Abstract: The invention relates to methods and systems for keyhole-free fusion cutting of a workpiece, wherein the workpiece is melted by a laser beam along a cutting joint and the molten mass produced is expelled from the produced cutting joint, e.g., by a gas jet at high pressure. According to the new methods at least one laser beam follows the laser beam in the cutting direction and influences the molten mass in such a manner that at least one of the two cutting flanks of the workpiece has a better cutting quality than when cutting without the trailing laser beam.

Abstract: A system for engraving a flexographic relief member includes a laser scanning apparatus providing a focused radiation beam. The flexographic relief member includes a laser engraveable flexographic member; a thin engraveable control layer on top of the flexographic member; and wherein the engraveable control layer has an engraving sensitivity lower than the flexographic member.

Abstract: Approaches for making a light-transmitting panel are disclosed. A panel is positioned on a support structure, and a stencil is positioned between a surface of the panel and a laser head. The stencil includes a plurality of openings. A defocused laser beam generated by the laser head is scanned over the openings in the stencil. The width of the defocused laser beam at a location at which the laser beam strikes the panel is at least as large as a size of the desired disruption, and the laser head is powered at a level and moved at a rate that creates a disruption in the surface of the panel at each opening.

Abstract: Various techniques are disclosed for an apparatus and a method to remove a layer from a substrate having a pattern formed on the layer. In one example, the apparatus comprises a stage configured to receive and hold the substrate. The apparatus may further comprise an irradiating device comprising a projection lens and configured to irradiate the surface of the substrate with pulses of laser light having a selected fluence to remove an interstitial portion of the layer between the pattern without removing the pattern for corresponding irradiated areas of the substrate. The pulses of laser light may be focused through the projection lens, and the stage and the projection lens may be configured to move continuously relative each other to irradiate a plurality of areas of the substrate with the pulses of laser light.

Abstract: In one form a maintenance device includes a flexible member with an inspection end sized to be inserted through an inspection port of a workpiece such as a gas turbine engine or a blade of a gas turbine engine. The maintenance device includes a directed energy member that in one form is configured to produce a double pulse laser with an interval time between a first one of the pulses and a second one of the pulses greater than the time of either the first one of the pulses or the second one of the pulses. The first one of the pulses is sufficiently powerful to produce a quantity of debris upon irradiation of the workpiece. The debris produced from the first one of the pulses can be evaporated by the second one of the pulses to eliminate and/or reduce a recast layer on the workpiece.

Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: Gradient-index (GRIN) lens fabrication employing laser pulse width duration control, and related components, systems, and methods are disclosed. GRIN lenses can be fabricated from GRIN rods by controlling the pulse width emission duration of a laser beam emitted by a laser to laser cut the GRIN rod, as the GRIN rod is disposed in rotational relation to the laser beam. Controlling laser pulse width emission duration can prevent or reduce heat accumulation in the GRIN rod during GRIN lens fabrication. It is desired that the end faces of GRIN lenses are planar to facilitate light collimation, easy bonding or fusing of the GRIN lens to optical fibers to reduce optical losses, polishing to avoid spherical aberrations, and/or cleaning the end faces when disposed in a fiber optic connector, as non-limiting examples.

Abstract: A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer, the mask including a layer covering and protecting the integrated circuits. The mask and a portion of the semiconductor wafer are patterned with a laser scribing process to provide a patterned mask and to form trenches partially into but not through the semiconductor wafer between the integrated circuits. Each of the trenches has a width. The semiconductor wafer is plasma etched through the trenches to form corresponding trench extensions and to singulate the integrated circuits. Each of the corresponding trench extensions has the width.

Abstract: A laser engraving device which can adjust its machining position is disclosed. The device includes a laser machine for supplying laser beam, a guide rod adjacent to and parallel to the laser machine, a galvanometric scanner coupled to the guide rod and being movable with the guide rod, and a driver disposed at an end of the guide rod for driving the guide rod.

Abstract: A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.

Abstract: An immersion lithographic apparatus includes a cleaning system for cleaning a component in the immersion lithographic apparatus in situ. The cleaning system is arranged to provide a cleaning environment in proximity of a predetermined position on a component to be cleaned. The system is also arranged to provide the cleaning environment substantially independent of a type of contamination present at the predetermined position.

Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: A non-contact glass shearing device and a method are described herein that vertically scribes or cuts a downward moving glass sheet to remove outer edges (beads) from the downward moving glass sheet. In addition, the non-contact glass shearing device and method can horizontally scribe or cut the downward moving glass sheet (without the outer edges) so that it can be separated into distinct glass sheets.

Abstract: A machine for the surface treatment of a cylinder includes a first operative station for supporting the cylinder and for bringing it into rotation around its longitudinal axis, and at least a second operative station cooperating with the first station for generating and emitting, by means of an optical fiber apparatus, pulsed laser radiations randomly striking the surface of the cylinder and defining a desired roughness on the same surface; the second station being adjustably coupled with the first station in a first direction parallel with respect to the axis of the cylinder and carrying one or more pulsed laser radiation emitting heads, and slidingly assembled with respect to the cylinder in a second direction perpendicular to the axis of the cylinder.

Abstract: A one-piece field-pole magnet is manufactured by filling a gap formed between magnetic pieces placed on a plane with an adhesive or resin. During the process, a pushing member applies a pushing force onto each of the magnet pieces in a thickness direction thereof. The pushing member comprises pushing parts each of which pushes each of the magnet pieces, thereby equalizing the pushing forces applied to the respective magnet pieces.

Abstract: An apparatus for laser scribing two transparent electrically conductive layers (72A,B; 73A,B) deposited on opposite surfaces of a transparent substrate (71A; 71B) comprising; a laser beam (74A), one or more lenses (75A, 76A, 77A) configured and positioned for adjusting the focal spot (78A; 78B) of the laser beam between a first position (78A) and a second position (78B), means for holding a substrate in a plane between the first and second position and means for moving the relative positions of the substrate (71A; 71B) and laser beam (74A) in two dimensions within the plane or a plane parallel to it, wherein in use, the first and second positions (78A; 78B) coincide with or are adjacent to exposed surfaces of the two transparent electrically conducting layers (72A,B; 73A,B).

Abstract: A welding arrangement and a welding process for forming a weld seam between two edge portions, wherein the edge portions form a Y joint having a root portion and a bevel portion, said root portion being welded by a hybrid laser electric arc welding process including directing a laser beam and an electric arc in a single interaction zone of plasma and molten metal. A hybrid laser electric arc welding head and welding submerged arc welding head are arranged on a common carrier structure for welding the Y joint.

Abstract: Embodiments of the present invention comprise an apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can be marked as the objects are conveyed along at least one path at a predetermined speed, the apparatus comprising, at least first and second lasers positioned adjacent one or more paths configured to direct a laser beam onto the objects to mark the same with indicia as the objects pass through the marking station, with each of the first and second lasers marking alternate following objects as they pass through the marking station.

Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

Abstract: A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. A pair of knife edges (13) adjust the divergence angle (?) of the laser beam (L1) incident on the objective lens (5) in the Y-axis direction. As a consequence, the cross section of the laser beam (L1) becomes an elongated form extending in the Y-axis direction at the point P2, while the maximum length in the Y-axis direction is regulated. Therefore, locating the point P2 on the front face of a work (S) can form an elongated working area extending in the Y-axis direction by a desirable length on the front face of the work (S).

Abstract: Provided is an etching system and a method of controlling etching process condition. The etching system includes a light source that irradiates incident light into a target wafer, a light intensity measuring unit that measures light intensity according to the wavelength of interference light generated by interference between reflected light beams from the target wafer, a signal processor that detects a time point at which an extreme value in the intensity is generated when the intensity of interference light varies according to the wavelength, and a controller that compares the extreme value generating time point detected from the signal processor with a reference time point corresponding to the extreme value generating time point and controls a process condition according to the comparison result.

Abstract: A laser machining system (20) employs a fast positioner (68), such as a pair of galvanometer mirrors (70), that directs a beam axis (24) at a specified velocity to a start position of a cutting path (92) in coincidence with one of multiple laser pulses emitted from a laser (28) a constant laser pulse repetition rate, which runs independently of the relative position of the beam axis (24) with respect to the workpiece (26).

Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Abstract: A surface treatment equipment is designed for forming nickel barriers on a plurality of terminals for preventing solder wicking is disclosed. The surface treatment equipment includes a retractable feeding system, a laser engraving system, an image sensor, and a control system. The retractable feeding system is utilized to transmit a strip that has the terminals. The laser engraving system is utilized to ablate the terminals. The image sensor is utilized to collect a plurality of images of the ablated terminals. The control system receives the images to perform image recognition. When a defective terminal is recognized, the control system controls the retractable feeding system to transmit in reverse and controls the laser engraving system to repeatedly ablate the defective terminal. The defective terminals can be automatically recognized by the image sensor accompanying the control system. Thus, the drawback of a human visual inspection is solved.

Abstract: A system, method, and device for etching an indicia onto a substrate includes a compact laser etching device having a delivery head, an emitter housing, a RF cable, and a communication cable. The delivery head has a beam steering mechanism and a hood assembly positioned between the beam steering mechanism and the substrate. The emitter housing has a laser for generating a laser beam, and a fold mirror positioned in an optical path of the laser beam for redirecting the laser beam into the beam steering mechanism. A remote RF electronics package drives the laser. Control electronics cause the beam steering mechanism to steer the laser beam into a pattern of the indicia. The delivery head may further include a plurality of suction cups for holding the compact laser etching device in engagement with the substrate.

Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Abstract: In a method for machining a workpiece, a laser beam (5) is guided across the workpiece surface by means of a beam guide (2, 51), wherein the laser beam guide comprises a first guide (2) effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide (51) simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.

Abstract: A laser system for processing conductive link structures includes a seed laser generating a seed laser beam. The seed laser is sliced by a modulator into a user configurable series of pulses and the pulses are optically amplified and applied to a conductive link structure. Preferably, the bandwidth of the seed laser is less than 1 nm with an IR center frequency, and the frequency of the laser light of the pulses is doubled or quadrupled prior to application to the conductive structure. Preferably, the pulses are about 1-18 nanosecond pulsewidth and are separated by 100-400 nanoseconds.

Abstract: A laser beam machining apparatus includes a height position detecting unit configured to detect the height position of an upper surface of a workpiece to be machined which is held on a chuck table, and a controller configured to control a condensing point position adjusting unit on the basis of a detection signal from the height position detecting unit. The height position detecting unit includes a detection laser beam oscillating unit configured to oscillate a detection laser beam having a wavelength different from the wavelength of the machining laser beam, and a reflected beam analyzing unit which analyzes a reflected beam generated upon reflection of the detection laser beam on the upper surface of the workpiece and which sends an analytical results to the controller. The laser beam machining apparatus further includes a condensing point position displacing unit configured to displace the condensing point position of the detection laser beam and the condensing point position of the machining laser beam.

Abstract: A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. As a consequence, the cross section of the laser beam (L1) becomes elongated forms extending in the X- and Y-axis directions at the points P1, P2, respectively. Therefore, when the points P1, P2 are located on the outside and inside of the work (S), respectively, an elongated working area extending in the Y-axis direction can be formed in a portion where the point P2 is positioned within the work (S).

Abstract: A laser match honing system and method are provided for processing one of a pair of mechanically matching components (1, 2) having matching portions (12, 22, 16, 26) that will be fitted with each other. A dimension of the matching portion (12, 16) of the first component (1) is measured and is then used for calculating the desired dimension of the corresponding matching portion (22, 26) of the second component (2). An actual dimension of the matching portion (22, 26) of the second component (2) is also measured. Then, the matching portion (22, 26) of the second component (2) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

Abstract: An apparatus and method for laser-assisted machining (LAM) of bone without raising the temperature of the surrounding bone is discussed. The method of LAM of bone involves determining a target bone needing to be machined an then scanning a high power density laser beam along the bone at a machining rate that produces low-heat affected zones (HAZ) on the target bone. The process and apparatus is advantageous over conventional technologies because it provides a chemically clean, coherent, and monochromatic beam to the region to be machined.

Abstract: Systems and processes for improved laser machining, such as micro machining, of a workpiece. Systems and processes involve directing at a first surface of the workpiece a laser beam and wherein at least the laser-irradiated region of the first surface of the workpiece is immersed in a liquid, and delivering to the liquid-immersed and laser-irradiated workpiece surface region at least a first ultrasound output from a first ultrasound device. The ultrasound output and the laser beam desirably impact the workpiece first surface substantially simultaneously.

Abstract: The angle of incidence (?) and azimuth (?) of a beam axis (32) can be moved relative to a workpiece (22) to provide desirable taper characteristics to a side wall (124) of a resulting kerf (120) produced by a focused laser beam (30) propagated along the beam axis (32).

Abstract: An embodiment includes a loading unit with an alignment mark configured to support a substrate, a laser beam generating unit configured to generate a laser beam toward the upper surface of the loading unit, a vision unit that causes the laser beam generating unit to irradiate the laser beam onto the substrate on the loading unit to form an alignment mark on the substrate and that generates corrected coordinate values based on the formed alignment mark on the substrate, a position detector located at the center of the loading unit to detect information about the laser beam generated by the laser beam generating unit, and a controller that controls an X-Y scanning mirror according to the corrected coordinate values, and controls power of the laser beam generated by the laser beam generating unit or the position of the loading unit according to the information detected by the position detector.

Abstract: The present invention relates to a method of manufacturing a bearing component, in which a visible identification mark is created on a surface of the component using a laser beam. The laser marking creates an oxidized layer on the component surface and, in an underlying region, alters the microstructure of the bearing steel from which the component is made. According to the invention, the mark is then rendered visually undetectable with the naked eye, by removing at least the oxidized surface layer of the mark. This exposes the altered microstructure, which is revealable by applying an etchant to the visually undetectable mark.

Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.

Abstract: A mask manufacturing apparatus includes a chamber, a laser beam irradiator, a stage, a cooling system, and a fan. The chamber provides an interior space therein. At least an upper wall of the chamber comprises a glass. The laser beam irradiator is disposed outside the chamber and configured to divide a laser beam into a plurality of sub-laser beams to irradiate the sub-laser beams onto a shadow mask material. The stage is disposed in the chamber and the shadow mask material is placed on the stage. The cooling system is configured cool the interior space. The fan configured to discharge heat generated in the interior space of the chamber to the outside of the chamber. Therefore, the shadow mask may be protected from overheating.

Abstract: A stent manufacturing device and methods for making intravascular stents and other medical devices. The stent manufacturing device may include a base, a laser or other cutting device coupled to the base, a horizontal motor coupled to the base, and a rotary motor coupled to the horizontal motor. A workpiece can be attached to the cutting device, for example adjacent the rotary motor, and the workpiece can be cut with the cutting device.

Abstract: A hand-guided marking system (1) is disclosed, which is furnished with a radiation source (2) for applying a marking (100) to a surface (101) of a workpiece (102). A camera (4) and at least one illumination device (6) are used for recording a part of the surface (101) of the workpiece (102). A protective housing (10) is mounted on a carrier frame (12) and has an opening (14) in the protective housing (10) that is located opposite the surface (101) of the workpiece (102). The beam source (2) is positioned in the carrier frame (12) in such manner that an optical axis (16) of the beam source (2) passes through the opening of the protective housing (10).

Abstract: An ablation method including a steps of ablating a region of a substrate (1) by a laser beam (3); and removing debris ablated from the region (1) by a flow of a fluid (7), namely, a gas or vapor, a liquid or a combination of the fluids. The flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter remove the entrapped debris from the region by directing the flow of fluid, with any entrapped debris, away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: The invention relates to a marking apparatus for marking an object with laser light, comprising a plurality of lasers and a control unit for individually activating each of the lasers to emit a laser beam (90a-i) acording to a sign to be marked. A set of deflection means (30) for directing the laser beams (90a-i) toward the object to be marked is provided, a set of telescopic means (40) comprising at least one telescopic means (40a-i) per laser beam (90a-i) is provided, and each telescopic means (40a-i) is adjustable for individually setting a focal length of the respective laser beam (90a-i).

Abstract: The invention relates to a marking apparatus (100) for marking an object with laser light, comprising a plurality of gas lasers (10) and a control unit for individually activating each of the gas lasers (10) to emit a laser beam according to a sign to be marked. The gas lasers (10) are stacked such that the laser beams emitted by the gas lasers (10) form an array of laser beams, in particular a linear array with parallel laser beams, each gas laser (10a-i) comprises laser tubes (12) that at least partially surround an inner area (5). The apparatus (100) further comprises beam-delivery means (14) for directing the array of laser beams into the inner area (5) and a set of deflection means (30) for rearranging the array of laser beams into a desired array of laser beams. The set of deflection means (30) is arranged in the inner area (5) and comprises at least one deflection means (33a, 33i) per laser beam, in particular at least one mapping mirror (33a, 33i) or one optical waveguide per laser beam.

Abstract: An apparatus for etching multiple surfaces of a hydroformed powder coated luminaire reflector is described. The system includes a laser, one or more high speed scan heads, a laser marking station and a conveyance device. The system positions a reflector into optical alignment with the scan heads to allow permanent etching of the surface thereof.

Abstract: The invention relates to a marking apparatus for marking an object with laser light, comprising a plurality of lasers and a control unit for individually activating each of the lasers to emit a laser beam (90) according to a sign to be marked. A set of deflection means (30) for rearranging the laser beams (90) into a desired array of laser beams (90) is provided, the set of deflection means (30) comprises at least two deflection means (33a-i, 34a-i) per laser beam (90), in particular at least two mapping mirrors (33a-i, 34a-i) or at least one optical waveguide and one lens per laser beam (90a-i), and each deflection means (33a-i, 34a-i) is individually adjustable in its deflection direction and/or individually shiftable.

Abstract: The invention relates to a marking apparatus (100) for marking an object with laser light, comprising a plurality of lasers (10), in particular gas lasers (10), and a control unit for individually activating each of the lasers (10) to emit a laser beam according to a sign to be marked. A deflection device (30) is provided by which at least two laser beams are combined on a common spot.