Abstract: A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.

Abstract: An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10?6/K to 3.4×10?6/K. The interposer further includes a number of holes having diameters ranging from 20 ?m to 200 ?m. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.

Abstract: A coated abrasive article (1) comprises a backing (3) having an abrasive coating (5) on one side, an attachment layer (7) on the other side of the backing, and a line of weakness (9) that does not penetrate the front face of the abrasive coating (5). The line of weakness, which may be formed using a laser beam, comprises a through-cut (11) in the attachment layer (7) and perforations (13) in the backing (3), and permits one part of the abrasive article (1) to be separated from another part. Alternatively, the abrasive article can be used in its original form.

Abstract: In some aspects, methods includes forming intersecting apertures in a workpiece with a laser beam by moving the laser beam along intersecting line paths, and cutting out a portion of a shape from the workpiece by moving the laser beam along a continuous final path extending around an intersection point of the intersecting line paths.

Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10×10?7 to 50×10?7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.

Abstract: A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material.

Abstract: Inventive single cavities for use in a high power fiber laser systems are described that include a high reflective grating, a gain fiber, an output coupler having a bandwidth in the range of 1 nm to 2 nm; and an output fiber connected to the single cavity that supplies power from the single cavity. The single cavity can be used in a wide variety of applications, including welding, cutting, brazing or drilling a material, or to seed a downstream amplifier.

Abstract: A process of laser machining a layer system is provided. The layer system has at least one metallic substrate and an outer ceramic layer. After laser machining the layer system, a layer thickness of the outer ceramic layer is reduced by a laser process and/or a smoothing process. The laser machining includes creating a plurality of passage holes using a diffuser.

Abstract: The present embodiments providing methods, systems and apparatuses of protecting a surface during laser machining. In some embodiments, a method of protecting a surface during laser machining comprises: directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; and directing a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage.

Abstract: An area of reduced thickness is formed in a panel, and a pattern of microscopic holes are formed in the area. The holes are filled with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area and the polymer may be colored to add color to light transmitted through the pattern. The panel can form a portion of a housing surrounding a lighting source that makes the holes visible when lit.

Abstract: Systems and methods are provided for monitoring and/or controlling laser drilling processes based on atomic emission spectral emissions that are collected in real time during laser drilling. The systems and methods may be used to monitor and control laser drilling operations across a range of materials, e.g., metals (including alloys) and ceramics, and may be used to identify spectral characteristics that signify hole completion and to manage/discontinue laser drilling operations based thereon. The ability to precisely monitor for hole completion provides the important advantage of reducing unnecessary laser pulses, which otherwise could reduce manufacturing efficiency and/or increase thermal or mechanical damage to the component material. The systems and methods may also be employed to control laser drilling operations so as to enhance hole quality and/or to implement corrective action when/if necessary to ensure that laser drilling operations yield high quality drilled holes.

Abstract: Disclosed are: dry tomatoes having excellent texture, flavor, and appearance, as well as being readily producible; and processed tomatoes suitable as a raw material for producing such dry tomatoes.

Abstract: There is described a method with which, on the basis of a three-dimensional recording of a component to be reworked, its surface configuration can be determined and stored temporarily so that, after it has been coated, it can be produced in its original surface form, or in its surface form then required, in certain regions, i.e. locally in the area of film-cooling openings. An especially precise and quick three-dimensional recording can be achieved by the use of the triangulation method. In this case, a reference pattern depicted on the component by a projector is recorded by two camera arranged at an angle. From the images from the cameras, the coordinates describing the surface three-dimensionally can then be determined by a control system using the triangulation method.

Abstract: The present invention relates to the production of a series of holes in a layer of material, in particular to the production of a target rupture line in a first layer of an airbag cover. The radiation of a plasma that forms during the production of each hole is detected from the surface that is being machined. From the signal pattern derived, the time of the beginning of the signal and the time of the appearance of a falling edge that meets a predetermined edge criterion are detected and stored. The point in time at which the falling edge appears is a switching criterion for switching off the laser. The difference between the two points in time stored for each hole constitutes a quality criterion for the respective hole.

Abstract: Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method in accordance with an embodiment of the present invention includes providing an insulation layer having a first area and a second area formed thereon, forming a solder resist layer on the insulation layer, in which the solder resist layer has a first opening formed thereon and the first opening exposes the first area, forming a first surface treatment layer on the first area inside the first opening, forming a second opening on the solder resist layer, in which the second opening exposes the second area, and forming a second surface treatment layer on the second area inside the second opening.

Abstract: A method for laser drilling of holes in a substrate (44) with varying simultaneity including operating a laser (22) to produce a single output beam (24) whose pulses have a total energy, dividing the single output beam into plural beams (41) to an extent which varies over time and applying the plural beams to plural hole drilling locations (209, 210, 212, 214, 216, 218, 220, 222) on the substrate including simultaneously drilling first parts of multiple holes using corresponding ones of the plural beams having a pulse energy which is a first fraction of the total energy and thereafter drilling at least one second part of at least one of the multiple holes using at least one of the plural beams each having a pulse energy which is at least a second fraction of the total energy, the second fraction being different from the first fraction.

Abstract: A method of forming a panel with an optically transmissive portion and resulting products. The method comprises drilling a via through a panel and filling the via with an optically transmissive material. A top surface and/or a bottom surface of the panel at the optically transmissive portion is smooth and continuous to the naked eye. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.

Abstract: A novel method of characterizing laser drilled boreholes is disclosed. The method uses x-ray microscopy for dimensional characterization. The x-ray output may be processed to control manufacturing equipment in automated production systems, including laser drilling systems and swaging apparatus.

Abstract: A hole forming method of forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material. The hole forming method includes a minimum shot number setting step of setting as a minimum value the number of shots of a pulsed laser beam applied to the workpiece at the time the spectral wavelength of plasma has changed from the spectral wavelength inherent in the first material to the spectral wavelength inherent in the second material, and a maximum shot number setting step of setting as a maximum value the number of shots of the pulsed laser beam at the time the spectral wavelength of the plasma has completely changed.

Abstract: Methods and systems for manufacturing back contact solar cells that have improved efficiency and device electrical properties. the solar cell device described herein includes an Emitter Wrap Through (EWT) solar cell that has plurality of laser drilled vias disposed in a spaced apart relationship to metal gridlines formed on a surface of the substrate. Solar cell structures that may benefit from the invention disclosed herein include back-contact solar cells, such as those in which both positive and negative contacts are formed only on the rear surface of the device.

Abstract: A laser processing method including a first step of irradiating a surface of a workpiece with a laser beam with a focal point spaced from the surface, and forming a bottomed hole on the workpiece, which is defined with a tubular inner circumferential face opening at the surface and a bottom face; and a second step of irradiating the bottom face with a laser beam while an assist gas is blown into an opening of the bottomed hole but not blown onto an area surrounding the opening, and forming a through hole penetrating through the workpiece. A laser processing system includes a processing head focusing a laser beam emitted from a laser oscillator so as to irradiate a workpiece with the laser beam and blowing an assist gas onto the workpiece; and a control section controlling the first and second steps as an operation of the processing head.

Abstract: A method for drilling holes in a component according to an optimized sequence is provided. The sequence is determined so as to minimize a total displacement of all axes of a hole drilling machine that is required for moving between each hole in the sequence.

Abstract: A method for drilling a shallow-angled hole through a thermal barrier coated component, in accordance with one aspect thereof, includes a step of applying a pulse laser beam with a first setting to drill a section of the hole substantially within a thermal barrier coating of the component. A further step is conducted to apply the pulse laser beam with a second setting through the initiated hole to further drill through a remainder of the component to complete the formation of the hole extending through the component.

Abstract: A method for providing a shallow-angled hole through a thermal barrier coated component in accordance with one aspect thereof, includes a step of applying a pulse laser beam to pre-drill the hole through a base metal of the component. A thermal barrier coating is then applied to the base metal, covering the pre-drilled hole in the base metal. A further step is conducted to apply the pulse laser beam through the thermal barrier coating a location to coincide with pre-drilled hole in the base metal in order to complete the formation of the hole extending through the component.

Abstract: A method for drilling a shallow-angled hole through a thermal barrier coated component includes a step of applying a pulse laser beam to drill a section of the hole substantially within a thermal barrier coating of the component in a direction substantially perpendicular to a top surface of the component. A further step is conducted to apply the pulse laser beam to further drill through a base metal of the component to complete the formation of the hole extending through the component.

Abstract: A method for providing a shallow-angled hole through a metal component, such as a turbine combustor, includes a step of applying a pulse laser beam to drill a section of the hole substantially within a thermal barrier coating of the component in a trepanning concept. A further step is conducted to apply the pulse laser beam through the completed section of the hole to further drill through a base metal of the component to complete the formation of the hole extending through the component.

Abstract: Apparatus and methods for drilling holes in a material with a laser are disclosed. An apparatus for drilling holes in a material with a laser includes a first steering element, a second steering element, and a lens. The first steering element is positioned to steer a beam from the laser. The second steering element is positioned to steer the beam from the first steering element. The lens focuses the beam from the second steering element. The first and second steering elements are configured to move with respect to the beam. Moving the first and second steering elements changes an angle of the beam where it contacts the material. The apparatus is operable to drill holes having no taper or reverse taper.

Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.

Abstract: Honeycomb body interdigitating mixers are disclosed along with methods for producing them, the honeycomb body having parallel cells extending along a common direction, the mixer comprising a first fluid path extending within the honeycomb body along a first path direction perpendicular to the common direction, the first fluid path defined within a first plurality of said cells, at least a high aspect ratio portion of the first fluid path having an aspect ratio of height in the common direction to width perpendicular to the common direction and to the first path direction of at least 3:1, and a second fluid path extending within the honeycomb body along a second path direction perpendicular to the common direction, the second fluid path defined within a second plurality of said cells, at least a high aspect ratio portion of the second fluid path having an aspect ratio of height in the common direction to width perpendicular to the common direction and to the second path direction of at least 3:1, wherein the f

Abstract: There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.

Abstract: An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.

Abstract: A method for forming at least one micro-via on a substrate is disclosed. The method comprises drilling at least one hole in a substrate by using a first laser beam. The first laser beam has an energy distribution, which is more at edges of the first laser beam than at the center of the first laser beam. The method further comprises forming at least one blank pattern on a top surface of the substrate and around an outer periphery of the at least one hole by removing at least a portion of the substrate by using a second laser beam. At least one blank pattern of the plurality of blank pattern corresponds to pad of the at least one micro-via. Thereafter, the method comprises filling the plurality of blank patterns and the at least one micro-via with a conductive material to form at least micro-via.

Abstract: A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Abstract: Methods are provided for laser patterning a partial depth surface portion of a glass body by controlling the amount of stress induced in the glass body. A laser beam is directed along an impinged path on the surface portion of the glass body to heat the glass body to form a swell. The glass body is then cooled and etched. The surface portion of the glass body is heated above the strain point at a heating rate HR to form a swell. The heating rate HR is a function of a target temperature T and an exposure time of the output laser beam. The exposure time is controlled to reach a target temperature above the softening point of the glass body and does not require a power density that would lead to laser ablation of the surface portion. The surface portion is cooled below the strain point to induce regions of localized stress. The unablated surface portion is etched while in a state of laser-induced localized stress to form a patterned glass body.

Abstract: A first laser working method includes a step of irradiating the metallic work held by a rotation holding mechanism, with a nanosecond laser beam from a first laser oscillation mechanism, to form a through hole, and a step of irradiating, when the metallic work is rotated under the action of the rotation holding mechanism, the inner wall of the through hole with a picosecond laser beam from a second laser oscillation mechanism, thereby to finish the same. While forming the through hole, metal vapor is sucked from the outside of the metallic work. Then, the gas is fed from the outside of the metallic work, and the inside of the metallic work is suctioned. In a second laser working method, when a lower hole made through is radially enlarged, the exit side of the lower hole is kept lower in pressure than the laser incident (or entrance) side.

Abstract: A process for producing a hole with an asymmetrical diffuser is produced. The angular position of the laser with respect to the substrate is changed discontinuously during the processing. The production of complex holes in a substrate is simplified by using a laser in five different angular positions relative to a substrate to be processed.

Abstract: A laser machining system for machining a workpiece is disclosed. The workpiece may have a primary surface and a secondary surface. The system may have a laser emitter configured to emit a laser beam. The system may also have a masking device having an absorbing portion formed from corundum. The absorbing portion may have a surface portion shaped to approximately correspond to a contour of an inner side of the primary surface of the workpiece.

Abstract: A manufacturing system is disclosed. The manufacturing system may have a laser source configured to generate a laser beam, and a delivery media operatively connected to the laser source. The manufacturing system may also have a gradient index lens located at a tip end of the delivery media to refract and focus the laser beam exiting the delivery media.

Abstract: The present invention is a method and system for the drilling of holes in a workpiece within a diameter range of 20 ?m to 500 ?m by means of laser radiation. The invention utilizes the beam quality of a laser beam as well as: the polarization of the laser radiation; the parameters of the impulses of the laser used; and, the type and pressure of the process gas used. The method and system utilize means for focusing laser radiation, in particular the ratio of the beam diameter at the site of the focusing element and its focal distance, and wherein the focusing is done in coordination with the beam quality number and wave length and other factors. A first working gas supports the formation of the hole shape and accelerates the drilling process; and, a second working gas is utilized to improve the surface quality of the drilling walls.

Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.

Abstract: An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.

Abstract: A system for laser microperforated fresh produce trays for use in modifying or controlling the flow of oxygen and carbon dioxide into and/out of a fresh produce container, where the microperforations are specifically tailored such as by size, location and number for the specific produce. The packaging system tailors microperforated trays for particular produce to optimally preserve the produce, using a method of making registered microperforations on the trays using at least some of the following: a conveyor, a thickness measuring devise, a sensor mechanism, and a laser system including optics.

Abstract: A method of forming articles having closed microchannels includes the steps of providing a substrate including a composite material, the composite having metal nanoparticles dispersed in a polymer matrix. The substrate is irradiated with a laser beam at an intensity and time sufficient to selectively remove the polymer below a surface of said substrate to form at least one microchannel, wherein the intensity and time is low enough to avoid removing the polymer above the microchannel, wherein an article having at least one closed microchannel is formed. A metal nanoparticle/polymer composite composition can have functionality that can undergo addition reactions to seal or join pieces of polymers or composites upon irradiation of the composition placed on one or more pieces.

Abstract: A method of producing at least one through-hole and countersink in at least one ultrahard insert including the steps of providing a body having a first major surface and an opposite second major surface; forming at least one pilot hole in said body using a laser, wherein said at least one pilot hole extends from said first major surface to the opposite second major surface of said body; cutting said pilot hole using a wire electrical discharge machine (WEDM) to produce a straight cylindrical portion and top conical portion; forming a countersink on at least one side of said body using an electrical discharge grinding machine (EDG); and severing said at least one ultrahard insert from said body forming a finished insert, wherein said finished insert includes a through-hole and a countersink.

Abstract: The invention relates to a method for the parametric production of a drilled hole in a component, in particular for the parametric production of a drilled cooling hole in a blade of a gas or steam turbine. In the case of the method according to the invention, in a first method step (21) an actual wall thickness of the component is measured at the location at which the drilled hole is to be introduced. Subsequently, at least one parametric drilled-hole geometry value is determined on the basis of an adjustment of the measured, actual wall thickness with an assumed, ideal wall thickness (method step 23). The drilled hole is then produced according to the determined parametric drilled-hole geometry value (method step 24). Furthermore, the invention relates to a drilling device, in particular for carrying out the method, and to a component into which one or more drilled holes have been introduced according to the method.

Abstract: A variable focus laser machining system is disclosed. The machining system may have a laser emitter configured to emit a laser beam. Additionally, the machining system may have a focusing element configured to focus the laser beam. The machining system may also have a controller. The controller may be configured to focus the laser beam at a first focal point. The first focal point may be approximately positioned on a first machining surface of a work piece. The controller may also be configured to determine that the first machining surface has moved relative to the first focal point. Additionally, the controller may be configured to re-focus the laser beam at a second focal point. The second focal point may be positioned between a second machining surface and a predetermined surface spaced apart from the second machining surface.

Abstract: A method for the formation of at least one passage hole in a high-temperature substrate is described. For each desired passage hole or group of passage holes, a node is first formed on the exterior surface of the substrate, by a laser consolidation process. The node functions as a pre-selected entry region for each passage hole. The passage hole can then be formed through the node, into the substrate. Related articles, such as turbine engine components, are also described.

Abstract: A method for making or repairing a laser drilled hole in a component of gas turbine engines, to meet requirements of air flow through the hole, includes deformation of an excess material melted during the laser drilling process and remaining around an opening end of the hole, thereby causing a marginal reduction in an effective diameter of the hole.