Abstract: The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.

Abstract: A method of infrared heat-processing of nuts (e.g., almonds, Brazil nuts, cashews, hazelnuts, macadamias, pecans, pine nuts, pistachios, walnuts and mixtures thereof in order to reduce the microorganism level thereof is provided wherein the nuts are sequentially moisturized by application of water and then subjected to infrared radiation, preferably through a series of treatment cycles. Nut treatment apparatus (10) includes opposed banks of infrared heaters (38, 40), with plural water application stations (48, 50, 52) along the length of the heater banks (38, 40).

Abstract: Cooking food in a hybrid conveyor with both electric and gas-fired infrared heaters. The heat output from the gas fired infrared heater is controlled by cycling or pulsing the gas supply to one or more burners that emit infrared heat by heating a nichrome screen wire. The electric power supplied to electrically powered heaters is also controlled.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: Multi-zone, solar cell diffusion furnaces having a plurality of radiant element (SiC) or/and high intensity IR lamp heated process zones, including baffle, ramp-up, firing, soaking and cooling zone(s). The transport of solar cell wafers, e.g., silicon, selenium, germanium or gallium-based solar cell wafers, through the furnace is implemented by use of an ultra low-mass, wafer transport system comprising laterally spaced shielded metal bands or chains carrying non-rotating alumina tubes suspended on wires between them. The wafers rest on raised circumferential standoffs spaced laterally along the alumina tubes, which reduces contamination. The bands or chains are driven synchronously at ultra-low tension by a pin drive roller or sprocket at either the inlet or outlet end of the furnace, with appropriate tensioning systems disposed in the return path. The high intensity IR flux rapidly photo-radiation conditions the wafers so that diffusion occurs >3× faster than conventional high-mass thermal furnaces.

Abstract: Methods and apparatus for providing a process gas to a substrate in a processing system are disclosed herein. In some embodiments, the substrate processing system may include a process chamber having a substrate support disposed therein; a light source disposed above the process chamber to direct energy towards the substrate support; and a window assembly disposed between the light source and the substrate support to allow light energy provided by the light source to enter the process chamber towards the substrate support, wherein the window assembly includes an inlet to receive a process gas and one or more outlets to distribute the process gas into the process chamber.

Abstract: A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.

Abstract: A conveyor oven is provided with both electric and gas-fired infrared heaters. The heat output from the gas fired infrared heater is controlled by cycling or pulsing the gas supply to one or more burners that emit infrared heat by heating a nichrome screen wire.

Abstract: In a substrate annealing apparatus, a substrate holder unit including a substrate stage made of carbon with a high emissivity or a material coated with carbon is accommodated in a vacuum chamber to be liftable. Also, a heating unit having a heat radiating surface facing the substrate stage is disposed above the substrate holder unit within the vacuum chamber. The substrate annealing apparatus brings the substrate stage close to the heat radiating surface so that a substrate mounted on the substrate stage can be heated by radiant heat from the heat radiating surface while the heat radiating surface is not in contact with the substrate. The substrate holder unit includes a radiating plate and a reflecting plate made of one of a metal carbide, a metal nitride, and a nickel alloy.

Abstract: During fabrication, a rotating semiconductor substrate is radiated in accordance with a thermal recipe. Temperature measurements of the semiconductor substrate are obtained along with the position of the semiconductor substrate at the time of each temperature measurement. It is then determined for the position of the semiconductor substrate whether at least one particular temperature measurement of the temperature measurements should be filtered. If so, at least one filtered temperature measurement is obtained. The radiation of the semiconductor substrate is subsequently controlled based on the temperature measurements, the at least one filtered temperature measurement, and the thermal recipe.

Abstract: A substrate processing apparatus includes a process chamber including upper and lower quartz walls, a substrate support disposed in the process chamber, radiant heaters respectively provided above and below the quartz walls of the chamber, and heat reflectors disposed outside the process chamber for reflecting heat towards the substrate support. Each of the heat reflectors has heating has a first thermally reflective section oriented to reflect the heat towards an outer peripheral region of the substrate support and a second thermally reflective section oriented to reflect the heat towards a central region of the substrate support. Each heat reflector also has a reflection angle adjusting mechanism by which an angle at which the second thermally reflective section reflects heat can be adjusted. The angle is adjusted depending on the temperature distribution across the substrate so that the substrate can be processed uniformly.

Abstract: Midway along an outer circulation passage provided outside a heating chamber, a steam generating device is arranged, and, through the outer circulation passage, steam is fed to the heating chamber. A control device controls a steam generating heater arranged inside the steam generating device and a vapor heating heater provided in a space through which an air stream flowing through the outer circulation passage is returned to the heating chamber, and forms a cooking sequence by using, singly or in combination, a first heating mode that uses superheated steam obtained as a result of the steam being heated with the vapor heating heater and a second heating mode that uses hot air or radiation heat obtained by making the vapor heating heater produce heat without supply of steam.

Abstract: An oven is disclosed having a first food preparation apparatus in the form of a convection heat source and/or a steam production assembly and/or a radiating heat source, and a second food preparation apparatus in the form of a smoking assembly. The oven can operate at least one of the food preparation apparatus simultaneously with the smoking assembly or separately from the smoking assembly.

Abstract: An approach for optimizing the thermal budget during a pulsed heating process is disclosed. A heat sink or thermal transfer plate is configured and positioned near an object, such as a semiconductor wafer, undergoing thermal treatment. The heat sink is configured to enhance the thermal transfer rate from the object so that the object is rapidly brought down from the peak temperature after an energy pulse. High thermally-conductive material may be positioned between the plate and the object. The plate may include protrusions, ribs, holes, recesses, and other discontinuities to enhance heat transfer and avoid physical damage to the object during the thermal cycle. Additionally, the optical properties of the plate may be selected to allow for temperature measurements via energy measurements from the plate, or to provide for a different thermal response to the energy pulse. The plate may also allow for pre-heating or active cooling of the wafer.

Abstract: A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.

Abstract: A degassing from a susceptor heated at a high temperature in a vacuum atmosphere is suppressed. The susceptor is disposed between a heater and a substrate and partitions a space in the chamber into a first chamber space where the heater is placed and a second chambers space where the substrate is placed, and the surface of the susceptor facing the second chamber space is coated with a pyrolytic carbon layer (15) of thickness of 10 ?m to 50 ?m.

Abstract: A vacuum thermal annealing device is provided having temperature control for use with various materials, such as semiconductor substrates. A vacuum is used to remove air and outgas residual materials. Heated gas is injected planar to a substrate as pressure is quickly raised. Concurrent with the heated gas flow, a chamber wall heater is turned on and maintains a temperature for a proper annealing time. Upon completion of the annealing process, the chamber wall heater shuts down and air is forced around the chamber wall heater. Additionally, cool gas replaces the heated gas to cool the substrate.

Abstract: In order to detect a change in the temperature of a substrate (2) and a change of the distribution of oxygen radical concentration near a surface of the substrate (2), a lamp power in each zone of a heater (3) and a pressure in a reactor (1) are measured, the measured lamp power in each zone of the heater (3) and the measured pressure in the reactor (1) are inputted to the prediction equation of process model of a monitoring device (16)to predict the thickness profile of the substrate (2), and it is decided whether an abnormality occurs in thermal processing on the substrate (2) based on the predicted thickness profile.

Abstract: A controlled dynamic radiant (CDR) oven uses a dynamic heating method to reproduce food material changes that occur during the frying process without immersing the food in oil. The CDR oven includes a conveyance system for moving food along a radiant frying path having various heating zones. The conveyance system includes individual food portion carriers. Radiant emitters, for example IR emitters, are located behind a spatter screen in each heating zone and to each side of the radiant frying path. Different heating zones utilize different radiant emissions to achieve various heat fluxes and heat profiles, for example, mimicking that of an oil immersion frying heat profile. The radiant frying path can be optionally oriented along a substantially vertical axis to minimize the oven footprint. The CDR oven also can be combined with refrigeration/freezer unit and a payment and dispensing system for vending of food product.

Abstract: A heating apparatus is disclosed having a first region containing a heat source and a second region that is separate from and thermally coupled with the first region via an interface element. The heating apparatus also includes a convection deflector disposed within the interior of the first region to direct convective heat towards the interface element. The deflector can have a geometric shaped cross-section with a first side oriented towards the heat source and an opposing second side oriented away from the heat source. The first and second sides are adapted to reflect radiant and convective heat.

Abstract: Apparatus and methods for removing components from a circuit board. A conveyor transports circuit boards having components attached with solder through a heating section. When the solder has been melted by application of electromagnetic radiation, the circuit board is subjected to mechanical forces that dislodge the components to be removed from the circuit board. In one embodiment, the electromagnetic radiation is supplied by heaters operating at color temperatures in the vicinity of 973 Kelvin. The components are recovered in a form that allows their reuse.

Abstract: Disclosed is an apparatus and a method for reducing flash in an injection mold (532 or 542,543) which molds a molded article between a first mold surface and a second mold surface. The apparatus includes an active material actuator (530 or 533a and 533b or 561a and 561b) configured to, in response to application or removal of an electrical actuation signal thereto, change dimension and urge the first mold surface relative to the second mold surface to reduce flash therebetween. The apparatus also includes a transmission structure (533) configured to provide in use, the electrical actuation signal to said active material actuator (530 or 533a and 533b or 561a and 561b) includes a set of active material actuators stacked one against the other to provide a varying sealing force to urge the first mold surface relative to the second mold surface.

Abstract: A cooking apparatus is provided having an apparatus body including a burner which heats an object. There may be a first image acquirer provided at one side of the apparatus body, the first image acquirer may be configured to acquire image information corresponding to a heat source generated by the burner. Additionally, a display may be provided at one side of the apparatus body to display the image information acquired by the first image acquirer.

Abstract: Methods and apparatus for processing substrates and controlling the heating and cooling of substrates are described. A radiation source providing radiation in a first range of wavelengths heats the substrate within a predetermined temperature range, the substrate being absorptive of radiation in a second range of wavelengths within the first range of wavelengths and within the predetermined temperature rang. A filter prevents at least a portion of radiation within the second wavelength range from reaching the substrate.

Abstract: An oven using radiant heat at infrared wavelengths optimized for producing rapid and uniform cooking of a wide variety of foods. The infrared oven toasts, bakes, broils, and reheats food at a much faster speed while maintaining high quality in taste and appearance of the cooked food. Optimal infrared wavelengths of the radiant heat sources are used for the best balance of cooking performance, while also reducing the time required to cook the food. Typically short to medium wavelength infrared radiant energy will result in good performance for toasting and browning of food. Medium to long wavelength infrared radiant energy is well suited for delivering more deeply penetrating radiant energy into the food. This deep penetration of radiant infrared heat energy results in a more thorough internal cooking of the food than with conventional methods of conduction and convection cooking.

Abstract: According to an aspect of the invention, there is provided a single substrate processing method which continuously heats substrates to be processed to which films containing solvents are applied, by use of a heating apparatus having an opening/closing mechanism, including supplying a gas containing a solvent contained in a film of a first substrate to be processed into the heating apparatus in a closed state of the opening/closing mechanism between processing of the first substrate to be processed and processing of a second substrate to be processed.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be either active sources of light energy or passive sources which reflect, refract or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Abstract: The invention relates to a furnace (10) for heating preforms (20), of the type that comprises a preform-heating tunnel (12). According to the invention, the tunnel consists of a heating module (18) comprising vertical walls (14, 16) between which the preforms (20) travel. Moreover, at least one wall (16) of the module (18) is provided with at least one heating means (32) which is mounted to supports (34) such that it can move transversely and means (40) for adjusting the transverse position of the heating means (32) comprising at least one member (42) for controlling the movement of the heating means (32) between at least two indexed positions. The invention is characterized in that the control member (42) comprises an indexing boss (54) which can deform elastically such as to fit inside the complementary indexing notches (56, 58) on the corresponding support (34) at proximal and distal positions respectively.

Abstract: An apparatus for manufacturing a semiconductor device includes a treatment chamber in which a working substrate is disposed; a plurality of lamps provided above the treatment chamber; and a reflector provided behind the lamps relative to a direction towards the working substrate, spatially controlling an in-plane distribution of reflection rate of light beams from the lamps, and irradiating the working substrate with light from the lamps.

Abstract: Temperature measurement using a pyrometer in a processing chamber is described. The extraneous light received by the pyrometer is reduced. In one example, a photodetector is used to measure the intensity of light within the processing chamber at a defined wavelength. A temperature circuit is used to convert the measured light intensity to a temperature signal, and a doped optical window between a heat source and a workpiece inside processing chamber is used to absorb light at the defined wavelength directed at the workpiece from the heat source.

Abstract: The present invention is directed toward an improved rotisserie oven, having the following features: a removable side mounted control box; single wall oven cabinet construction; single wall oven cabinet construction with tabs protruding from the lower side edges of the oven cabinet which mount feet to support the cabinet; a rigid heat coil structurally connected to the removable control box; a heat coil, supported by a bracket within the oven cabinet which both allows the heat coil to be slid in and out of the oven cabinet and allows for expansion of the heat coil when the coil is energized; a light bulb integrated with the removable control box so that the bulb's globe protrudes into the interior of the oven cabinet when the control box is mounted on the oven cabinet; a drive mechanism integrated into the removable control box which allows the control box to be easily removed from the oven cabinet; a drip pan located below the spit, which has its liquid catching reservoir recessed in from the pan's perimeter

Abstract: A circuit board and components provided thereupon are held by and between lower and upper palettes. The upper palette has protecting portions that are provided above and opposed to the components. The shielding components prevent light beams irradiated by a preheating light source from directly reaching the components made of colored synthetic resin. Meanwhile, the upper palette has openings that are opposed to the circuit board except for the components protected by the protecting portions members. The light beams from the light source travel through the openings and applied to the circuit board. Openings are formed so as to be opposed to terminals that are soldered on and connected to the circuit board. Inner surfaces of the openings are made of light-reflecting material that reflects downward the light beams from the light source.

Abstract: A warming drawer for mounting within a cabinet capable of maintaining the temperature in the warming drawer at one of a proofing temperature, a warming temperature, and a slow cooking temperature. The warming drawer can also include a housing having opposing side walls and at least one spacer extending from each of the side walls to space the side walls from the cabinet when the warming drawer is mounted within the cabinet to form dead air spaces between the side walls and the cabinet.

Abstract: Temperature measurement and heat-treating methods and systems. One method includes identifying a temperature of a first surface of a workpiece, and controlling energy of an irradiance flash incident on the first surface of the workpiece, in response to the temperature of the first surface. Identifying may include identifying the temperature of the first surface during an initial portion of the irradiance flash, and controlling may include controlling the power of a remaining portion of the irradiance flash. The first surface of the workpiece may include a device side of a semiconductor wafer.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be either active sources of light energy or passive sources which reflect, refract or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Abstract: Temperature control in an RTP system can be improved by consideration of one or more witness structures different from the wafer (or other semiconductor object) being processed. For example, power coupling between the RTP heating system and witness structure can be used to adjust one or more control parameters, such as model definitions, that are used by the RTP system to control wafer heating. As another example, a stored trajectory of a desired witness structure temperature or other property can be used as a basis for control during a processing cycle. Thus, the witness structure may be controlled “closed-loop” while the wafer is heated “open-loop.” As a further example, a heat flux between the RTP heating system and witness structure can be used to determine radiant energy from the heating system that is incident on the witness structure. One or more control actions can be taken based on this incident energy.

Abstract: Device for keeping a heating wire (2) in position in a horizontal oven includes a ceramic bar (3) and a number of ceramic spacer elements (4). Each spacer element consists of a bar-shaped part, on which a Y-shaped part (6) is placed near the center of the bar-shaped part. The V-shaped part of the Y-shaped part can partially enclose the bar. Near one end, the bar-shaped part is preferably provided with a transverse part, which is at right angles to the bar-shaped part and runs parallel to the Y-shaped part, so that a U-shaped recess is created which can accommodate the heating wire and the other side of the Y-shaped part and the bar-shaped part together form an L-shaped recess in which the heating wire can also be accommodated. The one end of each spacer element is provided with a projection and the other end with a recess.

Abstract: An oven for heating, cooking, or toasting a food product. The oven can comprise a conveyor for conveying the food product, and a parabolically shaped top surface with a plurality of reflectors connected thereto, to direct heat back toward the conveyor. The oven can also comprise a fan for circulating air within the oven cavity. The oven can also comprise a controller that can place the oven in an energy savings mode, when it detects that the oven is not in use. The controller can place the oven in energy savings mode by adjusting the speed of, or shutting off the conveyor, or by adjusting the amount of energy supplied to heating elements disposed within the oven.

Abstract: A temperature regulating method in a thermal processing system includes controlling a heating means by performing integral operation, differential operation and proportional operation by means of a heating control section in a manner a detection temperature by a temperature detecting means becomes a predetermined target temperature, determining a first output control pattern by patterning a first operation amount for the heating control section to control the heating means depending upon a detection temperature detected by a first temperature detecting means, in controlling the heating means controlling the heating means by means of the heating control section depending upon the first output control pattern determined, and determining a second output control pattern by patterning at least a part of a second operation amount for the heating control section to control the heating means depending upon a detection temperature detected by a second temperature detecting means, in controlling the heating means.

Abstract: An impurity-activating thermal process is performed after a target is subjected to an impurity introduction step. In this thermal process, while a spike RTA process including a holding period for holding a temperature at a predetermined temperature is performed, at least one iteration of millisecond annealing at a temperature higher than the predetermined temperature is performed during the holding period of the spike RTA process.

Abstract: An apparatus for heating a splice seal includes structural members defining a heating area that receives a splice seal. At least one of the structural members is moveable between an open position and a closed position. At least one heat source is arranged in the heating area. The heat source directs infrared radiation toward the splice seal when the structural member is in the closed position. At least one cooling device cools the heating area when the structural member is in the closed position.

Abstract: A kiln of the pottery or glass type and of insulating firebrick or ceramic fiber with an interior wall includes: a ceramic holder for holding a wound electrical heating element; a channel in the interior wall for receiving and supporting the ceramic holder. The ceramic holder is removably positionable within the slot with means for receipt and holding the wound electrical heating element when the ceramic holder is positioned within the channel in a first preferred embodiment, the ceramic holder has a supporting surface for receipt of the heating element and an inner, upper lip for holding the heating element on the ceramic holder. The interior wall has a horizontal retaining slot aligned with the ceramic holder supporting surface, the supporting surface has an outer end received within the retaining slot and an inwardly angled bore and a pin passing through the bore into the interior wall for holding the ceramic holder removably in place.

Abstract: A device for heating a substrate with light from a flash lamp having a semiconductor switch connected in series to the flash lamp. After triggering of a trigger electrode of the flash lamp, a first drive signal and a second drive signal are output from a gate circuit. The time period when the semiconductor switch is on due to the second drive signal is longer than the time period that the semiconductor switch is on by the first drive signal. Then, the semiconductor switch is switched on and off by the first drive signal and the substrate temperature is increased to a temperature, which is lower than the desired temperature to be achieved, and is maintained a that temperature for a short time, after which the surface temperature of the substrate is increased to the desired target temperature.

Abstract: The invention relates to a modular oven for food products, the oven including a conveyor device for entraining the products from an inlet to an outlet of the oven, and comprising in cascade at least two, and preferably three, individual modules, each individual module presenting: a ceiling of adjustable height that presents first air and/or steam injection means for generating forced convection; a floor of adjustable height that presents second air and/or steam injection means for generating forced convection; floor burners for baking by convection, which burners are disposed between the floor and the conveyor device and are adjustable vertical position; and ceiling burners for baking by radiation, which burners are disposed between the conveyor device and the ceiling, and are adjustable in vertical position.

Abstract: An electric oven includes a housing having a cooking chamber for cooking food and a component chamber containing components for operating the electric oven. A door is provided on a front of the housing for selectively opening and closing the cooking chamber. A suction duct introduces external air from outside of the housing into the component chamber, and an exhaust duct with a sloped portion discharges air from the component chamber to outside of the housing.

Abstract: A controller for a food holding oven determines one or more time periods during each of which heat is directed at a pre-cooked food item. By controlling the heat intensity and the time over which different amounts of heat are provided to different types of pre-cooked food items, the time during which a particular type of pre-cooked food item can be kept palatable is maximized.

Abstract: A heat treating device (50) has a cooling sleeve that covers a treating vessel (56) and a heater (100). The cooling sleeve has a cylindrical base member (110) and a cooling pipe (112) spirally wound on the outer peripheral surface hereof. The cooling pipe (112) is brazed to the base member (110).

Abstract: An apparatus for measuring an object temperature of an object, and including at least one heating apparatus having at least one heating element for heating an object via electromagnetic radiation. Also included is at least one first radiation detector that detects radiation coming from the object within a first field of vision, and, for determining correction parameters, a measuring device that detects the electromagnetic radiation that reaches the first field of vision from the at least one heating element up to a proportionality factor or a known intensity-dependent function.

Abstract: A temperature stabilization system, method, composition of matter and substrate processing system are disclosed. A heat absorbing material is disposed in thermal contact with a substrate. The heat absorbing material is characterized by a solid-liquid phase transition temperature that is in a desired temperature range for material processing the substrate. When the substrate is subjected to material processing that results in heat transfer into or out of the substrate the solid-liquid phase transition of the heat absorbing material stabilizes the temperature of the substrate.

Abstract: A heating system of a batch type reaction chamber for semiconductor device and a method thereof are disclosed. Each heat unit of heating groups has different height and caloric value at right angles according to the divided areas, thereby it can control an uniform temperature incline of the entire process space of the reaction chamber. Also, the reflecting plates are formed by each heating unit, so that the change of the heating unit can be simple. Furthermore, the divided reflecting blocks are adjacently connected to another reflecting block through the radiant wave shielding slit between them, so that the leakage of the radiant wave can be prevented and the reflecting blocks can be separately attached and deattached to each other. Also, the turning member is formed at the lower portion of the reflecting blocks, so that it can be easily attached and deattached.