Abstract: A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate to form a modified region on the glass substrate. A wet etching process is performed on the modified region of the glass substrate to remove the modified region and form a plurality of second substrate structures.

Abstract: A method of performing a gas arthroscopy by injecting a joint capsule with sealant prior to insufflation with gas. This sealant can be any biocompatible gel or liquid with sufficient viscosity or sealing capability to prevent air embolisms while performing gas arthroscopy.

Abstract: A method of machining a diamond includes using a pulsed laser. The diamond is placed in a container containing a transparent liquid. The liquid level is at least 100 microns above a surface of the diamond to be machined, and the transparent liquid can further contain a surfactant additive in an amount of at least 2% and 10% by mass. Next, a laser source is activated such that a laser beam with pulse durations of no longer than one microsecond at a repetition frequency of no more than 5 kHz is applied to the surface to be machined, and relative scanning is performed between the diamond and the laser source, cross-wise to the laser beam and axially in depth, with an amplitude and orientations that are determined by the shape to be machined in the diamond.

Abstract: Provided is a radio wave transmittable laminate, which includes a substrate; a primer coating layer located on an upper surface of the substrate and including a polymer resin; a metal layer located on an upper surface of the primer coating layer and made of a metal; a plurality of micro cracks formed in the metal layer so as to transmit radio waves; and a hole pattern constituted by a plurality of holes which vertically penetrate the metal layer so as to transmit the radio waves.

Abstract: The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.

Abstract: The present invention relates to a laser machining system (1) with a control unit (30), a laser ablation apparatus (10) and a gas supply (40), wherein the laser ablation apparatus (10) comprises a laser (12) for generating a laser beam (14), a laser head (16) including a re-directing arrangement (18) for directing the laser beam (14) of the laser (12) onto a surface (20) of a workpiece (22) to be machined, wherein the workpiece (22) is disposed in an accommodation device (26), placed in a working chamber (28), wherein a positioning arrangement (32) is provided for a relative movement between the laser head (16) and the workpiece (22) and wherein the working chamber (28) comprises at least one inlet (46) and at least one outlet (48) for a gas. The gas supply (40) of the laser machining system (1) is configured to provide a flow of the gas in the working chamber (28) and a temperature system (11) is provided to adjust the temperature of the gas flow (44).

Abstract: A method of manufacturing an optical device is disclosed. The method includes scanning along a curved path at a first surface of a glass plate with a laser beam directed orthogonally to the first surface to form a trench according to a pattern of a waveguide. The curved path is coincident with a longitudinal axis of the waveguide. The method further includes filling the trench with a material having an index different from that of glass to form the waveguide and, after filling the trench, depositing a cladding layer.

Abstract: Example methods, apparatus, systems for droplet actuator fabrication are disclosed. An example method disclosed herein for making a droplet actuator includes ablating a first substrate with a laser to form an electrode array on the first substrate. The example method includes applying at least one of hydrophobic or a dielectric material to the electrode array. The example method also includes aligning the first substrate with a second substrate. The second substrate includes a second treated layer. In the example method, the alignment includes a gap between at least a portion of the first treated layer and at least a portion the second treated layer.

Abstract: An optical element for a lighting device of an automotive vehicle. The optical element includes a first portion configured to transmit electromagnetic (EM) radiation therethrough, the EM radiation including visible wavelengths and an ablation process wavelength. Also included is a second portion configured to absorb at least the ablation process wavelength, the second portion being in contact with the first portion to define an ablation process boundary which separates a surface of the first portion from an adjacent surface of the second portion. A patterned optical coating is provided on the optical element such that the optical coating material is provided on at least a part of the surface of the second portion, but not provided on the surface of the first portion.

Abstract: Methods and systems for welding are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser; coupling the electromagnetic radiation from the ultrashort pulse laser to a scanner comprising a scanning and focus range, wherein the scanner is configured to receive the electromagnetic radiation from the ultrashort laser and to scan and focus the electromagnetic radiation onto a joining interface of one or more materials; using a computer to adjust the pulse repetition rate and the average power of the ultrashort pulse laser; using one or more stages to position the joining interface; using a dichroic filter positioned between the scanner and the one or more materials; and focusing an imager and processor through the dichroic filter and onto the joining interface to monitor the joining interface of the one or more materials within the scanning and focus range of the electromagnetic radiation. Other embodiments are described and claimed.

Abstract: Provided is a polyester resin composition for laser direct structuring, which exhibits high platability and excellent mechanical properties. This polyester resin composition for laser direct structuring is characterized by containing a laser direct structuring additive (C) at a quantity of 1 to 20 parts by mass relative to a total of 100 parts by mass of a thermoplastic polyester resin (A) and a thermoplastic resin (B) having a water absorption rate of 0.15 mass % or more, as measured using the ISO 62A method.

Abstract: A touch input device and a method for manufacturing the same are disclosed. The touch input device includes: a first base including a metal compound; a first pattern groove formed over one surface of the first base; a first sense pattern formed over the first pattern groove and including a conductive material; a second base stacked over the first base, and configured to include a metal compound; a second pattern groove formed over one surface of the second base; a second sense pattern formed over the second pattern groove, including a conductive material, and spaced apart from the first sense pattern; and a line unit connecting the first sense pattern and the second sense pattern to an integrated-circuit.

Abstract: Embodiments of the invention provide methods for processing a substrate within a processing chamber. In one embodiment, the method comprises providing a precursor gas mixture into the processing chamber, the precursor gas mixture comprising a deposition precursor gas and an etch precursor gas, subjecting the precursor gas mixture to a thermal energy from a heat source to deposit a material layer on a surface of the substrate, wherein the thermal energy is below the minimum required for pyrolysis of the etch precursor gas, and after the material layer is formed on the surface of the substrate, subjecting the precursor gas mixture to a photon energy from a radiation source, the photon energy having a wavelength and a power level selected to promote photolytic dissociation of the etch precursor gas over the deposition precursor gas and etch a portion of the material layer from the surface of the substrate.

Abstract: An apparatus includes a windshield blackout between a bottom of the windshield and a top of the instrument panel, a viewing window provided in the windshield blackout and a blackout window feature provided behind the viewing window.

Abstract: A method of laser-depositing at least one type of organic material, characterized in that a duty ratio of a laser that evaporates the organic material is adjusted, which addresses the problem of providing an organic material deposition method and deposition apparatus that solve the issues in the conventional art, such as the organic material vaporizing and contaminating the other raw materials to be deposited, and the film formation rate running out of control, and whereby the film formation rate and the evaporation rate can be stably adjusted and controlled. Additionally, the invention is characterized in that the duty ratio is adjusted based on the evaporation rate of the organic substance or the vapor pressure inside the vacuum chamber used for deposition.

Abstract: A hybrid laser modulation and acid etch process for the creation of a patterned substrate. According to some embodiments, a hole is formed in a glass substrate by first modulating a portion of the substrate in the desired shape. A mask is coated on the glass substrate and is patterned to expose the modulated portion. The glass substrate is then acid etched to remove the modulated portion. Once the modulated portion has been etched, the desired shape may be removed from the glass substrate and the mask may be stripped.

Abstract: An apparatus includes a windshield blackout between a bottom of the windshield and a top of the instrument panel, a viewing window provided in the windshield blackout and a blackout window feature provided behind the viewing window.

Abstract: A dental therapy apparatus which enables a dental therapy more surely and less invasively is provided. A dental therapy apparatus (10A) comprises a laser light source (11) emitting laser light (L) having a wavelength within a wavelength region of 5.7 to 6.6 ?m; a controller (12) pulse-driving the laser light source and controlling at least one of pulse width and repetition frequency of pulsed laser light emitted from the laser light source; and an irradiation optical system for irradiating a tooth (20) including a carious part (21) with the light emitted from the laser light source. In this dental therapy apparatus, the controller controls at least one of the pulse width and repetition frequency of the pulsed light, so as to selectively cut the carious part (21).

Abstract: Disclosed is a plasma processing apparatus in which a main control unit is capable of managing the processing situation of an exhaust gas in an exhaust gas processing unit through a dilution controller. The exhaust gas processing unit includes a detoxifying device connected to the outlet of a vacuum pump through an exhaust pipe, a dilution gas source connected to the exhaust pipe near the outlet of the vacuum pump through a dilution gas supply pipe, an MFC and an opening/closing valve installed at the middle of the dilution gas supply pipe, a gas sensor attached to the exhaust pipe on the downstream side of an end (node N) of the dilution gas supply pipe, and a dilution controller configured to control the MFC.

Abstract: A method and apparatus for dry etching pure Cu and Cu-containing layers for manufacturing integrated circuits. The invention uses a directional beam of O-atoms with high kinetic energy to oxidize the Cu and Cu-containing layers, and organic compound etching reagents that react with the oxidized Cu to form volatile Cu-containing etch products. The invention allows for low-temperature, anisotropic etching of pure Cu and Cu-containing layers in accordance with a patterned hard mask or photoresist.

Abstract: An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

Abstract: Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.

Abstract: A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. A separation start point is formed by setting a focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to a thickness of the wafer to be produced. The laser beam is applied to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and form cracks extending from the modified layer along a c-plane, thus forming a separation start point. The wafer is separated by immersing the ingot in water and then applying ultrasonic vibration to the ingot, thereby separating a plate-shaped member having a thickness corresponding to the thickness of the wafer from the ingot.

Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).

Abstract: A method including: a first step of forming a mask member having a structure in which a magnetic metal member provided with through-holes is in tight contact with one surface of a film; a second step of forming a plurality of preliminary opening patterns by subjecting the film to penetration processing by irradiating laser beams at predetermined regular positions in the plurality of through-holes; and a third step of performing laser processing so as to form each opening pattern over the corresponding preliminary opening pattern, is provided.

Abstract: A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

Abstract: Embodiments of the disclosure provide an array substrate and a manufacture method thereof. The array substrate comprises a display region and a non-display region, the display region comprises a transistor, the transistor comprises a source electrode, a drain electrode and an active layer, the source electrode and the drain electrode are provided on the active layer and are respectively provided at two ends of the active layer. The non-display region is provided with an alignment mark, the alignment mark is provided in a same layer as the active layer and is configured for aligning the source electrode and the drain electrode with the active layer in the case of re-fabricating the source electrode and the drain electrode.

Abstract: A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. A separation start point is formed by setting a focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and form cracks extending from the modified layer along a c-plane, thus forming a separation start point. The focal point is indexed by relatively moving the focal point in the direction where an off angle is formed and the c-plane is inclined downward.

Abstract: A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

Abstract: A method for drilling a shallow-angled hole through a thermal barrier coated component includes a step of applying a pulse laser beam to drill a section of the hole substantially within a thermal barrier coating of the component in a direction substantially perpendicular to a top surface of the component. A further step is conducted to apply the pulse laser beam to further drill through a base metal of the component to complete the formation of the hole extending through the component.

Abstract: Provided herein are devices, systems and methods for treating a vocal fold pathology by forming a substantially planar void below the epithelium of the vocal fold using optical energy. Also provided are devices, systems, and methods for combined imaging and treating of a vocal fold pathology.

Abstract: Provided are methods of etching a substrate using atomic layer deposition apparatus. Atomic layer deposition apparatus including a gas distribution plate with a thermal element are discussed. The thermal element is capable of locally changing the temperature of a portion of the surface of the substrate to vaporize an etch layer deposited on the substrate.

Abstract: Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces are disclosed herein. In one embodiment, a method includes depositing molecules of a gas onto a microfeature workpiece in the reaction chamber and selectively irradiating a first portion of the molecules on the microfeature workpiece in the reaction chamber with a selected radiation without irradiating a second portion of the molecules on the workpiece with the selected radiation. The first portion of the molecules can be irradiated to activate the portion of the molecules or desorb the portion of the molecules from the workpiece. The first portion of the molecules can be selectively irradiated by impinging the first portion of the molecules with a laser beam or other energy source.

Abstract: A method for manufacturing a magnetic read sensor allows for the construction of a very narrow trackwidth sensor while avoiding problems related to mask liftoff and shadowing related process variations across a wafer. The process involves depositing a plurality of sensor layers and forming a first mask structure. The first mask structure has a relatively large opening that encompasses a sensor area and an area adjacent to the sensor area where a hard bias structure can be deposited. A second mask structure is formed over the first mask structure and includes a first portion that is configured to define a sensor dimension and a second portion that is over the first mask structure in the field area.

Abstract: A system of gas-assisted laser machining is provided. The system includes a nozzle that delivers a gas jet at the surface of the work piece and a laser source that can focus a laser beam on the surface of the work piece. A mixture of a reactive gas and a carrier gas is provided via the gas jet. The reactive gas reacts with the material and helps to enhance the evaporation rate of the material and at the same time helps reduce the temperature at which the enhanced evaporation rate can be achieved. Use of reactive gases also helps to reduce the residual stress on the material, minimize material flow during evaporation, reduce re-deposited material, and eliminate rims on the pit structures formed as a result of the material removal.

Abstract: Provided are a method of forming a through hole, which can inhibit misalignment between central axes of holes in both surfaces of a substrate, which is free from metal contamination, and which inhibits notching so as to improve the dimensional accuracy, the method including: preparing a silicon substrate; preparing a supporting substrate for supporting the silicon substrate; fixing the silicon substrate and the supporting substrate to form a composite substrate; and carrying out dry etching to the composite substrate from a silicon substrate side of the composite substrate toward a supporting substrate side of the composite substrate to form a through hole in the silicon substrate, in which the supporting substrate in the preparing a supporting substrate has a hole formed at a region corresponding to a region of the through hole to be formed in the silicon substrate, on a surface of the supporting substrate facing the silicon substrate.

Abstract: A method for manufacturing a piezoelectric element includes a process for forming a first conductive layer, a process for forming a piezoelectric layer having a region serving as an active region, a process for forming a second conductive layer, which overlaps with the region, a process for forming a third conductive layer, which overlaps with the region, on the second conductive layer, a process for forming an opening portion that divides the third conductive layer into a first portion and a second portion, a process for forming a resist layer that covers the opening portion and a peripheral portion at the side of the opening portion of the first portion and the second portion; a process for etching the third conductive layer to form a first conductive portion and a second conductive portion, and a process for etching the second conductive layer to form a third conductive portion.

Abstract: A method fabricates a magnetic transducer. A sacrificial leading shield is provided on an etch stop layer. A nonmagnetic layer is provided on the sacrificial leading shield. A pole trench is formed in the nonmagnetic layer and on the sacrificial leading shield. A pole is formed. The pole has a bottom and a top wider than the bottom in a pole tip region. Part of the pole in the pole tip region is in the pole trench and at the ABS location. The sacrificial leading shield and part of the nonmagnetic layer adjacent to the pole are removed. An air bridge thus resides in place of the sacrificial leading shield between the portion of the pole and the etch stop layer. As least one shield layer is provided. The at least one shield layer substantially fills the air bridge and form a monolithic shield including a leading and side shields.

Abstract: A method of forming a magnetic recording head is provided. The method comprises the steps of forming a damascene trench comprising a lower region having a substantially trapezoidal cross-section and an upper region having a substantially rectangular cross-section, and providing a magnetic material within the damascene trench.

Abstract: A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.

Abstract: A method for manufacturing a disk drive head suspension having a plated load point dimple. An aperture is etched into the spring metal member. A photoresist mask having an opening with load point-defining side walls and a load point diameter is formed over a portion of a spring metal member including the aperture. Metal is plated onto the spring metal member and into the aperture in the opening to form a load point having the load point diameter on the spring metal member.

Abstract: A method is described to improve performance of a magneto-resistive (MR) sensor under conditions of high areal density. The free layer is partially etched away, the removed material being replaced by a magnetic flux guide structure that reduces the free layer's demagnetization field. This in turn reduces the stripe height of the sensor so that the resolution and the read-back signal are enhanced without increasing noise and instability.

Abstract: The surface of a material is textured and by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. Texturing and crystallization can be carried out as a single step process. The crystallization of the material provides for higher electric conductivity and changes in optical and electronic properties of the material. The method may be performed in vacuum or a gaseous environment. The gaseous environment may aid in texturing and/or modifying physical and chemical properties of the surfaces. This method may be used on various material surfaces, such as semiconductors, metals and their alloys, ceramics, polymers, glasses, composites, as well as crystalline, nanocrystalline, polycrystalline, microcrystalline, and amorphous phases.

Abstract: A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.

Abstract: A method for making a thermionic electron emission device. The method includes the following steps. First, an insulating substrate is provided. Second, a number of lattices are formed on the insulating substrate. Third, a first electrode and a second electrode are fabricated in each lattice on the insulating substrate. Fourth, a carbon nanotube film structure is provided and at least part of the carbon nanotube film is suspended structure above the insulating substrate. Sixth, excess carbon nanotube film structure is cut away to obtain a number of thermionic electron emitters. The thermionic electron emitters are spaced from each other and located between the first electrode and the second electrode in each lattice.

Abstract: Systems for and methods of laser-enhanced plasma processing of semiconductor materials are disclosed. The method includes supporting a semiconductor material in a processing chamber interior and subjecting the semiconductor material to a plasma process. The method also includes simultaneously heating the wafer surface with a laser beam through a window in the processing chamber to increase the reaction rate of the plasma process. Other methods include performing laser heating of the semiconductor material before or after the plasma process but while the semiconductor material resides in the same chamber interior.

Abstract: Capsules and similar objects are made from materials having diamond (sp3) lattice structures, including diamond materials in synthetic crystalline, polycrystalline (ordered or disordered), nanocrystalline and amorphous forms. The capsules generally include a hollow shell made of a diamond material that defines an interior region that may be empty or that may contain a fluid or solid material. Some of the capsules include access ports that can be used to fill the capsule with a fluid. Capsules and similar structures can be manufactured by growing diamond on suitably shaped substrates. In some of these methods, diamond shell sections are grown on substrates, then joined together. In other methods, a nearly complete diamond shell is grown around a form substrate, and the substrate can be removed through a relatively small opening in the shell.

Abstract: The surface of a material is textured and crystallized in a single step by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. The crystallization of the material provides for higher electric conductivity and changes in optical properties of the material. The method may be performed in a gaseous environment, so that laser assisted chemical etching will aid in the texturing of the surface. This method may be used on various material surfaces, such as semiconductors, metals, ceramics, polymers, and glasses.

Abstract: Disclosed is a method of modifying of a surface of a substrate of a photolithographic mask for extreme ultraviolet radiation comprising the step of focusing femtosecond light pulses of a laser system onto the substrate so that a plurality of color centers is generated inside the substrate, wherein the color centers are distributed to cause a modification of the substrate surface.