Methods Patents (Class 219/121.71)
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Publication number: 20120145678Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.Type: ApplicationFiled: February 15, 2012Publication date: June 14, 2012Inventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
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Patent number: 8183499Abstract: A processing apparatus is provided in which a laser beam L2 is irradiated onto a processing portion of a workpiece W, and at the same time as the laser irradiation, an assist gas G is injected toward the processing portion from a nozzle 3 arranged concentric to the laser beam L2 so that the processing portion is covered with the assist gas G, thereby processing a piercing hole H on the processing portion. The apparatus includes control means 10 for processing a piercing hole H while moving the nozzle 3 within the range of 5 mm from a processing start point after the irradiation of the laser beam L2 is started.Type: GrantFiled: June 6, 2006Date of Patent: May 22, 2012Assignee: Nissan Tanaka CorporationInventors: Shinji Numata, Yoshimi Sano
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Publication number: 20120111841Abstract: A series of laser pulses, each pulse characterized by one or more predetermined pulse characteristics including wavelength, pulse energy, inter-pulse time interval, pulse width or pulse shape, is provided to drill a hole in a material. Drilling the hole in the material is achieved by placing the series of laser pulse spots at the location wherein the hole is to be drilled. One or more characteristics of one or more laser pulses in the series is changed in order to optimize the drilling process for the hole. The ability to change the characteristics of one or more laser pulses in the series of pulses to optimize the drilling process results in holes with desired attributes and a high drilling rate.Type: ApplicationFiled: May 4, 2011Publication date: May 10, 2012Applicant: ESI-PyroPhotonics Lasers, Inc.Inventors: Richard Murison, Mathew Rekow
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Patent number: 8173931Abstract: To better address these problems, one or more characteristics are measured from a work piece (28). The measurement information is used to select a preferred predetermined laser processing recipe from a lookup table. The laser processing recipe is then used to process the work piece (28). The lookup table of laser processing recipes can be established from theoretical calculations, from trial an error by an operator, from an automated systematic recipe variation process with post process testing, or from some combination of these or other methods. An automated process can also reduce operator errors and may store measurement values for convenient tracking of work piece characteristics.Type: GrantFiled: June 30, 2008Date of Patent: May 8, 2012Assignee: Electro Scientific Industries, Inc.Inventors: Ling Wen, Mehmet Alpay, Jeff Howerton
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Patent number: 8173933Abstract: In a method of forming a hole on a work piece, a laser beam is directed from a laser head to a predetermined portion of the work piece to form a pilot hole having a first surface condition, and then the predetermined portion of the work piece is punched using a die and a punch having a cross-section greater than a cross-section of the pilot hole. Thus, a finished hole having a cross-section greater than the cross-section of the pilot hole is formed over the pilot hole. The finished hole has a second surface condition, and the second surface condition is formed by transforming the first surface condition by the punch to have a precise dimension.Type: GrantFiled: August 26, 2008Date of Patent: May 8, 2012Assignee: DENSO CORPORATIONInventors: Kengo Takeshita, Takashi Hoshiyama
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Patent number: 8173932Abstract: A perforation method and an perforation apparatus in which a hollow member of a fuel injection nozzle is filled with a filler such as a zirconia ball, and a laser light is applied to the hollow member to form an injection hole while vibrating the zirconia ball using an ultrasonic vibrator. After the injection hole is formed, the laser light is introduced through the injection hole to the inside of the fuel injection nozzle, and thereby is applied to the vibrated zirconia ball.Type: GrantFiled: July 23, 2008Date of Patent: May 8, 2012Assignee: Honda Motor Co., Ltd.Inventors: Takashi Kobayashi, Akihiro Nemoto, Hiroaki Yamagishi, Katsuyuki Nakajima
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Publication number: 20120102959Abstract: A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension. Also methods for making the shaped cooling holes.Type: ApplicationFiled: October 29, 2010Publication date: May 3, 2012Inventor: John Howard STARKWEATHER
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Publication number: 20120091106Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.Type: ApplicationFiled: January 5, 2007Publication date: April 19, 2012Inventors: Thomas Beck, Silke Settegast
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Patent number: 8158904Abstract: A method and apparatus is provided for removing material from an outer surface of a workpiece such as a catheter or other medical device. The method begins by generating a laser beam having an intensity profile and directing the laser beam onto the outer surface of the workpiece. After the laser beam is generated, its intensity profile is adjusted by a component such as a diffractive optical element (DOE) or a holographic optical element (HOE) so that material can be removed from the workpiece by ablation in a prescribed manner.Type: GrantFiled: August 13, 2004Date of Patent: April 17, 2012Assignee: Boston Scientific Scimed, Inc.Inventors: Jan Weber, Thomas J. Holman
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Publication number: 20120085739Abstract: A method of drilling holes through a solid material in such manner as to give holes in a first area a first profile and distribution and holes in a second area a second profile and distribution comprising the steps of: defining a first area in which holes have a first profile and distribution; defining a second area in which holes have a second profile and distribution at least one of which is different from that in the first area; defining a transition zone in which holes have a profile and/or distribution as the case may be which undergo a continuous and gradual transition from that in the first area to that in the second area; drilling holes in all of the first area, the transition zone and the second area via a continuous process.Type: ApplicationFiled: January 18, 2010Publication date: April 12, 2012Inventor: Bryan Humphreys
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Patent number: 8153923Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.Type: GrantFiled: December 29, 2006Date of Patent: April 10, 2012Assignee: Siemens AktiengesellschaftInventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
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Publication number: 20120082518Abstract: A cutting tool includes an insert defining a flank face, a rake face, and a cutting edge between the flank face and rake face. The cutting tool includes micro-nozzles formed in at least one of the tool body and the insert, and aimed at the cutting edge. Each micro-nozzle generates a micro jet of cutting fluid in close proximity to the cutting edge and adjacent to at least one of the flank face and the rake face.Type: ApplicationFiled: October 3, 2011Publication date: April 5, 2012Inventors: Douglas J. Woodruff, Gary W. Pennala, William J. Endres, Nicole Barna, Quincy Schultz, David Thomasini, Matthew Zblewski
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Publication number: 20120080415Abstract: A method and device for producing a hole in an object is disclosed. The method includes the generation of a beam for removing material such that a bottom of a borehole is placed in a focus position of the beam, and a removal of material by impingement of the beam on the bottom of the borehole. A repeated placing of the bottom of the borehole in a focus position of the beam in order to compensate for the increased depth of the hole as a result of the removal of material is combined with a step of changing a radiation characteristic of the beam when the bottom of the borehole is repeatedly placed in a focus position.Type: ApplicationFiled: May 29, 2010Publication date: April 5, 2012Applicant: MTU Aero Engines GmbHInventors: Mark Geisel, Stefan Schur
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Publication number: 20120074108Abstract: Disclosed is a micro-hole structure and a method for forming the micro-hole. A working energy source is projected onto a predetermined drilling site on a first surface of a substrate for a given period of time so as to melt a portion of the substrate to form a working energy entering section until the working energy source penetrates through a second surface of the substrate to form a micro-hole. A melt formed by melting a portion of the substrate in the micro-hole next to the second surface is allowed to reflow in a direction opposite to the projection of the working energy source to thereby form a reflow section in the substrate. Further, a two or more stages emission of laser pulses is used to form the micro-hole to control the bore diameter of the micro-hole.Type: ApplicationFiled: December 6, 2011Publication date: March 29, 2012Applicant: NATIONAL TAIWAN UNIVERSITYInventors: ANDREW M. WO, DE-SHIEN JONG, CHANG-YU CHEN, KUAN-TING LIU, LO-CHANG HSIUNG
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Publication number: 20120043497Abstract: A working component for magnetic heat exchange comprises a magnetocalorically active phase comprising La1-aRa(Fe1-x-yTyMx)13Hz, a hydrogen content, z, 90% or higher of a hydrogen saturation value, zsat, and values of a, x and y selected to give a Curie temperature Tc. M is one or more of the elements from the group consisting of Al and Si, T is one or more of the elements from the group consisting of Co, Ni, Mn, Cr, Cu, Ti and V and R is one or more of the elements from the group consisting of Ce, Nd, Y and Pr. Tcmax is a Curie temperature of a La1-aRa(Fe1-x-yTyMx)13Hz phase comprising a hydrogen content z=zsat and said selected values of a, x and y. The working component comprises the Tc wherein (Tcmax?Tc)?20K.Type: ApplicationFiled: February 11, 2011Publication date: February 23, 2012Applicant: Vacuumschmelze GmbH & Co. KGInventors: Matthias KATTER, Volker Zellmann, Alexander Barcza
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Patent number: 8119949Abstract: A method of forming a plurality of shaped holes on a workpiece. The method may include rotating the workpiece about multiple axes relative to a laser beam, and positioning the laser at a first predetermined angle relative to the workpiece. The laser beam is pulsed to form a first plurality of trepan cuts defining a row of metering holes. The laser beam, after adjusting to a next predetermined angle and adjacent a previous row of trepan cuts, is pulsed to create a plurality of rows of trepan cuts wherein each cut in the previous row of trepan cuts is connected to a cut in said subsequent row of trepan cuts. The plurality of rows of trepan cuts are formed in a side-to-side sweeping formation and define a portion of each of the shaped holes. Next, the laser is pulsed in alignment with the metering hole to remove debris from therein.Type: GrantFiled: November 26, 2008Date of Patent: February 21, 2012Assignee: Honeywell International Inc.Inventor: Lowell Frye
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Patent number: 8116341Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.Type: GrantFiled: May 31, 2007Date of Patent: February 14, 2012Assignee: Electro Scientific Industries, Inc.Inventors: Weisheng Lei, Yunlong Sun, Yasu Osako, John Davignon, Glenn Simenson, Hisashi Matsumoto
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Patent number: 8114520Abstract: An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.Type: GrantFiled: December 3, 2007Date of Patent: February 14, 2012Assignee: LINTEC CorporationInventors: Yoji Wakayama, Yosuke Sato, Naoki Taya
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Publication number: 20120020596Abstract: A gas bearing (100) having pressurised axially extending chambers (110) in a housing (102) having a shaft bore (104) therein, the axially chambers (110) being in fluid communication with a bearing surface (108) that defines the bore via laser-drilled capillaries (118). The end (122) of each laser-drilled capillary at the bearing surface (108) is flared such that the narrowest portion of the capillary is set back from the bearing surface (108). This shape can ensure that the load carrying function of the bearing (100) does not fail during shaft eccentricity by ensuring that pressure restriction must happen within the capillary and not the gap being shaft and bearing surface. The bearing surface may face in an axial and/or radial direction with respect to the shaft. The axial chambers may be pressurised axially such that the outer circumference of the housing is unbroken and hence usable for other purposes.Type: ApplicationFiled: January 26, 2010Publication date: January 26, 2012Applicants: AIR BEARINGS LIMITEDInventor: Ralf Dupont
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Patent number: 8101884Abstract: A pressure sensitive adhesive sheet 1 includes a base material 11 and a pressure sensitive adhesive layer 12. A plurality of through holes 2 pass through one face of the pressure sensitive adhesive sheet 1 to the other face. The hole diameter of the through holes 2 is 0.1 to 300 ?m and the hole density is 30 to 50,000/100 cm2. It is preferable to form the through holes 2 using a laser beam machining. In the pressure sensitive adhesive sheet 1, an air trapping or a blister can be prevented or removed without disfiguring the pressure sensitive adhesive sheet and while maintaining sufficient adhesive strength.Type: GrantFiled: October 8, 2009Date of Patent: January 24, 2012Assignee: Lintec CorporationInventors: Kiichiro Kato, Kazuya Kato, Takashi Takemoto
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Publication number: 20120000811Abstract: Methods of manufacturing a vacuum chamber and methods of forming a port tube for use in connection with a vacuum chamber are provided. Vacuum chambers, bodies, containers, port tubes, and related components made in accordance with these methods are also disclosed. Further, various laser-based arrangements and equipment (or components) that can be used in connection with these methods are further provided.Type: ApplicationFiled: June 30, 2011Publication date: January 5, 2012Applicant: Kurt J. Lesker CompanyInventors: Charles DeVentura, David Manko, David Kotsch
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Publication number: 20110319300Abstract: A method and an array filling system for loading a plurality of disparate sample containers, the sample containers comprising an integral structure. Each receptacle is characterized by a hydrophilic surface, and the receptacles are separated by a hydrophobic surface. The system has a liquid transfer device capable of holding liquid and adapted for motion to cause sequential communication of liquid held in the liquid transfer device with successive receptacles of the array by dragging the liquid across the hydrophobic surface.Type: ApplicationFiled: September 9, 2011Publication date: December 29, 2011Applicant: Massachusetts Institute of TechnologyInventors: Ian Hunter, Colin J.H. Brenan, Tanya S. Kanigan
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Publication number: 20110309059Abstract: An apparatus for creating a hole in solid sheet material (1) by laser beam irradiation is described comprising a source of laser radiation; a focusing apparatus (11) for impinging a beam of laser radiation from the source onto a surface of solid sheet material (1) in which holes are to be formed in use; and a holding device (7) for holding said solid sheet material (1); wherein the holding device (7) is structured to hold the sheet material (1) in use in an arcuate configuration. A method of creating a hole in solid sheet material making use of such an arcuate configuration is also described.Type: ApplicationFiled: January 20, 2010Publication date: December 22, 2011Inventor: Bryan Humphreys
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Patent number: 8076610Abstract: Punching machine for the execution of holes on metal plates comprising a laser cutting head slidably supported by a pair of slides movable along a pair of Cartesian axes in a relatively restricted space with high velocities and accelerations. Movable balancing masses are operatively associated to the first and to the second slide.Type: GrantFiled: September 22, 2005Date of Patent: December 13, 2011Assignee: Prima Industrie S.p.A.Inventors: Maurizio Gattiglio, Michele de Chirico
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Patent number: 8071911Abstract: A combustor component with cooling apertures has the apertures formed by laser drilling. The machining apparatus comprises a beam generator for generating a beam for directing at the combustor component and a beam trap. The component is translated relative to the beam and the beam is directed to the beam trap and is dissipated within the beam trap.Type: GrantFiled: January 24, 2008Date of Patent: December 6, 2011Assignee: Rolls-Royce PLCInventor: Ian M. Garry
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Publication number: 20110278270Abstract: A laser drilling system (100) for drilling rocks, soil and engineering materials with the aid of high-intensity laser light is described, which comprises an optical drill (104) for supplying laser light for the drilling of said materials provided with sensors (106); a control and operations center (101) comprising computer and supervising software with integrated logic; a cooling and debris withdrawal system (105) an energy source (102); an energy conductor (103) provided with sensors (107) and laser systems (201) for emitting high-intensity laser light and optical fibers (123) for conducting the so-generated laser light, so that the information collected by sensors (106), (107) supply said control and operations center (101) and said control and operations center (101) determines improved operation conditions of the optical drill (104) for the drilling of said solid materials or mixtures of solid and liquid materials relative to state-of-the-art drilling systems.Type: ApplicationFiled: November 30, 2009Publication date: November 17, 2011Applicant: Faculdades Catolicas, Sociedade Civil Mantenedora Da PUC RioInventors: Arthur Martins Barbosa Braga, Cicero Martelli
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Publication number: 20110272387Abstract: A process for making a hole into a substrate by a laser is provided. According to the proposed process, in a first step, at least one intermediate hole is produced into the substrate by at least one laser, the intermediate hole having an intermediate diameter that is smaller than a final diameter of the hole to be made. In a second step, the hole having the final diameter is produced into the substrate by the at least one laser.Type: ApplicationFiled: May 2, 2011Publication date: November 10, 2011Inventors: Andrea Massa, Andreas Oppert
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Patent number: 8049136Abstract: A method for producing a metal mask for screen printing is provided, in which dross that is deposited at the time a boring operation is conducted via a laser beam is removed, without causing warpage or bending. The method for producing a metal mask for screen printing includes steps of: forming openings in the metal plate by melting the metal plate at positions irradiated by the laser beam; and ejecting an abrasive onto the other surface of the metal plate after the openings are formed. The abrasive ejected in the abrasive ejection step is one having a predetermined flat shape (plate-shaped abrasive), so as to form a plate shape having a flat surface, or an elastically deformable abrasive, with an average grain diameter of a dispersed or carried abrasive grain being 1 mm to 0.1 ?m, and which is ejected at an incident angle of equal to or less than 80 degrees with respect to the other surface of the metal plate, and at an ejection pressure of 0.01 MPa to 0.Type: GrantFiled: July 16, 2008Date of Patent: November 1, 2011Assignee: Fuji Manufacturing Co., Ltd.Inventors: Keiji Mase, Shozo Ishibashi
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Publication number: 20110259631Abstract: The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the substrate surface and is used for creating fine groove structures by semi-continuous direct write type beam movement. The second process uses a second laser beam that is used to form a larger size image on the substrate surface and is used to create blind pads and contact holes in the substrate in step and drill mode. A third optional process uses the second laser beam operating in direct writing mode to remove layers of the substrate over larger continuous areas or in a mesh type pattern.Type: ApplicationFiled: May 27, 2009Publication date: October 27, 2011Applicant: M-SOLV LTD.Inventor: Philip Thomas Rumsby
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Patent number: 8044322Abstract: A system and method for processing a tubular member for producing a medical device, wherein the tubular member is oriented in a longitudinally vertical position during processing.Type: GrantFiled: October 28, 2010Date of Patent: October 25, 2011Assignee: Boston Scientific Scimed, Inc.Inventor: Kenneth M. Merdan
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Publication number: 20110240615Abstract: A process for providing a protection against damages in a machine head, wherein the machine head launches a transparent liquid jet guided laser beam LB by means of a nozzle 3 along an optical axis for treating a work piece is claimed. The process comprises the following steps: First a blind steel plate (protection plate 20) is fixed to a front of a protection chamber (10) prior to the liquid water jet (WJ). Then the transparent liquid jet (WJ) guided laser beam (LB) is stared, which impinges on the blind steel plate (20) blank and drills a transit-hole into the blind steel plate blank. The transit-hole (23) has a size which substantially corresponds to a cross-section of the laser beam (LB) guiding transparent liquid jet (WJ). The steel plate (20) with the transit-hole (23) provides a protection plate (20) having the transit-hole (23) precisely arranged on the optical axis. Therefore no further alignment is required.Type: ApplicationFiled: November 20, 2009Publication date: October 6, 2011Applicant: SYNOVA SAInventors: Grigore Suruceanu, Benjamin Carron
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Publication number: 20110236748Abstract: A current collector includes a metal foil with a plurality of through-holes formed therein. The metal foil is divided into two regions of: a distant region distant from a connection portion to be connected to an external terminal; and a close region being close to the connection portion and having the same area as the distant region. The open area ratio of the distant region of the metal foil is larger than that of the close region. Thus, the electrical resistance of the close region is smaller than that of the distant region. Therefore, production of heat in the close region due to passage of current can be suppressed.Type: ApplicationFiled: August 20, 2010Publication date: September 29, 2011Inventors: Takuya Nakashima, Hiroshi Temmyo
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Patent number: 8013316Abstract: A method and apparatus for near-field focusing of an incident wave, over a range of frequencies from microwaves to optical frequencies, into a sub-wavelength spot having a peak-to-null beamwidth of ?/10. The screen may be made out of closely spaced, unequal slots cut on a metallic sheet. Nano-scale focusing capability may be achieved with a simple structure of three slots on a metallic sheet, which can be readily implemented using current nanofabrication technologies. Unlike negative-refractive-index focusing implementations, this “meta-screen” does not suffer from image degradation when losses are introduced and is easily scalable from microwave to Terahertz frequencies and beyond. The slotted geometry is designed using a theory of shifted beams to determine the necessary weighting factors for each slot element, which are then converted to appropriate slot dimensions.Type: GrantFiled: December 4, 2008Date of Patent: September 6, 2011Inventor: George V. Eleftheriades
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Patent number: 8013273Abstract: Disclosed are an apparatus and a method for manufacturing an absorption pad used for picking up a package or a strip during a semiconductor manufacturing process. The apparatus includes a workpiece transfer device on which a workpiece is mounted, a laser generator installed above the workpiece transfer device while being spaced apart from the workpiece transfer device by a predetermined distance, a driving unit for moving the workpiece transfer device and the laser generator relative to each other, and a controller for controlling the laser generator. It is possible to precisely form patterns having various sizes and shapes according to use of the absorption pad and the size of the package. Processing conditions for the workpiece are standardized, so that the processing time and manufacturing cost for the absorption pad are minimized.Type: GrantFiled: January 26, 2006Date of Patent: September 6, 2011Assignee: Hanmi Semiconductor, Inc.Inventor: Nho-Kwon Kwak
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Publication number: 20110203924Abstract: Luminescence test measurements are conducted using an assay module having integrated electrodes with a reader apparatus adapted to receive assay modules, induce luminescence, preferably electrode induced luminescence, in the wells or assay regions of the assay modules and measure the induced luminescence.Type: ApplicationFiled: November 11, 2010Publication date: August 25, 2011Applicant: MESO SCALE TECHNOLOGIES, LLCInventors: Jacob N. Wohlstadter, Eli Glezer, James Wilbur, George Sigal, Kent Johnson, Charles Clinton, Alan Kishbaugh, Bandele Jeffrey-Coker, Jeff D. Debad, Alan B. Fischer
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Publication number: 20110198321Abstract: The present invention is a method and system for the drilling of holes in a workpiece within a diameter range of 20 ?m to 500 ?m by means of laser radiation. The invention utilizes the beam quality of a laser beam as well as: the polarization of the laser radiation; the parameters of the impulses of the laser used; and, the type and pressure of the process gas used. The method and system utilize means for focusing laser radiation, in particular the ratio of the beam diameter at the site of the focusing element and its focal distance, and wherein the focusing is done in coordination with the beam quality number and wave length and other factors. A first working gas supports the formation of the hole shape and accelerates the drilling process; and, a second working gas is utilized to improve the surface quality of the drilling walls.Type: ApplicationFiled: October 22, 2008Publication date: August 18, 2011Inventors: Herbert Walter, Gisbert Staupendahl
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Publication number: 20110185572Abstract: A process and system are provided for forming shaped air holes, such as for use in turbine blades. Aspects of the disclosure relate to forming shaped portions of air holes using a short pulse laser, forming a metered hole corresponding to each shaped portion, and separately finishing the shaped portion using a short-pulse laser. In other embodiments, the order of these operations may be varied, such as to form the shaped portions and to finish the shaped portions using the short-pulse laser prior to forming the corresponding metered holes.Type: ApplicationFiled: January 29, 2010Publication date: August 4, 2011Applicant: General Electric CompanyInventors: Bin Wei, Jon Conrad Schaeffer, Ronald Scott Bunker, Wenwu Zhang, Kathleen Blanche Morey, Jane Marie Lipkin, Benjamin Paul Lacy, Wilbur Douglas Scheidt
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Patent number: 7989728Abstract: A method and a device for producing a tear line in a vehicle interior trim part, in which a laser beam is guided along a tear line and a material ablation in the form of holes with a residual wall thickness is effected. On the side facing the laser beam, the complete extent of the tear line is detected by a stationary matrix camera. In the machining at a machining site, only pixels of a CMOS matrix camera that are known in advance, for which the incidence of a measurement radiation is expected at this machining site, are read out. The laser is preferably scanned and non-adjacent machining sites are machined successively.Type: GrantFiled: May 13, 2008Date of Patent: August 2, 2011Assignee: Jenoptik Automatisierungstechnik GmbHInventor: Wolfgang Wittenbecher
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Patent number: 7985942Abstract: Laser pulse energy adjustments are motivated by an understanding of the effect of laser pulse width variations among different lasers on satisfying a quality metric associated with a laser-processed target. In a preferred embodiment, the adjustments normalize this effect among different lasers drilling vias in a target specimen. The number of pulses delivered to the target specimen to form each via can be modified, based on the pulse energy applied to the via location, to control different via quality metrics.Type: GrantFiled: May 17, 2005Date of Patent: July 26, 2011Assignee: Electro Scientific Industries, Inc.Inventors: Weisheng Lei, Glenn Simenson, Jeff Howerton, Mark Unrath
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Patent number: 7982161Abstract: An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.Type: GrantFiled: March 24, 2008Date of Patent: July 19, 2011Assignee: Electro Scientific Industries, Inc.Inventors: Yunlong Sun, Weisheng Lei, Hisashi Matsumoto, Brian Johansen, Gregg Hardy, Brian Baird
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Patent number: 7976764Abstract: A method for the introduction of at least one locally limited weakening into a decorative composite, in particular for use in an automotive vehicle, by way of a plurality of laser beams, is disclosed. The decorative composite includes at least one decorative substrate, at least one decorative material and at least one upholstered layer arranged between the decorative substrate and the decorative material. The weakening is formed after the joining of the decorative composite as a sequence of first blind holes or perforations, which penetrate the decorative substrate completely, and unweakened webs between these blind holes or perforations. At least one second blind hole, which does not penetrate the decorative substrate, is introduced into at least one web.Type: GrantFiled: November 20, 2007Date of Patent: July 12, 2011Assignee: Lisa Draexlmaier GmbHInventors: Christian Schlemmer, Hubert Pirkl
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Patent number: 7977603Abstract: A method for manufacturing an eyeless needle by which a satisfactory hole can be formed in the end surface of a fine suture needle having a needle diameter less than 150 micrometers is proposed. In a method for manufacturing an eyeless needle by forming a hole for inserting and fixing one end of a suture thread by caulking in the end surface of the eyeless suture needle made of stainless steel, the hole is formed by irradiating the end surface of a needle material thicker by 6 to 20 micrometers than a desired needle diameter of the suture needle less than 150 micrometers with one shot of a laser beam, and subsequently, a portion thicker than the desired needle diameter is removed by electrolytic polishing or chemical polishing.Type: GrantFiled: March 30, 2006Date of Patent: July 12, 2011Assignee: MANI., Inc.Inventors: Kanji Matsutani, Masaki Mashiko, Yuji Yokoyama, Mieko Akaba, Hiroshi Yagisawa, Masao Akatsuka, Shoichi Fukuda
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Publication number: 20110163078Abstract: A laser machining device machines a workpiece having a machining portion where a hole is machined and a non-machining portion positioned on an extension of the hole. The laser machining device includes a nozzle that jets a column of liquid towards the hole of the machining portion and a laser head that introduces a laser beam into the column of liquid jetted towards the hole. The workpiece is held by a holding member. A laser beam blocking member is disposed in the non-machining portion. The laser beam blocking member blocks the laser beam that passes through the hole. Furthermore, a discharge path that discharges the liquid reaching the hole is provided in the laser beam blocking member.Type: ApplicationFiled: December 27, 2010Publication date: July 7, 2011Applicant: DENSO CORPORATIONInventors: Takeshi FUKUSHIMA, Keiji SAKAI, Hiroyuki OOTANI
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Patent number: 7968820Abstract: A method for producing an area of light transmissivity in a generally opaque panel comprises forming an area of reduced thickness in the panel, laser drilling an array of microscopic holes in the area and thereafter filling the holes with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area, and the polymer may be colored to add color to light transmitted through the pattern.Type: GrantFiled: May 1, 2007Date of Patent: June 28, 2011Assignee: Electro Scientific Industries, Inc.Inventors: Gregg E. Hardy, Michael S. Nashner, Jeffrey Howerton
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Publication number: 20110147351Abstract: A laser processing apparatus for piercing a workpiece and cutting the pierced workpiece by irradiating the workpiece with a laser beam. The apparatus includes: a laser beam projection unit for projecting the laser beam onto the workpiece with the focus position thereof set to lie within the workpiece and in the vicinity of the surface of the workpiece at least when piercing is started; and a laser oscillator that emits the laser beam as a pulsed laser having a frequency at which plasma is generated when the workpiece is irradiated with the laser beam at the focus position set through the laser beam projection unit when the piercing is started.Type: ApplicationFiled: June 1, 2009Publication date: June 23, 2011Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Takanori Miyazaki, Takashi Inoue, Hiroyuki Murai
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Publication number: 20110132882Abstract: A filler made of glass beads is provided. The glass improves the absorption and the distribution of the energy of the beam such that an internal wall of the hollow component is not damaged. A process for producing a through-hole in a hollow component is provided. Also, an apparatus for laser drilling is provided.Type: ApplicationFiled: December 2, 2010Publication date: June 9, 2011Inventors: Wolfgang Dorn, Francis-Jurjen Ladru, Michael Riemann
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Publication number: 20110132881Abstract: Apparatus and methods for drilling holes in a material with a laser are disclosed. An apparatus for drilling holes in a material with a laser includes a first steering element, a second steering element, and a lens. The first steering element is positioned to steer a beam from the laser. The second steering element is positioned to steer the beam from the first steering element. The lens focuses the beam from the second steering element. The first and second steering elements are configured to move with respect to the beam. Moving the first and second steering elements changes an angle of the beam where it contacts the material. The apparatus is operable to drill holes having no taper or reverse taper.Type: ApplicationFiled: December 7, 2009Publication date: June 9, 2011Inventor: Xinbing Liu
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Patent number: 7952050Abstract: A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 ?m high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.Type: GrantFiled: August 23, 2007Date of Patent: May 31, 2011Assignee: Hitachi Via Mechanics, Ltd.Inventors: Hidenori Tateishi, Masaru Futaana, Yuki Saeki, Yasunobu Ueno
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Publication number: 20110114610Abstract: Piercing a workpiece with a laser beam, while directing multiple gas flows onto the workpiece at angles and locations that cause the gas flows to blow slag away from the piercing location and produce a gas cushion between the blown away slag and the workpiece, thereby reducing adhesion of slag. A laser processing head is accordingly configured with additional gas nozzles.Type: ApplicationFiled: December 17, 2010Publication date: May 19, 2011Applicant: TRUMPF WERKZEUGMASCHINEN GMBH + CO. KGInventors: Arnd Szelagowski, Florian Sepp, Mathias Schlotter
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Patent number: 7938437Abstract: In a method for producing a weakened zone, in particular a predetermined breaking point for an airbag exit opening, in a carrier part equipped on the visible side with a decorative material, in particular a leather decoration, the carrier part is provided with a weakened section using first process, and weakening of the decorative material is performed through the weakened section of the carrier part using a second process. The weakening of the carrier part and the weakening of the decorative material taking place temporally close to one another, in particular at the same time. Furthermore, the invention relates to a component and an apparatus for carrying out the method.Type: GrantFiled: October 20, 2006Date of Patent: May 10, 2011Assignee: Johnson Controls Technology CompanyInventors: Martin Lippert, Dieter Renner, Hartmut Harnisch