Using Laser Patents (Class 216/65)
  • Patent number: 7596853
    Abstract: The method of manufacturing a thin film magnetic head includes forming a first recessed portion for insulation and a second recessed portion for contact that reach the substrate through the first insulating layer from a side of the first insulating layer of the substrate having the first insulating layer thereon; forming a second insulating layer on the substrate in the first recessed portion; and forming the lower shield layer in the first recessed portion and a contact portion in the second recessed portion.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: October 6, 2009
    Assignee: TDK Corporation
    Inventors: Kenji Ichinohe, Yosuke Goto
  • Patent number: 7587811
    Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording having a write pole with a very narrow track width and well controlled critical dimensions. The write pole is formed by depositing an electrically conductive seed layer over a substrate, and then depositing a photo resist layer over the seed layer. The photo resist layer is photolithographically exposed and developed to form an opening or trench in the photoreist layer, the opening defining the pattern of the write pole. A magnetic material is then plated into the opening in the photoresist layer. The photo resist layer can then be removed by a chemical lift off, and portions of the seed layer that are not covered by the write pole can be removed by ion milling.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: September 15, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hamid Balamane, Christian Rene Bonhote, Yimin Hsu, Aaron Neuhaus, Aron Pentek, Yi Zheng
  • Publication number: 20090223927
    Abstract: A method of manufacturing an engraved plate used in intaglio printing, said plate being engraved by a tool, for example a laser beam, characterised in that the engraving tool uses data from a depth-map, based on a three-dimensional raster image of the document to be printed.
    Type: Application
    Filed: February 17, 2009
    Publication date: September 10, 2009
    Inventors: Fausto Giori, Dirk Dauw, Jacques Perrier, Laurent Mathys
  • Patent number: 7578049
    Abstract: A method for manufacturing a write pole for a perpendicular magnetic write head. The method includes forming a mask structure over a full film layer of magnetic write pole material. A layer of hard mask material such as conformally deposited alumina is then deposited full film over the mask and write pole material. An ion mill, such as in an Ar or CHF3 chemistry is then used to preferentially remove horizontally disposed portions of the alumina layer (hard mask layer), thereby forming vertical hard mask walls at the sides of the mask structure. An ion mill is then used to form the write pole, with the alumna side walls providing excellent masking for forming well defined write pole edges. A relatively gentle clean up process can then be performed to remove the remaining mask material and side walls.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: August 25, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yimin Hsu, Vladimir Nikitin, Aron Pentek
  • Patent number: 7576008
    Abstract: Disclosed is a method for manufacturing an optoelectronic semiconductor device having a p-n junction diode, which includes the steps of: (a) etching at least one surface of the p-n junction diode in a depth direction to form a plurality of continuous, isolated or mixed type electrode pattern grooves with a certain array; and (b) filling the formed grooves with a conductive ink containing a transparent conducting particle through an inkjet and then performing heat treatment to form a buried transparent electrode, the optoelectronic semiconductor device, and an apparatus for manufacturing the optoelectronic semiconductor device. In the present invention, covering loss is significantly reduced due to a buried transparent electrode so that the high efficiency of photoelectric conversion can be implemented, and there can be provided the easiness of a manufacturing process and the enhancement of productivity through the unification of etching and electrode forming processes.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: August 18, 2009
    Assignee: LG Chem Ltd.
    Inventors: Tae Su Kim, Bu Gon Shin, Jae Sung You, Hyun Woo Shin
  • Patent number: 7571535
    Abstract: A suspension load beam used for attachment to a slider assembly and an actuation arm in a disc drive for data storage has a rigid middle beam section comprising a rigid bottom layer, a rigid top layer and a composite core layer sandwiched between the bottom layer and the top layer. A method for fabricating a vibration resistant mechanical member used a disc drive subject to high frequency motion operations is also disclosed. The method involves making an integral laminate structure and fabricating the mechanical member from the integral laminate structure. The integral laminate structure has a rigid bottom layer, a composite core layer on top of the rigid bottom layer, and a rigid top layer on top of the core layer so that the composite core layer is sandwiched between the rigid bottom layer and the rigid top layer.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: August 11, 2009
    Assignee: Seagate Technology LLC
    Inventor: John S. Wright
  • Patent number: 7568445
    Abstract: An apparatus and method for hologram induced deposition of material for use in the formation of three-dimensional structures is described. An electromagnetic energy source may be directed in the form of a hologram to a process chamber with a medium. The medium may be an organometallic gaseous medium. The hologram may induce the medium to form a solid structure associated with the shape of the hologram. The pressure of the gaseous medium may range from subatmospheric to greater than 100 psi. Alternatively, the medium may be a liquid polymer, a solid particle, or others. The hologram may be formed with an LCD panel or other means. Further, a holographic movie may be projected into one or more mediums to form complex three-dimensional structures.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: August 4, 2009
    Assignee: Lockheed Martin Corporation
    Inventors: Brian T. Rosenberger, William M. Carra
  • Patent number: 7568278
    Abstract: A method for manufacturing an inductor using a system-in-package (SIP) includes forming a first penetration electrode in a silicon substrate; depositing an insulating film on a first surface of the silicon substrate, and patterning the insulating film to form an inductor hole and a second penetration hole aligned with the first penetration hole; forming an inductor in the inductor hole and a second penetration electrode in the second penetration hole; and depositing a protective film on the insulating film and performing a back grind process such that the first penetration electrode is exposed from a second surface of the silicon substrate, the second surface being opposed to the first surface.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: August 4, 2009
    Assignee: Dongbu Hitek Co., Ltd.
    Inventor: Jae-Won Han
  • Patent number: 7565733
    Abstract: An improved method for the manufacture of magnetoresistive multilayer sensors is disclosed. The method is particularly advantageous for the production of magnetic tunnel junction (MTJ) sensors, which can be damaged at the air bearing surface by conventional lapping and ion milling. The disclosed process protects the ABS of the magnetoresistive sensor by depositing a diamond like carbon layer which remains in place through ion milling. The DLC layer is removed by oxidation subsequent to the formation of the ABS.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: July 28, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hardayal Singh Gill, Wipul Pemsiri Jayasekara, Huey-Ming Tzeng, Xiao Z. Wu
  • Publication number: 20090166324
    Abstract: Embodiments of silicon semiconductor wafers and die having surface marks are described herein. A laser, or other marking tool, may be used to mark, substantially all of a surface of an IC wafer with surface marks, such as microdimples, that camouflage or reduce or eliminate the visibility of any surface imperfections such as smudges, scratches, or other marks that may reduce the marketability of packaged IC's where such surface imperfections are visible to the end customer. By marking the wafer prior to dicing, the entire surface of each individual die may have its entire bottom surface marked. Other embodiments are also described.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Inventor: Kevin J. Lee
  • Patent number: 7549211
    Abstract: A method for de-tabbing a dielectric tab extending between and bonded to first and second stainless steel portions of a disk drive head suspension component. Exemplary first and second stainless steel portions are a flexure base region and a flexure tongue. The method includes applying laser energy to the dielectric tab. The laser energy is characterized by one or more parameters, e.g., a pulse width and/or an energy density, causing de-bonding of the dielectric tab from the first and second stainless steel portions.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: June 23, 2009
    Assignee: Hutchinson Technology Incorporated
    Inventors: Lucas P. Keranen, Hryhory T. Koba, Raymond A. Loehlein, Patrick E. Madsen, Arun S. Kumar
  • Patent number: 7543375
    Abstract: A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: June 9, 2009
    Assignee: TDK Corporation
    Inventors: Masashi Gotoh, Kaoru Kawasaki, Hiroshi Yamamoto, Mutsuko Nakano
  • Patent number: 7537708
    Abstract: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at least one beam of photons and at least one beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction predetermined by said material and said molecules composition takes place and forms a reaction product and said reaction product is removed from the material surface-irradiation and removal step.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: May 26, 2009
    Assignee: Nawotec GmbH
    Inventors: Hans Wilfried Peter Koops, Klaus Edinger
  • Patent number: 7536785
    Abstract: A method for manufacturing a droplet ejection head includes a step of forming recessed sections for forming nozzles by etching half way through a first face of a silicon substrate, a step of bonding a first support substrate to the first face of the silicon substrate, a step of reducing the thickness of the silicon substrate by processing a second face of the silicon substrate that is opposite to the first face thereof, and making the recessed sections through holes, and a step of removing the first support substrate from the silicon substrate after the reduction of the thickness of the silicon substrate.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: May 26, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Katsuji Arakawa, Yasutaka Matsumoto
  • Patent number: 7536776
    Abstract: A fabrication method for thin film magnetic heads, comprises, forming a Current Perpendicular to a Plane (CPP) sensor film over a lower shield and a first chemical mechanical polishing (CMP) stop film over the CPP sensor film, etching the CPP sensor film and forming a track width on the CPP sensor film, and covering at least the etching section of the CPP sensor film with an insulating film. The method further comprises forming a CMP dummy film over the insulating film and a second CMP stop film over the CMP dummy film, exposing the first CMP stop film, and removing the first CMP stop film and the second CMP stop film by oxygen reactive ion etching (RIE) and the CMP dummy film by fluorine RIE, and forming an upper shield film over the insulating film and over the CPP sensor film.
    Type: Grant
    Filed: June 13, 2006
    Date of Patent: May 26, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Nobuo Yoshida, Taku Shintani, Hisako Takei
  • Patent number: 7536778
    Abstract: A method of fabrication is disclosed for a slider having sites for fabrication of a continuous coil having a set of front coils and a set of back coils and a center tab, where the slider includes underpass leads.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: May 26, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Amanda Baer, Tsung Yuan Chen, David Patrick Druist, Edward Hin Pong Lee
  • Patent number: 7536775
    Abstract: A method for sample preparation. The method includes mechanically polishing portions of an insulating layer over a main pole of a recording head embedded within a sample structure. The insulating layer is polished top down in planar layers perpendicular to an air bearing surface adjoining the main pole. The method also includes selectively wet etching the remaining portions of the insulating layer to expose the main pole, wherein the insulating layer surrounds the main pole. Etching is made without damaging the main pole.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: May 26, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Phillip J. Peterson, Monica L. Vargas
  • Patent number: 7536777
    Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
    Type: Grant
    Filed: November 10, 2006
    Date of Patent: May 26, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hieu Lam, Patrick Rush Webb, Yi Zheng
  • Patent number: 7530159
    Abstract: A method is presented for fabricating a write pole for a magnetic recording head, wherein a photoresist layer is formed on a wafer stack. A target P2 pole configuration is provided, and a photomask having a pattern is produced, and the pattern is transferred to the photoresist to create a patterned photoresist having at least one photoresist channel. A layer of photoresist channel shrinking film used to produce a reduced width photoresist channel in an expanded photoresist. A P2 pole tip is formed within the reduced width photoresist channel. The P2 pole tip is then compared to the target P2 pole configuration to identify distortions, which are then used to produce a distortion-corrected photomask. The distortion-corrected photomask is then used to produce a distortion-corrected expanded photoresist, which is then used to produce a distortion-corrected P2 pole tip.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: May 12, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Kim Y. Lee, Jyh-Shury Lo
  • Patent number: 7531101
    Abstract: A method of eliminating, using a beam of laser radiation, defects lying within a laminate formed from at least a first substrate and from at least a second substrate. The laminate incorporates, between the first and second substrates, at least one smart active system. The method locates at least one defect lying within the active system and ablates the defect, by circumscribing the defect using a laser beam.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: May 12, 2009
    Assignee: Saint-Gobain Glass France
    Inventor: Fabien Beteille
  • Patent number: 7530160
    Abstract: A method for manufacturing a magnetoresistive sensor having improved free layer biasing and track width control. The method includes forming a ferromagnetic pinned layer, and depositing a ferromagnetic film thereover. A layer of Ta is deposited over the ferromagnetic film and a mask is formed over an active sensor area. A reactive ion etch process is performed to remove selected portions of said Ta layer. An etch is then performed to remove selected portions of the ferromagnetic film in unmasked areas and a ferromagnetic refill material is deposited.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: May 12, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventor: Hardayal Singh Gill
  • Patent number: 7520048
    Abstract: A giant magnetoresistive (GMR) head is formed to include a recess in an overcoat layer that reduces stress on the poles. The process includes depositing a seed layer over the overcoat layer prior to plating a metal mask layer with an opening where the recess is to be formed, wet chemical etching the seed layer through the opening in the mask layer and performing an ion milling process to remove any remaining traces of the seed layer. With the seed layer completely removed, a trench having smooth sidewalls and bottom is etched in the overcast layer by a reactive ion etch (RIE) process. The saw that is used to separate the head elements in the wafer can be passed through the clean trench without contacting the overcoat layer, thereby avoiding the chipping and cracking that might otherwise result from the use of a silicon dioxide or silicon nitride overcoat layer.
    Type: Grant
    Filed: May 31, 2007
    Date of Patent: April 21, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yunxiao Gao, Aron Pentek, Alan J. Tam, Sue Siyang Zhang
  • Patent number: 7517467
    Abstract: Disclosed herein is a method of forming a pattern, comprising: attaching a single-layer or multi-layer sacrificial film made of a semi-solid or solid material on part or all of the surface of a substrate; irradiating the sacrificial film with a focusable energy beam such as a laser beam to form a region to be charged with a functional material; charging the functional material into the formed region using a method such as an inkjet; drying the functional material; and removing the sacrificial film, thus obtaining the desired pattern.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: April 14, 2009
    Assignee: Korea Institute of Machinery & Materials
    Inventors: Dong-Youn Shin, Dong-Soo Kim, Chung-Hwan Kim, Taik-Min Lee, Jeong-Dai Jo, Byung-Oh Choi
  • Patent number: 7514015
    Abstract: A system for removing photoresist from semiconductor wafers is disclosed. The system utilizes a solid-state laser having wavelengths in the near-visible and visible portions of the electromagnetic spectrum to remove photoresist without requiring hazardous gases or wet solutions. In addition, the system does not damage the substrate being cleaned, nor leave a carbon residue requiring further processing to remove. The system uses photon energy, oxygen, water vapor and ozone to interact with contaminants on a surface, forming a gas reaction zone (GRZ). The GRZ reacts and completely removes the photoresist or other unwanted contamination.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: April 7, 2009
    Assignee: UVTech Systems
    Inventors: David J. Elliott, Ronald P. Millman, Jr., Murray Tardif, Krista Aiello
  • Publication number: 20090084972
    Abstract: To attain objects to reduce the spread of electrons as compared with a conventional one without degrading the multiplication factor of electrons; to provide a large electron multiplication factor; and to improve positional resolution, there is provided a gas electron multiplier using interaction between radiation and gas through photoelectric effects including: a chamber filled with gas and a single gas electron multiplication foil arranged in the chamber wherein the gas electron multiplication foil is made of a plate-like multilayer body composed by having a plate-like insulation layer made of a macromolecular polymer material having a thickness of around 100 ?m to 300 ?m and flat metal layers overlaid on both surfaces of the insulation layer, and the plate-like multilayer body is provided with a through-hole structure.
    Type: Application
    Filed: March 1, 2007
    Publication date: April 2, 2009
    Applicants: RIKEN, THE UNIVERSITY OF TOKYO, SCIENERGY Co., LTD,
    Inventors: Toru Tamagawa, Satoshi Koshimuta, Hideki Hamagaki
  • Patent number: 7509729
    Abstract: A method for making a write pole in a perpendicular magnetic recording write head uses a metal mask to pattern the primary resist and only ion milling during the subsequent patterning steps. A layer of primary resist is deposited over the magnetic write pole material and a metal mask layer is deposited on the primary resist layer. An imaging resist layer is formed on the metal mask layer and lithographically patterned generally in the desired shape of the write pole. Ion milling without a reactive gas is then performed over the imaging resist pattern to pattern the underlying metal mask layer, which is then used as the mask to define the shape of the primary resist pattern. Ion milling with oxygen is then performed over the metal mask pattern to pattern the underlying primary resist. Ion milling without a reactive gas is then performed over the primary resist pattern to form the underlying write pole.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: March 31, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Donald G. Allen, Amanda Baer, Michael Feldbaum, Hung-Chin Guthrie, Aron Pentek
  • Publication number: 20090081414
    Abstract: A resin composition for laser engraving contains a hydrophilic polymer and a light-to-heat conversion agent having an absorption maximum wavelength in a range of from 700 to 1,300 nm.
    Type: Application
    Filed: September 23, 2008
    Publication date: March 26, 2009
    Applicant: FUJIFILM CORPORATION
    Inventor: Atsushi Sugasaki
  • Patent number: 7506429
    Abstract: A magnetoresistive sensor having a well defined track width and method of manufacture thereof.
    Type: Grant
    Filed: February 7, 2005
    Date of Patent: March 24, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Howard Gordon Zolla, Edward Hin Pong Lee, Kim Y. Lee, Tsann Lin, Chun-Ming Wang
  • Patent number: 7506431
    Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method allows the write head to be formed with a write pole having a concave trailing edge. The method further allows the amount of concavity of the trailing edge to be accurately and carefully controlled both within a wafer and between wafers. A write pole is formed using a mask that includes a hard mask, a RIEable layer and an endpoint detection layer. A layer of non-magnetic material (ALD layer) is deposited, and then, an ion milling process is used to remove a portion of the ALD layer disposed over the write pole and mask. A reactive ion etch process is performed to remove the RIEable layer leaving the ALD layer to form non-magnetic side walls with upper portions that extend above the write pole.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: March 24, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Wen-Chien David Hsiao, Yimin Hsu, Vladimir Nikitin, Aron Pentek, Yi Zheng
  • Patent number: 7506430
    Abstract: The problem of increased edge sensitivity associated with the reduction of the spacing between bias magnets in a CPP head has been solved by limiting the width of the bias cancellation layer and by adding an extra layer of insulation to ensure that current through the device flows only through its central area, thereby minimizing its edge reading sensitivity.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: March 24, 2009
    Assignee: Headway Technologies, Inc.
    Inventors: Jei-Wei Chang, Koichi Terunuma, Youfeng Zheng, Kochan Ju
  • Patent number: 7500302
    Abstract: Embodiments of the present invention recite a process for fabricating a write gap structure for a magnetic recording head. In one embodiment, at least one layer of inert material is deposited which is disposed proximate to the P2 pole of a magnetic recording head. A layer of magnetic material is deposited which is disposed between the layer of inert material and the P1 pedestal (P1P) of the magnetic recording head. In embodiments of the present invention, a second layer of inert material is deposited which is disposed between the layer of magnetic material and the P1P of the magnetic recording head. In embodiments of the present invention, the throat height of the write gap structure is defined wherein the layer of magnetic material and the inert layer only overlie a portion of the P1 pedestal of the magnetic recording head.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: March 10, 2009
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Wen-Chien Hsiao, Terence Lam, Yinshi Liu, Michael Yang, Samuel Yuan
  • Publication number: 20090057268
    Abstract: An optical imaging apparatus (80) for direct engraving of flexographic plates (52) includes at least two laser sources (43), each emitting laser beams (44). A mirror or prism (45) is placed in front of each of the laser sources to alter an optical path of each of the laser beams. The laser beams cut the flexographic plate at different depths and cut out chunks (65) of the flexographic plate.
    Type: Application
    Filed: August 27, 2007
    Publication date: March 5, 2009
    Inventor: David Aviel
  • Patent number: 7497009
    Abstract: A main pole forming method is provided. The main pole forming method includes etching an exposed side face of a main pole layer, and the plated foundation film, thereby defining a recording track width. The method also includes etching the nonmagnetic insulating layer, and reattaching a material repelled from the nonmagnetic insulating layer to the side face of the main pole layer and a side face of the plated foundation film.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: March 3, 2009
    Assignee: TDK Corporation
    Inventor: Kiyoshi Kobayashi
  • Patent number: 7497008
    Abstract: An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: March 3, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Tsung Yuan Chen, Frederick Hayes Dill, James Mac Freitag, Kuok San Ho, Wipul Pemsiri Jayasekara, Kim Y. Lee, Mustafa Michael Pinarbasi, Ching Hwa Tsang, Patrick Rush Webb
  • Patent number: 7472469
    Abstract: A method is disclosed for fabricating a read sensor for a magnetic head for a hard disk drive having a read sensor stack and two lateral stacks. The method of fabrication includes forming lateral stacks on a gap layer, surrounding a groove to form a template. The read sensor stack is then formed in the groove, which defines the lateral dimensions of the read sensor stack, and lead layers are then formed on the lateral stacks. Also disclosed is a read head for a disk drive having a sensor stack defined by pre-established lateral stacks, and a disk drive having the read head.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: January 6, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: David Eugene Heim, Kim Y. Lee, Tsann Lin, Jih-Shiuan Luo, Chun-Ming Wang
  • Patent number: 7472471
    Abstract: A method of manufacturing a magnetic head for perpendicular magnetic recording that includes a pole layer and a pole-layer-encasing layer. The method includes the steps of: forming a nonmagnetic layer that will be formed into the pole-layer-encasing layer; forming a polishing stopper layer on the top surface of the nonmagnetic layer, the polishing stopping layer being made of a nonmagnetic conductive material and having a penetrating opening with a shape corresponding to the plane geometry of the pole layer; forming a groove in the nonmagnetic layer by selectively etching a portion of the nonmagnetic layer exposed from the opening; forming a magnetic layer to be the pole layer such that the groove is filled; and polishing the magnetic layer until the polishing stopper layer is exposed, so that the magnetic layer is formed into the pole layer.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: January 6, 2009
    Assignee: Headway Technologies, Inc.
    Inventors: Yoshitaka Sasaki, Hironori Araki, Shigeki Tanemura, Takehiro Horinaka
  • Patent number: 7472470
    Abstract: A main magnetic pore layer is formed on an insulating layer flattened into a high-flatness surface, and a yoke layer having a large film thickness is formed under the main magnetic pole layer independently of the main magnetic pole. The main magnetic pole layer has a front end surface formed in a shape with a width size gradually increasing in a direction of track width as the front end surface departs farther away from an auxiliary magnetic pole layer. A perpendicular magnetic recording head can be provided which can suppress the occurrence of fringing in a recording pattern, and can form the main magnetic pole layer with high pattern accuracy, and can satisfactorily introduce a recording magnetic field to a fore end of the main magnetic pole layer.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: January 6, 2009
    Assignee: TDK Corporation
    Inventors: Toru Takahashi, Hisayuki Yazawa, Hideki Gochou, Kiyoshi Kobayashi, Minoru Yamada, Kiyoshi Sato, Toshinori Watanabe
  • Patent number: 7469468
    Abstract: A read/write head for a disk drive having a shorting conductor from a shield of the read element to a conductor that runs from the write element to an external electrical contact pad. This allows for the measurement of the electrical isolation between the read sensor and the read shield via the external contact pads. Such a capability allows the electrical isolation to be measured both during the lapping process and subsequent to the heads being diced into separate sliders. This shorting conductor may be in the form of an internal shorting stud or in the form of an interim conductor that passes through the parting zone between adjacent heads. In the latter case, the shorting conductor is broken when the heads are diced so that a head of this embodiment can only be measured for electrical isolation prior to dicing.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: December 30, 2008
    Assignee: Maxtor Corporation
    Inventors: Ralph W. Cross, Chris Broussalian
  • Patent number: 7469464
    Abstract: A method for adjusting a performance parameter of a head suspension for positioning a read/write head in a disk drive. The suspension includes a beam and flexible element for carrying a read/write head extending from the beam. The flexible element has one or more adjustment portions. The beam has one or more openings adjacent to the adjustment portions of the flexible element to provide access to the adjustment portions through the beam. The method comprises acting upon one or more adjustment portions of the flexible element through one or more of the openings in the beam to change a performance parameter of the head suspension. A laser beam is used to irradiate the adjustment portions of the flexible element in one embodiment of the invention.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: December 30, 2008
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jacob D. Bjorstrom, Michael W. Davis, Craig A. Leabch
  • Patent number: 7464457
    Abstract: Methods for forming write heads. One method includes forming a mask layer above a pole tip layer; forming a layer of resist above the mask layer; patterning the resist; removing portions of the mask layer not covered by the patterned resist; shaping a pole tip from the pole tip layer; depositing a layer of dielectric material above the pole tip and flux shaping layer, wherein the layer of dielectric material extends about adjacent to the mask layer; depositing a stop layer over the dielectric material, the stop layer abutting the mask layer; and polishing for forming a substantially planar upper surface comprising the mask layer and stop layer. Another method includes depositing a layer of dielectric material at least adjacent the pole tip, wherein the layer of dielectric material extends about adjacent to the mask layer. A further method includes forming dishing in the pole tip.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: December 16, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Quang Le, Edward Hin Pong Lee, Jui-Lung Li, Aron Peniek, Nian-Xiang Sun
  • Patent number: 7461447
    Abstract: A method of fabrication of a magnetic head including a read head sensor includes providing a read sensor stack having a front edge, a rear edge, a right side edge and a left side edge, and at least one pinning layer. The left side edge, right side edge, front edge and rear edge of the sensor stack are milled. The read sensor stack is annealed in a magnetic field to set the final orientation of the pinning layer, and the read sensor stack is encapsulated in overcoat material having a front surface. A projected final ABS boundary is established which lies within the overcoat material. A trim range is established relative to the projected final ABS boundary. The front surface of the overcoat material is lapped until the overcoat front surface is within the trim range. Residual overcoat material is then removed by ion beam etching.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: December 9, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Huey-Ming Tzeng, Xiao Z. Wu
  • Patent number: 7454828
    Abstract: A method for measuring recession in a wafer undergoing an asymmetrical ion mill process. The method includes the formation of first and second reference features and possibly a dummy feature. The reference features are constructed such that the location of the midpoint between them is unaffected by the asymmetrical ion mill. By measuring the distance between a portion of the dummy feature and the midpoint between the reference features, the amount of recession of the dummy feature can be measured. The measurement can be used to calculate the relative location of the flare to the read sensor rear edge through overlay information. By keeping the angles of the sides of the features steep (ie. nearly parallel with the direction in which the ion mill is asymmetrical) the amount of material consumed on each of the reference features is substantially equal and the midpoint between the reference features is substantially stationary.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: November 25, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Sukhbir Singh Dulay, Justin Jia-Jen Hwu, Thao John Pham
  • Patent number: 7452476
    Abstract: A method for the selective removal of one or more layers from a power unit component, e.g., a turbine blade of a heavy-duty turbine, using high-energy radiation of such a wavelength that the supplied energy is so strongly absorbed by the layer to be removed in each case that the removal threshold of the specific material of the layer to be removed is exceeded, while this removal threshold is not reached in the subsurface to be preserved, a spectrometer connected to a control unit via a light-conducting fiber cable such that the method-specific characteristic values are determinable by spectroscopic methods during the removal of the respective layer and are used for the self-regulating process limitation.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: November 18, 2008
    Assignee: MTU Aero Engines GmbH
    Inventors: Erwin Bayer, Karsten Gold, Albin Platz, Matthias Schmidt
  • Patent number: 7444741
    Abstract: Biasing schemes used for CIP GMR devices were previously thought to be impractical for CPP devices due to current shunting by the abutted hard magnets. In the present invention the CPP stripe is a narrow conductor directly above the free layer. The resistivity of the latter is made to be relatively high so the sensing current diverges very little as it passes through it. This makes it possible to use abutted hard magnets for longitudinal bias with virtually no loss of sensing current due to shunting by the magnets.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: November 4, 2008
    Assignee: Headway Technologies, Inc.
    Inventors: Yimin Guo, Li-Yan Zhu
  • Patent number: 7441323
    Abstract: A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: October 28, 2008
    Assignee: Hutchinson Technology Incorporated
    Inventor: Raymond R. Wolter
  • Patent number: 7435352
    Abstract: A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printed circuit boards, which are fabricated either by the buildup process or the parallel process. Lower manufacturing costs and improved accuracy of the solder resist pattern can be achieved due to the simplified process.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: October 14, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jee-Soo Mok, Jang-Kyu Kang, Chang-Hyun Nam
  • Publication number: 20080213545
    Abstract: A panel assembly, and method of making it, that includes a substrate and a coating proximate at least one edge of the substrate for defining a coated edge portion, the coating including one or more film forming resins having at least one functional group capable of polymerization; an initiator for causing the formation of free radicals or cations; and one or more compounds, which are reactive with the film forming resin and which also contain at least one acidic moiety. A plastic is bonded onto the coated edge portion of the substrate.
    Type: Application
    Filed: December 18, 2007
    Publication date: September 4, 2008
    Inventors: Dominic J. Allam, Marc A. Pocock
  • Patent number: 7418778
    Abstract: A CPP thin-film magnetic head includes a bottom shield layer; a top shield layer, the bottom shield layer and the top shield layer being disposed at a predetermined interval; a thin-film magnetic head element between the bottom shield layer and the top shield layer; an insulating layer behind the thin-film magnetic head element in the height direction and disposed between the bottom shield layer and the top shield layer; and a metal layer in the insulating layer, the top shield layer including a first top shield sublayer on the thin-film magnetic head element; and a second top shield sublayer behind the first top shield sublayer in the height direction, the second top shield sublayer and the bottom shield layer being conductively connected through the metal layer, wherein a current flows in the direction orthogonal to a surface of a layer constituting the thin-film magnetic head element.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: September 2, 2008
    Assignee: TDK Corporation
    Inventor: Yoshihiro Nishiyama
  • Patent number: 7392580
    Abstract: A method for manufacturing sliders from a bar has: a radiating step which includes radiating an electromagnetic wave on at least a part of each space on a second surface of said bar, wherein said second surface is a back surface of a first surface of said bar, said first surface being formed into an air bearing surface of said slider, wherein said space is sandwiched between said elements, and wherein said electromagnetic wave is radiated such that an entire portion of said bar forms a curved shape such that said first surface forms a convex surface; a lapping step of lapping said first surface while pressing said bar against a lapping surface such that said first surface of each element forms a concave shape; and a dicing step of dicing said bar along said spaces to separate said bar into said sliders.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: July 1, 2008
    Assignee: Sae Magnetics (H.K.) Ltd.
    Inventors: Osamu Fukuroi, Ryuta Murakoshi
  • Patent number: 7386933
    Abstract: A method for fabricating a magnetic recording head writer. The writer includes a bottom magnetic pole and a write gap formed over the bottom pole and a coil trench formed in the bottom pole. A top magnetic pole is provided as two layers with the first layer including front and back tips with spaced apart walls positioned adjacent the trench bottom defining trench sides. A pole cover layer is included that is made up of a thin layer of insulating material deposited to cover sides and bottom of the coil trench. A bottom coil is formed on the pole cover layer in the bottom of the coil trench and coil insulation is provided between coil elements and adjacent trench walls and covemg the coil. A top coil with insulation is formed over the planarized bottom coil insulation and the top pole second layer is formed over the top coil.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: June 17, 2008
    Assignee: Western Digital (Fremont), LLC
    Inventors: Mohamad T. Krounbi, Ming Zhao, Yining Hu, Jim Watterston