Using Laser Patents (Class 216/65)
  • Patent number: 10434936
    Abstract: An apparatus includes a windshield blackout between a bottom of the windshield and a top of the instrument panel, a viewing window provided in the windshield blackout and a blackout window feature provided behind the viewing window.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: October 8, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: John Quintin White, Bradley Berner
  • Patent number: 10329659
    Abstract: A method of laser-depositing at least one type of organic material, characterized in that a duty ratio of a laser that evaporates the organic material is adjusted, which addresses the problem of providing an organic material deposition method and deposition apparatus that solve the issues in the conventional art, such as the organic material vaporizing and contaminating the other raw materials to be deposited, and the film formation rate running out of control, and whereby the film formation rate and the evaporation rate can be stably adjusted and controlled. Additionally, the invention is characterized in that the duty ratio is adjusted based on the evaporation rate of the organic substance or the vapor pressure inside the vacuum chamber used for deposition.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: June 25, 2019
    Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Tetsuhiko Miyadera, Takeshi Sugita, Takurou Murakami, Masayuki Chikamatsu, Koji Matsubara
  • Patent number: 10300557
    Abstract: A hybrid laser modulation and acid etch process for the creation of a patterned substrate. According to some embodiments, a hole is formed in a glass substrate by first modulating a portion of the substrate in the desired shape. A mask is coated on the glass substrate and is patterned to expose the modulated portion. The glass substrate is then acid etched to remove the modulated portion. Once the modulated portion has been etched, the desired shape may be removed from the glass substrate and the mask may be stripped.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: May 28, 2019
    Assignee: Apple Inc.
    Inventors: Nathan K. Gupta, Simon R. Lancaster-Larocque, Prithu Sharma, Weibo Cheng, Abhijit A. Kangude, Bryan W. Posner, Sudirukkuge T. Jinasundera, Karan Bir
  • Patent number: 10220773
    Abstract: An apparatus includes a windshield blackout between a bottom of the windshield and a top of the instrument panel, a viewing window provided in the windshield blackout and a blackout window feature provided behind the viewing window.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: March 5, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: John Quintin White, Bradley Berner
  • Patent number: 10168049
    Abstract: Disclosed is a plasma processing apparatus in which a main control unit is capable of managing the processing situation of an exhaust gas in an exhaust gas processing unit through a dilution controller. The exhaust gas processing unit includes a detoxifying device connected to the outlet of a vacuum pump through an exhaust pipe, a dilution gas source connected to the exhaust pipe near the outlet of the vacuum pump through a dilution gas supply pipe, an MFC and an opening/closing valve installed at the middle of the dilution gas supply pipe, a gas sensor attached to the exhaust pipe on the downstream side of an end (node N) of the dilution gas supply pipe, and a dilution controller configured to control the MFC.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: January 1, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Norihiko Amikura, Norikazu Sasaki, Risako Miyoshi
  • Patent number: 10166086
    Abstract: A dental therapy apparatus which enables a dental therapy more surely and less invasively is provided. A dental therapy apparatus (10A) comprises a laser light source (11) emitting laser light (L) having a wavelength within a wavelength region of 5.7 to 6.6 ?m; a controller (12) pulse-driving the laser light source and controlling at least one of pulse width and repetition frequency of pulsed laser light emitted from the laser light source; and an irradiation optical system for irradiating a tooth (20) including a carious part (21) with the light emitted from the laser light source. In this dental therapy apparatus, the controller controls at least one of the pulse width and repetition frequency of the pulsed light, so as to selectively cut the carious part (21).
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: January 1, 2019
    Assignees: OSAKA UNIVERSITY, HAMAMATSU PHOTONICS K.K.
    Inventors: Kunio Awazu, Katsunori Ishii, Naota Akikusa, Tadataka Edamura, Hirofumi Kan
  • Patent number: 10147613
    Abstract: A method and apparatus for dry etching pure Cu and Cu-containing layers for manufacturing integrated circuits. The invention uses a directional beam of O-atoms with high kinetic energy to oxidize the Cu and Cu-containing layers, and organic compound etching reagents that react with the oxidized Cu to form volatile Cu-containing etch products. The invention allows for low-temperature, anisotropic etching of pure Cu and Cu-containing layers in accordance with a patterned hard mask or photoresist.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: December 4, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Lee Chen, Audunn Ludviksson
  • Patent number: 9978481
    Abstract: An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: May 22, 2018
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takashi Yamaguchi, Tatsuoki Nagaishi, Masaya Konishi, Kotaro Ohki, Genki Honda
  • Patent number: 9953912
    Abstract: Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: April 24, 2018
    Assignee: Corning Incorporated
    Inventor: Uta-Barbara Goers
  • Patent number: 9925619
    Abstract: A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. A separation start point is formed by setting a focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to a thickness of the wafer to be produced. The laser beam is applied to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and form cracks extending from the modified layer along a c-plane, thus forming a separation start point. The wafer is separated by immersing the ingot in water and then applying ultrasonic vibration to the ingot, thereby separating a plate-shaped member having a thickness corresponding to the thickness of the wafer from the ingot.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: March 27, 2018
    Assignee: DISCO CORPORATION
    Inventors: Kazuya Hirata, Kunimitsu Takahashi, Yoko Nishino
  • Patent number: 9870922
    Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: January 16, 2018
    Assignees: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Patent number: 9802221
    Abstract: A method including: a first step of forming a mask member having a structure in which a magnetic metal member provided with through-holes is in tight contact with one surface of a film; a second step of forming a plurality of preliminary opening patterns by subjecting the film to penetration processing by irradiating laser beams at predetermined regular positions in the plurality of through-holes; and a third step of performing laser processing so as to form each opening pattern over the corresponding preliminary opening pattern, is provided.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: October 31, 2017
    Assignee: V Technology Co., Ltd.
    Inventor: Michinobu Mizumura
  • Patent number: 9583458
    Abstract: A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 28, 2017
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Tirunelveli Sriram, Brian Smith, Bryan Mclaughlin, John Lachapelle
  • Patent number: 9570475
    Abstract: Embodiments of the disclosure provide an array substrate and a manufacture method thereof. The array substrate comprises a display region and a non-display region, the display region comprises a transistor, the transistor comprises a source electrode, a drain electrode and an active layer, the source electrode and the drain electrode are provided on the active layer and are respectively provided at two ends of the active layer. The non-display region is provided with an alignment mark, the alignment mark is provided in a same layer as the active layer and is configured for aligning the source electrode and the drain electrode with the active layer in the case of re-fabricating the source electrode and the drain electrode.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: February 14, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zhenfei Cai, Jian Zhang, Xingxing Song
  • Patent number: 9517530
    Abstract: A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. A separation start point is formed by setting a focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and form cracks extending from the modified layer along a c-plane, thus forming a separation start point. The focal point is indexed by relatively moving the focal point in the direction where an off angle is formed and the c-plane is inclined downward.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: December 13, 2016
    Assignee: DISCO CORPORATION
    Inventors: Kazuya Hirata, Kunimitsu Takahashi, Yoko Nishino
  • Patent number: 9481052
    Abstract: A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: November 1, 2016
    Assignee: General Lasertronics Corporation
    Inventors: James W. Thomas, Robert L. Cargill, Mitchell R. Wool
  • Patent number: 9445496
    Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: September 13, 2016
    Assignee: Intel Corporation
    Inventors: Qing Ma, Johanna M Swan
  • Patent number: 9434025
    Abstract: A method for drilling a shallow-angled hole through a thermal barrier coated component includes a step of applying a pulse laser beam to drill a section of the hole substantially within a thermal barrier coating of the component in a direction substantially perpendicular to a top surface of the component. A further step is conducted to apply the pulse laser beam to further drill through a base metal of the component to complete the formation of the hole extending through the component.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: September 6, 2016
    Assignee: PRATT & WHITNEY CANADA CORP.
    Inventors: Amr Elfizy, Ghislain Hardy, Sylvain Cournoyer
  • Patent number: 9333036
    Abstract: Provided herein are devices, systems and methods for treating a vocal fold pathology by forming a substantially planar void below the epithelium of the vocal fold using optical energy. Also provided are devices, systems, and methods for combined imaging and treating of a vocal fold pathology.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: May 10, 2016
    Assignees: Board of Regents, The University of Texas System, The General Hospital Corporation
    Inventors: Adela Ben-Yakar, Christopher L. Hoy, William Neil Everett, James B. Kobler, Richard Rox Anderson, William A. Farinelli, Steven M. Zeitels
  • Patent number: 9111876
    Abstract: Provided are methods of etching a substrate using atomic layer deposition apparatus. Atomic layer deposition apparatus including a gas distribution plate with a thermal element are discussed. The thermal element is capable of locally changing the temperature of a portion of the surface of the substrate to vaporize an etch layer deposited on the substrate.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: August 18, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Mei Chang, Joseph Yudovsky
  • Patent number: 9023436
    Abstract: Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces are disclosed herein. In one embodiment, a method includes depositing molecules of a gas onto a microfeature workpiece in the reaction chamber and selectively irradiating a first portion of the molecules on the microfeature workpiece in the reaction chamber with a selected radiation without irradiating a second portion of the molecules on the workpiece with the selected radiation. The first portion of the molecules can be irradiated to activate the portion of the molecules or desorb the portion of the molecules from the workpiece. The first portion of the molecules can be selectively irradiated by impinging the first portion of the molecules with a laser beam or other energy source.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: May 5, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Ross S. Dando, Dan Gealy
  • Patent number: 8984741
    Abstract: A method for manufacturing a magnetic read sensor allows for the construction of a very narrow trackwidth sensor while avoiding problems related to mask liftoff and shadowing related process variations across a wafer. The process involves depositing a plurality of sensor layers and forming a first mask structure. The first mask structure has a relatively large opening that encompasses a sensor area and an area adjacent to the sensor area where a hard bias structure can be deposited. A second mask structure is formed over the first mask structure and includes a first portion that is configured to define a sensor dimension and a second portion that is over the first mask structure in the field area.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: March 24, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: Yi Zheng, Guomin Mao, Hicham M. Sougrati, Xiaozhong Dang
  • Publication number: 20150034596
    Abstract: A system of gas-assisted laser machining is provided. The system includes a nozzle that delivers a gas jet at the surface of the work piece and a laser source that can focus a laser beam on the surface of the work piece. A mixture of a reactive gas and a carrier gas is provided via the gas jet. The reactive gas reacts with the material and helps to enhance the evaporation rate of the material and at the same time helps reduce the temperature at which the enhanced evaporation rate can be achieved. Use of reactive gases also helps to reduce the residual stress on the material, minimize material flow during evaporation, reduce re-deposited material, and eliminate rims on the pit structures formed as a result of the material removal.
    Type: Application
    Filed: March 13, 2012
    Publication date: February 5, 2015
    Inventors: Selim Elhadj, Paul Geraghty, Michael A. Johnson, Manyalibo Joseph Matthews, Steven T. Yang
  • Patent number: 8926848
    Abstract: Provided are a method of forming a through hole, which can inhibit misalignment between central axes of holes in both surfaces of a substrate, which is free from metal contamination, and which inhibits notching so as to improve the dimensional accuracy, the method including: preparing a silicon substrate; preparing a supporting substrate for supporting the silicon substrate; fixing the silicon substrate and the supporting substrate to form a composite substrate; and carrying out dry etching to the composite substrate from a silicon substrate side of the composite substrate toward a supporting substrate side of the composite substrate to form a through hole in the silicon substrate, in which the supporting substrate in the preparing a supporting substrate has a hole formed at a region corresponding to a region of the through hole to be formed in the silicon substrate, on a surface of the supporting substrate facing the silicon substrate.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: January 6, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoichi Ikarashi
  • Patent number: 8914955
    Abstract: A method for manufacturing a piezoelectric element includes a process for forming a first conductive layer, a process for forming a piezoelectric layer having a region serving as an active region, a process for forming a second conductive layer, which overlaps with the region, a process for forming a third conductive layer, which overlaps with the region, on the second conductive layer, a process for forming an opening portion that divides the third conductive layer into a first portion and a second portion, a process for forming a resist layer that covers the opening portion and a peripheral portion at the side of the opening portion of the first portion and the second portion; a process for etching the third conductive layer to form a first conductive portion and a second conductive portion, and a process for etching the second conductive layer to form a third conductive portion.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: December 23, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Eiju Hirai, Hiroshi Ito, Toshihiro Shimizu, Jiro Kato
  • Patent number: 8914969
    Abstract: A method fabricates a magnetic transducer. A sacrificial leading shield is provided on an etch stop layer. A nonmagnetic layer is provided on the sacrificial leading shield. A pole trench is formed in the nonmagnetic layer and on the sacrificial leading shield. A pole is formed. The pole has a bottom and a top wider than the bottom in a pole tip region. Part of the pole in the pole tip region is in the pole trench and at the ABS location. The sacrificial leading shield and part of the nonmagnetic layer adjacent to the pole are removed. An air bridge thus resides in place of the sacrificial leading shield between the portion of the pole and the etch stop layer. As least one shield layer is provided. The at least one shield layer substantially fills the air bridge and form a monolithic shield including a leading and side shields.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: December 23, 2014
    Assignee: Western Digital (Fremont), LLC
    Inventors: Xiaotian Zhou, Hongzhou Jiang, Donghong Li, Lien-Chang Wang, Ching-Huang Lu, Wencheng Su, Lieping Zhong, Tao Pan
  • Patent number: 8893376
    Abstract: A method of forming a magnetic recording head is provided. The method comprises the steps of forming a damascene trench comprising a lower region having a substantially trapezoidal cross-section and an upper region having a substantially rectangular cross-section, and providing a magnetic material within the damascene trench.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: November 25, 2014
    Assignee: Western Digital(Fremont), LLC
    Inventors: Changqing Shi, Ming Jiang
  • Patent number: 8894868
    Abstract: A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: November 25, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Andy Hooper, Daragh Finn, Tim Webb, Lynn Sheehan, Kenneth Pettigrew, Yu Chong Tai
  • Patent number: 8881378
    Abstract: A method is described to improve performance of a magneto-resistive (MR) sensor under conditions of high areal density. The free layer is partially etched away, the removed material being replaced by a magnetic flux guide structure that reduces the free layer's demagnetization field. This in turn reduces the stripe height of the sensor so that the resolution and the read-back signal are enhanced without increasing noise and instability.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: November 11, 2014
    Assignee: Headway Technologies, Inc.
    Inventors: Yuchen Zhou, Joe Smyth, Min Li, Glen Garfunkel
  • Patent number: 8881375
    Abstract: A method for manufacturing a disk drive head suspension having a plated load point dimple. An aperture is etched into the spring metal member. A photoresist mask having an opening with load point-defining side walls and a load point diameter is formed over a portion of a spring metal member including the aperture. Metal is plated onto the spring metal member and into the aperture in the opening to form a load point having the load point diameter on the spring metal member.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: November 11, 2014
    Assignee: Hutchinson Technology Incorporated
    Inventors: Zachary A. Pokornowski, Michael W. Davis
  • Patent number: 8846551
    Abstract: The surface of a material is textured and by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. Texturing and crystallization can be carried out as a single step process. The crystallization of the material provides for higher electric conductivity and changes in optical and electronic properties of the material. The method may be performed in vacuum or a gaseous environment. The gaseous environment may aid in texturing and/or modifying physical and chemical properties of the surfaces. This method may be used on various material surfaces, such as semiconductors, metals and their alloys, ceramics, polymers, glasses, composites, as well as crystalline, nanocrystalline, polycrystalline, microcrystalline, and amorphous phases.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: September 30, 2014
    Assignee: University of Virginia Patent Foundation
    Inventors: Mool C. Gupta, Barada K. Nayak
  • Patent number: 8819903
    Abstract: A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: September 2, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Toshihiro Shimizu, Jiro Kato, Eiju Hirai, Hiroshi Ito
  • Patent number: 8808554
    Abstract: A method for making a thermionic electron emission device. The method includes the following steps. First, an insulating substrate is provided. Second, a number of lattices are formed on the insulating substrate. Third, a first electrode and a second electrode are fabricated in each lattice on the insulating substrate. Fourth, a carbon nanotube film structure is provided and at least part of the carbon nanotube film is suspended structure above the insulating substrate. Sixth, excess carbon nanotube film structure is cut away to obtain a number of thermionic electron emitters. The thermionic electron emitters are spaced from each other and located between the first electrode and the second electrode in each lattice.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: August 19, 2014
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Peng Liu, Liang Liu, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 8796151
    Abstract: Systems for and methods of laser-enhanced plasma processing of semiconductor materials are disclosed. The method includes supporting a semiconductor material in a processing chamber interior and subjecting the semiconductor material to a plasma process. The method also includes simultaneously heating the wafer surface with a laser beam through a window in the processing chamber to increase the reaction rate of the plasma process. Other methods include performing laser heating of the semiconductor material before or after the plasma process but while the semiconductor material resides in the same chamber interior.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: August 5, 2014
    Assignee: Ultratech, Inc.
    Inventors: Andrew M. Hawryluk, Arthur W. Zafiropoulo
  • Patent number: 8778196
    Abstract: Capsules and similar objects are made from materials having diamond (sp3) lattice structures, including diamond materials in synthetic crystalline, polycrystalline (ordered or disordered), nanocrystalline and amorphous forms. The capsules generally include a hollow shell made of a diamond material that defines an interior region that may be empty or that may contain a fluid or solid material. Some of the capsules include access ports that can be used to fill the capsule with a fluid. Capsules and similar structures can be manufactured by growing diamond on suitably shaped substrates. In some of these methods, diamond shell sections are grown on substrates, then joined together. In other methods, a nearly complete diamond shell is grown around a form substrate, and the substrate can be removed through a relatively small opening in the shell.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: July 15, 2014
    Assignee: Sunshell LLC
    Inventor: Victor B. Kley
  • Patent number: 8753990
    Abstract: The surface of a material is textured and crystallized in a single step by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. The crystallization of the material provides for higher electric conductivity and changes in optical properties of the material. The method may be performed in a gaseous environment, so that laser assisted chemical etching will aid in the texturing of the surface. This method may be used on various material surfaces, such as semiconductors, metals, ceramics, polymers, and glasses.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: June 17, 2014
    Assignee: University of Virginia Patent Foundation
    Inventors: Mool C. Gupta, Barada K. Nayak
  • Patent number: 8735030
    Abstract: Disclosed is a method of modifying of a surface of a substrate of a photolithographic mask for extreme ultraviolet radiation comprising the step of focusing femtosecond light pulses of a laser system onto the substrate so that a plurality of color centers is generated inside the substrate, wherein the color centers are distributed to cause a modification of the substrate surface.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: May 27, 2014
    Assignees: Carl Zeiss SMT GmbH, Carl Zeiss SMS GmbH., Carl Zeiss SMS Ltd
    Inventors: Sergey Oshemkov, Ralph Klaesges, Markus Mengel
  • Patent number: 8728849
    Abstract: A method of laser cutting through dissimilar materials separated by a metal foil. A material stack includes a semiconductor layer or film, with a metal foil layer attached to the back surface. The metal foil layer is attached to an insulative support material layer. A laser parameter is selected and optimized for the material stack. A laser beam creates a kerf in the material stack down to the metal foil layer. The laser beam removes metal through the kerf primarily by gasification rather than melting. Kerf formation continues after optimization of the laser parameter for removal of material from the remaining layers. A debris field resulting from the laser cutting of the metal layer is reduced and/or a portion of the debris is removed in an assisted manner as the beam cuts. The materials are diced by cutting the kerf through all materials.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: May 20, 2014
    Assignee: Alta Devices, Inc.
    Inventors: Laila Mattos, Daniel G. Patterson
  • Patent number: 8728563
    Abstract: A method of manufacturing an endoluminal implantable surface, stent, or graft includes the steps of providing an endoluminal implantable surface, stent, or graft having an inner wall surface, an outer wall surface, and a wall thickness and forming a pattern design into the endoluminal implantable surface, stent, or graft. At least one groove is created in the inner surface of the intravascular stent by applying a laser machining method to the inner surface.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: May 20, 2014
    Assignee: Palmaz Scientific, Inc.
    Inventors: Julio C. Palmaz, Armando Garza
  • Patent number: 8709271
    Abstract: The invention relates to a method for the laser marking of a support having a body and a cover sheet. A laser beam is used to etch the body of the support through the thickness of the cover sheet. The support is laminated either during or after the laser marking in order to reduce or prevent deformations in the cover sheet resulting from etching.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: April 29, 2014
    Assignee: Gemalto SA
    Inventor: Jean-Luc Lesur
  • Patent number: 8696920
    Abstract: A method of fabricating a case for a portable electronic device includes: preparing a case preform; processing the inner surface of the case preform using a laser; and surface-treating the outer surface of the case preform, wherein the outer surface of the case preform shows fine prominences and depressions formed by the surface-treating of the outer surface of the case preform, and patterns formed by processing the inner surface of the case preform appear bumpily on the outer surface of the case preform.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: April 15, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Chul Jin, Yong-Wook Hwang, Seung-Chang Baek, Jong-Woo Kim, Hoon-Soo Park
  • Publication number: 20140054267
    Abstract: An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample.
    Type: Application
    Filed: August 19, 2013
    Publication date: February 27, 2014
    Applicant: FEI Company
    Inventors: Milos Toth, Marcus Straw
  • Patent number: 8623230
    Abstract: The present method relates to processes for the removal of a material from a sample by a gas chemical reaction activated by a charged particle beam. The method is a multiple step process wherein in a first step a gas is supplied which, when a chemical reaction between the gas and the material is activated, forms a non-volatile material component such as a metal salt or a metaloxide. In a second consecutive step the reaction product of the first chemical reaction is removed from the sample.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: January 7, 2014
    Assignee: Carl Zeiss SMS GmbH
    Inventors: Nicole Auth, Petra Spies, Tristan Bret, Rainer Becker, Thorsten Hofmann, Klaus Edinger
  • Patent number: 8621744
    Abstract: A method of manufacturing an inductor for a microelectronic device comprises providing a substrate (610), forming a first plurality of inductor windings (111, 211, 411, 620, 2030) over the substrate, forming a magnetic inductor core (112, 212, 412, 810) over the first plurality of inductor windings, and forming a second plurality of inductor windings (113, 213, 413, 1010) over the magnetic inductor core. In another embodiment, the method comprises forming the inductor on a sacrificial substrate (1610) such that the inductor can subsequently be mounted onto a carrier tape (1810). In yet another embodiment, a method of manufacturing a substrate for a microelectronic device comprises forming an inductor within a build-up layer (101, 102, 103, 104) of a substrate.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: January 7, 2014
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Gloria Alejandra Camacho-Bragado
  • Patent number: 8623224
    Abstract: The present disclosure relates to a method for making pattern conductive element. The method includes steps. A substrate having a surface is provide. An adhesive layer is formed on the surface of the substrate. Part of the adhesive layer is solidified to form a solidified adhesive layer and a non-solidified adhesive layer. A carbon nanotube layer is applied on the adhesive layer. The non-solidified adhesive layer is solidified so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer. The non-fixed carbon nanotube layer is removed and the fixed carbon nanotube layer is remained to form a pattern carbon nanotube layer.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: January 7, 2014
    Assignee: Shih Hua Technology Ltd.
    Inventors: Jia-Shyong Cheng, Po-Shan Huang, Po-Sheng Shih, Chun-Yi Hu, Chih-Han Chao, Jeah-Sheng Wu
  • Patent number: 8615868
    Abstract: A method for manufacturing a magnetic sensor that includes depositing a plurality of mask layers, then forming a stripe height defining mask over the sensor layers. A first ion milling is performed just sufficiently to remove portions of the free layer that are not protected by the stripe height defining mask, the first ion milling being terminated at the non-magnetic barrier or spacer layer. A dielectric layer is then deposited, preferably by ion beam deposition. A second ion milling is then performed to remove portions of the pinned layer structure that are not protected by the mask, the free layer being protected during the second ion milling by the dielectric layer.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: December 31, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Yongchul Ahn, Xiaozhong Dang, Quang Le, Simon H. Liao
  • Patent number: 8607438
    Abstract: A read sensor for a transducer is fabricated. The transducer has a field region and a sensor region corresponding to the sensor. A sensor stack is deposited. A hybrid mask including hard and field masks is provided. The hard mask includes a sensor portion covering the sensor region and a field portion covering the field region. The field mask covers the field portion of the hard mask. The field mask exposes the sensor portion of the hard mask and part of the sensor stack between the sensor and field regions. The sensor is defined from the sensor stack in a track width direction. Hard bias layer(s) are deposited. Part of the hard bias layer(s) resides on the field mask. Part of the hard bias layer(s) adjoining the sensor region is sealed. The field mask is lifted off. The transducer is planarized.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: December 17, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Wei Gao, Guanxiong Li, Ming Mao, Chih-Ching Hu, Guanghong Luo, Miao Wang, Zhihong Zhang, Anup G. Roy
  • Patent number: 8607439
    Abstract: A method and system for providing an energy assisted magnetic recording (EAMR) head are described. The method and system include providing a slider, an EAMR transducer coupled with the slider, and a top layer on the slider. The top layer includes a mirror well therein and has a substantially flat top surface. The method and system further includes providing a laser including a light-emitting surface and providing a mirror optically coupled with the laser. The laser is coupled to the top surface of the top layer external to the mirror well. The mirror has a bottom surface and a reflective surface facing the light-emitting surface of the laser. A portion of the bottom surface of the mirror is affixed to the top surface of the top layer. A portion of the mirror resides in the mirror well.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: December 17, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Lei Wang, Dujiang Wan
  • Patent number: 8585911
    Abstract: The present invention discloses a thin film multi-band antenna, which is formed by PVD-Roll to Roll process and is formed of metal-oxide, conductive polymer, conductive glue or CNT. In another aspect, the present invention discloses a manufacturing method of thin film antenna, comprising preparing gel, followed by coating the gel on a substrate to form a transparent thin film. Thermal process is performed to heat the thin film. The gel includes vinyl oxide and metal compounds, wherein the vinyl oxide includes PEO having In(NO)3.3H2O, In(Ac)3, SnCl2.2H2O, or Sn(C2O4) contained thereof.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: November 19, 2013
    Inventor: Kuo-Ching Chiang
  • Patent number: 8585914
    Abstract: [Object] To provide a method for producing a vehicle window glass pane that possesses both a solar radiation energy blocking function and a radio wave transmitting function. [Means for achieving the Object] A method for producing a vehicle window glass pane on which an infrared reflective film is formed by a vacuum film forming method, which is characterized by having a process in which an edge portion of an infrared reflective film having a radio wave transmissible window produced by using a masking member is removed by dry etching, and further characterized in that the dry etching is carried out by using a grindstone or a laser.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: November 19, 2013
    Assignee: Central Glass Company, Limited
    Inventors: Takeshi Mori, Takeshi Hosokawa