuit that detects the acceleration. Sensitivity to low-G acceleration is achieved by proper dimensioning of the proofmasses and one or more springs used to support the proofmasses in the switch.

Abstract: Technologies are generally described for manufacturing an optical device by attaching a light-emitting element to an optical element through a resin. In various examples, a method is described, where a substrate is provided to have a through-hole at a position in the substrate where an optical element is to be mounted. A resin in liquid state may be injected into the through-hole in the substrate. Further, an optical element having a light-emitting portion may be mounted on the substrate such that a center of the tight-emitting portion is self-aligned with a center of the through-hole due to a surface tension of the resin in liquid state. The resin may be cured such that the optical element is fixed to the substrate.

Abstract: According to an embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer, a dielectric film and an electrode. The first semiconductor layer is capable of emitting light. The second semiconductor layer has a first major surface in contact with the first semiconductor layer and a second major surface opposite to the first major surface, the second major surface including a first region having convex structures and a second region not having the convex structures. The dielectric film is provided at least at a tip portion of the convex structures, and the electrode is provided above the second region.

Abstract: A vacuum-cavity-insulated flow sensor and related fabrication method are described. The sensor comprises a porous silicon wall with numerous vacuum-pores which is created in a silicon substrate, a porous silicon membrane with numerous vacuum-pores which is surrounded and supported by the porous silicon wall, and a cavity with a vacuum-space which is disposed beneath the porous silicon membrane and surrounded by the porous silicon wall. The fabrication method includes porous silicon formation and silicon polishing in HF solution.

Abstract: A MEMS capacitive pressure sensor is provided. The MEMS capacitive pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate. The capacitive pressure sensor also includes a second dielectric layer having a step surface profile formed on the first dielectric layer, and a first electrode layer having a step surface profile formed on the second dielectric layer. Further, the MEMS capacitive pressure sensor includes an insulation layer formed on the first electrode layer, and a second electrode layer having a step surface profile with a portion formed on the insulation layer in the peripheral region and the rest suspended over the first electrode layer in the device region. Further, the MEMS capacitive pressure sensor also includes a chamber having a step surface profile formed between the first electrode layer and the second electrode layer.

Abstract: A two-dimensional electrostatic scanner with distributed springs is disclosed. The two-dimensional electrostatic scanner comprises a frame, a mirror, one or more first-directional comb drives, two or more second-directional comb drives, four or more first-directional springs, and two or more second-directional springs. The four or more first-directional springs may connect to different electrical voltage source or electrical ground.

Abstract: A micromechanical resonator is disclosed. The resonator includes a resonant micromechanical element. A film of annealable material can be deposited on a facial surface of the element. The resonance of the element can be tuned by annealing the deposited film. Also disclosed are methods of applying a film on a resonator and annealing the film, thereby tuning one or more resonant properties of the resonator.