Using Laser Patents (Class 216/65)
  • Patent number: 8580130
    Abstract: Laser-assisted apparatus and methods for performing nanoscale material processing, including nanodeposition of materials, can be controlled very precisely to yield both simple and complex structures with sizes less than 100 nm. Optical or thermal energy in the near field of a photon (laser) pulse is used to fabricate submicron and nanometer structures on a substrate. A wide variety of laser material processing techniques can be adapted for use including, subtractive (e.g., ablation, machining or chemical etching), additive (e.g., chemical vapor deposition, selective self-assembly), and modification (e.g., phase transformation, doping) processes. Additionally, the apparatus can be integrated into imaging instruments, such as SEM and TEM, to allow for real-time imaging of the material processing.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: November 12, 2013
    Assignee: The Regents of the University of California
    Inventors: Samuel S. Mao, Costas P. Grigoropoulos, David J. Hwang, Andrew M. Minor
  • Patent number: 8578594
    Abstract: A process for fabricating a magnetic recording transducer for use in a data storage system comprises providing a substrate, an underlayer and a first nonmagnetic intermediate layer deposited to a first thickness on and in contact with the underlayer, performing a first scanning polishing on a first section of the first intermediate layer to planarize the first section of the first intermediate layer to a second thickness, providing a main pole in the planarized first section of the first intermediate layer, providing a first pattern of photoresist on and in contact with the first section of the first intermediate layer, the pattern comprising an aperture to define a side shield trench, performing a wet etch to remove at least a portion of the first intermediate layer thereby exposing at least one of the plurality of main pole sides, and depositing side shield material in the side shield trench.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: November 12, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Ming Jiang, Ronghui Zhou, Guanghong Luo, Masahiro Osugi, Danning Yang
  • Patent number: 8567045
    Abstract: As track densities increase, it becomes increasingly important, while writing in a given track, not to inadvertently write data in adjoining tracks. This problem has been overcome by limiting the width of material in the ABS plane to what it is at the write gap. The part of the lower pole that is wider than this is recessed back away from the ABS, thereby greatly reducing its magnetic influence on adjacent tracks. Four different embodiments of write heads that incorporate this notion are described together with a description of a general process for their manufacture.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: October 29, 2013
    Assignee: Headway Technologies, Inc.
    Inventors: Moris Dovek, Glen Garfunkel, Po Kang Wang
  • Patent number: 8533937
    Abstract: A method or forming a wrapped-around shielded perpendicular magnetic recording writer pole is disclosed. A structure comprising a leading shield layer and an intermediate layer disposed over the leading shield layer is provided, the intermediate layer comprising a pole material and a dielectric material. A trench is formed in the dielectric material. A non-magnetic layer in the trench is removed via an ion beam etching process. A seed layer is deposited in the trench and over the pole material. A magnetic material comprising a side shield layer is deposited on at least a portion of the seed layer.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: September 17, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Jinwen Wang, Weimin Si, Jianxin Fang, Ying Hong, Hongzhou Jiang, Ching-Huang Lu, Yan Chen, Donghong Li, Lien-Chang Wang, Lieping Zhong, Tao Pan
  • Patent number: 8528203
    Abstract: An enhanced mechanism for via stub elimination in printed wiring boards (PWBs) and other substrates employs laser resin activation to provide selective via plating. In one embodiment, the resin used in insulator layers of the PWB contains spinel-based non-conductive metal oxide. Preferably, only insulator layers through which vias will pass contain the metal oxide. Those layers are registered and laser irradiated at via formation locations to break down the metal oxide and release metal nuclei. Once these layers are irradiated, all layers of the PWB or subcomposite are laid up and laminated. The resulting composite or subcomposite is subsequently drilled through and subjected to conventional PWB fabrication processes prior to electroless copper plating and subsequent copper electroplating. Because metal nuclei were released only in the via formation locations of the appropriate layers, plating occurs in the via barrels only along those layers and partially plated vias are created without stubs.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: September 10, 2013
    Assignee: International Business Machines Corporation
    Inventors: Gregory E. Balcome, Brett P. Krull, Joseph Kuczynski, Terry G. Ryks, Timothy J. Tofil
  • Patent number: 8529782
    Abstract: A microstructure manufacturing method includes (a) generating first light including an interference fringe by crossing two laser beams, (b) forming a denatured region and a non-denatured region on an object having thermal non-linearity by applying the first light onto the object, so that the denatured region and the non-denatured region are disposed so as to correspond to a period of the interference fringe of the first light, and (c) etching the object so that the denatured region or the non-denatured region is selectively eliminated.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: September 10, 2013
    Assignee: Seiko Epson Corporation
    Inventor: Jun Amako
  • Patent number: 8518280
    Abstract: An exemplary brittle non-metallic workpiece (80) defines a through hole (82). An inner surface (822) for forming the through hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate (50) is also provided. The method includes as follows: forming an enclosing sketched etch (66) engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object (74) on an excess portion (68) inside the enclosing sketched etch (66); and extending the enclosing sketched etch through the brittle non-metallic substrate.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: August 27, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Mu-Chi Hsu, Vladimir Stepanovich Kondratenko
  • Patent number: 8507829
    Abstract: A method for producing rough surface structures comprising the following step: running a laser beam along filling lines (1) over an area to be processed, wherein the filling line (1) is broken down into particular laser dots (2) with a distance a, and wherein the laser dots (2) are moved in a X direction and in a Y direction in a plane with a random factor b relative to the filling line (1) so that they form a cloud of dots.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: August 13, 2013
    Assignee: ACSYS Lasertechnik GmbH
    Inventors: Silvo Heinritz, Uwe Heinritz, Marcus Polster, Claudia Hartmann, Mirko Jedynak
  • Patent number: 8506826
    Abstract: A method for manufacturing a micro electro-mechanical system (MEMS) switch system (600, 700) includes etching each of a plurality of base circuit layers (425) and a plurality of passive component substrate layers (412, 418, 42, 426). The method continues with laser milling of a first dielectric film (406) to create a spacer layer (405). A metal cladding (402, 403) formed on a flexible dielectric film layer 404 is etched so as to form a plurality of switch component features. Further laser milling is performed with respect to the flexible dielectric film layer to form at least one switch structure (448, 450). Thereafter, a stack (400) is assembled which is comprised of the spacer layer disposed between the flexible dielectric film layer and the plurality of base circuit layers. Additional layers can also be included in the stack. When the stack is completed, heat and pressure are applied to join the various layers forming the stack.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: August 13, 2013
    Assignee: Harris Corporation
    Inventor: John E. Rogers
  • Patent number: 8506718
    Abstract: A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: August 13, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Takehiro Shindou, Masaki Kondo
  • Patent number: 8505190
    Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: August 13, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Kee Lee, Tae Joon Park, Sang Kee Yoon, Hyung Jae Park, Yeong Gyu Lee, Heung Woo Park
  • Patent number: 8499435
    Abstract: A thin-film magnetic head is constructed such that a main magnetic pole layer, a lower shield layer, an upper shield layer and a thin-film coil are laminated on a substrate. A method of manufacturing the thin-film magnetic head has a lower shield layer forming step. This step comprises a step of forming a first lower shield part in a lower shield planned area, including a planned line along the medium-opposing surface, a step of forming a partial lower seed layer having a partial arrangement structure in which the partial lower seed layer is arranged on a lower formation zone except a lower exception zone including the planned line, a step of forming a second lower shield part on the partial lower seed layer.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: August 6, 2013
    Assignees: Headway Technologies, Inc., SAE Magnetics (H.K.) Ltd.
    Inventors: Yoshitaka Sasaki, Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato, Atsushi Iijima
  • Patent number: 8474127
    Abstract: A method for enhancing thermal stability, improving biasing and reducing damage from electrical surges in self-pinned abutted junction heads. The method includes forming a free layer, forming first hard bias layers abutting the free layer and forming second hard bias layers over the first hard bias layers discontiguous from the free layer, the second hard bias layers being anti-parallel to the first hard bias layers, the first and second hard bias layers providing a net longitudinal bias on the free layer.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: July 2, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Hardayal Singh Gill, Wen-Chien Hsiao, Jih-Shiuan Luo
  • Patent number: 8466943
    Abstract: A method and apparatus is disclosed for producing precision marks (28) for a metrological scale in the form of a stainless steel ribbon (10). A laser (21) is used to produce ultra-short pulses, which have a fluence at the ribbon such that ablation takes place. The laser light can be scanned via scanner (25) and the pitch of the marks (28) can be controlled. The ablative technique causes little thermal input and improves the accuracy of the scale.
    Type: Grant
    Filed: January 20, 2003
    Date of Patent: June 18, 2013
    Assignee: Renishaw PLC
    Inventors: Alexander David Scott Ellin, James Reynolds Henshaw
  • Patent number: 8460566
    Abstract: A staggered laser-etch line graphic system, method, and articles of manufacture are provided. One described method includes the steps of laser engraving a first plurality of lines associated with a first component section of a graphic on a surface of an article; laser engraving a second plurality of lines associated with a second component section of the graphic on the surface of the article; and controlling said laser engraving of the first plurality of lines and said laser engraving of second plurality of lines to reduce the visual impact of a demarcation line separating the first component section of the graphic and the second component section of the graphic.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: June 11, 2013
    Assignee: Echelon Laser Systems, LP
    Inventor: Darryl J. Costin, Jr.
  • Patent number: 8454752
    Abstract: A foreign substance removing apparatus includes a mounting table for mounting and rotating a substrate; and a laser beam irradiation unit for removing foreign substances attached to a surface of the substrate by irradiating foreign substance cleaning laser beam onto the substrate mounted and rotated on the mounting table. In the foreign substance removing apparatus, the laser beam irradiation unit irradiates laser beam having an elongate shaped irradiation cross section onto the surface of the substrate.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: June 4, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Masaki Kondo, Takehiro Shindou
  • Patent number: 8448329
    Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: May 28, 2013
    Assignee: Hutchinson Technology Incorporated
    Inventors: Alexander J. Rice, Mark A. Miller, Gregory J. VanHecke, Lance Nevala
  • Patent number: 8443511
    Abstract: A scalable MEMS inductor is formed on the top surface of a semiconductor die. The MEMS inductor includes a plurality of magnetic lower laminations, a circular trace that lies over and spaced apart from the magnetic lower laminations, and a plurality of upper laminations that lie over and spaced apart from the circular trace.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: May 21, 2013
    Assignee: National Semiconductor Corporation
    Inventors: Peter Smeys, Peter Johnson
  • Patent number: 8438710
    Abstract: A structure with an integrated circuit (IC) and a silicon condenser microphone mounted thereon includes a substrate having a first area and a second area. The IC is fabricated on the first area in order to form a conducting layer and an insulation layer. Both the conducting layer and the insulation layer further extend to the second area. The insulation layer is removed under low temperature in order to expose the conducting layer on which the silicon condenser microphone is fabricated. The silicon condenser microphone includes a first film layer, a connecting layer and a second film layer under a condition that the connecting layer connects the first and the second film layers. The first film layer and the second film layer act as two electrodes of a variable capacitance.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: May 14, 2013
    Inventor: Gang Li
  • Patent number: 8435607
    Abstract: A housing for a portable electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The decorative layer defines a pattern extending through the decorative layer.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: May 7, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jen-Hong Hsu, Hai-Lin Chen, Jian-Wei Zhang, Yong Yang, Ying-Hao Feng, Yu-Guo Zhang
  • Patent number: 8424192
    Abstract: A method and system for manufacturing a pole on a recording head is disclosed. The method and system include sputtering at least one ferromagnetic layer and fabricating a hard mask on the ferromagnetic layer. The method and system also include defining the pole and depositing a write gap on the pole. A portion of the pole is encapsulated in an insulator.
    Type: Grant
    Filed: August 8, 2005
    Date of Patent: April 23, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Danning Yang, Lei Wang, Yingjian Chen, Brant Nease, Kyusik Sin
  • Patent number: 8424202
    Abstract: A process for fabricating a circuit board is provided. A circuit substrate having a first surface and a first circuit layer is provided. A first dielectric layer having a second surface is formed on the circuit substrate and covers the first surface and the first circuit layer. An antagonistic activation layer is formed on the second surface. The antagonistic activation layer is irradiated by a laser beam to form at least a blind via extended from the antagonistic activation layer to the first circuit layer and an intaglio pattern. A first conductive layer is formed inside the blind via. A second conductive layer is formed in the intaglio pattern and the blind via. The second conductive layer covers the first conductive layer and is electrically connected with the first circuit layer through the first conductive layer. The antagonistic activation layer is removed to expose the second surface.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: April 23, 2013
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Shu-Sheng Chiang, Tsung-Yuan Chen
  • Patent number: 8414788
    Abstract: A reverse acting rupture disc is provided having a laser defined electropolished line-of-weakness recess, and an improved method of forming an electropolished line-of-weakness recess in a reverse acting rupture disc that assures full opening of the disc upon reversal. A rupture disc blank is pre-bulged, final bulged, and then provided with a layer of resist material. A laser is used to remove at least a portion of the layer of resist material corresponding to a desired line-of-weakness recess in the concave face of the bulged rupture disc. The disc is then subjected to an electropolishing operation to remove metal from the lased area of the rupture disc, thereby forming a lustrous polished line-of-weakness recess in the disc of desired configuration and of a predetermined depth that is related to material thickness.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: April 9, 2013
    Assignee: Fike Corporation
    Inventors: Bon F. Shaw, Bradford T. Stilwell, Michael D. Krebill, Brent W. Leonard
  • Patent number: 8413317
    Abstract: A method and system for fabricating a microelectric device are described. A write pole of an energy assisted magnetic recording head or a capacitor might be fabricated. The method includes depositing a resist film and curing the resist film at a temperature of at least 180 degrees centigrade. A cured resist film capable of supporting a line having an aspect ratio of at least ten is thus provided. A portion of the cured resist film is removed. A remaining portion of the resist film forms the line. An insulating or nonmagnetic layer is deposited after formation of the line. The line is removed to provide a trench in the insulating or nonmagnetic layer. The trench has a height and a width. The height divided by the width corresponds to the aspect ratio. At least part of the structure is provided in the trench.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: April 9, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Dujiang Wan, Hai Sun, Ge Yi, Wei Gao, Hong Zhang, Guanghong Luo, Yunjun Tang, Tiffany Yun Wen Jiang, Zhigang Zhou, Wencheng Su
  • Patent number: 8409672
    Abstract: It is an object to provide a method of manufacturing a light-emitting device, which improves use efficiency of an evaporation material and increases accuracy in forming an evaporated pattern by using an evaporation donor substrate by which a material layer to be a transfer layer is prevented from being excessively evaporated and a desired evaporated pattern can be formed. In a method of manufacturing an evaporation donor substrate, a first substrate which is an evaporation donor substrate is irradiated with first light (laser light) through a second substrate which is a mask substrate, whereby a material layer over the first substrate is patterned. In addition, in a method of manufacturing a light-emitting device, the first substrate provided with the material layer which is patterned by the above method is irradiated with second light, whereby the material layer can be evaporated onto a third substrate which is a deposition target substrate.
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: April 2, 2013
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kohei Yokoyama, Yosuke Sato
  • Patent number: 8402635
    Abstract: A method of manufacturing a magnetic head, including a magneto resistance effect (MR) element that reads a magnetic recording medium, is disclosed. A multilayer film is formed on a shield layer. Unnecessary portions of the multilayer film are removed from both sides of the MR element in a first direction orthogonal to a lamination direction of the multilayer film and parallel to the MR element surface facing the magnetic recording medium. An insulating layer is formed on a surface exposed by removal of the unnecessary portions. An integrated soft magnetic layer covering both sides of the MR element in the first direction and an upper side of the MR element is formed, thereby configuring a second shield layer. An anisotropy application layer is formed on the second shield layer, thereby providing exchange anisotropy to the soft magnetic layer, and magnetizing the soft magnetic layer in a predetermined direction.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: March 26, 2013
    Assignee: TDK Corporation
    Inventors: Naomichi Degawa, Takumi Yanagisawa, Satoshi Miura, Yoshikazu Sawada, Takahiko Machita, Kenzo Makino, Takekazu Yamane, Shohei Kawasaki
  • Patent number: 8381392
    Abstract: A method, including depositing a layer of material onto a base portion of a wafer, is disclosed. The layer of material has a first surface adjacent the base portion. The method also includes depositing a pattern of masking material onto a portion of a second surface of the layer. Material from the layer of material that is unprotected by the pattern of masking material is removed from the layer of material. By removing such material a portion of the layer of material is suspended from the base portion.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: February 26, 2013
    Assignee: Seagate Technology LLC
    Inventors: Jie Zou, Kaizhong Gao
  • Patent number: 8371019
    Abstract: A method for manufacturing a magnetic write head having a write pole with a very narrow track width, straight well defined sides and a well defined trailing edge width (e.g. track-width). The method includes uses two separate chemical mechanical polishing processes that stop at separate CMP stop layers. The first CMP stop layer is deposited directly over a RIEable fill layer. A RIE mask, is formed over the fill layer and first CMP stop layer, the RIE mask having an opening. A trench then is formed in the RIEable fill layer. A second CMP stop layer is then deposited into the trench and over the RIE mask, followed by plating of a magnetic material. First and second chemical mechanical polishing processes are then performed, the first stopping at the first CMP stop and the second stopping at the second CMP stop.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: February 12, 2013
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Sue Siyang Zhang, Yi Zheng, Qiping Zhong, Honglin Zhu
  • Patent number: 8367971
    Abstract: According to the present invention, a method of working material with high-energy radiation is provided, wherein a polymer matrix (1) is irradiated with high-energy radiation, in particular with a laser beam (9), wherein the radiation is focused onto a focal point (11) and the focal point (11) is set such that the focal point (11) lies behind the surface (3) of the polymer matrix (1) facing the radiation, and material removal is brought about at the polymer matrix (1), and consequently a reaction space (13) is created within the polymer matrix (1).
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: February 5, 2013
    Assignee: tesa SE
    Inventors: Arne Koops, Sven Reiter
  • Patent number: 8353098
    Abstract: A method of manufacturing a perpendicular magnetic recording head capable of easily and accurately forming a main magnetic-pole layer having a shape suitable for concentrating a magnetic flux is provided. A nonmagnetic layer having a recessed section (a first recessed section and a second recessed section) is formed, and then an additional nonmagnetic layer is formed on an inner surface of the recessed section. Then, a magnetic layer is formed in the recessed section formed with the additional nonmagnetic layer, and then the magnetic layer is cut to form an air bearing surface, so as to form the main magnetic-pole layer.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: January 15, 2013
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Tetsuya Mino, Naoto Matono, Ikuhito Onodera, Kazushi Nishiyama, Michitoshi Tsuchiya, Kenji Sasaki
  • Patent number: 8347489
    Abstract: A method for manufacturing a magnetic write head having a tapered write pole as well as a leading edge taper, and independent trailing and side magnetic shields. The method allows the write pole to be constructed by a dry process wherein the write pole material is either deposited by a process such as sputter deposition or electrically plated and the write pole shape is defined by masking and ion milling. The write pole has a stepped feature that can either be used to provide increased magnetic spacing between the trailing shield and the write pole at a location slightly recessed from the ABS or can be magnetic material that increases the effective thickness of the write pole at a location slightly recessed from the ABS. A bump structure can be further built over that stepped feature to enhance field gradient as well as reduce trailing shield saturation.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: January 8, 2013
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Liubo Hong, Aron Pentek, Yi Zheng, Honglin Zhu
  • Patent number: 8347488
    Abstract: A method for manufacturing a magnetic write head having a non-magnetic step layer, non-magnetic bump at the front of the non-magnetic step layer and a write pole with a tapered trailing edge. The tapered portion of the trailing edge of the write pole is formed by a two step process that allows the write pole taper to be formed with greater accuracy and repeatability than would be possible using a single step taper process. An alternative method is also described on how to make a non-magnetic bump structure with adjustable bump throat height prior to Damascene side shield gap formation in a Damascene wrap around shield head.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: January 8, 2013
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Liubo Hong, Aron Pentek, Yi Zheng
  • Patent number: 8341826
    Abstract: A method and system for fabricating magnetic transducer are described. The method and system include providing a main pole having a bottom, a top wider than the bottom, and a top bevel. A nonmagnetic gap covering the main pole is provided. A portion of the nonmagnetic gap resides on the top of the main pole. A first seed layer is provided. At least a portion of the first seed layer covers the portion of the nonmagnetic gap on top of the main pole. A portion of the nonmagnetic gap on the magnetic recording transducer is removed after the first seed layer is provided. A second seed layer is provided after the portion of the nonmagnetic gap is removed. The second seed layer covers at least the portion of the first seed layer. A wrap-around shield layer is provided on the second seed layer.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: January 1, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Hai Jiang, Yunhe Huang, Jinwen Wang, Yun-Fei Li, Ying Hong
  • Patent number: 8336194
    Abstract: A method of fabricating a tunneling magnetoresistance (TMR) reader is disclosed. A TMR structure comprising at least one ferromagnetic layer and at least one nonmagnetic insulating layer is provided. A first thermal annealing process on the TMR structure is performed. A reader pattern definition process performed on the TMR structure to obtain a patterned TMR reader. A second thermal annealing process is performed on the patterned TMR reader.
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: December 25, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Lu Yuan, Jian X. Shen, Geoffrey W. Anderson, Christopher Ng
  • Patent number: 8333897
    Abstract: A method for making a device includes providing a tubular member which will be formed into the device, masking at least a portion of the inner surface of the tubular member with a removable sacrificial material, selectively removing a portion of the tubular member and sacrificial material using a laser device, and mechanically removing the sacrificial material from the inner surface of the tubular member. Ultrasonic energy could be applied to a workpiece which is being laser cut to prevent any generated slag from welding itself to an exposed surface of the workpiece. A compressed fluid or gas, such as air, could be used to clean the surface of the laser-cut workpiece to remove slag formation which adheres to the surface of the cut workpiece.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: December 18, 2012
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Michael R. Bialas, Robert P. Barbier, David Strauss, David Mackiewicz, Pius Kienzle, Mihaela Baldi
  • Publication number: 20120308765
    Abstract: A nanostructure forming method includes: preparing a substrate having an appropriate processing value; applying laser beam having a pulse duration of picosecond order or less to a planar surface oriented in a propagation direction of the laser beam and a direction perpendicular to a polarization direction (electric field direction) of the laser beam in the interior of the substrate at an irradiation intensity which is close to the appropriate processing value of the substrate; forming a structure-modified portion at a focus at which the laser beam is concentrated and in a region which is close to the focus; and forming a nanostructure formed of a nano-hole by selectively etching the structure-modified portion.
    Type: Application
    Filed: August 3, 2012
    Publication date: December 6, 2012
    Applicants: FUJIKURA LTD., THE UNIVERSITY OF TOKYO, BIO ELECTRO-MECHANICAL AUTONOMOUS NANO SYSTEMS LABORATORY TECHNOLOGY RESEARCH ASSOCIATION
    Inventors: Osamu NUKAGA, Seiji SAMUKAWA, Masakazu SUGIYAMA
  • Patent number: 8322023
    Abstract: A method for fabricating a magnetic transducer is described. The magnetic transducer includes a pole having a pole tip and a flared region. The method Includes providing a first mask layer on the pole and providing a second mask layer on the first mask layer. The first mask layer is soluble in a predetermined solution and has a first thickness. The second mask layer has a second thickness greater than the first thickness. The method also includes forming a mask from the first mask layer and the second mask layer. The step of forming the mask layer includes using the predetermined solution. The mask has a pattern that exposes a portion of the pole tip and covers a portion of the flared region. The method also includes providing a wrap-around shield on at least the pole tip.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: December 4, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Xianzhong Zeng, Yunhe Huang, Ling Wang, Hai Sun
  • Patent number: 8316527
    Abstract: The method provides a magnetoresistive device. The magnetoresistive device is formed from a plurality of magnetoresistive layers. The method includes providing a mask. The mask covers a first portion of the magnetoresistive element layers in at least one device area. The magnetoresistive element(s) are defined using the mask. The method includes depositing hard bias layer(s). The method also includes providing a hard bias capping structure on the hard bias layer(s). The hard bias capping structure includes a first protective layer and a planarization stop layer. The first protective layer resides between the planarization stop layer and the hard bias layer(s). The method also includes performing a planarization. The planarization stop layer is configured for the planarization.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: November 27, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Liubo Hong, Honglin Zhu
  • Patent number: 8318029
    Abstract: Capsules and similar objects are made from materials having diamond (sp3) lattice structures, including diamond materials in synthetic crystalline, polycrystalline (ordered or disordered), nanocrystalline and amorphous forms. The capsules generally include a hollow shell made of a diamond material that defines an interior region that may be empty or that may contain a fluid or solid material. Some of the capsules include access ports that can be used to fill the capsule with a fluid. Capsules and similar structures can be manufactured by growing diamond on suitably shaped substrates. In some of these methods, diamond shell sections are grown on substrates, then joined together. In other methods, a nearly complete diamond shell is grown around a form substrate, and the substrate can be removed through a relatively small opening in the shell.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: November 27, 2012
    Assignee: Terraspan LLC
    Inventor: Victor B. Kley
  • Patent number: 8307539
    Abstract: A method for modeling devices in a wafer comprises the step of providing the wafer comprising a first plurality of devices having a track width and a first stripe height, a second plurality of devices having the track width and a second stripe height, and a third plurality of devices having the track width and a third stripe height. The method further comprises the steps of measuring resistance values for the first, second and third plurality of devices to obtain a data set correlating a stripe height and a resistance value for each of the first, second and third plurality of devices, and estimating a linear relationship between resistance and inverse stripe height for the first, second and third plurality of devices based on the data set.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: November 13, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Steven C. Rudy, Eric R. Mckie, Mark D. Moravec
  • Patent number: 8296929
    Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: October 30, 2012
    Assignee: Hutchinson Technology Incorporated
    Inventors: Reed T. Hentges, Kurt C. Swanson, Peter F. Ladwig, Lance Nevala
  • Patent number: 8296930
    Abstract: A method for manufacturing a magnetoresistive sensor that results in the sensor having a very flat top magnetic shield. The process involves depositing a plurality of sensor layers and then depositing a thin high density carbon CMP stop layer over the sensor layers and forming a mask over the CMP stop layer. An ion milling is performed to define the sensor. Then a thin insulating layer and magnetic hard bias layer are deposited. A chemical mechanical polishing is performed to remove the mask and a reactive ion etching is performed to remove the remaining carbon CMP stop layer. Because the CMP stop layer is very dense and hard, it can be made very thin. This means that when it is removed by reactive ion etching, there is very little notching over the sensor, thereby allowing the upper shield to be very thin.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: October 30, 2012
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Shin Funada, Quang Le, Thomas L. Leong, Jui-Lung Li, Chang-Man Park, Ning Shi, Hicham M. Sougrati
  • Patent number: 8294034
    Abstract: A circuit board including a circuit substrate, a first dielectric layer, an antagonistic activation layer, a first conductive layer, a second conductive layer and a second dielectric layer is provided. The circuit substrate has a first surface and a first circuit layer. The first dielectric layer is disposed on the circuit substrate and covers the first surface and the first circuit layer. The first dielectric layer has a second surface, at least a blind via extending from the second surface to the first circuit layer and an intaglio pattern. The antagonistic activation layer is disposed on the second surface of the dielectric layer. The first conductive layer is disposed in the blind via. The second conductive layer is disposed in the intaglio pattern and the blind via and covers the first conductive layer. The second conductive layer is electrically connected with the first circuit layer via the first conductive layer.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: October 23, 2012
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Shu-Sheng Chiang, Tsung-Yuan Chen
  • Patent number: 8282998
    Abstract: The present invention relates to a method of realizing an optical function on a component of a motor vehicle indicating or lighting device. This method is more particularly suited to producing a mask for a headlamp or light and/or to treating reflective surfaces. The method comprises a step of forming said component in a predetermined material and a step of exposing at least one surface of said component to laser radiation.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: October 9, 2012
    Assignee: Valeo Vision
    Inventors: Ghislain Lefevre, Thomas Giroud
  • Patent number: 8278387
    Abstract: The invention provides a resin composition for laser engraving, containing at least (A) a polymerizable compound having two or more ethylenic unsaturated bonds, a carbon-sulfur bond being contained at the site where two among the two or more ethylenic unsaturated bonds are connected and (B) a binder polymer. The invention further provides an image forming material containing the resin composition, a relief printing plate precursor having a relief forming layer which contains the resin composition, a relief printing plate precursor having a relief forming layer which contains a product formed by subjecting the resin composition to cross-linking, a method for manufacturing a relief printing plate including subjecting the relief printing plate precursor having the relief forming layer which contains the resin composition to cross-linking, and a relief printing plate manufactured by the manufacturing method.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: October 2, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Takashi Kawashima, Atsushi Sugasaki, Kenta Yoshida
  • Patent number: 8276258
    Abstract: A method and system provide a magnetic transducer that includes an underlayer and a first nonmagnetic layer on the underlayer. The method and system include providing a first trench in the first nonmagnetic layer. The first trench has at least one edge corresponding to at least one side shield. The method and system also include providing a second nonmagnetic layer in the first trench and providing a second trench in the second nonmagnetic layer. The method and system include providing the main pole. At least part of the main pole resides in the second trench. The method and system further include removing at least a portion of the second nonmagnetic layer between the edge(s) and the main pole. The method and system also provide the side shield(s) in the first trench. The side shield(s) extend from at least an air-bearing surface location to not further than a coil front location.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: October 2, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Ut Tran, Zhigang Bai
  • Patent number: 8268182
    Abstract: A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: September 18, 2012
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hidehiko Mishima, Yasuhiro Okuda, Shuji Sakabe, Masaki Hashida, Seiji Shimizu
  • Patent number: 8257603
    Abstract: Methods are provided for laser patterning a partial depth surface portion of a glass body by controlling the amount of stress induced in the glass body. A laser beam is directed along an impinged path on the surface portion of the glass body to heat the glass body to form a swell. The glass body is then cooled and etched. The surface portion of the glass body is heated above the strain point at a heating rate HR to form a swell. The heating rate HR is a function of a target temperature T and an exposure time of the output laser beam. The exposure time is controlled to reach a target temperature above the softening point of the glass body and does not require a power density that would lead to laser ablation of the surface portion. The surface portion is cooled below the strain point to induce regions of localized stress. The unablated surface portion is etched while in a state of laser-induced localized stress to form a patterned glass body.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: September 4, 2012
    Assignee: Corning Incorporated
    Inventors: Stephan Lvovich Logunov, Joseph Francis Schroeder, III
  • Patent number: 8250730
    Abstract: In the disassembling method of a display device of the present invention, the display device has a display panel, and metal plate unit having a panel member formed of a chassis member disposed on the back surface of the display panel and a circuit board as an electric circuit member attached to the chassis member through an attaching member. The disassembling method has a mounting step of mounting metal plate unit on stage whose tilt angle can be adjusted by mechanism section and a cutting step of cutting the attaching member in parallel with the surface of stage with saw blade that abuts on the attaching member by the own weight of metal plate unit based on the tilt angle of stage.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: August 28, 2012
    Assignee: Panasonic Corporation
    Inventors: Yoshiyuki Tani, Hiroshi Iwamoto
  • Patent number: 8240024
    Abstract: In one general embodiment, a method for fabricating magnetic structures using post-deposition tilting includes forming a thin film magnetic transducer structure on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: August 14, 2012
    Assignee: International Business Machines Corporation
    Inventors: Robert Glenn Biskeborn, Laurent Dellmann, Michel Despont, Philipp Herget, Pierre-Olivier Jubert