Etching Or Trimming Patents (Class 219/121.68)
  • Patent number: 10537027
    Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: January 14, 2020
    Assignee: Orbotech Ltd.
    Inventors: Zvi Kotler, Michael Zenou
  • Patent number: 10481458
    Abstract: This present invention relates to bus bar configurations and fabrication methods of non-rectangular shaped (e.g., triangular, trapezoidal, circular, pentagonal, hexagonal, arched, etc.) optical devices. The optical device comprises a first side, a second side, and a third side adjacent to the second side and two bus bars spanning a portion of the optical device.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: November 19, 2019
    Assignee: View, Inc.
    Inventors: Abhishek Anant Dixit, Todd Martin, Anshu A. Pradhan, Gordon Jack, Yashraj Bhatnagar
  • Patent number: 10481589
    Abstract: A system for coordinated laser marking of mid-conveyance food includes a controller, multiple lasers, and one or more industrial components. The lasers are in network communication with the controller. The controller can send a first instruction set, having a first language, to a first laser, and a second instruction set, having a second language different from the first language, to a second laser, the first laser associated with a first conveyor of multiple conveyors, and the second laser associated with a second conveyor different from the first conveyor. During operation, the first laser applies a marking to a first product as the first product is conveyed along the first conveyor, based on the first instruction set. Also during operation, the second laser applies the marking to a second product as the second product is conveyed along the second conveyor, based on the second instruction set.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: November 19, 2019
    Assignee: NLL, LLC
    Inventor: Gregory P. Drouillard
  • Patent number: 10442233
    Abstract: A method is provided of generating a pattern image used to form a pattern on a surface of a fabric using laser irradiation. A plurality of parameters associated with laser irradiation units are input into a user interface. The parameters include an area parameter, a laser irradiation unit density parameter, optionally a discontinuity parameter, and a dye removal parameter. A plurality of laser irradiation units arranged in a pattern area of a user interface based on computer processing of the inputted plurality of parameters is received for viewing at the user interface. The laser irradiation units collectively establish the pattern image for viewing by the user.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: October 15, 2019
    Assignee: RevoLaze, LLC
    Inventors: Darryl J. Costin, Jr., Heath Colwell
  • Patent number: 10440779
    Abstract: A process for the production of laminar electric resistances having plan geometry according to a predetermined pattern. The laminar electric resistances are formed by a metallic foil, a rigid first template, a trace and at least one sheet of insulating material. The trace is shaped to substantially trace the plan geometry of the predetermined pattern forming a path. The first template includes a fixing means adapted to fix the metallic foil. The trace has a height from the base between 10 and 50 mm. The process includes the steps of: fixing the metallic foil onto the first template by means of fixing means; cutting, according to a predetermined pattern, the metallic foil with a laser to obtain a cut foil; adhering a first sheet of insulating material to a surface of the cut foil which is distal from the first template; and detaching the cut foil from the first template.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: October 8, 2019
    Assignee: I.R.C.A. S.P.A. INDUSTRIA RESISTENZE CORAZZATE E AFFINI
    Inventor: Federico Zoppas
  • Patent number: 10435266
    Abstract: An automatic mesh reeling machine includes a manual fiber loading mesh disc mechanism, a quantitative fiber mesh conveying mechanism, a fiber mesh cutting mechanism, an automatic mesh reeling mechanism of left and right mesh reeling hands, an automatic fiber mesh drum delivery mechanism and an automatic mesh stapling mechanism of a mesh stapler. Information about replacing a mesh disc can be transmitted under the cooperation of a mesh pressing rod and a micro switch. A servo motor drives a metering roll to realize fixed length feeding of a mesh. A cutter cylinder drives a blade to cut the fixed length mesh. A left mesh reeling hand and a right mesh reeling hand reel the mesh into a closed mesh drum. A sliding table cylinder, pneumatic parallel clamping jaws and an electric servo cylinder move the fiber mesh drum to a specified position.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: October 8, 2019
    Assignee: QINHUANGDAO XINYUE INTELLIGENT EQUIPMENT CO., LTD.
    Inventors: Guoxin Xiao, Taotao Liu, Chong Li, Yan Sun
  • Patent number: 10425626
    Abstract: The laser projection display device (1) includes a laser beam source (5), a laser driver (4) driving the laser beam source, and an image processing unit (2) supplying a display image signal to the laser driver. The image processing unit applies a preliminary emission signal (53) to perform preliminary emission to an image signal (50) in a predetermined period (t0 to t1) immediately before a black pixel signal is switched to a signal except for the black pixel signal when the image signal has a black pixel duration. In particular, the preliminary emission process is performed when the laser beam source is operated in a dark image region while being reduced in maximum light intensity, and, as the preliminary emission signal, a signal (L0) corresponding to a light intensity which is 1/10 or less a maximum light intensity (La) in the dark image region.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: September 24, 2019
    Assignee: HITACHI-LG DATA STORAGE, INC.
    Inventors: Yuya Ogi, Yoshiho Seo
  • Patent number: 10414326
    Abstract: An illumination device is provided having a light source, a light exit aperture, and a reflector unit that is arranged between the light source and the light exit aperture and can be controlled in terms of its reflection position by means of a control signal, wherein the reflector unit is designed to assume (via an operating control signal) an operating position in which light emitted by the light source can be deflected to the light exit aperture, and wherein the illumination device has an absorber element which is designed to absorb received light, wherein the reflector unit is designed to assume (via an absorber signal) an absorber position in which the light emitted by the light source and/or light entering into the illumination device from the outside through the light exit aperture can be deflected to the absorber element.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: September 17, 2019
    Assignee: AUDI AG
    Inventor: Carsten Gut
  • Patent number: 10406631
    Abstract: A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: September 10, 2019
    Assignee: Disco Corporation
    Inventors: Takashi Sampei, Yukiyasu Masuda
  • Patent number: 10379667
    Abstract: A capacitive touchscreen panel and a method for etching an indium tin oxide film on a gap portion of a capacitive touchscreen panel, the method for etching comprises using a laser etching line to cut ITO on the gap portion into a plurality of ITO segments, the ITO segments are independent of each other and are not connected to each other. The method for etching an indium tin oxide film on a capacitive touchscreen panel and a gap portion thereof of the present invention has high production efficiency, and the touchscreen product has a good display effect after etching.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: August 13, 2019
    Assignee: KUNSHAN VISIONOX DISPLAY CO., LTD.
    Inventors: Leping An, Yao Hong, Long Wang, Ming Gao, Peisheng You
  • Patent number: 10363586
    Abstract: A method of using a laser ablation system to clean an area of a surface with a laser beam, having a target fluence and a target irradiance. The area comprises scan regions, each having a scan width. The method comprises determining a traverse scan speed, a laser-beam average power, a laser pulse repetition rate, a laser pulse width, and a laser-beam spot area of the laser beam for each one of the scan regions to achieve the target fluence and the target irradiance. The scan width of at least one of the scan regions is different from the scan width of another one of the scan regions. The method also comprises sequentially scanning, across the scan width, each one of the scan regions of the area with the laser beam at the target fluence and the target irradiance.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: July 30, 2019
    Assignee: The Boeing Company
    Inventor: Richard Charles Barclay
  • Patent number: 10359468
    Abstract: An apparatus according to an embodiment comprises: a laser source that outputs a laser beam; an optical system that modifies the laser beam, and directs the modified laser beam onto a test object; a signal detector that detects a change of signal in the process of irradiating the test object with the modified laser beam; and a computer system that performs a failure analysis based on the change detected by the signal detector, wherein the optical system modifies the laser beam so that the modified laser beam generates an irradiation zone that includes a first intensity component of which peak intensity is near an irradiation axis and a second intensity component of which peak intensity is around the irradiation axis.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: July 23, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Juan Felipe Torres, Hiroya Kano, Masataka Shiratsuchi, Shinichi Tatsuta
  • Patent number: 10343194
    Abstract: With a tire cleaning system, movement of at least a tire or laser head held on an arm is controlled by a control device, a laser beam provided from a laser oscillator is irradiated onto an inner surface of the tire while relatively moving the laser head along the inner surface of the tire, and contamination such as a mold release agent or the like adhered to the inner surface is removed.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: July 9, 2019
    Assignee: The Yokohama Rubber Co., LTD.
    Inventor: Kensuke Matsumura
  • Patent number: 10338561
    Abstract: A data generating device includes a memory; and a controller. The memory is configured to store a plurality of sets of drawing information about an index pattern and a laser beam used for drawing the index pattern on a surface of a workpiece in association with respective ones of a plurality of sets of machining contents individually. The index pattern is represented by drawing data. Each of the plurality of machining contents indicates a machining process to be performed on the workpiece to measure deformation of the workpiece. The controller is configured to perform: receiving a generation instruction instructing to start generating the drawing data; designating one set of machining contents from the plurality of sets of machining contents; and generating the drawing data according to designated one set of machining contents and corresponding one of the plurality of sets of drawing information.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: July 2, 2019
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Narihiko Hashimoto, Koki Furukawa, Ryuhei Ito
  • Patent number: 10329641
    Abstract: One embodiment of the laser processing apparatus is for surface treatment by supplying liquid to a surface of the target member and irradiating pulsed laser light to the surface of the target member via the liquid. The apparatus includes a laser oscillator and a liquid supply. The laser oscillator irradiates the laser light to the surface through the liquid via an optical window. The liquid supply is configured to supply the liquid to the surface of the target member via a flow path passing on an outer surface of the optical window. When the liquid is in contact with a laser light emission surface of the optical window, the laser light emission surface transmits the laser light. When the liquid is not in contact with the laser light emission surface, the laser light emission surface reflects the laser light.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: June 25, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kota Nomura, Itaru Chida, Katsunori Shiihara, Hiroya Ichikawa
  • Patent number: 10319288
    Abstract: A display apparatus and a controlling method thereof are provided. The method of controlling the display apparatus including a plurality of LED devices, includes determining whether a plurality of LED devices are open using, for example, a pin voltage connected to the plurality of LED devices, in response to an open LED device being present, determining a coordinate of the open LED device, processing an image so that a particular color is output in an area where the open LED device is located, and outputting the processed image.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: June 11, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-woo Kim, Byong-heon Jeon
  • Patent number: 10315273
    Abstract: A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: June 11, 2019
    Assignee: Disco Corporation
    Inventor: Shungo Yoshii
  • Patent number: 10297385
    Abstract: The invention relates to a for a targeted shaping of the magnetic field of a single permanent magnet or an arrangement of a plurality of permanent magnets, wherein magnetic material from selected locations of the single permanent magnet or at least one of said permanent magnets of the arrangement is removed by means of at least one of the following removal procedures for shaping the magnetic field: laser ablation using laser radiation, high-pressure waterblasting using high-pressure water jets and mechanical ablation using a non-magnetic tool.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: May 21, 2019
    Assignee: Rheinisch-Westfällsche Technische Hochschule (RWTH) Aachen
    Inventors: Ernesto Pablo Danieli, Bernhard Blumich, Wasif Zia, Holger Leonards
  • Patent number: 10260911
    Abstract: In a method for applying a structure such as a marking and/or inscription to at least one element with a marking system, such as a laser system, the at least one element is arranged relative to a shaft, the method including: a) arranging the shaft or the shaft with the element arranged relative to the shaft in the marking system; b) determining a spatial position and/or a centre of rotation of the shaft in relation to a reference point, preferably the origin, of the marking system; and c) applying a structure to the element.
    Type: Grant
    Filed: March 8, 2014
    Date of Patent: April 16, 2019
    Inventor: Randolf Karl Hoche
  • Patent number: 10239159
    Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: March 26, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Nick S. Evans, Bradley J. Mitchell, Mark Blumenkrantz
  • Patent number: 10239161
    Abstract: Provided are a stage for cutting a substrate and a substrate-cutting apparatus. The stage for cutting a substrate includes: a plurality of cell areas, each of the cell areas including a first opening; an edge area at an outer side of the cell areas, the edge area including a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: March 26, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Wonwoo Choi, Seungho Yoon, Sangbong Lee
  • Patent number: 10239155
    Abstract: Described herein is a system for processing a workpiece that includes a plurality of lasers that each produces a laser beam pulse. The system also includes a laser control module that sequences temporal characteristics of the laser beam pulses. Additionally, the system includes a laser beam compensation module that shapes a near field intensity profile of at least one of the laser beam pulses and adjusts a path length of at least one of the laser beam pulses. The system also includes at least one laser beam position element that combines the laser beam pulses to produce a combined laser beam pulse at a surface of the workpiece.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: March 26, 2019
    Assignee: The Boeing Company
    Inventors: Alan F. Stewart, Anthony J. Kay, Louis K. Zeldin, Andrea Koumvakalis
  • Patent number: 10221086
    Abstract: The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO2 laser beam, aligning the CO2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: March 5, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Dai Dong, Weigang Gong, Yang Huang, Sheng Tao
  • Patent number: 10220470
    Abstract: Method of producing equipment for marking products by laser, comprising the steps of: having at least one base plate; having various types of modules in which equipment components are grouped; having casings, rear covers and front covers that can be attached to said base plate; selecting modules from each of the different module types; removably attaching the selected modules to the base plate; attaching the casing, rear cover and front cover to the base plate.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: March 5, 2019
    Assignee: MACSA ID, S.A.
    Inventors: Francesc Bravo Montero, Sven Alexander Vogler, Joan Camps Claramunt
  • Patent number: 10220602
    Abstract: Techniques or processes for providing markings on fabric articles are disclosed. In one embodiment, the articles may be fabric carrying cases for electronic devices. For example, a fabric carrying case for a particular electronic may include a fabric base layer and a plurality of thick films coupled to the fabric base layer, wherein the plurality of thick films may comprise a top thick film and an underlying thick film. Regions of the top thick film may be selectively etched through, for selectively exposing the underlying thick film. The selectively etched regions may be arranged for marking of textual or graphical indicia on the fabric carrying case for the portable electronic device.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: March 5, 2019
    Assignee: Apple Inc.
    Inventor: Michael S. Nashner
  • Patent number: 10208373
    Abstract: A production method for a deposition mask is provided. The production method includes the steps of: forming a mask member having a structure in which a thin-board magnetic metal member having a through hole and a resin film contact tightly with each other; forming a mark that has a specified depth by irradiating a part of the film through the through hole of the mask member with laser beams; and forming an opening pattern that penetrates the film by irradiating a predetermined position with laser beams, using the mark as a reference.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: February 19, 2019
    Assignee: V TECHNOLOGY CO., LTD.
    Inventor: Michinobu Mizumura
  • Patent number: 10201928
    Abstract: A method for machining a workpiece by means of a laser beam, in which material of the workpiece is removed layer-by-layer according to predetermined definitions to produce a workpiece by traversing the exposed workpiece surface in lengths across the entire surface with a laser beam in order to vaporize and/or combust workpiece material. In a first material removal phase, the laser beam is guided relative to the workpiece over the workpiece surface by adjustable mirrors inside the laser tool, more particularly without mechanical control axes being moved to adjust the relative position between the laser tool and the workpiece. In a second material removal phase, the laser beam is guided relative to the workpiece over the workpiece surface by means of one or more control axes of the machine, the focal length being variably adjustable by means of a variable optical unit.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: February 12, 2019
    Assignee: SAUER GMBH LASERTEC
    Inventor: Peter Hildebrand
  • Patent number: 10201878
    Abstract: A laser cutting head includes a controllable collimator with movable collimator lenses for controlling beam diameter and/or focal point location. The laser cutting head may be used in a laser cutting system with a control system for controlling the position of the movable collimator lenses. The lenses may be moved, for example, to adjust the beam spot size for cutting different types of material or material thicknesses. The lenses may also be moved to adjust a focal point back to the workpiece after changing the distance of the laser cutting head relative to the workpiece.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: February 12, 2019
    Assignee: IPG Photonics Corporation
    Inventors: Yuri Grapov, Felix Stukalin, Nikhit Nair
  • Patent number: 10179952
    Abstract: The described invention provides a method of patterning a thin film deposited on a substrate comprising applying a moving focused field of thermal energy to the thin film deposited on the substrate; and dewetting the thin film from the substrate. Dewetting the thin film from the substrate is characterized by a negative space of a desired design; and displacement of the thin film into adjacent structures, thereby accumulating thin film in the adjacent structures.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: January 15, 2019
    Assignee: Rutgers, The State University of New Jersey
    Inventors: Glenn G. Amatucci, Anthony Ferrer
  • Patent number: 10179471
    Abstract: A method of marking a holographic matrix. The method includes forming the holographic matrix, which is designed to produce holograms by printing. At least one anti-copy mark on the holographic matrix is formed and at least one copy-robust mark on the holographic matrix is formed. At least one of the steps for forming at least one mark on the holographic matrix uses laser-structuring of the holographic matrix surface. Preferably, the anti-copy mark represents a message and a plurality of redundancies of the message carried by the anti-copy mark. Also, preferably, a picosecond laser is used to form the anti-copy mark is formed.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: January 15, 2019
    Assignee: ADVANCED TRACK & TRACE
    Inventors: Jean-Pierre Massicot, Alain Foucou, Zbigniew Sagan
  • Patent number: 10160229
    Abstract: The shifted laser surface texturing method is a method of writing of large arrays of small objects (5) on surface or inside of a material. The whole array of objects (5) is produced by repeated linear raster (1) laser processing with sequential shifting of linear raster between each repetition of the scanning process. The linear raster is a set of paths (1) for laser beam scanning. Distance between spots (2) in the laser beam path (1) of the linear raster is defined by speed of laser beam scanning and by period between laser pulses. Sequence of linear raster shifts (4) defines the form of the small objects (5) in the array. Computational data for an array of the same objects (5) is very low. It is comparable to the number of lines N in one linear raster plus number of spots in one object. The presented method eliminates heat accumulation effect and strongly decreases plasma shielding effect, while at the same time enables effective use of high average power pulsed lasers.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: December 25, 2018
    Inventors: Martin Ku{hacek over (c)}era, Denys Moskal, Ji{hacek over (r)}i Martan
  • Patent number: 10137527
    Abstract: In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: November 27, 2018
    Assignee: IMRA America, Inc.
    Inventors: Michiharu Ota, Alan Y. Arai, Zhenlin Liu
  • Patent number: 10112263
    Abstract: The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, and laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: October 30, 2018
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Robert Reichenbach, Jeffrey Howerton, Jeffrey Albelo
  • Patent number: 10109475
    Abstract: A semiconductor wafer has a base material with a first thickness and first and second surfaces. A wafer scribe mark is disposed on the first surface of the base material. A portion of an interior region of the second surface of the base material is removed to a second thickness less than the first thickness, while leaving an edge support ring of the base material of the first thickness and an asymmetric width around the semiconductor wafer. The second thickness of the base material is less than 75 micrometers. The wafer scribe mark is disposed within the edge support ring. The removed portion of the interior region of the second surface of the base material is vertically offset from the wafer scribe mark. A width of the edge support ring is wider to encompass the wafer scribe mark and narrower elsewhere around the semiconductor wafer.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: October 23, 2018
    Assignee: Semiconductor Components Industries, LLC
    Inventor: Michael J. Seddon
  • Patent number: 10099440
    Abstract: The present invention is directed to a method of cleaning an innermost surface of a pneumatic tire, the surface having a residue deposited thereon, comprising the steps of: activating a laser to generate laser radiation; directing a pulse of laser radiation to impinge on an area of the innermost surface, the pulse of radiation having a pulse width and a fluence sufficient to remove at least part of the residue in the area to form a cleaned area; repeating the step of directing the pulse of radiation sequentially over the innermost surface to form a sequence of cleaned areas, the sequence of cleaned areas defining a stripe, the stripe following a continuous nonlinear path extending at least one circumference about the inner surface, the stripe having a stripe width W2. The invention is further directed to a tire made by the method.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: October 16, 2018
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Thomas Benedikt Helfen, Jean-Claude Patrice Philippe Griffoin
  • Patent number: 10099316
    Abstract: A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system detects a predetermined movement of the length of the material and provides a speed signal and a distance signal, and a controller is provided in operative communication with the sensing system and the laser device for receiving the speed signal and the distance signal and responsively directing the marking beam of the laser system onto the length of material in a predetermined pattern.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: October 16, 2018
    Assignee: Klein Tools, Inc.
    Inventors: Bradley Kunas, John Hankus, Dave Colin Evans, Joseph William Banderob, Robert C. Easton
  • Patent number: 10092979
    Abstract: A laser irradiation apparatus may include: an irradiation head section including first and second irradiation heads each configured to perform laser light irradiation on a workpiece; a laser unit section including first and second laser units configured to respectively output first laser light and second laser light; a beam delivery section provided in an optical path between the laser unit section and the irradiation head section, and configured to perform switching of optical paths between optical paths of the first laser light and the second laser light to cause the first or second laser light to enter the first or second irradiation head; a first beam property varying section provided in an optical path between the first laser unit and the irradiation head section; and a second beam property varying section provided in an optical path between the second laser unit and the irradiation head section.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: October 9, 2018
    Assignee: Gigaphoton Inc.
    Inventors: Akiyoshi Suzuki, Minoru Taniyama, Osamu Wakabayashi
  • Patent number: 10086638
    Abstract: Personal data may be embedded in a kinegram of an identification document using a suitable low energy laser without compromising the integrity of the kinegram or the identification document. The personal data can be written in a metalized portion of the kinegram in a high definition, high resolution manner such that the personal data may be read by a human without the use of a text-enhancing viewer device (e.g., magnifying glasses). Additional personal data can be written in a reduced text size (e.g., micro-text) in another metalized portion of the kinegram such that a human must use a text-enhancing viewer device to view the micro-text personal data.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: October 2, 2018
    Assignee: MorphoTrust USA, LLC
    Inventors: Robert Jones, Daoshen Bi
  • Patent number: 10086597
    Abstract: A laser-based coating removal method debonds a film from a substrate rather than ablating the film. A laser light is transmitted through a transparent film to an underlying bonding layer for bonding the film to one or more additional films and/or a substrate. The laser light is absorbed at the bonding layer and the transparent film is released. In some embodiments, after the transparent film is released it is able to be physically removed.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: October 2, 2018
    Assignee: General Lasertronics Corporation
    Inventor: Richard T. Simko
  • Patent number: 10052726
    Abstract: There is provided a method for creating machining data for a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece; and a shape-measurement means, wherein the creation of the machining data makes use of: information on original shape corresponding to shape of the workpiece; information on roughly-machining shape to be removed from the workpiece by the electromagnetic-wave-machining means; and stereoscopic model of after-electromagnetic-wave-machining shape which is obtained by subtracting the roughly-machining shape from the original shape, wherein the machining data is created for electromagnetic-wave machining on the basis of information on a plurality of sliced portions obtained by partially slice-cutting from the stereoscopic model of the after-electromagnetic-wave-machi
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: August 21, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takashi Shindo, Yoshiyuki Uchinono, Kimitake Okugawa, Noboru Urata, Syoji Kuroki, Akira Fukuoka, Atsushi Sakaguchi
  • Patent number: 10022820
    Abstract: A removably attached coupling assembly can be used to be attached to a laser focus optic assembly of a liquid jet guided laser system. The coupling assembly can include a coupling body, a window assembly, and a nozzle assembly. The coupling assembly thus can allow the independent and separate servicing of the window and the nozzle. For example, to service the window, the coupling assembly can be first detached from the laser focus optic assembly, exposing the top portion of the coupling assembly. The window assembly then can be detached from the coupling assembly. The window can be removed from the window assembly for servicing, such as being repaired or replaced.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: July 17, 2018
    Assignee: Avonisys AG
    Inventors: Jens Guenter Gaebelein, Jeroen Hribar
  • Patent number: 9999784
    Abstract: A system (101) for treatment of an epithelial tissue layer (3) is provided. The system comprises a reservoir (107), for containing an amount of a flowable medium, arranged to enable the medium, when contained in the reservoir, to be in contact with a surface (5) of the epithelial tissue layer, a light source (109) for generating a laser beam (11) during at least a predetermined pulse time, and an optical system for focusing the laser beam into a focal spot (15), and for positioning the focal spot in a target position. The target position of the focal spot is within the reservoir and within the medium, when contained in the reservoir, and the dimension of the focal spot and the power of the generated laser beam are such that, in the focal spot, the laser beam has a power density, which is above the characteristic threshold value for the medium, above which, for the predetermined pulse time, a laser induced optical breakdown event occurs in the medium.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: June 19, 2018
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Aliaksandr Bratchenia, Rieko Verhagen
  • Patent number: 9964403
    Abstract: Provided are a device and a method for detecting flatness of a surface of a display panel. The device comprises: a bearing platform for bearing a display panel; an image acquisition unit that moves in a detection plane parallel to a bearing surface of the bearing platform and is used for focusing detection points preset in a surface of the display panel facing the image acquisition unit in a direction perpendicular to the bearing surface of the bearing platform, and sending a focal length to a data processing unit; and a data processing unit used for calculating a distance of each of the detection points from the detection plane according to the focal length, and then determining the flatness of the surface of the display panel. The damage and pollution to the display panel may be avoided according to the device and method of the present invention.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: May 8, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Dezhi Xu, Xianxue Duan, Cheng Chen
  • Patent number: 9954333
    Abstract: A commutator is formed by providing an electrically insulating commutator body. First and second areas are defined on the commutator body covering a brush contact surface in an alternating manner. At least the surfaces of the first areas are formed of laser direct structured material. The first areas are treated by a laser to form metal particle layers. Conductive layers are formed on the metal particle layers by a plating process to form commutator segments. Terminals are connected to the conductive layers for connecting the commutator to rotor windings.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: April 24, 2018
    Assignee: Johnson Electric S.A.
    Inventor: Wilfried Gorlt
  • Patent number: 9945792
    Abstract: A system which may be used to generate a plurality of spots on a surface is provided. The spots may be aligned with the incident plane of oblique illumination. The system may include a diffractive optical element configured to split a beam into a plurality of beams by generating a plurality of diffraction orders. The system may also include a focusing lens configured to focus at least some of the plurality of beams on the surface in the plurality of spots. At least some of the plurality of beams may be focused on the surface at an oblique illumination angle. The system may also include an illumination source positioned off-axis relative to an optical axis of the diffractive optical element. Using the system, a plurality of spots may be generated on an inclined surface.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: April 17, 2018
    Assignee: KLA-Tencor Corporation
    Inventor: Guoheng Zhao
  • Patent number: 9931806
    Abstract: An embossing/debossing system and method for embossing or debossing an impressionable material, such as paper. The system may comprise a laser cutting apparatus and a stamping apparatus. The laser cutting apparatus may comprise a laser configured for cutting and/or ablating one or more patterns into a stencil material. The stamping apparatus may be configured to receive the stencil material from the laser cutting apparatus and may have an actuatable elastomeric press pad configured to press the impressionable material into the patterns formed in the stencil material by the laser cutting apparatus. The system may also comprise various feeding devices configured to feed the stencil material from the laser cutting apparatus to the stamping apparatus and/or configured to feed the impressionable material through the stamping apparatus.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: April 3, 2018
    Assignee: Preco, Inc.
    Inventors: Lowell Teague, Dana Poulain
  • Patent number: 9889523
    Abstract: A method is provided for processing a workpiece using laser radiation, particularly for the purpose of laser ablation. At least one laser beam is provided, which is affected using at least one changeable beam forming device. The laser beam subsequently impinges upon at least one processing area of the workpiece. Using the beam forming device, at least one specified adjustable beam profile is impressed upon the laser beam at the location of the processing area configured.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: February 13, 2018
    Assignee: Robert Bosch GMBH
    Inventors: Roland Gauch, Ulrich Graf
  • Patent number: 9885934
    Abstract: Portable apparatus for identifying and mitigating defects in electronic devices disposed on substrates or windows are disclosed herein. Such defects can be visually perceived by the end user. The substrates or windows may include flat panel displays, photovoltaic windows, electrochromic devices, and the like, particularly electrochromic windows.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: February 6, 2018
    Assignee: View, Inc.
    Inventors: Robert T. Rozbicki, Bruce Baxter, Trevor Frank
  • Patent number: 9857532
    Abstract: A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall of the substrate is inclined towards the surface of the substrate at an angle of approximately 87 degrees to approximately 89 degrees.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 2, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi-Min Chin, Jia-Hao Zhang, Chi-Han Chen, Mei-Ju Lu
  • Patent number: 9844833
    Abstract: A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: December 19, 2017
    Assignee: APPLE INC.
    Inventors: Michael M. Li, Anthony J. Richter, Dale N. Memering