Abstract: An apparatus and method for manufacturing a light emitting devices by separating a semiconductor layer from a substrate includes a laser beam source for emitting a laser beam, a mesh-typed mask having a plurality of apertures through which the laser beam passes to provide a plurality of unit beams; and an imaging lens for forming a plurality of beam spots by focusing the plurality of unit beams at an interface between a substrate and a semiconductor layer to separate the substrate from the semiconductor layer.

Abstract: A system for generating a laser machined tool from a substantially cylindrical work piece. The system includes a laser producing a laser beam, a mask positioned within the laser beam for shaping the laser beam into an image, and an optical system for imaging the laser beam image onto the outer surface of the work piece. The system coordinates rotational and translation movements of the work piece with activation of the laser in order to use the laser image for ablating the outer surface of the work piece, creating microstructures within the surface of the work piece to form the cylindrical tool.

Abstract: A method is described, for treating a superalloy substrate which includes at least one cavity containing adherent metal oxide material on its surface. A short-pulsed, high repetition rate laser beam is directed against the cavity surface for a period of time sufficient to remove substantially all of the adherent metal oxide material. The laser beam is characterized by a peak power density in the range of about 10 megawatts/cm2 to about 10 gigawatts/cm2. In another embodiment, a high-power, short-pulsed, high repetition rate laser beam is directed to a region on the substrate which includes the cavity, under laser operational conditions which are capable of cutting into the superalloy material; so that a boundary region is formed within the substrate, which encloses the cavity. The cavity can be a crack in a turbine blade, and the crack can be repaired after treatment, by welding, or by another suitable technique.

Abstract: A laser beam irradiation apparatus and method of manufacturing an organic light emitting display device using the same are disclosed. The laser beam irradiation apparatus is configured to irradiate a laser beam to an object extending in a first direction while moving the laser beam relative to the object in the first direction, where the laser beam has a cross-section taken in a plane perpendicular to a second direction in which the laser beam is irradiated from the apparatus, the cross-section comprising two substantially symmetrical portions that are substantially symmetrical about a centerline of the cross-section extending in the first direction, where the cross-section has a centerline length taken in the centerline, where at least part of the substantially symmetrical portions has a length in the first direction that is longer than the centerline length.

Abstract: A high energy, high repetition rate workpiece surface heating apparatus is disclosed which comprise a XeF laser producing a laser output light pulse beam, an optical system narrowing the laser output light pulse beam in the short axis of the laser output light pulse beam and expanding the laser output light pulse beam to form in a long axis of the beam a workpiece covering extent of the long axis, the optical system focuses the laser output light pulse beam at a field stop with a magnification sufficient to maintain an intensity profile that has sufficiently steep sidewalls to allow the field stop to maintain a sufficiently steep beam profile at the workpiece.

Abstract: A laser processing beam machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the laser beam application means comprises a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means; and the condenser comprises a condenser lens opposed to the workpiece held on the chuck table, a cylindrical lens arranged on the upstream side in the laser beam application direction of the condenser lens, and an interval adjustment mechanism for adjusting the interval between the condenser lens and the cylindrical lens.

Abstract: The invention relates to a lid (2) for closing a cup (1) along a peripheral sealing edge (10). Said lid comprises at least one aluminum film and an optionally multi-layered plastic layer which is co-extruded onto the aluminum film and has a closed predetermined tearing line (3). The invention is characterized in that the plastic layer is made of plastic based on polyethylene (PE) or plastic based on polypropylene (PP) and that the predetermined tearing line is introduced into the plastic layer preferably by means of a CO2 laser. In one embodiment, said predetermined tearing line (3) is provided directly in the region of the sealing edge (10). The invention also relates to a method for producing such a lid.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: A device for a laser processing head includes an optical element configured for attachment to the laser processing head, a housing for the laser processing head configured to receive the optical element, and a mechanical encoding disposed on at least one of the optical element and the housing to permit installation of a predetermined optical element at a predetermined orientation into the housing.

Abstract: By laser beam being slantly incident to the diffractive optics, an aberration such as astigmatism or the like is occurred, and the shape of the laser beam is made linear on the irradiation surface or in its neighborhood. Since the device has a very simple configuration, the optical adjustment is easier, and the device becomes compact in size. Furthermore, since the beam is slantly incident with respect to the irradiated body, the return beam can be prevented.

Abstract: With many coated sheets, in particular zinc-coated sheets as used in the automobile industry, the coating material has a much lower boiling point than the material of the sheet. On welding said sheets together the above leads to explosive evaporation of coating material which seriously affects the quality of the connection. In order to improve the quality of the connection it has already been disclosed that narrow gaps between the sheets can be produced by means of spacers, through which the coating material can escape. The spacers can be produced for example, by means of laser bombardment of the sheets. A disadvantage is the relatively long time necessary for machining, which causes large costs in particular for serial production. The aim of the invention is to reduce the time necessary for machining the sheets whilst at least maintaining, preferably improving the quality of the machining.

Abstract: A method for real-time optical diagnostics in laser ablation and laser processing of layered or structured materials or material structures. Diagnostics is provided during laser ablation that is utilized regularly in laser processing and/or chemical analysis of structured materials, by means of measuring optical emission generated as a result of the pulsed laser-material interaction in real time. The method can involve a single-layer-film or a stack of multiple layers or a structure of different domains. The method is particularly beneficial in fabrication of thin-film structures, such as photovoltaic and electronic devices or circuits of devices.

Abstract: Disclosed are a laser annealing method and apparatus capable of forming a crystalline semiconductor thin film on the entire surface of a substrate without sacrificing the uniformity of crystallinity in a seam portion in a long-axis direction of laser light, the crystalline semiconductor thin film having good properties and high uniformity to an extent that the seam portion is not visually recognizable. During the irradiation of a linear beam, portions corresponding to the edges of the linear beam are shielded by a mask 10 which is disposed on the optical path of a laser light 2, and the mask 10 is operated so that the amount of shielding is periodically increased and decreased.

Abstract: In laser annealing using a solid state laser, a focus position of a minor axial direction of a rectangular beam is easily corrected depending on positional variation of a laser irradiated portion of a semiconductor film. By using a minor-axis condenser lens 29 condensing incident light in a minor axial direction and a projection lens 30 projecting light, which comes from the minor-axis condenser lens 29, onto a surface of a semiconductor film 3, laser beam 1 is condensed on the surface of the semiconductor film 3 in the minor axial direction of a rectangular beam. The positional variation of a vertical direction of the semiconductor film 3 in a laser irradiated portion of the semiconductor film 3 is detected by a positional variation detector 31, and the minor-axis condenser lens 29 is moved in an optical axis direction based on a value of the detection.

Abstract: A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

Abstract: In a manufacturing method, energy beam heat is radiated to a target area of the motor assembly which is used for a storage disk drive. By radiating energy beam thereto, a portion of the motor assembly is deformed in a non-contact manner, thus, without being affected by elastic recovery of a portion of the motor assembly to be deformed, the machining accuracy of the motor assembly is adjusted in a precise manner.

Abstract: An apparatus that divides a single laser beam into two or more beams that can be directed at an object, such as a work piece, to perform laser heat treatment is disclosed. An adapter stage is in optical communication with a light source, such as a laser source, and arranged to receive a light beam from the light source. A focus stage in optical communication with the adapter stage is arranged to receive the light beam from the adapter stage and to focus the light beam. A beam splitting stage in optical communication with the focus stage is arranged to receive the focused light beam and to split the focused light beam into a multiple light beams. A redirection stage in optical communication with the beam splitting stage is arranged to receive the multiple light beams and to direct them toward a plurality of target locations on the object.

Abstract: The invention relates to a machine tool for processing a plate-like workpiece, including a processing tool. The processing tool is movable relative to the workpiece and the workpiece is movable relative to the processing tool along a common movement axis. A control unit selectively actuates the processing tool and the workpiece in such a manner that in a first processing mode both the processing tool and the workpiece are moved along the common movement axis and, in a second processing mode the processing tool alone is moved along the common movement axis. The invention further relates to a method for processing a workpiece of the kind mentioned above, to a method for creating a processing program, and to a computer program product having code for performing all steps of the method for creating the processing program.

Abstract: A method of decorating a perfume bottle having a wall (11, 12, 13) that presents an outside surface (14) and an inside surface (15), at least one of the surfaces (14, 15) having a shape in relief that is complex, the method comprising at least one step of applying a coating (4, 5) to at least one portion of one of the surfaces (14, 15) of complex shape, the method further comprising a subsequent step of treating said coating, the method being characterized in that said treatment step is a marking step using a laser beam (F).

Abstract: A high, energy, high repetition rate workpiece surface heating apparatus is disclosed which comprise a XeF laser producing a laser output light pulse beam, an optical system narrowing the laser output light pulse beam in the short axis of the laser output light pulse beam and expanding the laser output light pulse beam to form in a long axis of the beam a workpiece covering extent of the long axis, the optical system focuses the laser output light pulse beam at a field stop with a magnification sufficient to maintain an intensity profile that has sufficiently steep sidewalls to allow the field stop to maintain a sufficiently steep beam profile at the workpiece.

Abstract: Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices; the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.

Abstract: An object of the present invention is to provide a laser irradiation method and a laser irradiation apparatus for irradiating an irradiation surface with a linear beam having more homogeneous intensity by blocking a low-intensity part of the linear beam without forming the fringes due to the diffraction on the irradiation surface. In the laser irradiation, a laser beam emitted from a laser oscillator 101 passes through a slit 102 so as to block a low-intensity part of the laser beam, the traveling direction of the laser beam is bent by a mirror 103, and an image formed at the slit is projected to an irradiation surface 106 by a convex cylindrical lens 104.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: A pattern forming apparatus for a light guide panel is provided. The apparatus includes a pattern design system, a control system, a header moving unit including an XY moving unit and a header unit, one or more laser systems, and two or more optical units. The pattern design system has an input of data on a pattern. The control system connects with the pattern design system and transmits a position signal. The XY moving unit mechanically moves up/down and left/right in response to the position signal. The header unit is coupled with the XY moving unit and reflects a scanned laser beam. The laser systems output laser beams by a pulse signal. The optical units each reflect and collect the laser beams.

Abstract: In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while long-axis lens arrays 20a and 20b are reciprocated in a direction corresponding to a long axial direction of a linear beam (X-direction). Therefore, vertical stripes are significantly reduced. Further, the incident angle and intensity of a laser beam 1 entering a large-sized lens (projection lens 30) of a short-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while short-axis lens arrays 26a and 26b are reciprocated in a direction corresponding to a short axial direction of a linear beam (Y-direction). Therefore, horizontal stripes are significantly reduced.

Abstract: A device for processing a workpiece using a plurality of parallel laser beams includes a focusing optical system displaceable in a direction of an axis of symmetry configured to focus each of the plurality of parallel laser beams onto a common focusing plane, and wherein the plurality of laser beams include a first and a second laser beam pair, each containing two laser beams equidistant from the axis of symmetry. The device further includes a reflector assembly having at least two reflectors each having a plurality of reflection surfaces displaceable relative to one another in a direction of the axis of symmetry.

Abstract: A laser exposure which includes: a laser light source including a multi-transverse mode semiconductor laser; a far-field pattern forming optical system for forming a far-field pattern of multi-transverse mode laser light emitted from the laser light source; a condensing optical system for condensing the laser light emitted from the far-field pattern forming optical system and applying the condensed laser light to a substance to be exposed; and a coherency reducing element disposed in an optical path between the laser light source and the substance to be exposed, for reducing coherency of two wavefront components that are contained in high-order transverse mode light of each order emitted from the laser light source and propagate in substantially symmetrical directions with respect to the optical axis.

Abstract: An active laser energy delivery system includes a relay imaging system. Input optics arranged to receive the laser energy, a transmitting mirror having adjustable angle of incidence relative to the input optics, and a robot mounted processing head including an optical assembly are configured to direct laser energy toward the movable target image plane. The laser energy follows an optical path including an essentially straight segment from the transmitting mirror to the receiving mirror, having a variable length and a variable angle relative to the input optics. Diagnostics on the processing head facilitate operation.

Abstract: A coherent beam source, e.g., a laser having a cavity that is unstable in at least one direction, is used to produce a coherent beam having an initial intensity profile. The beam is passed through a relay having a Fourier plane containing a spatial filter that serves as a radiation defining mask. The filter has an aperture size and shape effective to modify the beam such that the modified beam forms an image on a substrate. The to image has an intensity profile that more closely approximates a super-Gaussian profile than the initial profile. For example, when the initial intensity profile is Gaussian, the spatial filter may allow passage of only unattenuated the central core of the beam and block completely blocks the wings of the Guassian profile. The modified beam may be more suitable for use in a scanning system used to anneal wafers or other substrates containing integrated circuits.

Abstract: A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction. The AOD subsystem may be used for aligning a processing laser beam to workpiece features.

Abstract: A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.

Abstract: A percussion drilled shaped through hole formed between a first surface and a second surface of a component and a method of forming the through hole. The through hole is defined by a primary crater, a secondary crater, and a metering hole. The primary crater is formed using laser percussion drilling in the first surface of the component. The secondary crater is formed using laser percussion drilling within the primary crater and substantially offset from a centerline of the primary crater. The metering hole is formed using laser percussion drilling within the secondary crater and extending through the component to the second surface. The primary crater, the secondary crater, and the metering hole define a Coand{hacek over (a)} ramp and provide for the flow of fluid through the percussion drilled shaped through hole according to the Coand{hacek over (a)} effect.

Abstract: Previous methods for the production of a hole in a component are very time-consuming and expensive, as special lasers having ultra short laser pulse lengths are used. The inventive method varies laser pulse lengths and ultra short laser pulse lengths are used exclusively in the region which is to be removed, wherein it is possible to have a noticeable influence on through flow and/or out-flow behavior. This, for example, the inner surface of a diffuser of a hole, which can be produced in a precise manner using ultra short laser pulse lengths.

Abstract: An object of the present invention is to provide a laser irradiation method and a laser irradiation apparatus for irradiating an irradiation surface with a linear beam having more homogeneous intensity by blocking a low-intensity part of the linear beam without forming the fringes due to the diffraction on the irradiation surface. In the laser irradiation, a laser beam emitted from a laser oscillator 101 passes through a slit 102 so as to block a low-intensity part of the laser beam, the traveling direction of the laser beam is bent by a mirror 103, and an image formed at the slit is projected to an irradiation surface 106 by a convex cylindrical lens 104.

Abstract: An apparatus for processing a work-piece (80) includes a laser source (102) and a first lens assembly (108). The laser source is configured for emitting laser beams. The first lens assembly is configured for adjustably focusing the laser beams onto the work-piece. The first lens assembly is disposed in optical alignment with the laser source and includes a first lens set having a positive refractive power and a second lens set having a negative refractive power. Because of the first lens assembly, the laser beams emitted from the laser source can be focused accurately onto the work-piece, and then the apparatus for processing the work-piece has accurately focused laser beams as a result.

Abstract: A method and an apparatus for laser beam processing of an element (12) that has a total transmittance for light of at least 10?5, comprising a laser unit (1) for generating a laser beam on one side of the to-be-processed element (12), an illumination unit (7), an imaging system (10) comprising a sensor unit on the one side of the to-be-processed element (12), the sensor unit recording residual light that results from light of the illumination unit (7), a scanning unit (2) for adjusting the laser beam processing position, and a control unit. The control unit is operatively connected to the laser unit (1), the imaging system (10) and the scanning unit (2), and the illumination unit (7) is positioned on the other side of the to-be-processed element (12) in relation to the laser unit (1). Since the to-be-processed element (12) allows light to pass through an otherwise opaque or almost opaque layer, a good contrast is obtained that is used to determine the position of the laser beam with high precision.

Abstract: A laser energy delivery system includes a relay imaging system. Input optics arranged to receive the laser energy, a transmitting mirror having adjustable angle of incidence relative to the input optics, and a robot mounted optical assembly are configured to direct laser energy toward the movable target image plane. The laser energy follows an optical path including an essentially straight segment from the transmitting mirror to the receiving mirror, having a variable length and a variable angle relative to the input optics through air. Diagnostics on the processing head facilitate operation.

Abstract: The energy distribution in the short-side direction of a rectangular laser beam applied to an amorphous semiconductor film (amorphous silicon film) is uniformized. It is possible to the energy distribution in the short-side direction of the rectangular laser beam by the use of a cylindrical lens array 26 or a light guide 36 and concentrating optical systems 28 and 44 or by the use of an optical system including a diffracting optical element. Accordingly, since the effective energy range of a laser beam applied to the amorphous semiconductor film is widened and the transport speed of a substrate 3 can be enhanced as much, it is possible to improve the processing ability of the laser annealing.

Abstract: It is an object of the present invention to provide a laser irradiation apparatus and a laser irradiation method for conducting a laser process homogeneously to the whole surface of a semiconductor film. A first laser beam emitted from a first laser oscillator passes through a slit and a condensing lens and then enters an irradiation surface. At the same time, a second laser beam emitted from a second laser oscillator is delivered so as to overlap the first laser beam on the irradiation surface. Further, the laser beams are scanned relative to the irradiation surface to anneal the irradiation surface homogeneously.

Abstract: A method of selectively ablating an undesired material from a substrate includes providing a substrate with two regions; providing laser pulses; tuning a wavelength of the laser pulses to match a desired wavelength characteristic of a material and directing the tuned laser pulses onto the substrate; and controlling a pulse duration, wavelength, or both, of the laser pulses to ablate the undesired material without damaging the substrate or any adjacent material. In another embodiment, an apparatus for repairing a defect on a reflective photomask includes a femtosecond pulse width laser; a harmonic conversion cell; a filter for passing a selected EUV harmonic of the laser light; a lens arrangement configured to direct the selected EUV harmonic of the laser light onto the photomask; and a control unit connected to the laser to control an ablation of the defect on the reflective photomask.

Abstract: A method for machining a transparent material by the non-linear absorption of pulsed laser radiation, in the region of a laser focus, includes the following steps: a laser wavelength of between 300 and 1000 ?m is selected; and laser impulses having a temporally flat beam profile are applied. The method is characterized in that the irradiation intensity is selected from an interval predetermined for the material to be machined, in which plasma is formed without plasma luminescence. An apparatus for laser treating a transparent material includes structure to set an irradiance and inspect the treatment as being within a defined interval.

Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

Abstract: According to the present invention, a method of working material with high-energy radiation is provided, wherein a polymer matrix (1) is irradiated with high-energy radiation, in particular with a laser beam (9), wherein the radiation is focused onto a focal point (11) and the focal point (11) is set such that the focal point (11) lies behind the surface (3) of the polymer matrix (1) facing the radiation, and material removal is brought about at the polymer matrix (1), and consequently a reaction space (13) is created within the polymer matrix (1).

Abstract: A laser welding apparatus having a laser source outputting a laser beam and a light transmitting device being positioned downstream from the laser source. The light transmitting device transmits the laser beam therethrough. The laser beam exiting the light transmitting device has at least a zero order light lobe and a first order light lobe, wherein the zero order light lobe and the first order light lobe together defining an initial beam width. An optical device positioned downstream from the light transmitting device converges the first order light lobe with the zero order light lobe to define a final beam width that is narrower than the initial beam width.

Abstract: An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: A laser energy delivery system includes a relay imaging system. Input optics arranged to receive the laser energy, a transmitting mirror having adjustable angle of incidence relative to the input optics, and a robot mounted optical assembly are configured to direct laser energy toward the movable target image plane. The laser energy follows an optical path including an essentially straight segment from the transmitting mirror to the receiving mirror, having a variable length and a variable angle relative to the input optics through air. Diagnostics on the processing head facilitate operation.

Abstract: Multiple beamlet laser beam delivery systems and methods may be used in laser machining systems and methods to machine multiple regions on a workpiece simultaneously. One embodiment of a laser machining system and method may be used, for example, to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The multiple beam delivery systems may be movable to scribe multiple lines simultaneously in the workpiece.

Abstract: Methods for processing an amorphous silicon thin film sample into a polycrystalline silicon thin film are disclosed.

Abstract: Systems and methods are disclosed for shaping laser light as a line beam for interaction with a film that may have an imperfect, non-planar surface. The system may include a beam stop that defines an edge; a sensor that measures a distance between a selected point on a surface of the film and a reference plane and generates a signal representative of the measured distance; and an actuator coupled to the beam stop and responsive to the signal to move a portion of beam stop edge. Movement of the beam stop edge portion shifts a corresponding portion of the focused line beam in a direction normal to the reference plane to produce a line beam that more closely conforms to the surface profile of the film.

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.