Abstract: The invention provides a laser etching method for optical ablation working by irradiating a work article formed of an inorganic material with a laser light from a laser oscillator capable of emitting in succession light pulses of a large energy density in space and time with a pulse radiation time not exceeding 1 picosecond, wherein, in laser etching of the work article formed of the inorganic material by irradiation thereof with the laser light from the laser oscillator with a predetermined pattern and with a predetermined energy density, there is utilized means for preventing deposition of a work by-product around the etching position.

Abstract: Disclosed herein are methods for making high-contrast sub-surface marks in transparent polymeric materials using femtosecond, picosecond or nanosecond pulsed fiber lasers. Systems for making sub-surface marks and transparent materials bearing marks made by the methods are also disclosed.

Abstract: A process is provided for producing near-perfect optical surfaces, for EUV and soft-x-ray optics. The method involves polishing or otherwise figuring the multilayer coating that has been deposited on an optical substrate, in order to correct for errors in the figure of the substrate and coating. A method such as ion-beam milling is used to remove material from the multilayer coating by an amount that varies in a specified way across the substrate. The phase of the EUV light that is reflected from the multilayer will be affected by the amount of multilayer material removed, but this effect will be reduced by a factor of 1?n as compared with height variations of the substrate, where n is the average refractive index of the multilayer.

Abstract: An etching method includes applying a first electromagnetic radiation to an area of structure, thereby altering a characteristic of the structure in the area, and applying a second electromagnetic radiation to the structure, the second electromagnetic radiation configured to selectively ablate the structure based on the characteristic.

Abstract: A method of patterning a carbon nanotube layer includes providing a substrate comprising a carbon nanotube layer. A laser beam is generated. The laser beam is directed onto a first surface of the carbon nanotube layer. Relative movement between the laser beam and the first surface is caused, thereby forming at least one cavity feature on the first surface.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A method for treating a substrate having a layer or coating of material thereon (such as for example a metal conductor coated with an insulating ‘enamel’) comprises the steps of directing a pulsed beam of laser radiation at the substrate to cause an interaction or adjacent the interface between the layer or coating and the substrate, leading to local separation of the layer or coating. The removal is effected by creating an interaction effect at the interface between the substrate and the layer or coating to create an effect similar to a shockwave which causes local separation of the layer or coating at the interface.

Abstract: An inertial sensor includes a mesoscaled disc resonator comprised of micro-machined substantially thermally non-conductive wafer with low coefficient of thermal expansion for sensing substantially in-plane vibration, a rigid support coupled to the resonator at a central mounting point of the resonator, at least one excitation electrode within an interior of the resonator to excite internal in-plane vibration of the resonator, and at least one sensing electrode within the interior of the resonator for sensing the internal in-plane vibration of the resonator. The inertial sensor is fabricated by etching a baseplate, bonding the substantially thermally non-conductive wafer to the etched baseplate, through-etching the wafer using deep reactive ion etching to form the resonator, depositing a thin conductive film on the through-etched wafer.

Abstract: A method for manufacturing a coordinate detector having a resistive film formed on a substrate formed of an insulating material and a common electrode for applying a voltage to the resistive film. The substrate includes a quadrangular shape. The method includes the steps of a) forming first resistive film removal regions by removing predetermined first regions of the resistive film provided along a peripheral edge of the substrate, b) forming the common electrode on the first resistive film removal regions, c) applying voltage to the resistive film, d) measuring an electric potential of the resistive film, e) calculating second resistive film removal region data according to the measured electric potential, and f) forming second resistive film removal regions by irradiating a laser beam to predetermined second regions of the resistive film according to the calculated second resistive film removal region data.

Abstract: Methods for making devices comprise forming a plurality of transducers on a major surface of a wafer, including forming a plurality of solid layers each having a thickness that is less than one micron; dividing the wafer and the attached transducers into a plurality of units such that each of the units includes a portion of the layers and a substantially planar surface that is substantially perpendicular to the portion of the layers; and removing at least part of the substantially planar surface, including creating, for each transducer, at least one flexible element that is attached the transducer. Conventional problems of connecting a head to the flexure and/or gimbal are eliminated. The heads can be made thinner than is conventional and gimbals and flexures can be more closely aligned with forces arising from interaction with the media surface and from seeking various tracks, reducing torque and dynamic instabilities.

Abstract: Concerns about inadequate electromigration robustness in CCP CPP GMR devices have been overcome by adding magnesium to the current confining structures that are presently in use. In one embodiment the alumina layer, in which the current carrying copper regions are embedded, is fully replaced by a magnesia layer. In other embodiments, alumina is still used but a layer of magnesium is included within the structure before it is subjected to ion assisted oxidation.

Abstract: A method is disclosed for fabricating a read head for a magnetic disk drive having a read head sensor and a hard bias layer, where the read head has a shaped junction between the read head sensor and the hard bias layer. The method includes providing a layered wafer stack to be shaped. A single- or multi-layered photoresist mask having no undercut is deposited upon the layered wafer stack to be shaped. The layered wafer stack is shaped by the output of a milling source, where the shaping includes partial milling to within a partial milling range to form a shaped junction. A hard bias layer is then deposited which is in contact with the shaped junction of the wafer stack.

Abstract: The method of manufacturing a thin film magnetic head includes forming a first recessed portion for insulation and a second recessed portion for contact that reach the substrate through the first insulating layer from a side of the first insulating layer of the substrate having the first insulating layer thereon; forming a second insulating layer on the substrate in the first recessed portion; and forming the lower shield layer in the first recessed portion and a contact portion in the second recessed portion.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording having a write pole with a very narrow track width and well controlled critical dimensions. The write pole is formed by depositing an electrically conductive seed layer over a substrate, and then depositing a photo resist layer over the seed layer. The photo resist layer is photolithographically exposed and developed to form an opening or trench in the photoreist layer, the opening defining the pattern of the write pole. A magnetic material is then plated into the opening in the photoresist layer. The photo resist layer can then be removed by a chemical lift off, and portions of the seed layer that are not covered by the write pole can be removed by ion milling.

Abstract: A method of manufacturing an engraved plate used in intaglio printing, said plate being engraved by a tool, for example a laser beam, characterised in that the engraving tool uses data from a depth-map, based on a three-dimensional raster image of the document to be printed.

Abstract: A method for manufacturing a write pole for a perpendicular magnetic write head. The method includes forming a mask structure over a full film layer of magnetic write pole material. A layer of hard mask material such as conformally deposited alumina is then deposited full film over the mask and write pole material. An ion mill, such as in an Ar or CHF3 chemistry is then used to preferentially remove horizontally disposed portions of the alumina layer (hard mask layer), thereby forming vertical hard mask walls at the sides of the mask structure. An ion mill is then used to form the write pole, with the alumna side walls providing excellent masking for forming well defined write pole edges. A relatively gentle clean up process can then be performed to remove the remaining mask material and side walls.

Abstract: Disclosed is a method for manufacturing an optoelectronic semiconductor device having a p-n junction diode, which includes the steps of: (a) etching at least one surface of the p-n junction diode in a depth direction to form a plurality of continuous, isolated or mixed type electrode pattern grooves with a certain array; and (b) filling the formed grooves with a conductive ink containing a transparent conducting particle through an inkjet and then performing heat treatment to form a buried transparent electrode, the optoelectronic semiconductor device, and an apparatus for manufacturing the optoelectronic semiconductor device. In the present invention, covering loss is significantly reduced due to a buried transparent electrode so that the high efficiency of photoelectric conversion can be implemented, and there can be provided the easiness of a manufacturing process and the enhancement of productivity through the unification of etching and electrode forming processes.

Abstract: A suspension load beam used for attachment to a slider assembly and an actuation arm in a disc drive for data storage has a rigid middle beam section comprising a rigid bottom layer, a rigid top layer and a composite core layer sandwiched between the bottom layer and the top layer. A method for fabricating a vibration resistant mechanical member used a disc drive subject to high frequency motion operations is also disclosed. The method involves making an integral laminate structure and fabricating the mechanical member from the integral laminate structure. The integral laminate structure has a rigid bottom layer, a composite core layer on top of the rigid bottom layer, and a rigid top layer on top of the core layer so that the composite core layer is sandwiched between the rigid bottom layer and the rigid top layer.

Abstract: A method for manufacturing an inductor using a system-in-package (SIP) includes forming a first penetration electrode in a silicon substrate; depositing an insulating film on a first surface of the silicon substrate, and patterning the insulating film to form an inductor hole and a second penetration hole aligned with the first penetration hole; forming an inductor in the inductor hole and a second penetration electrode in the second penetration hole; and depositing a protective film on the insulating film and performing a back grind process such that the first penetration electrode is exposed from a second surface of the silicon substrate, the second surface being opposed to the first surface.

Abstract: An apparatus and method for hologram induced deposition of material for use in the formation of three-dimensional structures is described. An electromagnetic energy source may be directed in the form of a hologram to a process chamber with a medium. The medium may be an organometallic gaseous medium. The hologram may induce the medium to form a solid structure associated with the shape of the hologram. The pressure of the gaseous medium may range from subatmospheric to greater than 100 psi. Alternatively, the medium may be a liquid polymer, a solid particle, or others. The hologram may be formed with an LCD panel or other means. Further, a holographic movie may be projected into one or more mediums to form complex three-dimensional structures.

Abstract: An improved method for the manufacture of magnetoresistive multilayer sensors is disclosed. The method is particularly advantageous for the production of magnetic tunnel junction (MTJ) sensors, which can be damaged at the air bearing surface by conventional lapping and ion milling. The disclosed process protects the ABS of the magnetoresistive sensor by depositing a diamond like carbon layer which remains in place through ion milling. The DLC layer is removed by oxidation subsequent to the formation of the ABS.

Abstract: Embodiments of silicon semiconductor wafers and die having surface marks are described herein. A laser, or other marking tool, may be used to mark, substantially all of a surface of an IC wafer with surface marks, such as microdimples, that camouflage or reduce or eliminate the visibility of any surface imperfections such as smudges, scratches, or other marks that may reduce the marketability of packaged IC's where such surface imperfections are visible to the end customer. By marking the wafer prior to dicing, the entire surface of each individual die may have its entire bottom surface marked. Other embodiments are also described.

Abstract: A method for de-tabbing a dielectric tab extending between and bonded to first and second stainless steel portions of a disk drive head suspension component. Exemplary first and second stainless steel portions are a flexure base region and a flexure tongue. The method includes applying laser energy to the dielectric tab. The laser energy is characterized by one or more parameters, e.g., a pulse width and/or an energy density, causing de-bonding of the dielectric tab from the first and second stainless steel portions.

Abstract: A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole.

Abstract: A fabrication method for thin film magnetic heads, comprises, forming a Current Perpendicular to a Plane (CPP) sensor film over a lower shield and a first chemical mechanical polishing (CMP) stop film over the CPP sensor film, etching the CPP sensor film and forming a track width on the CPP sensor film, and covering at least the etching section of the CPP sensor film with an insulating film. The method further comprises forming a CMP dummy film over the insulating film and a second CMP stop film over the CMP dummy film, exposing the first CMP stop film, and removing the first CMP stop film and the second CMP stop film by oxygen reactive ion etching (RIE) and the CMP dummy film by fluorine RIE, and forming an upper shield film over the insulating film and over the CPP sensor film.

Abstract: A method for manufacturing a droplet ejection head includes a step of forming recessed sections for forming nozzles by etching half way through a first face of a silicon substrate, a step of bonding a first support substrate to the first face of the silicon substrate, a step of reducing the thickness of the silicon substrate by processing a second face of the silicon substrate that is opposite to the first face thereof, and making the recessed sections through holes, and a step of removing the first support substrate from the silicon substrate after the reduction of the thickness of the silicon substrate.

Abstract: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at least one beam of photons and at least one beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction predetermined by said material and said molecules composition takes place and forms a reaction product and said reaction product is removed from the material surface-irradiation and removal step.

Abstract: A method of fabrication is disclosed for a slider having sites for fabrication of a continuous coil having a set of front coils and a set of back coils and a center tab, where the slider includes underpass leads.

Abstract: A method for sample preparation. The method includes mechanically polishing portions of an insulating layer over a main pole of a recording head embedded within a sample structure. The insulating layer is polished top down in planar layers perpendicular to an air bearing surface adjoining the main pole. The method also includes selectively wet etching the remaining portions of the insulating layer to expose the main pole, wherein the insulating layer surrounds the main pole. Etching is made without damaging the main pole.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A method for manufacturing a magnetoresistive sensor having improved free layer biasing and track width control. The method includes forming a ferromagnetic pinned layer, and depositing a ferromagnetic film thereover. A layer of Ta is deposited over the ferromagnetic film and a mask is formed over an active sensor area. A reactive ion etch process is performed to remove selected portions of said Ta layer. An etch is then performed to remove selected portions of the ferromagnetic film in unmasked areas and a ferromagnetic refill material is deposited.

Abstract: A method is presented for fabricating a write pole for a magnetic recording head, wherein a photoresist layer is formed on a wafer stack. A target P2 pole configuration is provided, and a photomask having a pattern is produced, and the pattern is transferred to the photoresist to create a patterned photoresist having at least one photoresist channel. A layer of photoresist channel shrinking film used to produce a reduced width photoresist channel in an expanded photoresist. A P2 pole tip is formed within the reduced width photoresist channel. The P2 pole tip is then compared to the target P2 pole configuration to identify distortions, which are then used to produce a distortion-corrected photomask. The distortion-corrected photomask is then used to produce a distortion-corrected expanded photoresist, which is then used to produce a distortion-corrected P2 pole tip.

Abstract: A method of eliminating, using a beam of laser radiation, defects lying within a laminate formed from at least a first substrate and from at least a second substrate. The laminate incorporates, between the first and second substrates, at least one smart active system. The method locates at least one defect lying within the active system and ablates the defect, by circumscribing the defect using a laser beam.

Abstract: A giant magnetoresistive (GMR) head is formed to include a recess in an overcoat layer that reduces stress on the poles. The process includes depositing a seed layer over the overcoat layer prior to plating a metal mask layer with an opening where the recess is to be formed, wet chemical etching the seed layer through the opening in the mask layer and performing an ion milling process to remove any remaining traces of the seed layer. With the seed layer completely removed, a trench having smooth sidewalls and bottom is etched in the overcast layer by a reactive ion etch (RIE) process. The saw that is used to separate the head elements in the wafer can be passed through the clean trench without contacting the overcoat layer, thereby avoiding the chipping and cracking that might otherwise result from the use of a silicon dioxide or silicon nitride overcoat layer.

Abstract: Disclosed herein is a method of forming a pattern, comprising: attaching a single-layer or multi-layer sacrificial film made of a semi-solid or solid material on part or all of the surface of a substrate; irradiating the sacrificial film with a focusable energy beam such as a laser beam to form a region to be charged with a functional material; charging the functional material into the formed region using a method such as an inkjet; drying the functional material; and removing the sacrificial film, thus obtaining the desired pattern.

Abstract: A system for removing photoresist from semiconductor wafers is disclosed. The system utilizes a solid-state laser having wavelengths in the near-visible and visible portions of the electromagnetic spectrum to remove photoresist without requiring hazardous gases or wet solutions. In addition, the system does not damage the substrate being cleaned, nor leave a carbon residue requiring further processing to remove. The system uses photon energy, oxygen, water vapor and ozone to interact with contaminants on a surface, forming a gas reaction zone (GRZ). The GRZ reacts and completely removes the photoresist or other unwanted contamination.

Abstract: To attain objects to reduce the spread of electrons as compared with a conventional one without degrading the multiplication factor of electrons; to provide a large electron multiplication factor; and to improve positional resolution, there is provided a gas electron multiplier using interaction between radiation and gas through photoelectric effects including: a chamber filled with gas and a single gas electron multiplication foil arranged in the chamber wherein the gas electron multiplication foil is made of a plate-like multilayer body composed by having a plate-like insulation layer made of a macromolecular polymer material having a thickness of around 100 ?m to 300 ?m and flat metal layers overlaid on both surfaces of the insulation layer, and the plate-like multilayer body is provided with a through-hole structure.

Abstract: A method for making a write pole in a perpendicular magnetic recording write head uses a metal mask to pattern the primary resist and only ion milling during the subsequent patterning steps. A layer of primary resist is deposited over the magnetic write pole material and a metal mask layer is deposited on the primary resist layer. An imaging resist layer is formed on the metal mask layer and lithographically patterned generally in the desired shape of the write pole. Ion milling without a reactive gas is then performed over the imaging resist pattern to pattern the underlying metal mask layer, which is then used as the mask to define the shape of the primary resist pattern. Ion milling with oxygen is then performed over the metal mask pattern to pattern the underlying primary resist. Ion milling without a reactive gas is then performed over the primary resist pattern to form the underlying write pole.

Abstract: A resin composition for laser engraving contains a hydrophilic polymer and a light-to-heat conversion agent having an absorption maximum wavelength in a range of from 700 to 1,300 nm.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method allows the write head to be formed with a write pole having a concave trailing edge. The method further allows the amount of concavity of the trailing edge to be accurately and carefully controlled both within a wafer and between wafers. A write pole is formed using a mask that includes a hard mask, a RIEable layer and an endpoint detection layer. A layer of non-magnetic material (ALD layer) is deposited, and then, an ion milling process is used to remove a portion of the ALD layer disposed over the write pole and mask. A reactive ion etch process is performed to remove the RIEable layer leaving the ALD layer to form non-magnetic side walls with upper portions that extend above the write pole.

Abstract: A magnetoresistive sensor having a well defined track width and method of manufacture thereof.

Abstract: The problem of increased edge sensitivity associated with the reduction of the spacing between bias magnets in a CPP head has been solved by limiting the width of the bias cancellation layer and by adding an extra layer of insulation to ensure that current through the device flows only through its central area, thereby minimizing its edge reading sensitivity.

Abstract: Embodiments of the present invention recite a process for fabricating a write gap structure for a magnetic recording head. In one embodiment, at least one layer of inert material is deposited which is disposed proximate to the P2 pole of a magnetic recording head. A layer of magnetic material is deposited which is disposed between the layer of inert material and the P1 pedestal (P1P) of the magnetic recording head. In embodiments of the present invention, a second layer of inert material is deposited which is disposed between the layer of magnetic material and the P1P of the magnetic recording head. In embodiments of the present invention, the throat height of the write gap structure is defined wherein the layer of magnetic material and the inert layer only overlie a portion of the P1 pedestal of the magnetic recording head.

Abstract: An optical imaging apparatus (80) for direct engraving of flexographic plates (52) includes at least two laser sources (43), each emitting laser beams (44). A mirror or prism (45) is placed in front of each of the laser sources to alter an optical path of each of the laser beams. The laser beams cut the flexographic plate at different depths and cut out chunks (65) of the flexographic plate.

Abstract: A main pole forming method is provided. The main pole forming method includes etching an exposed side face of a main pole layer, and the plated foundation film, thereby defining a recording track width. The method also includes etching the nonmagnetic insulating layer, and reattaching a material repelled from the nonmagnetic insulating layer to the side face of the main pole layer and a side face of the plated foundation film.

Abstract: An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.

Abstract: A method is disclosed for fabricating a read sensor for a magnetic head for a hard disk drive having a read sensor stack and two lateral stacks. The method of fabrication includes forming lateral stacks on a gap layer, surrounding a groove to form a template. The read sensor stack is then formed in the groove, which defines the lateral dimensions of the read sensor stack, and lead layers are then formed on the lateral stacks. Also disclosed is a read head for a disk drive having a sensor stack defined by pre-established lateral stacks, and a disk drive having the read head.

Abstract: A method of manufacturing a magnetic head for perpendicular magnetic recording that includes a pole layer and a pole-layer-encasing layer. The method includes the steps of: forming a nonmagnetic layer that will be formed into the pole-layer-encasing layer; forming a polishing stopper layer on the top surface of the nonmagnetic layer, the polishing stopping layer being made of a nonmagnetic conductive material and having a penetrating opening with a shape corresponding to the plane geometry of the pole layer; forming a groove in the nonmagnetic layer by selectively etching a portion of the nonmagnetic layer exposed from the opening; forming a magnetic layer to be the pole layer such that the groove is filled; and polishing the magnetic layer until the polishing stopper layer is exposed, so that the magnetic layer is formed into the pole layer.

Abstract: A main magnetic pore layer is formed on an insulating layer flattened into a high-flatness surface, and a yoke layer having a large film thickness is formed under the main magnetic pole layer independently of the main magnetic pole. The main magnetic pole layer has a front end surface formed in a shape with a width size gradually increasing in a direction of track width as the front end surface departs farther away from an auxiliary magnetic pole layer. A perpendicular magnetic recording head can be provided which can suppress the occurrence of fringing in a recording pattern, and can form the main magnetic pole layer with high pattern accuracy, and can satisfactorily introduce a recording magnetic field to a fore end of the main magnetic pole layer.

Abstract: A read/write head for a disk drive having a shorting conductor from a shield of the read element to a conductor that runs from the write element to an external electrical contact pad. This allows for the measurement of the electrical isolation between the read sensor and the read shield via the external contact pads. Such a capability allows the electrical isolation to be measured both during the lapping process and subsequent to the heads being diced into separate sliders. This shorting conductor may be in the form of an internal shorting stud or in the form of an interim conductor that passes through the parting zone between adjacent heads. In the latter case, the shorting conductor is broken when the heads are diced so that a head of this embodiment can only be measured for electrical isolation prior to dicing.