Abstract: An infrared convection paint baking oven comprising a tunnel having an entrance and exit, the tunnel having top and side walls equipped with air ducts that communicate with a at least one air pressure blower to form an air plenum in the interior of said tunnel. The oven is equipped with at least one exhaust to re-circulate heated air and vent moisture and volatiles from said tunnel. The exhaust communicates said pressure blower with air make up and an RTO. The re-circulated air flow is divertible from the exhaust to the furnace to control temperature and VOC emissions. Infrared light assemblies are arranged in said tunnel interior on the top and side walls such that air from said plenum is circulated around said light assemblies to form a convection air current. The light assemblies are in close proximity to each other at the entrance and along a distance of said tunnel to form a warm up zone.

Abstract: This invention relates to a device for drying at least one object containing a liquid, in particular a dental restoration object (12). Said device comprises a means for generating thermal energy acting upon the object and sufficient for increasing the temperature of the object to the boiling point. Moreover, the device includes an impingement area for impinging on the object with thermal energy and a control device (24) that is characterized by the fact that a temperature detection element (20) of the device (10) measures the temperature of the object (12), and upon reaching a trigger temperature that is at the boiling temperature, somewhat below or somewhat above thereof, emits a signal to the control device.

Abstract: An ultraviolet (UV) LED-based lamp for UV curing lamp assemblies is disclosed. An array of UV emitting LEDs are packaged together and arranged along the length of a cylindrical lens to form a UV LED-based optical component assembly. The UV LED-based optical component assembly may be made to be modular. A UV LED lamp assembly may comprise a plurality of UV LED-based optical component assemblies arranged around a workpiece tube. The workpiece tube may be filled with an inert gas and may be made of quartz or glass. One or more curved back reflectors may be placed opposite the LED UV LED-based optical component assemblies to collect UV light escaping the workpiece tube and refocus the light to the other side of the workpiece. The UV LEDs may be arranged on a single surface or a multi-level tiered platform.

Abstract: Disclosed is a substrate rotating and oscillating apparatus for a rapid thermal process (RTP), that oscillates an oscillation plate using an oscillation motor moved by an elevating unit. Rotational shafts of the oscillation motor comprise lower and upper center rotational shafts mounted on a central axis of the motor, and an eccentric shaft mounted between the lower and the upper center rotational shafts as deviated from the central axis. An oscillation cam is mounted to the eccentric cam. The oscillation plate has an oscillation hole for inserting the oscillation cam therein. A bearing is mounted between the oscillation cam and the eccentric shaft such that the oscillation cam rotates independently from the eccentric shaft. The oscillation plate supports the whole multipole-magnetized magnetic motor or maglev motor. Accordingly, the substrate can be uniformly heated by both rotating and all-directionally oscillating the substrate.

Abstract: The invention relates to a method of heating glass panels for tempering. The horizontal glass panels are heated in a lehr by upper and lower convection blast and by upper and lower radiation heating, information representing a load of the glass panels and used for the control and/or regulation of heating is read, the upper radiation heating is controlled and/or regulated in the way of a matrix by a profiling both in a conveying direction and a direction lateral thereto. At least the upper convection blast is controlled and/or regulated in various sections of the lehr in the way of a matrix by a profiling both in a conveying direction and a direction lateral thereto, and the relative blast effects of convection blowing elements successive in the conveying direction are regulated for a profiling in the conveying direction. The invention relates also to an apparatus applying the method.

Abstract: A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps.

Abstract: A silver reflector for reflecting radiation from a lamp in a semiconductor processing chamber is disclosed. The reflector may be a sleeve to be disposed in a lightpipe or part of a lamphead. The silver may be in the form of a coating on the sleeve or the lamphead.

Abstract: The installation (10) is adapted for the heat treatment of objects, such as plastic preforms (17), and comprises a reflective device exhibiting a plurality of elongated and opened IR-reflective cavities stacked one onto the other according to a stacking axis and arranged to lodge elongated IR lamps (16) within, where the aperture of each cavity faces generally a main axis parallel to the stacking axis along which the object would be placed. The reflective device (20) further comprises protrusions separating the cavities one to the other and extending generally transversal/transverse to the stacking axis, the reflective device being made as at least one integral block of a heat-conductive material. The cavities may each comprise a curved bottom portion and two opposite side surfaces provided with respective longitudinal breaks of slope at a junction with the curved bottom.

Abstract: Embodiments of a lamphead and apparatus utilizing same are provided herein. In some embodiments, a lamphead for use in thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage. In some embodiments, the lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.

Abstract: A resin forming method and a resin forming apparatus for obtaining a resin formed product, by filling a cavity of a rubber-made mold with a thermoplastic resin, and cooling the thermoplastic resin. When filling the cavity with the thermoplastic resin, an electromagnetic wave generator is used, and electromagnetic waves having an intensity peak in a wavelength region of 0.78 to 2 ?m are irradiated to the thermoplastic resin from the surface of the mold, and thereby the thermoplastic resin is heated selectively from the mold. The thermoplastic resin is an ABS resin which either a noncrystalline thermoplastic resin, or is a rubber modified thermoplastic resin.

Abstract: An emitter tube has an outer surface and an inner surface, wherein the inner surface defines a cavity of the emitter tube, and the cavity of the emitter tube is adapted for receiving food. An outer tube has an inner surface that defines a cavity of the outer tube, and the emitter tube is positioned in the cavity of the outer tube. A heating unit is for heating the outer surface of the emitter tube so that heat energy is transferred by conduction from the outer surface of the emitter tube to the inner surface of the emitter tube, and the inner surface of the emitter tube emits infrared radiant energy into the cavity of the emitter tube so that a majority of the energy that is transferred to the food within the emitter tube is in the form of infrared radiant energy.

Abstract: An oven apparatus for solidifying a coating on a housing includes a supporting module, a curing module, and a transporting module. The supporting module includes a frame and of periphery boards around the frame, the frame includes at least two stacked frame sections. The curing module and the heating module are respectively mounted to the frame sections, the transporting module circularly transports the housing and passes though the heating module and heating module.

Abstract: A heat treatment apparatus with a process chamber, a tubular heater, a heat exhaust system and a cooling section. The heater surrounds an outer circumference of the process chamber. The heat exhaust system exhausts an atmosphere in a space between the heater and the process chamber. The cooling section blows a cooling fluid into the space to cool the atmosphere. The heater includes a tubular heat insulator, a heat generating resistor on an inner circumference of the heat insulator, and an outer shell provided on an outer circumference of the heat insulator. The cooling section includes at least one annular flow path between the heat insulator and the outer shell, and an outlet in the heat insulator. The outlet blows cooling fluid toward a vertical central axis of the heat insulator, or in a direction oblique to the direction toward vertical central axis of the heat insulator.

Abstract: A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate to a chamber at a first temperature, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate in the chamber during a first time period to a second temperature, heating the substrate in the chamber to a third temperature during a second time period, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period, wherein the second time period is about 2 seconds or less.

Abstract: An emitter tube has an outer surface and an inner surface, wherein the inner surface defines a cavity of the emitter tube, and the cavity of the emitter tube is adapted for receiving food. An outer tube has an inner surface that defines a cavity of the outer tube, and the emitter tube is positioned in the cavity of the outer tube. A heating unit is for heating the outer surface of the emitter tube so that heat energy is transferred by conduction from the outer surface of the emitter tube to the inner surface of the emitter tube, and the inner surface of the emitter tube emits infrared radiant energy into the cavity of the emitter tube so that a majority of the energy that is transferred to the food within the emitter tube is in the form of infrared radiant energy.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: A disclosed heating apparatus includes a heating chamber configured to heat a substrate placed in the heating chamber with a heat plate opposing the substrate; a gas stream forming portion that creates a gas stream along a top surface of the substrate in the heating chamber; and a pair of first plate members respectively located between an inner side wall of the heating chamber and a first substrate edge opposing the inner side wall, and between another inner side wall of the heating chamber and a second substrate edge opposing the other inner side wall.

Abstract: A mounting table structure arranged in a processing chamber is provided for mounting a target object to be processed on the upper surface. The mounting table structure is characterized in having a mounting table wherein a heating unit are embedded to heat the target object to perform a specified heat treatment to the target object, and a supporting column which stands on the bottom portion of the processing chamber and supports the mounting table. The mounting table structure is also characterized in that a heat-equalizing member spread in a planar direction is embedded above the heating unit in the mounting table.

Abstract: Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.

Abstract: A heating apparatus comprises heating elements arranged of a sheet form and having notches or through holes provided therein, a side wall member made of an electrically conductive material and arranged to surround and define the heating space, and holding members disposed at the heating space side of the side wall member for holding at one end the heating elements. Also, extending members are provided, each member comprising an extending-through portion arranged to project from the heating space side of the side wall member and extend through the notch or through hole between both ends in the heating element and projected portions arranged to project at both, front and back, sides of the heating element from the extending-through portion in a direction, which is orthogonal to the extending direction of the extending-through portion, thus to inhibit the displacement of the heating elements along the extending direction.

Abstract: A substrate processing system includes a processing chamber, a pedestal for supporting a substrate disposed within the processing chamber, and an optical pyrometry assembly coupled to the processing chamber to measure an emitted light originating substantially from a portion of the pedestal or substrate. The optical pyrometry assembly further includes a light receiver, and an optical detector. The optical pyrometry assembly receives a portion of the emitted light, and a temperature of the substrate is determined from an intensity of the portion of the emitted light near at least one wavelength.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be either active sources of light energy or passive sources which reflect, refract or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Abstract: Deterioration of an O ring due to radiation heating in a vacuum heating apparatus is prevented to allow heat treatment of a substrate with good annealing properties. The vacuum heating apparatus 1 includes a vacuum chamber 2 constituted by flanges 11 and 12 having an opening portion 9 and joined together, a turbo molecular pump 17 for exhausting gas from the vacuum chamber 2, and a heater base 3 for heating a substrate 5 placed in the vacuum chamber 2. Joint surfaces of the flanges 11 and 12 are sealed by an O ring 10. Further, bonding steps 13 are formed between the heater base 3 and the O ring 10 on the joint surfaces of the flanges 11 and 12, thereby preventing thermo-radiation from the heater base 3 from reaching the O ring 10 through the joint surfaces of the flanges 11 and 12.

Abstract: An oven is configured with a cooking cavity for receiving a cooking load, a circuit for current supplied by one or more stored energy devices such as rechargeable batteries, and a heater comprising one or more radiant lamps to be driven by the current, the one or more radiant lamps being sized and positioned for heating the cooking load. The lamps are driven by current discharged from the batteries to radiantly heat a cooking load. An application of this stove configuration is in a toaster which is capable of toasting slices of bread in a matter of seconds.

Abstract: There is disclosed a heating element 10 comprising: at least a heat-resistant base member 1; a conductive layer 3 having a heater pattern 3a formed on the heat-resistant base member; a protection layer 4 with an insulating property formed on the conductive layer; and a corrosion-resistant layer 4p having a nitrogen gas permeability of 1×10?2 cm2/sec or less or being made of a compound containing a dopant formed on the protection layer 4.

Abstract: To provide a photo-irradiation type heat treatment apparatus that eliminates the adverse influence of a light transmitting window on the temperature distribution of an article to be treated without losing the original function of a reflecting mirror a photo-irradiation type heat treatment apparatus in which heat treating of an article is performed by irradiating the article with light emitted from multiple filament lamps through a light transmitting window, by providing the apparatus with a reflecting mirror having an opening at its central area so that cooling air can pass therethrough and by providing an air permeable reflector so as to cover the opening in the reflecting mirror.

Abstract: The present invention provides a heating apparatus for heating objects to be processed, which can detect a temperature of the objects to be processed with higher precision and accuracy, thereby to achieve higher precision temperature control. A heating apparatus 2 includes a processing vessel 8 configured to contain therein a plurality of objects W to be processed, the objects W including objects 58a to 58e to be processed for temperature measurement, each object 58a to 58e having each corresponding elastic wave element 60a to 60e, a heating means 10 adapted for heating the objects W to be processed, and a holding means 22 adapted to hold the objects W to be processed. To the processing vessel 8, a transmitter antenna 52 adapted to transmit an electric wave for measurement toward each elastic wave element 60a to 60e, and a receiver antenna 52 adapted to receive an electric wave having a frequency corresponding to the temperature and generated from each elastic wave element 60a to 60e are provided.

Abstract: A thermal processing apparatus comprising a processing vessel containing, in addition to a plurality of objects subject to heat treatment, an acoustic wave device for temperature measurement. A holding unit holds the plurality of objects to be processed and an object for temperature measurement utilizing an acoustic wave device. A heating unit heats the objects to be processed and the object for temperature measurement. A first conductive member functions as an antenna for transmitting an electromagnetic wave toward the acoustic wave device in the processing vessel; a second conductive member functions as a receiver antenna for receiving an electromagnetic wave dependent on a temperature of the acoustic wave device which is emitted from the acoustic wave device. A temperature analysis part obtains a temperature of the object based on the electromagnetic wave received by the receiver antenna, and a temperature control part controls the heating unit.

Abstract: A cooking system for cooking foods using a combination of magnetic induction, convection and radiant heat, including a magnetic induction stage proximate the inlet end of a cooking chamber in which food is cooked by convention and radiant heating. A conveyor system, either continuous or configured in stages, passes food from the magnetic induction heating stage to and through the radiant and convention heating stages.

Abstract: A substrate processing apparatus comprises: an outer tube; a manifold connected to the outer tube and made of a non-metal material; an inner tube disposed in the manifold at a more inner side than the outer tube and configured to process a substrate therein; a heating device installed at a more outer side than the outer tube and configured to heat the inside of the outer tube; a lid configured to open and close an opening of the manifold, with a seal member intervened therebetween; and a heat absorption member installed in the manifold, with a bottom end of the inner tube intervened therebetween, and configured to absorb heat from the heating device, the heat absorption member being made of a non-metal material.

Abstract: A controller for a food holding oven determines one or more time periods during each of which heat is directed at a pre-cooked food item. By controlling the heat intensity and the time over which different amounts of heat are provided to different types of pre-cooked food items, the time during which a particular type of pre-cooked food item can be kept palatable is maximized.

Abstract: A cooking structure which provide for two or more side-by-side ovens separated by vertical, movable, hinged partition(s) whereby the oven structure may function as one large oven or as two or more smaller independent ovens, wherein for each oven a tangential fan blows air substantially evenly over upper electrical heating elements strung generally from side-to-side of the oven, wherein a flow director (baffle) structure functions as a radiant heat shield which is operator movable to either expose to or occlude from the oven cooking chamber the direct radiation from its heating elements, depending on the need to roast, bake, or broil the food product. Also provided are lower electrical heating elements positioned below a ceramic cooking surface for ensuring evenness of radiant heat transfer therefrom. Also provided is operator controlled top vs.

Abstract: A cooking appliance includes a cabinet forming an oven cavity, a broil heating element, a bake heating element, a convection heating system and a controller. The convection heating system develops a flow of heated air into the oven cavity, and includes a fan and a convection heating element. The controller controls activations of the broil, bake and convection heating elements during an oven cavity preheating operation in which the broil heating element and the bake heating element are alternately activated while the convection heating element is activated.

Abstract: A filament post used in plasma-enhanced chemical vapor deposition has an outer shell and an inner post. An electrical potential is applied only to the inner post to ensure that there is no impact on the plasma density and the carbon film properties. The inner post and the outer shell are electrically insulated by ceramic insulators, such that no electrical potential is applied to outer shell. The stress generated in the carbon film is directly related to the electrical potential of the surface to which the film is deposited. The carbon film deposited on the outer shell of the post is not highly stressed, which significantly reduces film delamination from the filament post surfaces.

Abstract: A materials processing system comprises a thermal processing chamber including a heating source, a first noncontacting thermal measurement device positioned to measure temperature on a first area of the material being processed, and, a second noncontacting thermal measurement device positioned to measure temperature on a second area of the material being processed, the first device being relatively more sensitive to changes in surface emissivity than the second device. By comparing the outputs of the two devices, emissivity changes can be detected and used as a proxy for some physical change in the workpiece and thereby determine when the desired process has been completed. The system may be used to develop a process recipe, or it may be part of a system for real-time process control based on emissivity changes. Applicable processes include heating, annealing, dopant activation, silicide formation, carburization, nitridation, sintering, oxidation, vapor deposition, metallization, and plating.

Abstract: An apparatus and methods are provided for heating and sensing the temperature of a chemical reaction chamber without direct physical contact between a heating device and the reaction chamber, or between a temperature sensor and the reaction chamber. A plurality of chemical reaction chambers can simultaneously or sequentially be heated independently and monitored separately.

Abstract: A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.

Abstract: The present invention provides a vertical heat treatment boat that has at least four or more support portions per processing target substrate to be supported, the support portions horizontally supporting the processing target substrate, support auxiliary members on which the processing target substrate is mounted being detachably attached to the four or more support portions, respectively, wherein flatness obtained from all surfaces of the respective support auxiliary members on which the processing target substrate is mounted is adjusted by adjusting thicknesses of the support auxiliary members or interposing spacers between the support portions and the support auxiliary members in accordance with respective shapes of the four or more support portions.

Abstract: In an analyzer for analyzing a sample that reacts with a reagent 25, an analyzing tool 10, an infrared sensor 1 and a temperature controlling part 5 are provided. Inside the analyzing tool 10, a reaction cell 24 in which the sample and the reagent 25 react with each other and a heating element 33 that is heated by electrification are provided. The infrared sensor 1 is disposed outside the analyzing tool 10 so as to photoreceive an infrared ray 9 that is emitted from the reaction cell 24, and outputs a signal that is in accordance with an amount of the photoreceived infrared ray 9 to the temperature controlling part 5. The temperature controlling part 5 adjusts a heat value of the heating element 33 based on the signal from the infrared sensor 1.

Abstract: Embodiments of the present invention provide apparatus and method for reducing noises in temperature measurement during thermal processing. One embodiment of the present invention provides a chamber for processing a substrate comprising a chamber enclosure defining a processing volume, an energy source configured to direct radiant energy toward the processing volume, a spectral device configured to treat the radiant energy directed from the energy source towards the processing volume, a substrate support disposed in the processing volume and configured to support the substrate during processing, and a sensor assembly configured to measure temperature of the substrate being processed by sensing radiation from the substrate within a selected spectrum.

Abstract: A toaster oven appliance including low-profile heating elements having a predetermined single-sided surface area calculated to provide uniform heating within the cooking chamber, facilitate cleaning and to increase its usable capacity is disclosed. Various alternative configurations of top, bottom, and side-mounted heating elements in combination with both fixed and vertically movable heating element embodiments are provided for use with standard and digital controls. The heating elements are positioned both internally and externally of the cooking chamber and are provided in unsheathed, plain-sheathed, and metallic-sheathed types for a given application of the present oven. In one embodiment the heating elements are constructed as removable plug-in modules for convenient cleaning and replacement. The present toaster oven further includes an optional forced convection fan to reduce cooking temperature and shorten cooking cycles.

Abstract: In a heat treatment apparatus, a reflector is provided to cover a plurality of flash lamps arranged in an array for emitting a flash of light, and a cooling box is provided over the reflector. The cooling box has a buffer space incorporated therein, and a plurality of jet openings in communication with the buffer space are formed through a bottom surface of the cooling box and the reflector. The plurality of jet openings are positioned just over gaps between the plurality of flash lamps in the lamp array. Nitrogen gas ejected from the plurality of jet openings passes through the gaps between adjacent ones of the flash lamps in the lamp array, and is then blown against a lamp light radiation window. The flash lamps are effectively cooled down by the direct cooling using the nitrogen gas and the decrease in temperature of the lamp light radiation window.

Abstract: A method and apparatus for oxidizing materials used in semiconductor integrated circuits, for example, for oxidizing silicon to form a dielectric gate. An ozonator is capable of producing a stream of least 70% ozone. The ozone passes into an RTP chamber through a water-cooled injector projecting into the chamber. Other gases such as hydrogen to increase oxidation rate, diluent gas such as nitrogen or O2, enter the chamber through another inlet. The chamber is maintained at a low pressure below 20 Torr and the substrate is advantageously maintained at a temperature less than 800° C. Alternatively, the oxidation may be performed in an LPCVD chamber including a pedestal heater and a showerhead gas injector in opposition to the pedestal.

Abstract: There is disclosed a heating element 10 comprising: at least a heat-resistant base member 1; a conductive layer 3 having a heater pattern 3a formed on the heat-resistant base member; a protection layer 4 with an insulating property formed on the conductive layer; and a corrosion-resistant layer 4p that is an oxide having an oxygen amount of stoichiometric ratio or less formed on the protection layer. There can be provided a heating element in which a corrosion-resistant layer whose resistivity or hardness is controlled is formed on a protection layer and through which the corrosive gas is difficult to be transmitted even under an environment of a high temperature and a corrosive gas and by which degradation due to corrosion of a conductive layer, particularly, a power-supply-terminal portion can be avoided and additionally which can fulfill a high function as an electrostatic chuck even when having a chuck pattern and which has a long operation life and is capable of being produced at a low cost.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: A thermal processing apparatus (1) comprises a chamber body (6), a holding part (7) for holding a substrate (9) inside the chamber body (6), a light emitting part (5) for heating the substrate (9) through light irradiation and a light measuring part (2) for measuring light energy. The light measuring part (2) comprises a calorimeter (24) disposed outside the chamber body (6), a light guide structure (20) for guiding the light inside the chamber body (6) to the calorimeter (24) and a calculation part (25) for performing computations on the basis of an output of the calorimeter (24). In the thermal processing apparatus (1), by measuring the light from the light emitting part (5) by the calorimeter (24), it is possible to measure the energy of light emitted from the light emitting part (5) during thermal processing inside chamber body (6) and obtain a surface temperature of the substrate (9) by the calculation part (25).

Abstract: A semiconductor manufacturing method includes a determination of, when the heater is controlled using a first output control pattern, an output amount by differential operation, and an output amount by a proportional operation such that a temperature detected by the first thermometer becomes a target temperature from a temperature at a ramp-up start time, patterning a part of an operation amount of the heater by using a first heat amount to determine a second output control pattern, the second heat amount being determined based on a temperature detected by the second thermometer and being defined at a period from the ramp-up start time to a time of maximum temperature, the operation amount of the heater being defined at the period, and a processing of the substrate while controlling the heater by using the second output control pattern.

Abstract: A cooking device including a cooking cavity, a fan located in the cooking device, the fan being configured to force air into the cooking cavity, and at least one optical heater to supply optical wave energy to heat the forced air provided by the fan.

Abstract: A method of forming a device is presented. The method includes providing a wafer having an active surface and dividing the wafer into a plurality of portions. The wafer is selectively processed by localized heating of a first of the plurality of portions. The wafer is then repeatedly selectively processed by localized heating of a next of the plurality of portions until all plurality of portions have been selectively processed.

Abstract: Contemplated fully automated coffee roaster have significantly reduced energy demands, use electrical heat as a heat source in a temperature-only driven program mode, and eliminate smoke and smell within the roaster. Most preferably, contemplated fully automated roasters will consume only about 10 percent of the energy as compared to known devices on a per kilogram basis of beans and require no operator experience.