Abstract: A method of manufacturing a metal product comprise forming a base region on a surface of a metal member by repeatedly scanning along a predetermined first direction while irradiating the surface of the metal member with a base laser beam over a first set of rows. The method further comprises forming a marking by repeatedly scanning along a predetermined second direction while irradiating the surface of the metal member with a marking laser beam over a second set of rows. The second direction is different from the first direction. An identification code having a predetermined pattern comprises a combination of the base region and the marking.

Abstract: There is provided a substrate support device. The substrate support device includes a substrate support part on which a wafer is deposited, the substrate support part including a first mesh electrode and a second mesh electrode disposed under the first mesh electrode; a chucking circuit configured to apply a DC voltage to the first mesh electrode; and an edge control circuit configured to control timings of operations related to the first mesh electrode and the second mesh electrode and control RF (Radio Frequency). The second mesh electrode is divided into a plurality of second sub-mesh electrode to remove an induced electromotive force generated due to a closed loop.

Abstract: Vitreous material treatment uses a piece of vitreous material having two opposite faces and a laser emission beam source. The vitreous material is heated, and a laser beam radiated on one of the faces of the vitreous material to scan following a line surpassing the opposite edges of the face of the vitreous material while the vitreous material oscillates along a path. The scan is performed while the vitreous material is heated. The vitreous material is cooled. The laser beam scan follows a line surpassing the opposite edges of the face. The scan performed oscillating between a first point and a second point.

Abstract: A laser processing method includes a scattered-light blocking film stacking step of stacking a scattered-light blocking film that blocks scattered light of a laser beam on an upper surface side of a wafer, a holding step of holding a lower surface side of the wafer by a chuck table, a laser processing step of forming a layer of water on the upper surface side of the wafer and irradiating a region to be processed in the wafer with the laser beam while moving the chuck table and a laser beam irradiation unit relatively, and a scattered-light blocking film removal step of removing the scattered-light blocking film from the wafer for which the laser processing step has ended.

Abstract: A device for preparing a gaseous sample obtained from a solid sample. The device includes a laser source arranged to emit a laser beam which is capable of generating calcination and/or combustion of a portion of the solid sample, a collector arranged to collect a gaseous sample of a gas emitted during the calcination and/or combustion of the portion of the solid sample; the laser beam has an irradiance less than 5 MW/cm2 in a given impact zone on a surface of the sample, and including an optical fibre for propagating the laser beam between the laser source and the given impact zone on the surface of the sample.

Abstract: Methods and systems for the laser surface treatment on stainless steel alloys and nickel alloys may include a computer may be programmed to set a laser path corresponding to a predetermined geometric pattern. A laser may be coupled to the computer and apply a pulsed laser beam to a contact surface of the substrate along the predefined geometric pattern. The pulsed laser beam may have a laser power between 0.1 W and 100 W, single pulse fluence 1 mJ/mm2 and 1025 mJ/mm2 and a laser speed between 25.4 cm/s and 127 cm/s. The laser may generate an open pore oxide layer on the contact surface of the substrate with a thickness of 0.1-1 ?m, an open pore distance of 0.05-1 ?m. The open pore oxide layer may have a topography corresponding to the predefined geometric pattern. The topography may contain open pore structures and promote adhesive bond performance.

Abstract: A method for manufacturing a glass substrate including an opening includes forming lines of inner and outer circumferential portions irradiated with a laser beam along substantially concentric circles in a surface of a glass blank, separating a portion on an inner side of the line of the outer circumferential portion of the glass blank and a portion on an outer side of the line of the outer circumferential portion from each other by heating the portion on the outer side of the line of the outer circumferential portion with radiant heat, and separating a portion on an inner side of the line of the inner circumferential portion of the glass blank and a portion on an outer side of the line of the inner circumferential portion from each other by heating the portion on the outer side of the line of the inner circumferential portion with radiant heat.

Abstract: A direct write laser based machining process wherein a laser beam is controlled to machine a glass material in an interlaced raster scan pattern. An embodiment of machining a glass substrate to form an optical element is described. An ultrashort pulsed laser is used for machining and smoothing fused silica, followed by CO2 laser polishing. High speed and high quality machining is possible using this approach, which allows efficient use of high laser repetition rates.

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses into the substrate through the first surface of the substrate and, subsequently, through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least substantially transparent and a beam waist of the focused beam of laser pulses is closer to the second surface than to the first surface. The focused beam of laser pulses is characterized by a pulse repetition rate, a peak optical intensity at the substrate and an average power at the substrate sufficient to: melt a region of the substrate near the second surface, thereby creating a melt zone within the substrate; propagate the melt zone toward the first surface; and vaporize or boil material of the substrate and located within the melt zone.

Abstract: A method for processing a transparent workpiece includes applying a fluid film having a first refractive index to a impingement surface of the transparent workpiece that has a second refractive index. Further, a difference between the first refractive index and the second refractive index is about 0.8 or less and the impingement surface comprises a surface roughness Ra of about 0.1 ?m or greater. The method also includes forming a defect in the transparent workpiece by directing a laser beam oriented along a beam pathway and output by a beam source, through the fluid film, through the impingement surface, and into the transparent workpiece such that a portion of the laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing the defect within the transparent workpiece.

Abstract: A device includes a first laser emitter, a second laser emitter, and a separating portion. The first laser emitter is configured to emit, in an outer circumferential portion of a bonded substrate including a first substrate and a second substrate bonded to each other, a first laser beam into the first substrate from a side of the first substrate to form a modified layer. The second laser emitter is configured to emit a second laser beam to a material layer that is arranged between the first substrate and the second substrate and is provided on the second substrate from a side of the second substrate, to cause peeling between the second substrate and the material layer. The separating portion is configured to separate an outer circumferential portion of the first substrate and an outer circumferential portion of the material layer from the outer circumferential portion of the bonded substrate.

Abstract: Systems and methods here may be used for a setup of fluorescence image capturing of a gemstone, such as a diamond placed on a flat stage. Some examples utilize a setup that both sends light and captures the image from the table side of the gemstone by passing ultraviolet (UV) light between 10 nm and 400 nm to the gemstone and capturing the excited fluorescence image for analysis through a dichroic beam splitter. In some examples, the cutoff is 300 nm. The dichroic beam splitter arrangement allows for the camera to focus on the same interface of the stage and gemstone over and over for ease of use and without moving, changing, or adjusting the equipment for different samples.

Abstract: Laser welding is performed while moving irradiation positions of a laser beam and a measurement beam in forward, rightward, rearward and leftward directions, and the penetration depth of a weld portion is measured during laser welding in each of the directions. Then, a direction in which a value smaller than a reference value is measured is determined to be an optical axis deviation direction, and a correction value is added to the values measured during the laser welding when the laser welding is performed in the optical axis deviation direction.

Abstract: Systems and methods are provided for generating microscale structures and/or nanoscale structures, surface profiles, and surface chemistries on medical devices. Embodiments disclosed herein utilize exposure of pulsed laser radiation on to a surface of a material by a pulsed laser. The pulsed laser according to embodiments disclosed herein is configured to emit at least one laser pulse toward the surface and thereby modify the profile of the surface in order to selectively promote or inhibit bioactivity and medical functionality of the material. By selectively promoting or inhibiting bioactivity of the material, enhanced biointegration at a cellular level may be achieved. For example, modifying the surface profile and/or surface chemistry of a first substrate material can improve adhesive and/or chemical bonding of the first material to a bioactive second coating material.

Abstract: A method for forming in particular reflection-reducing nanostructures (5) on a preferably polished surface (3) of a crystalline, in particular ionic, substrate (1) for transmission of radiation in the FUV/VUV wavelength range. The method includes: providing a surface (3, 7), which surface is not oriented along a lattice plane having a minimum surface energy, on the substrate (1) or on a layer (6) applied to the substrate (1) by a coating method, in particular vacuum vapor deposition, and introducing an energy input (E) into the surface (7) for rearranging the surface (7) to form the nanostructures (5), wherein the energy input (E) is generated by irradiating the surface (7) with electromagnetic radiation (4). Also, an optical element for transmission of radiation in the FUV/VUV wavelength range.

Abstract: A deposition mask for manufacturing a display panel includes a metallic base having a thickness of about 50 micrometers to about 200 micrometers and a plurality of openings defined therein, wherein at least some of the openings include a first opening having a first width and a second opening having a second width smaller than the first width respectively defined along a thickness direction of the metallic base, and wherein the metallic base includes a first part in which the first opening is defined, and a second part in which the second opening is defined, the second part having a width that increases in a direction downward from a top surface of the metallic base along the thickness direction of the metallic base.

Abstract: An apparatus for waste heat recovery is provided. The apparatus includes a base block disposed adjacent to a heat source, a thermoelectric generator including a first end and a second end, the first end being thermally coupled to the base block and configured to receive heat from the heat source, and a thermoelectric cooler including a third end and a fourth end, the third end being thermally coupled to the second end. The thermoelectric cooler is configured to receive an electric current, which causes the third end to cool and the fourth end to heat such that the third end conducts heat from the second end. Related apparatus, systems, techniques, and articles are also described.

Abstract: A method for cleaning a substrate includes the following: exposing the substrate to a cleaning agent to remove impurities on a surface of the substrate; exposing the substrate to a dewetting chemical agent in a liquid phase to remove the cleaning agent on the surface of the substrate; solidifying the dewetting chemical agent in the liquid phase remaining on the surface of the substrate to obtain the dewetting chemical agent in a solid phase; and sublimating and removing the dewetting chemical agent in the solid phase.

Abstract: A mail screening apparatus is provided to perform the inspection of mail or similar objects. Terahertz inspection is used to localize potential suspicious areas by imaging the contents inside the envelope or small parcel. The mail screening apparatus includes a primary and a secondary inspection zone, preferably allowing inspection of the mail in a normal and a zoomed mode, respectively. The same light source, image capture device and intervening optical components are used in both normal and zoomed modes. Metal detection may optionally be used to enhance awareness in the presence of metallic content. In one implementation, metal detection zones are provided in an orthogonal configuration with respect to the primary inspection zone used for terahertz imaging to accommodate for both manual and automatic inspection of mail.

Abstract: A system and method for array system for cells, organoids and organs culture and testing. The system includes a disposable chips and systems with actuators, sensors, software/firmware and smart device App. The disposable includes standard well plates, custom well plates, T-flasks, microfluidic chips. The system includes vascular fluidics using gravity-driven flow and pneumatic flow, media, reagents, protein and collagen dispensers in wells or surfaces, manufacturing techniques for multi-layer chips and plates and culture system with gas and media control.

Abstract: In various embodiments, workpieces are processed, e.g., via welding or cutting, while the shape and/or one or more other parameters of the laser processing beam are altered. The shape and/or one or more other parameters of the laser processing beam may be varied based on one or more characteristics of the workpiece.

Abstract: A device and method for altering biochrome ratios in plant leaves is provided. The device and method generally include a light source; and means of directing the light source to deliver an altering spectrum to a group of cells. The altering spectrum alters the biochrome content of a group of cells to produce a contrasting color that creates a desired pattern on a leaf. The device may include a first light source that emits a main growth spectrum, a second light source that emits an altering spectrum; and means of directing the first and second light source to a group of cells, wherein the altering spectrum alters the biochrome content of a group of cells to create a desired pattern on a leaf.

Abstract: A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.

Abstract: The invention provides a method for laser modification of a sample to form a modified region at a target location within the sample. The method comprises positioning a sample in a laser system for modification by a laser; measuring tilt of a surface of the sample through which the laser focusses; using at least the measured tilt to determine a correction to be applied to an active optical element of the laser system; applying the correction to the active optical element to modify wavefront properties of the laser to counteract an effect of coma on laser focus; and laser modifying the sample at the target location using the laser with the corrected wavefront properties to produce the modified region.

Abstract: A computer system of a finishing center, such as a mobile finishing center, includes a tool that allows a customer to preview or create new designs for apparel before purchase and before laser finishing. Software and lasers are used in finishing apparel to produce a desired wear pattern or other design. Based on a laser input file with a pattern, a laser will burn or ablate the pattern onto apparel. With the tool, the customer will be able to preview, create, make changes, and view images of a design, in real time, before purchase and burning or ablation by a laser. Input to the tool can include fabric template images, laser input files, and damage input. In an implementation, the customer or another user can also move, rotate, scale, and warp the image input.

Abstract: A system for coordinated laser marking of mid-conveyance food includes a controller, multiple lasers, and one or more industrial components. The lasers are in network communication with the controller. The controller can send a first instruction set, having a first language, to a first laser, and a second instruction set, having a second language different from the first language, to a second laser, the first laser associated with a first conveyor of multiple conveyors, and the second laser associated with a second conveyor different from the first conveyor. During operation, the first laser applies a marking to a first product as the first product is conveyed along the first conveyor, based on the first instruction set. Also during operation, the second laser applies the marking to a second product as the second product is conveyed along the second conveyor, based on the second instruction set.

Abstract: A laser processing apparatus includes: a chuck table for holding a single-crystal SiC ingot on a holding surface thereof; a laser beam applying unit for applying a laser beam to the single-crystal SiC ingot held on the holding surface of the chuck table; and a camera unit configured to capture an image of the single-crystal SiC ingot held on the holding surface of the chuck table. The chuck table includes a porous material making up the holding surface and a glass frame made of a non-porous material and having a recess defined therein and receiving the porous material fitted therein, and a negative pressure transfer path for transferring a negative pressure to the porous material fitted in the recess.

Abstract: A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.

Abstract: A method for machining at least one workpiece surface to apply a texture pattern to at least one section of the workpiece surface using a laser, based on image data specifying an image of the texture pattern applied to the at least one section of the workpiece surface and model data specifying a three-dimensional geometry of a surface form corresponding to the at least one section of the workpiece surface. Control data and segment data are generated based on the image and model data. The control data specify one or more segment sequences for each track line. Each segment sequence has track segments where the laser guides the texture pattern application to the at least one section of the workpiece surface; wherein the track segments of a segment sequence include one or more laser track segments where the laser travels in the switched-on state at a constant machining setpoint speed.

Abstract: A gyro sensor includes a plurality of beams connected via a turnaround part. A groove is provided on a main surface of at least one beam of the plurality of beams. Wall thicknesses on the main surface of two sidewalls facing each other of the groove in a direction orthogonal to a longitudinal direction of the beam satisfy 0.9?T1/T2?1.1, where T1 is the wall thickness of one sidewall and T2 is the wall thickness of the other sidewall.

Abstract: The present invention is directed to a method of forming a bottom-gusseted package, wherein each package includes an inwardly-extending, pleat-like gusset at the bottom of the package. To permit heat-sealing formation of each package, the sleeve from which each gusset is formed comprises a lamination of two differing polymeric materials, a sealant layer and a non-sealant layer, so that only an exterior surface of each sleeve, at which the sealant layer is positioned, exhibits the desired heat-sealing characteristics. To facilitate package formation, the sleeves from which the bottom gussets are formed are maintained in a closed or sealed configuration during package formation by providing a heat-sealed bond at the edge of each sleeve. In one embodiment, portions of the non-sealant layer are vaporized to provide sealable surface regions of the sealant layer.

Abstract: In cutting a band-shaped glass film along a longitudinal direction thereof and evaluating linearity of an end side formed in association with the cutting to inspect quality of a cut band-shaped glass film, the following steps are performed: an imaging step of dividing the end side into a plurality of segments and imaging each of the plurality of segments; a linear approximation step of calculating an approximate straight line of the end side based on a plurality of points different from each other on the end side in each of a plurality of images obtained in the imaging step; a variation calculation step of calculating a variation value of the plurality of points based on the approximate straight line; and an evaluation step of evaluating the linearity of the end side based on a plurality of variation values respectively corresponding to the plurality of images.

Abstract: Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

Abstract: Various examples are provided related to anisotropic constitutive parameters (ACPs) that can be used to launch Zenneck surface waves. In one example, among others, an ACP system includes an array of ACP elements distributed over a medium such as, e.g., a terrestrial medium. The array of ACP elements can include one or more horizontal layers of radial resistive artificial anisotropic dielectric (RRAAD) elements positioned in one or more orientations over the terrestrial medium. The ACP system can include vertical lossless artificial anisotropic dielectric (VLAAD) elements distributed over the terrestrial medium in a third orientation perpendicular to the horizontal layer or layers. The ACP system can also include horizontal artificial anisotropic magnetic permeability (HAAMP) elements distributed over the terrestrial medium. The array of ACP elements can be distributed about a launching structure, which can excite the ACP system with an electromagnetic field to launch a Zenneck surface wave.

Abstract: A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.

Abstract: A laser machining apparatus 1 includes: a laser head that is supported by a laser moving device so as to be movable in X, Y, and Z directions above a motor driven conveyor that transports a workpiece loaded thereon. The laser head includes protection glass for protecting a laser focusing lens; an ultraviolet irradiation device disposed beside the conveyor such that a laser light axis and an ultraviolet ray axis are parallel to each other; and a control device that controls the components of the laser machining apparatus so that the ultraviolet irradiation device radiates UV rays on the protection glass in a state in which a UV irradiation port faces a laser irradiation port of the laser head, thus cleaning the protection glass without removing it from the laser head.

Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.

Abstract: Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).

Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.

Abstract: A control system for a three-dimensional printer includes an energy component interface, an agent depositing component interface, and control logic. The control logic controls the operation of an energy component through the energy component interface and an agent depositing component through the agent depositing component, in forming an output object that is specified in a print job. Additionally, in some examples, the control logic can implement a plurality of modes. Each mode, when selected modulate one or more operational parameters of a least one of the energy component or agent depositing component.

Abstract: A method of cleaving an optical fiber comprises inserting the optical fiber through a bore of a holding member, securing the optical fiber to the holding member with a bonding agent, operating at least one laser to emit at least one laser beam, and directing the at least one laser beam from the at least one laser to the end face of the holding member. At least a portion of the at least one laser beam reflects off the end face of the holding member and is thereafter incident on an end portion of the optical fiber. The at least one laser beam cleaves the end portion of the optical fiber less than 20 ?m from the end face of the holding member. Related systems are also disclosed.

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

Abstract: A liquid supply mechanism disposed at an upper portion of a holding unit includes a liquid chamber having a transparent plate positioned to form a gap between itself and an upper surface of a workpiece held on a holding table, a roller formed of a transparent member that is disposed in a non-contact state at a position proximate to an upper surface of the workpiece held on the holding table inside the liquid chamber and that produces a flow of a liquid on the workpiece; a motor rotating the roller, a liquid supply nozzle supplying the liquid into the gap from one side of the liquid chamber, and a liquid discharge nozzle discharging the liquid from the other side of the liquid chamber. A laser beam is applied to the workpiece through the transparent plate, the roller, and the liquid supplied into the gap.

Abstract: In various embodiments, laser delivery systems feature variable polarizers and beam shapers for altering the polarization and/or shape of the output beam for processing of various materials. The polarization and/or shape of the beam may be varied based on one or more characteristics of the workpiece.

Abstract: The present invention relates to the technical field of material surface peening, and more particularly to an energy compensated equipower density oblique laser shock method. The method includes: acquiring a radius of curvature of a peening region of a part to be processed, and judging a range of a laser incident angle; determining laser parameters, such as laser pulse width, a spot diameter, and required laser energy under a vertical incidence condition; calculating the required laser energy at the minimum incident angle, and judging whether the energy falls within the technical indexes of a laser; and performing laser shock peening on the part by pulse laser beams with different energies. According to the present invention, the laser power or energy is compensated according to changes in the incident angle and the radius of curvature of the part to be processed.

Abstract: A method is provided that includes producing filamentary damages in a volume of a glass or glass ceramic element adjacently aligned along a separation line and extend obliquely relative to a surface of the glass or glass ceramic element; and separating a portion from the glass or glass ceramic element along the separation line. The step of producing the filamentary damages includes directing laser pulses of an ultrashort pulse laser obliquely on the surface so that the laser pulses have a light propagation direction that extends obliquely relative to the surface and so that the filamentary damages resulting from the laser pulses have the longitudinal extension that extends obliquely relative to the surface; generating a plasma within the volume with the laser pulses; and displacing the laser pulses at points of incidence over the surface along the separation line.

Abstract: The present disclosure provides a preparation method of an optical fiber device having a polymer micronano structure integrated in an optical fiber, the method comprising: welding a hollow optical fiber so that the hollow optical fiber is welded between two solid optical fibers, ablating the welded hollow optical fiber utilizing a femtosecond laser ablation technology so that a channel vertical to an inner wall is ablated on the hollow optical fiber, filling a colorless and transparent liquid photoresist material inside the hollow optical fiber which has been ablated so that the inside of the hollow optical fiber is filled with the photoresist material, and polymerizing on the photoresist material inside the hollow optical fiber utilizing a femtosecond laser two-photon polymerization technology.

Abstract: An image processing method includes: detecting a plurality of feature lines from a first image captured from a first position; specifying, based on a positional relationship between the plurality of feature lines and a plurality of projection lines generated by projecting each of a plurality of line segments onto the first image, a feature line representing a defective portion of a shape of an object; setting a plurality of candidate positions based on the first position, each of the plurality of candidate positions being a candidate for a second position at which a second image is captured; calculating an evaluation value of each of the plurality of candidate positions; determining any of the plurality of candidate positions based on the evaluation value of each of the plurality of candidate positions; and outputting first information to be used in recognition of the determined candidate position.

Abstract: A laser ablation process can be configured to reduce the appearance of or eliminate a potentially objectionable diffraction effect that can occur when a workpiece or product that has been subjected to the ablation process interacts with light. The diffraction effect can be reduced by introducing irregularity into the arrangement of overlapping laser spots during the process. Other process parameters may be modified to reduce the diffraction effect, such as laser scan speed, laser pulse frequency, the position of the focal plane of the laser, the configuration of raster lines, or the energy profile of the laser beam, for example. The process modifications and configurations are particularly useful with products including an ablated surface that is intended to reflect light or to allow light to pass therethrough as part of its function.

Abstract: A method is for producing an ornamental design (O) in a clearcoat layer (K). The ornamental design (O) is produced by a selective matting of the clearcoat layer (K) by working the clearcoat layer (K) by a laser. The working of the clearcoat layer may be performed by a UV laser. Additionally, the working of the clearcoat layer K may be performed by electromagnetic waves at a wavelength of about 355 nm. Furthermore, the working of the clearcoat layer K may be performed by a laser operating at a frequency of about 23 500 Hz. Still further, the working of the clearcoat layer (K) may be performed by a laser operating with a pulse duration of about 2 ?s. The working of the clearcoat layer (K) may be performed by a laser operating with a line spacing of about 0.03 mm.