Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

Abstract: A method and system for preparing polysilicon slim rods, the method and system including: placing a piece of polysilicon on a fixture; applying a predetermined laser beam or abrasive jet to the piece of polysilicon; and separating a polysilicon slim rod from the piece of polysilicon. The laser beam may be used for either cutting or for cracking depending on the operating parameters chosen. There may also be various combinations of cutting and cracking used in order to separate the slim rod from the piece of polysilicon. For example, the laser cut may be a scribing and/or partial cut and the separation may be completed by cracking the remaining silicon. In this case, the cracking may be accomplished by, for example, mechanical bending or laser cracking. Generally speaking, a laser beam used for cracking may be different from and have differing operating parameters from a laser beam used for cutting.

Abstract: Disclosed are a method for manufacturing an anticorrosive thin film resistor and a structure thereof, which includes a thin film resistor and a protection layer formed on the thin film resistor. The method uses one of silicon (Si) or tantalum (Ta) to serve as a film coating target and, during a process of reactive sputtering, mixes reactive oxygen or nitrogen with a discharge gas so as to coat a thin film on the thin film resistor with the operation temperature of the reactive sputtering process controlled between 100° C.-500° C. As such, the film coating target is passivated to form an anticorrosive protection layer having a thickness of at least 1 ?m to prevent change of electrical property of the resistor resulting from electrolytic corrosion.

Abstract: A laser etching method for a transparent conductive plate includes the steps as follows: providing a transparent conductive plate having a transparent conductive layer; continuingly emitting a plurality of laser beams to the transparent conductive layer, and controlling the center points of the laser beams to move in a front path and a rear path partially overlapping a beginning portion of the front path for forming an end connection groove connecting the beginning and the end thereof, or controlling the center points of the laser beams to move in a transverse path and a longitudinal path without overlapping the transverse path for forming a T-shaped groove, or controlling the center points of the laser beams to sequentially move in a first path, a curve path, and a second path substantially perpendicular to the first path for forming a curve groove.

Abstract: In an aberration-correcting method according to an embodiment of the present invention, in an aberration-correcting method for a laser irradiation device 1 which focuses a laser beam on the inside of a transparent medium 60, aberration of a laser beam is corrected so that a focal point of the laser beam is positioned within a range of aberration occurring inside the medium. This aberration range is not less than n×d and not more than n×d+?s from an incidence plane of the medium 60, provided that the refractive index of the medium 60 is defined as n, a depth from an incidence plane of the medium 60 to the focus of the lens 50 is defined as d, and aberration caused by the medium 60 is defined as ?s.

Abstract: A device for assisting in the production of wiring harnesses. The device includes a board, with a groove that makes it possible to receive cables. The device further includes an arrangement for transporting a cable, including a nozzle making it possible to position the cable in the groove of the board. Further, a control is configured and arranged to drive the displacement of the cable transport arrangement. Also, flexible and resilient holding elements are provided for holding cables in the groove. The holding elements deform to allow the nozzle to pass when the nozzle positions a cable in the groove and then revert to their initial form to hold the cable in the groove.

Abstract: A light coupling structure is provided that includes a diffractive grating coupler, a total internal reflection (TIR) mirror, and a polymer waveguide. The TIR mirror is formed within the polymer waveguide to direct light signals between the diffractive grating coupler and the polymer waveguide.

Abstract: A combined multi-axial manipulator and guided vehicle (10). The combination (10) comprises a trackless guided vehicle (12), a multi axial manipulator (14) and a carrier (16) which may be configured as a passenger module.

Abstract: Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a front surface having a plurality of integrated circuits thereon involves forming a mask layer above the front surface of the semiconductor wafer. The method also involves laser scribing the mask layer and the front surface of the semiconductor wafer to provide scribe lines in the mask layer and partially into the semiconductor wafer. The laser scribing involves use of a dual focus lens to provide a dual focus spot beam. The method also involves etching the semiconductor wafer through the scribe lines to singulate the integrated circuits.

Abstract: A multi-function, adjustable chiropractic table comprises a body section fixed to a table frame. A cervical section is pivotally attached to the table frame and securable at a desired angle. The cervical section comprises a padded head support, forehead strap, and neck bolsters. The head support is slidably mounted in a tray and translatable therein using a scissors mechanism, for linear axial traction. Pivotally mounting the tray to the cervical section permits lateral traction. A four-bar linkage, including a base frame, permits raising/lowering of the table using an actuator activated by a foot triggered wave switch comprising proximity sensors. The body section comprises a chest, lumbar, and leg sections. The chest section is replaceable with a treatment module comprising hot and cold compresses, or a laser enhanced spinal decompression therapy apparatus comprising a laser driven by two linear actuators to emit light according to one or more treatment protocols.

Abstract: An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.

Abstract: A laser processing apparatus including a dust discharging unit for discharging dust generated by the application of a laser beam from a focusing unit to a workpiece. The dust discharging unit includes a dust collector provided below the focusing unit and a suction unit connected to the dust collector. The dust collector has a U-shaped configuration composed of a rectangular top wall having an opening for allowing the pass of the laser beam applied from the focusing unit, a first side wall projecting downward from one side edge of the top wall, and a second side wall projecting downward from the other side edge of the top wall so as to be opposed to the first side wall. The suction unit includes a suction duct having one end connected to the dust collector and the other end connected to a vacuum source.

Abstract: Described herein is a device that generates a beam of light with uniform intensity. The device includes an array of light sources. The light generated passes through a beam splitter. One beam is used for feedback to maintain uniform intensity. The other beam passes through a barrel which is used to mold the beam with uniform intensity into the desired shape and to reduce divergence. The device can be used as part of a quality control system for testing a photoreceptor drum.

Abstract: Laser processing systems for processing one or more materials or combination of materials with composite laser energy and associated systems and methods are disclosed herein. In several embodiments, for example, a laser processing system includes one or more laser sources that provide a first plurality of first laser beams and preconditioning optics that combine the first laser beams into a first composite beam. The system also includes recomposition optics that separate the first composite beam into second plurality of second laser beams and combine the second laser beams into a second composite beam. The system further includes beam modification optics that modify wave fronts of one or more of the individual second laser beams such that the second composite beam has one or more beam characteristics that are modified relative to corresponding beam characteristics of the first composite beam. For example, the second laser beams of the second composite beam can focus at a common focusing plane.

Abstract: A system directs a laser beam to mark a material with an alphanumeric code. Character and quality information corresponding to a mark to apply to the material with the laser beam can be received, a font definition that specifies character segments can be obtained, a set of multiple spaced locations can be generated from the character segments in accordance with the character and quality information, and the material can be marked with the laser beam by directing the laser beam to dwell at the locations and move between the locations without deactivating the laser beam.

Abstract: This disclosure relates to a method for the nondestructive testing, using laser ultrasonics, of a composite part having a fibrous reinforcement in a resin that optically scatters the laser, includes: a) taking a measurement of the thickness of the resin of the part on the surface that is illuminated during the laser shot, which is capable of generating a thermoelastic effect in said resin and which is referred to as an ultrasonic laser shot; b) adjusting the power of the laser of said ultrasonic shot on the basis of the thickness measurement carried out in step a) so as to eliminate any risk of a flash on the reinforcements; and c) producing the ultrasonic laser shot at the power determined during step b). The device used for implementing the method comprises a combined photoacoustic imaging and low time-coherence interferometry (OCT) system.

Abstract: A system is disclosed for repairing liquid crystal display panels that include a polarizing film. The system includes a laser repair optical system, a measurement optical system, and a processor. The laser repair optical system includes a polarization unit for modifying a polarization of a laser repair beam along a laser output path that is directed toward a workpiece. The measurement optical system includes an illumination source for providing measurement illumination along a measurement illumination path, and a detector for detecting reflected measurement illumination. The processor adjusts the polarization unit responsive to the reflected measurement illumination.

Abstract: Systems and methods are disclosed for delivering a substance into a plant. The systems and methods include a light energy that is applied to a first area on the plant to create a first indentation. The first indentation can be a minor incision or a rupture of a portion of the first area. Once the first indentation is created, a first dosage of the substance is applied to the first area in an amount effective to promote a biological response of the plant. It is contemplated that at least a portion of the substance is absorbed by the plant via the first indentation.

Abstract: An optical contact element for coupling a laser processing device to an object to be processed is described, wherein the laser processing device focuses a scanned laser beam through a surface of the object into a certain region of the object and the contact element comprises an entrance side for receiving the scanned laser radiation and an exit side imparting a defined surface curvature to the surface of the object upon contact therewith, wherein a diffractive optical element is provided on the entrance side, which element reduces the angle of incidence of the laser radiation on the surface of the object.

Abstract: A laser material processing system comprises: a housing defining an engraving chamber, an xy laser beam steering system, and a non-telescoping sliding focus mechanism. The housing includes a removable bottom panel that allows processing of workpieces that exceed dimensions of the engraving chamber and allows stacking of the system on modular attachments for specialized functions. The focus mechanism includes a carriage mirror subassembly attached to the x-axis carriage, a sliding member moveably attached to the carriage mirror subassembly, and a focusing lens subassembly attached perpendicularly to the lower end of the sliding member. The carriage mirror subassembly and the focusing lens subassembly are configured to receive and focus a laser beam to a focal point. The focusing lens subassembly is adjusted along a z-axis by disengaging the locking component and vertically sliding the sliding member and is locked into a position by engaging the locking component with the sliding member.

Abstract: Apparatuses for forming chamfers on superabrasive tables of cutting elements for earth-boring tools include a chuck for temporarily holding and positioning a cutting element, and at least one emitter for emitting a beam of energy toward an edge of a superabrasive table of a cutting element held and positioned by the chuck. Methods of forming cutting elements for earth-boring tools and methods for forming earth-boring tools are also disclosed.

Abstract: A method and apparatus to produce controlled ablation of material through the use of laser pulses of short pulse widths at short wavelengths.

Abstract: A laser engraving device includes a retractable enclosure which provides full access to the product to be engraved for set-up while providing complete enclosure of the product during the engraving operation.

Abstract: A grain oriented electrical steel sheet has a total length of cracks in a film on a steel sheet surface, of 20 ?m or less per 10000 ?m2 of the film, wherein magnetic domain refinement interval in a rolling direction of the steel sheet, provided in magnetic domain refinement through substantially linear introduction of thermal strain from one side of the steel sheet corresponding to a winding outer peripheral side of a coiled steel sheet at a stage of final annealing in a direction intersecting the rolling direction; and deflection of 3 mm or less per unit length: 500 mm in the rolling direction of the steel sheet.

Abstract: A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.

Abstract: The invention relates to a camera arrangement having at least one wide-angle camera for monitoring an elongated space, and to a mount for the camera. It is provided in this case that the mount is designed for directing the wide-angle camera with a field of view of low distortion onto distant parts of space, and for directing the wide-angle camera with a field of view of higher distortion onto closer parts of space.

Abstract: A microlens array is a stacked body of four unit microlens arrays, and the optical axis of a portion of the unit microlens arrays can be shifted from the optical axis of the other unit microlens arrays. In a scanning exposure apparatus, a CCD line camera detects an image on a substrate, and using a first-layer pattern on the substrate as a reference pattern, in a case in which a mask exposure pattern does not match the reference pattern, shifts the optical axis of the microlenses to adjust the magnification of a projection pattern using the microlens array. This makes it possible to adjust the exposure position using the microlens array so that even when the exposure pattern deviates from the reference pattern, the deviation can be detected during exposure and an exposure pattern misregistration can be prevented, enabling the precision of the exposure pattern to be enhanced in an overlay exposure.

Abstract: A regenerative amplifier according to one aspect of this disclosure is used in combination with a laser device, and the regenerative amplifier may include: a pair of resonator mirrors constituting an optical resonator; a slab amplifier provided between the pair of the resonator mirrors for amplifying a laser beam with a predetermined wavelength outputted from the laser device; and an optical system disposed to configure a multipass optical path along which the laser beam is reciprocated inside the slab amplifier, the optical system transferring an optical image of the laser beam at a first position as an optical image of the laser beam at a second position.

Abstract: A medical device processing system is provided which includes a support wall having a support surface for supporting a medical device thereon, such as a graft device. The support wall is generally translucent to allow light to pass therethrough to illuminate a medical device supported on the support surface. The support wall can be formed from other suitable materials that are clear or at least translucent to allow light from a light emitting member to pass therethrough to illuminate the medical device. The support wall and/or the support surface can have any shape suitable to support and allow optimal transmission of light toward the medical device. The support wall can be generally tubular shaped to support tubular shaped medical devices, such as stent grafts.

Abstract: The invention is directed to an apparatus and a method for generating separating fissures in a substrate through action of a laser beam having an elliptical beam cross section with a beam spot length in a movement direction along a separating fissure to be generated in the substrate. The apparatus and method are particularly suitable for separating fissures which start or end on the substrate surface. A suitable diaphragm prevents radiation from impinging on the substrate before the start and after the end of the fissure.

Abstract: Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

Abstract: The invention provides an apparatus for fabricating a periodic micro-pattern by laser beams. The apparatus includes an ultrafast laser light source configured to generate an output laser beam. A diffraction optical element is configured to divide the output laser beam into a plurality of diffractive laser beams. A confocal system is configured to focus the plurality of diffractive laser beams on a focal point, so that the plurality of diffractive laser beams produces an interference light beam with interference phenomena. The interference light beam ablates a surface of an element to fabricate a periodic micro-pattern on the surface of the element. The confocal system includes a first lens, a second lens and a light shielding mask. The plurality of diffractive laser beams passes through the first lens, the light shielding mask and the second lens in sequence.

Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

Abstract: A thin-film scribing apparatus employing an optical device converts a low M2, Gaussian or pseudo-Gaussian beam into an inverted Gaussian beam. The all refractive optical device is such that it is not susceptible to either beam size or angular variations and exhibits very little loss of energy for the transformation process. The output can be configured for either single or dual-axis operation where the geometric shape of the beam is rectangular or square with steep edge intensity. The resulting rectangular beam requires less beam overlap and has very little shoulder in the intensity profile, providing high uniformity scribe features with greatly improved processing speeds.

Abstract: An apparatus for radiatively scribing a substantially planar semiconductor substrate along a scribelane that extends between opposing rows of semiconductor devices on a target surface of the substrate, said scribelane having a length extending parallel to a first direction and a width extending parallel to a second direction, these first and second directions lying respectively parallel to X and Y axes of a Cartesian coordinate system, comprising: A substrate holder for holding the substrate; An illuminator for producing an adjustable array of several light beams; A projection system for focusing said light beams onto said target surface of the substrate when held on the substrate holder; An actuator system for causing relative displacement of the substrate holder with respect to said light beams parallel to an XY plane, which apparatus further comprises: An adjustable spatial filter located between said illuminator and said substrate holder, comprising a plurality of motorized plates whose position can

Abstract: An adjustable system for controlling an amount of gas permeability allowed through multilayer material. A laser is controlled through a controller, and the laser processes the multiple layer material to remove only some of the layers in only an area. The area can be a pattern such as a line, or can just be a pattern of areas. The layers are removed without fully penetrating the material, thus adjusting the gas permeability. This allows gases and vapors to transmit into the package thru the scored area more specifically thru the remaining material at a faster rate than a non-scored material. The pattern can score along a line to allow gases and vapors to pass through more rapidly. The laser beam does not cut through the entire structure, and the package remains sealed. This means, therefore, that the amount of gas/vapor permeability can be changed for a sealed package, e.g., with material therein.

Abstract: A system for creating marked can tabs may include an isolation mechanism located in the path of the tab material strip between a tab material dereeler and a tab forming press and a system suitable for marking the tab material strip. The isolation mechanism may be configured to convert discontinuous motion of the tab material strip proximate the tab forming press into continuous motion of the tab material strip at the dereeler. The system may be suitable for marking the tab material strip. The marking system may be located between the dereeler and the isolation mechanism such that the laser system acts on the tab material strip while it is moving at a relatively constant speed.

Abstract: A method and related device for machining a workpiece is provided, wherein material of the workpiece is removed in a machining region by a non-contact removal process. The workpiece is excited by means of an excitation oscillation having a natural resonant frequency of the workpiece, or a composite comprising the workpiece and a coupling element that is rigidly coupled to the workpiece is excited by means of an excitation oscillation having a joint natural resonant frequency of the workpiece and the coupling element. The natural resonant frequency is selected such that in the machining region an oscillation occurs that has a maximum oscillation amplitude in relation to the excitation amplitude of the excitation oscillation.

Abstract: A system and method for precision cutting using multiple laser beams is described. The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: Embodiments of the present invention comprise an apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can be marked as the objects are conveyed along at least one path at a predetermined speed, the apparatus comprising, at least first and second lasers positioned adjacent one or more paths configured to direct a laser beam onto the objects to mark the same with indicia as the objects pass through the marking station, with each of the first and second lasers marking alternate following objects as they pass through the marking station.

Abstract: In a method for re-imaging a printing form that has been used for printing in a prior printing process a substrate of the printing form is cleaned globally of ink or varnish and the substrate is treated abrasively globally in order to erase a preceding printing image. The substrate to be imaged with a new printing image is treated locally in image regions with a pulsed laser beam and, in the process, a nanoscopic and hydrophobic surface structure is produced locally. The substrate is treated globally with a hydrophilicity intensifier, as a result of which the substrate becomes hydrophilic locally in the previously hydrophobic image regions. An apparatus has a corresponding erasing unit and an imaging unit with a femtosecond laser.

Abstract: An optical scanning device includes: a projector configured to radiate laser light incident thereon while causing the laser light to make angular movement around a projection center, and a reflector with a parabolic surface, the reflector being configured to reflect the laser light from the projector. The projection center is positioned at a focal point of the parabolic surface. The projector radiates the laser light such that the greater a difference between a rotation angle of the laser light and a reference angle, the lower an angular speed of the laser light, the reference angle being the rotation angle of the laser light when the laser light reflects on a vertex of the parabolic surface. A laser machining device includes the optical scanning device, and is configured to cause the laser light from the reflector to fall on a workpiece to form a machining line.

Abstract: A coordinate detecting device includes a resistive film formed on a substrate and a common electrode for applying a voltage to the resistive film, wherein a potential distribution is created in the resistive film, an electric potential of the resistive film at a contact position is detected, and a position of the contact position of the resistive film is detected. In a manufacturing apparatus, a laser light source irradiates laser light to remove a part of the resistive film to form a resistive film removed part, an optical system converges the laser light, a plurality of probes measure electric potentials of a surface of the resistive film with the common electrode providing the voltage to the resistive film, an X-Y table moves the substrate at least two-dimensionally, and a control part controls the X-Y table and the laser light source.

Abstract: A method and apparatus for the laser machining of an unfinished object into a cutting tool with a cutting edge and a free surface. A laser generates laser beam impulses which are directed by a redirecting arrangement onto a surface of the unfinished object. An impulse reaches an impact location on the surface of the unfinished object under an inclination angle between the laser beam direction (R) of the impulse and the surface to be formed. The redirecting arrangement is controlled so that the laser beam impulses impact at adjacent impact locations and form a pulse zone. With a positioning arrangement a relative movement between the pulse zone and the unfinished object of predetermined speed is established so that the pulse zone formed by the impact locations moves along the surface of the unfinished object and an ablation layer of a layer thickness (dS) is removed with each contour pass.

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The mask is composed of a layer covering and protecting the integrated circuits. The mask is patterned with a split-beam laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the integrated circuits.

Abstract: In embodiments, a method of laser scribing a mask disposed over a semiconductor wafer includes determining a height of the semiconductor over which a mask layer is disposed prior to laser scribing the mask layer. In one embodiment the method includes: determining a height of the semiconductor wafer under the mask in a dicing street using an optical sensor and patterning the mask with a laser scribing process. The laser scribing process focuses a scribing laser beam at a plane corresponding to the determined height of the semiconductor wafer in the dicing street. Examples of determining the height of the semiconductor wafer can include directing a laser beam to the dicing street of the semiconductor wafer, which is transmitted through the mask and reflected from the wafer, and identifying an image on a surface of the wafer under the mask with a camera.

Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

Abstract: Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.

Abstract: A rotary tool (21) working surface (23) includes a plurality of cutting bodies (24). The rotary tool (21) can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface (23) is ascertained by an optical measuring arrangement (29). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (23). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (29), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies (24a, 24b) are machined and/or removed by a laser device (35).

Abstract: A pulsed laser beam is applied to a workpiece held on a chuck table by a laser beam applying unit. The laser beam applying unit includes a pulsed laser beam oscillator, a focusing lens, and a piezoelectric motor for displacing the focusing unit in a direction inclined at a predetermined angle (?) with respect to the Z direction. A controller controls the frequency and voltage of an RF current to be applied to the piezoelectric motor in relation to the repetition frequency of the pulsed laser beam to move the focusing unit in the X direction by ?x and in the Z direction by ?z in feeding the chuck table in the X direction, thereby displacing the focal point of the pulsed laser beam to be focused by the focusing lens in the thickness direction of the workpiece held on the chuck table.