Methods Patents (Class 219/121.69)
  • Patent number: 11294285
    Abstract: A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: April 5, 2022
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Mei Yang, Jun Dai
  • Patent number: 11285566
    Abstract: A laser machining apparatus 1 includes: a laser head that is supported by a laser moving device so as to be movable in X, Y, and Z directions above a motor driven conveyor that transports a workpiece loaded thereon. The laser head includes protection glass for protecting a laser focusing lens; an ultraviolet irradiation device disposed beside the conveyor such that a laser light axis and an ultraviolet ray axis are parallel to each other; and a control device that controls the components of the laser machining apparatus so that the ultraviolet irradiation device radiates UV rays on the protection glass in a state in which a UV irradiation port faces a laser irradiation port of the laser head, thus cleaning the protection glass without removing it from the laser head.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 29, 2022
    Assignee: Honda Motor Co., Ltd.
    Inventors: Toshiyuki Tanaka, Kazuhide Matsuo, Shinichi Miyasaka, Satoshi Oyama
  • Patent number: 11289621
    Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: March 29, 2022
    Assignees: NICHIA CORPORATION, IMRA AMERICA, INC.
    Inventors: Minoru Yamamoto, Naoto Inoue, Hiroaki Tamemoto, Yoshitaka Hotta, Hideyuki Ohtake
  • Patent number: 11267072
    Abstract: Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: March 8, 2022
    Assignee: LASER ENGINEERING APPLICATIONS
    Inventors: Paul-Etienne Martin, Anne Henrottin, Sébastien Estival, Axel Stefan M. Kupisiewicz, Jose Ramos De Campos
  • Patent number: 11260599
    Abstract: A control system for a three-dimensional printer includes an energy component interface, an agent depositing component interface, and control logic. The control logic controls the operation of an energy component through the energy component interface and an agent depositing component through the agent depositing component, in forming an output object that is specified in a print job. Additionally, in some examples, the control logic can implement a plurality of modes. Each mode, when selected modulate one or more operational parameters of a least one of the energy component or agent depositing component.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: March 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vanessa Verzwyvelt, Matthew A. Shepherd, Arthur H. Barnes, Wesley R. Schalk, Hector Jose Lebron, Jake Wright
  • Patent number: 11260470
    Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: March 1, 2022
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventors: Takashi Shimanuki, Masanobu Koyata, Shuhei Oshida
  • Patent number: 11256039
    Abstract: A method of cleaving an optical fiber comprises inserting the optical fiber through a bore of a holding member, securing the optical fiber to the holding member with a bonding agent, operating at least one laser to emit at least one laser beam, and directing the at least one laser beam from the at least one laser to the end face of the holding member. At least a portion of the at least one laser beam reflects off the end face of the holding member and is thereafter incident on an end portion of the optical fiber. The at least one laser beam cleaves the end portion of the optical fiber less than 20 ?m from the end face of the holding member. Related systems are also disclosed.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: February 22, 2022
    Assignee: Corning Optical Communications LLC
    Inventors: Joel Patrick Carberry, Minghan Chen, Ming-Jun Li, Anping Liu, Barada Kanta Nayak
  • Patent number: 11247932
    Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: February 15, 2022
    Assignee: Corning Incorporated
    Inventors: Jeffery Alan DeMeritt, Davide Domenico Fortusini, Andrey Kobyakov, David Mark Lance, Leonard Thomas Masters, Ulrich Wilhelm Heinz Neukirch, Alexander Mikhailovich Streltsov, James Scott Sutherland
  • Patent number: 11224941
    Abstract: A liquid supply mechanism disposed at an upper portion of a holding unit includes a liquid chamber having a transparent plate positioned to form a gap between itself and an upper surface of a workpiece held on a holding table, a roller formed of a transparent member that is disposed in a non-contact state at a position proximate to an upper surface of the workpiece held on the holding table inside the liquid chamber and that produces a flow of a liquid on the workpiece; a motor rotating the roller, a liquid supply nozzle supplying the liquid into the gap from one side of the liquid chamber, and a liquid discharge nozzle discharging the liquid from the other side of the liquid chamber. A laser beam is applied to the workpiece through the transparent plate, the roller, and the liquid supplied into the gap.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: January 18, 2022
    Assignee: DISCO CORPORATION
    Inventors: Keiji Nomaru, Yuji Hadano, Masatoshi Nayuki
  • Patent number: 11204506
    Abstract: In various embodiments, laser delivery systems feature variable polarizers and beam shapers for altering the polarization and/or shape of the output beam for processing of various materials. The polarization and/or shape of the beam may be varied based on one or more characteristics of the workpiece.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: December 21, 2021
    Assignee: TERADIODE, INC.
    Inventors: Parviz Tayebati, Bien Chann, Wang-Long Zhou, Francisco Villarreal-Saucedo, Robin Huang
  • Patent number: 11193183
    Abstract: The present invention relates to the technical field of material surface peening, and more particularly to an energy compensated equipower density oblique laser shock method. The method includes: acquiring a radius of curvature of a peening region of a part to be processed, and judging a range of a laser incident angle; determining laser parameters, such as laser pulse width, a spot diameter, and required laser energy under a vertical incidence condition; calculating the required laser energy at the minimum incident angle, and judging whether the energy falls within the technical indexes of a laser; and performing laser shock peening on the part by pulse laser beams with different energies. According to the present invention, the laser power or energy is compensated according to changes in the incident angle and the radius of curvature of the part to be processed.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: December 7, 2021
    Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Yongkang Zhang, Chaohui Lin, Zeming Zhou, Zheng Zhang, Guoxin Lu
  • Patent number: 11163110
    Abstract: The present disclosure provides a preparation method of an optical fiber device having a polymer micronano structure integrated in an optical fiber, the method comprising: welding a hollow optical fiber so that the hollow optical fiber is welded between two solid optical fibers, ablating the welded hollow optical fiber utilizing a femtosecond laser ablation technology so that a channel vertical to an inner wall is ablated on the hollow optical fiber, filling a colorless and transparent liquid photoresist material inside the hollow optical fiber which has been ablated so that the inside of the hollow optical fiber is filled with the photoresist material, and polymerizing on the photoresist material inside the hollow optical fiber utilizing a femtosecond laser two-photon polymerization technology.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: November 2, 2021
    Assignee: SHENZHEN UNIVERSITY
    Inventors: Changrui Liao, Yiping Wang, Chi Li, Lei Xu
  • Patent number: 11161766
    Abstract: A method is provided that includes producing filamentary damages in a volume of a glass or glass ceramic element adjacently aligned along a separation line and extend obliquely relative to a surface of the glass or glass ceramic element; and separating a portion from the glass or glass ceramic element along the separation line. The step of producing the filamentary damages includes directing laser pulses of an ultrashort pulse laser obliquely on the surface so that the laser pulses have a light propagation direction that extends obliquely relative to the surface and so that the filamentary damages resulting from the laser pulses have the longitudinal extension that extends obliquely relative to the surface; generating a plasma within the volume with the laser pulses; and displacing the laser pulses at points of incidence over the surface along the separation line.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: November 2, 2021
    Assignee: SCHOTT AG
    Inventors: Andreas Ortner, Albrecht Seidl, Frank-Thomas Lentes, Fabian Wagner
  • Patent number: 11145048
    Abstract: An image processing method includes: detecting a plurality of feature lines from a first image captured from a first position; specifying, based on a positional relationship between the plurality of feature lines and a plurality of projection lines generated by projecting each of a plurality of line segments onto the first image, a feature line representing a defective portion of a shape of an object; setting a plurality of candidate positions based on the first position, each of the plurality of candidate positions being a candidate for a second position at which a second image is captured; calculating an evaluation value of each of the plurality of candidate positions; determining any of the plurality of candidate positions based on the evaluation value of each of the plurality of candidate positions; and outputting first information to be used in recognition of the determined candidate position.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: October 12, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Atsunori Moteki, Yu Ishikawa, Toshiyuki Yoshitake
  • Patent number: 11130195
    Abstract: A laser ablation process can be configured to reduce the appearance of or eliminate a potentially objectionable diffraction effect that can occur when a workpiece or product that has been subjected to the ablation process interacts with light. The diffraction effect can be reduced by introducing irregularity into the arrangement of overlapping laser spots during the process. Other process parameters may be modified to reduce the diffraction effect, such as laser scan speed, laser pulse frequency, the position of the focal plane of the laser, the configuration of raster lines, or the energy profile of the laser beam, for example. The process modifications and configurations are particularly useful with products including an ablated surface that is intended to reflect light or to allow light to pass therethrough as part of its function.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: September 28, 2021
    Assignee: GENTEX CORPORATION
    Inventors: Kurtis L. Geerlings, David J. Cammenga, Donald L. Bareman, Henry A. Luten
  • Patent number: 11084319
    Abstract: A method is for producing an ornamental design (O) in a clearcoat layer (K). The ornamental design (O) is produced by a selective matting of the clearcoat layer (K) by working the clearcoat layer (K) by a laser. The working of the clearcoat layer may be performed by a UV laser. Additionally, the working of the clearcoat layer K may be performed by electromagnetic waves at a wavelength of about 355 nm. Furthermore, the working of the clearcoat layer K may be performed by a laser operating at a frequency of about 23 500 Hz. Still further, the working of the clearcoat layer (K) may be performed by a laser operating with a pulse duration of about 2 ?s. The working of the clearcoat layer (K) may be performed by a laser operating with a line spacing of about 0.03 mm.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: August 10, 2021
    Inventors: Matthias Ganter, Martin Grammer, Manuel Selinger
  • Patent number: 11073501
    Abstract: A system and method for the non-destructive testing of additively manufactured parts. An input mechanism excites with an excitation force (e.g., a vibration) an additive manufacturing build structure, which includes a part on a build platform, to induce a dynamic response in the part. An output mechanism (e.g., a non-contact transducer) senses the induced dynamic response in the part. A processor determines and examines the relationship between the response and excitation to identify an indication of a defect in the part, and communicates an alert if the indication is identified. The processor may compare the phase, magnitude, coherence, or time delay of the relationship to a reference relationship and/or may compare the modal frequency or the modal damping to a reference to identify a deviation greater than a pre-established threshold.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: July 27, 2021
    Assignee: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Troy Juan Hartwig, Benjamin Ross Brown, David Soine
  • Patent number: 11045899
    Abstract: A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: June 29, 2021
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Jan Kleinert
  • Patent number: 11028003
    Abstract: A method for laser-based machining of a flat substrate, to separate the substrate into a plurality of sections, in which the laser beam of a laser is directed at the substrate using an optical arrangement, which is positioned in the beam path of the laser. The optical arrangement forms a laser beam focal line that is extended as viewed along the beam direction and the substrate is positioned relative to the laser beam focal line such that an induced absorption is produced in the material of the substrate along a section of the laser beam focal line that is extended as viewed in the beam direction.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: June 8, 2021
    Assignee: CORNING LASER TECHNOLOGIES GMBH
    Inventors: Richard Grundmueller, Helmut Schillinger
  • Patent number: 11014197
    Abstract: The invention disclose a picosecond-nanosecond laser composite asynchronous ceramics polishing method. First, a picosecond laser is used to scan and irradiate the ceramic surface along the scanning path. At the same time, ceramic surface is initially flattened and the electronic state of materials is removed by picosecond laser to produce micro-nanoparticles. Micro-nanoparticles exist as ionized state in the adjacent space region of irradiated ceramics surface. Then, low energy density nanosecond laser is used according to a preset time to irradiate and melt these micro-nanoparticles which can easily form a dense and smooth fine crystal melting layer to achieve the polishing effect. The present disclosure fixes the generation of micro-cracks and pores in traditional laser polishing process. It overcomes the shortcomings of traditional laser polishing such as large thermal influence zone, easy to generate micro-cracks and pores on the surface, etc.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: May 25, 2021
    Assignee: BEIJING UNIVERSITY OF TECHNOLOGY
    Inventors: Lingfei Ji, Ximin Zhang, Wenhao Wang, Tianyang Yan, Rui Ma
  • Patent number: 11011735
    Abstract: In a flexible OLED device production method, after an intermediate region and flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and glass base is irradiated with laser light. The multilayer stack is separated into first and second portions while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and intermediate region. The laser light is formed from a plurality of arranged laser light sources and irradiation intensity for at least part of the interface between the intermediate region and the glass base is lower than the irradiation intensity for the interface between the flexible substrate region and the glass base.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: May 18, 2021
    Assignee: Sakai Display Products Corporation
    Inventors: Katsuhiko Kishimoto, Kohichi Tanaka
  • Patent number: 11004743
    Abstract: According to one embodiment, a dicing method is provided. The dicing method includes detecting a first distance between a first portion of a substrate and a first substrate information detection unit. The method also includes detecting a second distance between a second portion of the substrate a second substrate information detection unit, the second portion different from the first portion. Distance information is calculated between the substrate and a processing lens, which is located farther from the second substrate information detection unit than from the first substrate information detection unit, based on the detected first distance and the detected second distance, and the substrate is irradiated with laser light from the processing lens based on the distance information.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 11, 2021
    Assignee: KIOXIA CORPORATION
    Inventors: Tsutomu Fujita, Takanobu Ono
  • Patent number: 10994373
    Abstract: A method of cutting a web structure that is utilized in the manufacture of an absorbent article. The method of cutting the web structure can employ a laser having a pulse mode of operation. In various embodiments, the frequency of the beam of radiation pulsed from the laser can be patterned to correspond to the material of the web structure. In various embodiments, the frequency of the beam of radiation pulsed from the laser can be patterned to correspond to the speed at which the web structure is moving and can change with any change in speed of the web structure movement.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: May 4, 2021
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Paul Milbrodt, Brian T. Anderson, Brittany Alissa Young
  • Patent number: 10978318
    Abstract: A laser beam applying unit of a laser processing apparatus includes a laser oscillator adapted to emit a laser beam, a condenser adapted to focus the laser beam emitted from the laser oscillator and to thereby apply the laser beam to the workpiece held by a holding unit, and a liquid layer former disposed at a lower end portion of the condenser and adapted to form a layer of a liquid on an upper surface of the workpiece. The liquid layer former includes a casing having a bottom wall that forms a gap between itself and the upper surface of the workpiece, a liquid supply section adapted to supply the liquid to the casing, and a transparent section that is formed at the bottom wall adjacently to the jet port and that permits transmission of the laser beam therethrough.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: April 13, 2021
    Assignee: DISCO CORPORATION
    Inventors: Yuji Hadano, Masatoshi Nayuki, Keiji Nomaru
  • Patent number: 10968562
    Abstract: Disclosed are methods and apparatus for cleaning a substrate, such as a fabric material, involving the application of optical energy to the substrate, typically in the form of a beam of light, where the energy of the beam causes removal of the contaminant from substrate, such as from the fibres of a fabric material. The cleaning may occur via any mechanism, including one or more of, alone or in any combination, ablation, melting, heating or reaction with the substrate or contaminant or agent introduced to aid in the cleaning. The optical energy is typically applied to a selected area of the substrate (e.g., as a beam), and the substrate and beam or optical energy source moved relative to one another so as to clean a larger area of the substrate, either by moving the substrate or the beam, or both. Movement of the beam with respect to the substrate can be attained through a beam scanning mechanism or through movement of the optical source itself.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: April 6, 2021
    Inventor: John Redvers Clowes
  • Patent number: 10934635
    Abstract: There is provided a method of fabricating a trapped vacancy in a crystal lattice of a target comprising: positioning the target in a laser system, the target containing vacancy trapping elements within the crystal lattice; modifying the crystal lattice within the target by using a laser to generate a lattice vacancy; and annealing the target to cause the lattice vacancy to migrate and be captured by a vacancy trapping element to form the trapped vacancy in the crystal lattice.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: March 2, 2021
    Assignee: Oxford University Innovation Limited
    Inventors: Martin James Booth, Patrick Salter, Jason Smith, Yu-Chen Chen
  • Patent number: 10930561
    Abstract: An SiC substrate processing method includes a separation layer forming step of setting a focal point of a laser beam having a transmission wavelength to SiC inside an SiC substrate and next applying the laser beam to the SiC substrate to thereby form a separation layer inside the SiC substrate, the SiC substrate having a first surface and a second surface opposite to the first surface; a first plate attaching step of attaching a first plate to the first surface of the SiC substrate; a second plate attaching step of attaching a second plate to the second surface of the SiC substrate; and a separating step of applying an external force to the separation layer after performing the first plate attaching step and the second plate attaching step, thereby separating the SiC substrate into a first SiC substrate and a second SiC substrate along the separation layer.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: February 23, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 10919794
    Abstract: A method having steps of placing a glass sheet having a front surface, a reverse surface and a thickness onto a sacrificial substrate; directing a beam from a laser at the front surface and through the glass sheet; pulsing the beam at a frequency of between 10 kHz and 30 kHz, and at the sacrificial substrate; moving the beam across the glass sheet at a rate of between 30 millimeters per second and 90 millimeters per second; ablating the sacrificial substrate with the beam; generating a superheated vapor in response to the ablating of the sacrificial substrate; and ablating the reverse surface of the glass sheet with the superheated vapor, whereby the glass sheet is cut.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: February 16, 2021
    Assignee: GENERAL ATOMICS
    Inventors: James Ross MacDonald, Esteban Balarezo Bagdy, Mark Aoraha Cacause, Jeffrey James Trial
  • Patent number: 10903392
    Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: January 26, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Patent number: 10870175
    Abstract: Microfluidic flow-through elements and methods for forming and using the same, particularly, low cost, easily sterilized, disposable microfluidic flow-through elements may include an orifice region suitable, for example, for fluid jet formation (such as in a droplet sorter or flow cell) or sample injection or hydrodynamic focusing (such as in a non-droplet flow cytometer). Laser drilling, for example laser ablation, may be used to form an orifice region extending through an orifice wall section of a base substrate. The base substrate may be unitarily-formed by injection molding a polymeric material. The orifice region may be advantageously configured to form a predetermined geometry by controlling the characteristics of the ablating beam.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: December 22, 2020
    Assignee: CYTONOME/ST, LLC
    Inventors: Kristopher Scott Buchanan, Johnathan Charles Sharpe
  • Patent number: 10861725
    Abstract: A laser marking device includes a laser emission unit configured to emit a laser beam to a first surface of an object to be processed, and a pressing unit configured to press a second surface that is opposite to the first surface of the object to be processed to make the first surface of the object to be flat. The pressing unit includes a first pressing portion configured to press an edge area of the second surface in a contact manner, and at least one second pressing portion configured to press a middle area of the second surface in a non-contact manner to maintain a separation distance from the second surface within a certain distance.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: December 8, 2020
    Assignee: EO TECHNICS CO., LTD.
    Inventors: Sung Beom Jung, Jea Ho Moon, Soo Young Kim, Doo Seok Lee
  • Patent number: 10862210
    Abstract: A multiple band phase shifter includes a first dielectric layer, a conductive layer, a second dielectric layer, and for each central operating frequency of a plurality of central operating frequencies, a switch, a plurality of vias, and a conducting pattern layer. Each via is formed of a conductive material that extends through the first dielectric layer, through a third dielectric material formed in and through the conductive layer, and through the second dielectric layer and is connected to a first throw arm or a second throw arm of the switch. The conducting pattern layer includes conductors electrically connected to a distinct via. An electric polarization of a reflected electromagnetic wave is rotated by 90 degrees when the switch is positioned in the first conducting position and the electric polarization of the reflected electromagnetic wave is rotated by ?90 degrees when the switch is positioned in the second conducting position.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: December 8, 2020
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Nader Behdad, John H. Booske, Hung Thanh Luyen, Zongtang Zhang
  • Patent number: 10858524
    Abstract: Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: December 8, 2020
    Assignee: DISCO CORPORATION
    Inventors: Yukinobu Ohura, Senichi Ryo, Yohei Yamashita
  • Patent number: 10836105
    Abstract: The present invention relates to a device as well as a method for creating three-dimensional structures consisting of a material to be consolidated, in particular a material containing organopolysiloxane, by way of locally selective consolidation of the latter as a result of light-induced organic cross-linking. The device is characterized by a movable focusing optical system for the formation of one or a plurality of laser foci, wherein either the laser beam of a laser source can be introduced into the material to be consolidated through the material container and a movable carrier unit is arranged in said container or the focusing optical system is immersed into the material bath and the laser beams can be introduced into the material to be consolidated via a beam exit area of the focusing optical system.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: November 17, 2020
    Assignee: Multiphoton Optics GmbH
    Inventors: Ruth Houbertz, Thomas Stichel, Soenke Steenhusen
  • Patent number: 10827936
    Abstract: A method for forming an implantable electrode (100) includes exposing a conductive surface of the electrode (100) with a first application of an excimer laser (215) and creating a first surface texture on a conductive surface with a second application of the excimer laser. In one example, a low impedance implantable electrode includes a conductive surface and a coating disposed over the conductive surface. The coating may have a lower contact impedance with biological tissue than the conductive surface. At least a portion of the coating has an excimer laser textured surface.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: November 10, 2020
    Assignee: Advanced Bionics AG
    Inventor: Atoosa Lotfi
  • Patent number: 10818546
    Abstract: There is provided a method of laser-processing a device wafer with a laser beam applied thereto. The device wafer has a face side having thereon a plurality of crossing projected dicing lines and devices formed in respective areas demarcated by the projected dicing lines. The method includes a covering step of supplying the face side of the device wafer with water and a powdery protective film agent to cover the face side with an aqueous solution in which the powdery protective film agent is dispersed, a protective film forming step of evaporating the water content of the aqueous solution to form a protective film on the face side, and a laser processing step of applying a laser beam having a wavelength that is absorbable by the device wafer to the device wafer along the projected dicing lines to form laser-processed grooves in the device wafer along the projected dicing lines.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: October 27, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 10804122
    Abstract: To provide a substrate heating apparatus, a substrate heating method and a method of manufacturing an electronic device having excellent uniformity at the time of processing the substrate by a linear heat source. A substrate heating apparatus including a substrate holding tool holding a substrate as a processed object, a heat source heating the substrate held by the substrate holding tool by a linear heating portion, a moving mechanism allowing the substrate holding tool and the heat source to relatively move in a direction orthogonal to a longitudinal direction of the linear heating portion of the heat source and a cooling mechanism arranged in the substrate holding tool and contacting the substrate to cool an outer peripheral portion of the substrate, in which the cooling mechanism has a distribution in cooling ability according to a position of the substrate.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: October 13, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masahiro Yamamoto, Tomohiro Okumura
  • Patent number: 10799987
    Abstract: Disclosed herein is a laser processing apparatus for forming a separation layer inside an ingot by applying a laser beam to an end surface of the ingot in the condition where the focal point of the laser beam is set inside the ingot, the laser beam having a transmission wavelength to the ingot. The laser processing apparatus includes a holding unit for holding the ingot, a moving unit for moving the holding unit in a direction parallel to the end surface of the ingot held by the holding unit, a laser beam applying unit for applying the laser beam to the ingot held by the holding unit, an imaging unit for detecting the position of the ingot in the direction parallel to the end surface of the ingot, and a height detecting unit for detecting the height of the end surface of the ingot held by the holding unit.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: October 13, 2020
    Assignee: DISCO CORPORATION
    Inventors: Kentaro Iizuka, Koyo Honoki, Shuichi Torii, Yutaka Kobayashi, Ryohei Yamamoto, Kazuya Hirata
  • Patent number: 10786874
    Abstract: Embodiments of the present invention are generally directed to materials processing methods using femtosecond duration laser pulses, and to the altered materials obtained by such methods. The resulting nanostructured (with or without macro- and micro-structuring) materials have a variety of applications, including, for example, aesthetic applications for jewelry or ornamentation; biomedical applications related to biocompatibility; catalysis applications; and modification of, for example, the optical and hydrophilic properties of materials including selective coloring.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: September 29, 2020
    Assignee: UNIVERSITY OF ROCHESTER
    Inventors: Chunlei Guo, Anatoliy Y. Vorobyev
  • Patent number: 10780524
    Abstract: Disclosed herein is a laser processing method including a first application step of applying a first laser beam having a pulse width shorter than time of electron excitation generated by application of a laser beam to a workpiece, and a second application step of applying a second laser beam within the electron excitation time.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: September 22, 2020
    Assignee: DISCO CORPORATION
    Inventors: Hiroshi Morikazu, Noboru Takeda
  • Patent number: 10773338
    Abstract: In a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet by setting a laser beam to be focused on the grain-oriented electromagnetic steel sheet and scanned in a scanning direction, the laser beam focused on the grain-oriented electromagnetic steel sheet is linearly polarized light, and the angle between the linear polarization direction and the scanning direction is equal to or higher than 0° and lower than 45°.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: September 15, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Koji Hirano, Hirofumi Imai, Hideyuki Hamamura, Tatsuhiko Sakai
  • Patent number: 10750672
    Abstract: A device and method for altering biochrome ratios in plant leaves is provided. The device and method generally include a a light source; and means of directing the light source to deliver an altering spectrum to a group of cells. The altering spectrum alters the biochrome content of a group of cells to produce a contrasting color that creates a desired pattern on a leaf. The device may include a first light source that emits a main growth spectrum, a second light source that emits an altering spectrum; and means of directing the first and second light source to a group of cells, wherein the altering spectrum alters the biochrome content of a group of cells to create a desired pattern on a leaf.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: August 25, 2020
    Assignee: Just Greens, LLC
    Inventor: Roger Buelow
  • Patent number: 10748797
    Abstract: Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a method for monitoring plasma behavior includes acquiring at least one image of a plasma, and determining a plasma parameter based on the at least one image.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: August 18, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sidharth Bhatia, Edward P. Hammond, IV, Bhaskar Kumar, Anup Kumar Singh, Vivek Bharat Shah, Ganesh Balasubramanian
  • Patent number: 10737303
    Abstract: A system includes a laser configured to conduct a cleaning cycle that includes producing a laser beam capable of cleaning a faying surface of each of a plurality of nutplates, and conducting a first pass to clean each of the faying surfaces, wherein the laser is at a first position having a first angle relative to an axis orthogonal to the faying surfaces during the first pass. The system also includes a nutplate tray configured to hold the plurality of nutplates such that each faying surface is oriented such that the laser beam is capable of contacting each faying surface at least once during the cleaning cycle.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: August 11, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: David Haynes Coleman, Caroline Rebecca Mitchell, Michael Bryan Stoddard, Steven E. Twaddle
  • Patent number: 10729497
    Abstract: An apparatus and method for laser-assisted machining (LAM) of non-monolithic composite bone material is described. A high intensity focused laser beam conducts bone material removal in extremely short time duration without causing any thermal (necrosis) and mechanical damage to the material surrounding the bone-laser interaction region. A computer associated with the apparatus for machining bone preferably employs a Multiphysics computational modeling approach which takes into account physical phenomena such as heat transfer, fluid flow, convection mixing, and surface tension when determining bone target volume, calculating material properties of the multicomponent and multicomposition composite bone material, determining parameters for the laser-assisted machining based on the material properties, and performing the laser-assisted cutting/shaping/machining of bone.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: August 4, 2020
    Assignee: UNIVERSITY OF NORTH TEXAS
    Inventors: Narendra Dahotre, Soundarapandian Santhanakrishnan
  • Patent number: 10710198
    Abstract: Provided is a laser processing device that performs laser processing on a workpiece to which a protective film has been attached, wherein a determination is made as to whether or not a common part for which laser marking processing is necessary for cutting the protective film is present on the basis of processing information including a processing program, and when a common part for which laser marking processing is necessary for cutting the protective film is present, the laser marking processing process for that common part is added to the processing program.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: July 14, 2020
    Assignee: AMADA HOLDINGS CO., LTD.
    Inventors: Norio Imai, Hiroshi Takano, Takahiro Shibata, Ko Nakamura
  • Patent number: 10695871
    Abstract: An absorptivity of a work is adjusted easily before laser machining is performed. A combined machining method performed by an apparatus including laser machining means and mechanical machining means includes a first step of performing mechanical machining with respect to a laser machining target region which is a target of laser machining on a machining target so that the laser machining target region has a surface shape having a predetermined absorptivity of a laser beam; and a second step of radiating a laser beam to the laser machining target region to heat the machining target after the first step ends.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: June 30, 2020
    Assignee: FANUC CORPORATION
    Inventor: Atsushi Mori
  • Patent number: 10639851
    Abstract: An article for laser marking can comprising: a thermoplastic composition comprising a thermoplastic polymer, an active component comprising at least one of a polymeric unit and an additive, wherein the thermoplastic polymer has a visible transmission of greater than or equal to 80% according to ASTM D1003-00, Procedure A, using D65 illumination, 10 degrees observer, and thickness of 1 mm; and a mark produced by chemical rearrangement of the active component generated by a laser of a first wavelength; wherein the mark exhibits at least one of: (i) a change in optical properties in the region 400 nm to 700 nm when exposed to light having a wavelength less than or equal to 500 nm; and (ii) a change in optical properties in the region of 400 nm to 700 nm when exposed to light having a wavelength greater than or equal to the first wavelength.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: May 5, 2020
    Assignee: SABIC GLOBAL TECHNOLOGIES IP B.V.
    Inventors: Tony Farrell, Robin Alphonsus Adriana van der Scheer, Cornelis Johannes Gerardus Maria van Peer
  • Patent number: 10640837
    Abstract: An upholstery layer of a vehicle interior panel includes an airbag tear seam formed as a plurality of blind cuts arranged along a tear seam pattern. Each one of the blind cuts is formed by laser material removal at a plurality of locations along the pattern. Laser energy is delivered to the upholstery layer in a series of ultra-short pulses to form the blind cuts, which are formed in the upholstery layer while separate from a substrate of the panel. This technique is particularly useful with leather upholstery materials, in which non-visible airbag tear seams have been proven difficult to form.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: May 5, 2020
    Assignee: FAURECIA INTERIOR SYSTEMS, INC.
    Inventor: Ulrich Weissert
  • Patent number: 10632534
    Abstract: Processes for producing and treating thin-films comprising nanomaterials are provided. A process of producing a transparent conducting film includes printing nanomaterials on a substrate, and directing a laser beam onto the nanomaterials to weld junctions between the nanomaterials. A process for tightly integrating nanomaterials with 2D material includes locating the 2D material over the nanomaterials, and directing a laser beam towards the 2D material to produce laser shock pressure sufficient to wrap the 2D material on the nanomaterials. A process of reducing the resistivity of a transparent conducting film includes directing a first laser beam towards a transparent conducting film having nanomaterials thereon such that the nanomaterials experience laser shock pressure sufficient to compress the nanomaterials, and then directing a second laser beam towards the transparent conducting film such that junctions between the nanomaterials are fused.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: April 28, 2020
    Assignee: Purdue Research Foundation
    Inventor: Gary J. Cheng