Abstract: A semiconductor wafer in which a carbon thin film is formed on a surface of a silicon substrate implanted with impurities is irradiated with flash light emitted from flash lamps. Absorbing the flash light causes the temperature of the carbon thin film to increase. The surface temperature of the silicon substrate implanted with impurities is therefore increased to be higher than that in a case where no thin film is formed, and the sheet resistance value can be thereby decreased. When the semiconductor wafer with the carbon thin film formed thereon is irradiated with flash light in high concentration oxygen atmosphere, since the carbon of the thin film is oxidized to be vaporized, removal of the thin film is performed concurrently with flash heating.

Abstract: The back surface of a substrate having a front surface coated with a resist film is irradiated with flashes of light emitted from flash lamps. Heat conduction from the back surface of the substrate abruptly raised in temperature by the irradiation with flashes of light toward the front surface thereof occurs to heat the resist film formed on the front surface of the substrate, so that a post-applied bake process is performed. After the completion of the post-applied bake process, a cooling plate cools down the substrate. Regardless of the type of resist film formed on the front surface of the substrate, the substrate has a constant absorptance of flashes of light to allow the resist film to be heated to a constant treatment temperature, because the back surface of the substrate is irradiated with flashes of light.

Abstract: A heating device for tempering preforms before processing in a stretch blow device. The heating device includes a heating alley with a plurality of infra red emitters, arranged parallel to the longitudinal axis of the tempered preforms. At least one back reflector and/or one filter is assigned to the infra red emitters, whereby the at least one back reflector and/or the at least one filter is segmented.

Abstract: The current invention discloses a novel spray booth containing a plurality of spacers disposed on the walls or ceiling, and a plurality of fans attached to the spacers. A spacer allows a fan to be disposed at an angle and at a certain distance away from the wall or ceiling, allowing sufficient airflow for spraying or curing an object within the housing. Having fans emit airflow toward both the top and the sides of an object allows optimal coating and heating of the object. A ceiling fan may also be disposed within a plenum in the ceiling of the spray booth.

Abstract: An oven is configured with a cooking cavity for receiving a cooking load, a circuit for current supplied by one or more stored energy devices such as rechargeable batteries, and a heater comprising one or more radiant lamps to be driven by the current, the one or more radiant lamps being sized and positioned for heating the cooking load. The lamps are driven by current discharged from the batteries to radiantly heat a cooking load. An application of this stove configuration is in a toaster which is capable of toasting slices of bread in a matter of seconds.

Abstract: A toasting appliance includes a toasting chamber, a heating element for heating a foodstuff located within the toasting chamber, an optical system having a first light source for illuminating the foodstuff with light having a first wavelength and an optical receiver for detecting light reflected from the foodstuff. A second light source is provided for illuminating at least the optical receiver with light having a second wavelength different from the first wavelength. A controller varies the intensity of the light emitted from the second light source during a toasting operation.

Abstract: This invention introduces the welding technology of an electrical connector and its welding device. The welding device comprises of a base frame, IR lamp that can emit infrared rays, and convex lens used to collect infrared rays. The lamp and lens are set in the base frame, with the convex lens in front, which collects all infrared rays from the lamp and irradiates them to the solder paste, allowing for fast heating. The melted solder paste forms defect-free welding spots with sound electrics performance and low energy consumption, thus saving energy. This invention of welding device is used for the welding when electrical connector is assembled, solder paste is put and the connector is fixed in the conveying belt. The electrical connector goes through the heating zone in welding device, which enables the automatic welding of each cored wire in the electrical connector and wire connecting terminal. The welding is fast and the production can be continuous free of any tack welding.

Abstract: Embodiments of a lamphead and apparatus utilizing same are provided. In some embodiments, a lamphead for thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage, wherein the at least one heat transfer member extends into each coolant passage up to the full height of each coolant passage. The lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.

Abstract: An infrared firing furnace includes a case-integrated cooling system to provide high performance cooling as the first step in the cooling process. The cooling system includes a cooling manifold integrated into, and made from, the same case material as the adjacent firing zone. As the cooling system is made from the same material as the rest of the case, it can handle being exposed to higher temperatures. The cooling system is positioned such that the plane of its outlet is at a specific clearance level relative to the product passing underneath. High pressure cooling jets of air are directed downward toward the products as they pass under the cooling manifold in order to quickly bring the temperature of the products down from the much higher firing temperature, and minimize the dwell time of the product at the higher temperature.

Abstract: A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.

Abstract: A device for heating a substrate with light from a flash lamp having a semiconductor switch connected in series to the flash lamp. After triggering of a trigger electrode of the flash lamp, a first drive signal and a second drive signal are output from a gate circuit. The time period when the semiconductor switch is on due to the second drive signal is longer than the time period that the semiconductor switch is on by the first drive signal. Then, the semiconductor switch is switched on and off by the first drive signal and the substrate temperature is increased to a temperature, which is lower than the desired temperature to be targeted, and is maintained a that temperature for a short time, after which the surface temperature of the substrate is increased to the desired target temperature.

Abstract: A heated counter for service of hot food has one or more hotplates, a light source illuminating each hotplate and a number of light sensors below each hotplate. When a sensor is obscured by a dish of food, power is supplied to that hotplate, and when no sensor is obscured, that hotplate is kept in stand-by mode.

Abstract: Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.

Abstract: An apparatus for heating a material that is susceptible to RF heating by an RF antenna array. The apparatus includes a source of RF power connected to an antenna array having a plurality of loop antenna sections connected to each other by dipole antenna sections wherein the loop antenna sections and dipole antenna sections create a magnetic near field and an electric near field such that the ratio of magnetic field strength to electric field strength is approximately a predetermined value. Material is heated by the apparatus by placing the material in the near fields of the antenna array and creating magnetic near fields and electric near fields that approximate a ratio that is predetermined to efficiently heat the material and connecting the antenna array to an RF power source.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: A thermal processing apparatus and method with predictive temperature correction. Distances are measured from a backside of the wafer relative to a reference plane. Heat is transferred to the backside of the substrate in relation to the measured distances. This allows a baking unit to uniformly heat the substrate to compensate for irregularities or warpage.

Abstract: Installation for heating the bodies (1) of thermoplastic preforms (2) with a view to manufacturing containers by blow-molding or stretch-blow-molding, while the preforms (2) are being moved along with their bodies (1) following a predetermined path (T), this installation comprising at least one directional source (5) of electromagnetic radiation directed towards a location (E) on the path (T); the source (5) is inclined by an angle (?) of between about 60° and 10° and preferably less than about 45°, with respect to the tangent (6) to the path (T) at the location (E); thus, the electromagnetic radiation can pass through several preform bodies or parts of bodies without being appreciably reflected back towards the source (5).

Abstract: In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. The apparatus includes a heating assembly having a housing that contains at least one infrared heating element. The heating assembly is mounted above an upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing comprises a gas inlet connected to a gas supply, and at least one outlet for discharging gas from the housing.

Abstract: A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate at a first temperature to a substrate support in a chamber, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate to a second temperature during a first time period while the substrate is disposed on the substrate support, heating the substrate to a third temperature during a second time period while the substrate is disposed on the substrate support, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period.

Abstract: A conveyor oven has several heating zones. Each heating zone is comprised of one or more infrared emitters that are configured to emit a spectrum of infrared wavelengths that varies in intensity and spectrum over time. The spectra of emitted infrared wavelengths in each zone can have the same or different profile. Zones are regions wherein infrared emitters are configured and operated to emit the same or substantially the same infrared energy wavelengths and intensity levels across an IR spectrum. Access to the infrared emitters and the conveyor is provided by one or more access or maintenance ports formed into a side of the conveyor oven. Temperature control inside the oven is effectuated by venting hot air through air vents formed into the oven sides and/or top.

Abstract: When a semiconductor wafer is preheated by halogen lamps, the temperature of a peripheral portion of the semiconductor wafer is lower than that of a central portion thereof. A laser light emitting part disposed immediately under the center of the semiconductor wafer is rotated about the center line of the semiconductor wafer, while laser light is directed from the laser light emitting part toward the peripheral portion of the semiconductor wafer. Thus, the irradiation spot of the laser light exiting the laser light emitting part swirls around along the peripheral portion of the back surface of the semiconductor wafer so as to draw a circular trajectory. As a result, the entire peripheral portion of the semiconductor wafer at a relatively low temperature is uniformly heated. This achieves a uniform in-plane temperature distribution of the semiconductor wafer.

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a substrate support surface and a shaft; an RF electrode disposed in the substrate support proximate the substrate support surface to receive RF current from an RF source; a heater disposed proximate the substrate support surface to provide heat to a substrate when disposed on the substrate support surface, the heater having one or more conductive lines to provide power to the heater; a thermocouple to measure the temperature of a substrate when disposed on the substrate support surface; and a conductive element having an interior volume with the one or more conductive lines and the thermocouple disposed through the interior volume, the conductive element coupled to the RF electrode and having an electric field of about zero in the interior volume when RF current is flowed through the conductive element.

Abstract: The apparatus of this invention relates to a device for heating or cooking food or liquids such as soup, water, roast, etc. A downwardly curved visor-like deflector is positioned at the upper end of a radiation disk of an infrared heater so as to extend outwardly therefrom. The deflector has an upwardly presented cooking utensil opening formed therein and a horizontally disposed cooking utensil support secured to the deflector at the inner surface thereof below the cooking utensil opening. The cooking utensil support dwells in a plane below the upper end of the radiation disk whereby infrared rays emitted from the radiation disk will impinge upon the cooking utensil support and a cooking utensil positioned on the cooking utensil support to cook or heat the contents thereof.

Abstract: A high speed cooking apparatus employing a low voltage high current system for heating foods employing a novel wire mesh heating element. The system herein described providing the benefits of high speed cooking like that further described by U.S. Provisional Application 60/822,028 filed on Aug. 10, 2006, but yet providing significant cost benefit and simplicity over said system.

Abstract: Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.

Abstract: A cooling and exhaust system of a dual oven has upper and lower ovens, in which, in one aspect, an installation structure of a cooling fan and an exhaust structure provided for respectively cooling and exhausting the upper and lower ovens may be integrated into a simplified structure having common components to increase the manufacturing productivity. In another aspect, fans provided at the upper and lower ovens may be independently controlled to operate at different speeds according to a desired operation to maximize the cooling efficiency.

Abstract: Various embodiments of the present invention are directed to heating systems. In various embodiments, a tray may be supported adjacent a housing having a plurality of heating compartments configured to provide heat to food items within each of the heating compartments. In other embodiments, a vessel may be configured to be disposed in a housing having a plurality of heating compartments configured to provide heat within each of the heating compartments. In further embodiments, a housing may have a plurality of heating compartments configured to provide heat within each of the heating compartments, and the heating compartment may have open ends arranged around a circumference of the housing.

Abstract: A bread toaster includes an outer cover, a toaster base, a toaster frame mounted on the toaster base, a first sliding member slidably provided on a predetermined side of the toaster frame, a second sliding member also provided on the same predetermined side of the toaster frame, a front supporting frame and a rear supporting frame provided at a front side and a rear side of the toaster frame respectively, a lid arrangement, and a control circuitry, wherein the lid arrangement is arranged to be operated between a closed position and an opened position for closing and opening the toasting slots of the bread toaster.

Abstract: An oven body includes a grilling chamber provided with several far infrared ray heaters and a smoking chamber that emits smoke from the charcoal heated by electric heaters, wherein the meat to be roasted is rotated in the grilling chamber by a rotating means, rotating alternately through a far infrared ray heating area where far infrared ray concentrates and through a smoking area where smoke concentrates, in which process the roasting operation by the far infrared ray and the smoking operation with particular scent of a charcoal are carried out simultaneously.

Abstract: A method and device for measuring the soot load in the exhaust gas systems of diesel engines using a sensor which is mounted downstream of a particulate filter and comprises a sensor element, to measure the operability of the particulate filter. According to the method, the soot load of the sensor element is measured resistively or capacitively using electrodes. The measuring voltage of the sensor element is controlled depending on at least one actual operating parameter of the diesel engine.

Abstract: Methods and apparatus for controlling the temperature of multi-zone heater in a process chamber are provided herein. In some embodiments, a method is provided to control a multi-zone heater disposed in a substrate support, wherein the multi-zone heater has a first zone and a second zone. In some embodiments, the method may include measuring a current drawn by the first zone at a first time; measuring a voltage drawn by the first zone at the first time; calculating the resistance of the first zone based upon the measured current and voltage drawn by the first zone at the first time; determining a temperature of the first zone based upon a predetermined relationship between the resistance and the temperature of the first zone; and adjusting the temperature of the first zone in response to the temperature determination.

Abstract: An oven has a first conveyor, a first burner that directs heat toward the first conveyor from above the first conveyor, and a second burner directs heat toward the first conveyor from below the first conveyor. A method includes providing foodstuff on a conveyor, exposing the foodstuff to heat directed toward the foodstuff from above the conveyor, and exposing the foodstuff to heat directed toward the foodstuff from below the conveyor. Another oven has a first conveyor and first conveyor insulators that surround the first conveyor and define a first zone. Another method includes introducing foodstuff to a first conveyor belt within a first insulated zone, introducing heat into the first insulated zone, and retaining a portion of the heat within the first insulated zone. Another oven has an insulated cooking zone that closely envelopes a cooking path and an insulated oven zone that substantially envelopes the cooking zone.

Abstract: A food heating device includes a platen (101) and a pair of conveyor segments (103). A first conveyor segment is arranged and spaced to transport a food product (201, 203, 205) between a first side of the platen (101) and the first conveyor segment (103). A second conveyor segment (103/703/903) is arranged and spaced to transport the food product between a second side of the platen (101) and the second conveyor segment (103/703/903). A transfer device (505/705) may be disposed at one end of the platen (101) such that the transfer device transfers the food product (203) from the first side of the platen (101) to the second side of the platen (101).

Abstract: An oven comprising a box housing with an internal cavity bounded by walls, and provided on one side with an opening closable by a movable door, at least one of the walls there being provided a browning or grilling member comprising an electrical resistance element, and presenting a first side facing the wall and a second side, opposite the first side, facing the interior of the oven cavity in which at least one food item is positioned to be subjected to cooking and/or grilling, this latter function being obtained by activating the member. In a position corresponding with first side of the grilling member a flat element is provided presenting two opposing flat faces, a first face presenting high emissivity and the second face presenting high reflectivity or reflective power, the element being able to be moved relative to the member such that this latter can be faced by the first face or the second face, depending on the type of cooking required for the food item positioned within the oven cavity.

Abstract: Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.

Abstract: Cooking, smoking and aromatization device which consists of a casing or container (1) comprising a plurality of sealed compartments (2, 3, 4, 5) communicating with the main cooking chamber (6) by means of a plurality of channels or ducts (7) which are controlled by a plurality of valves (8a, 8b, 8c, 8d), there being at least one for each of the sealed compartments (2, 3, 4, 5) so that the contents of each of said sealed compartments are supplied to the central cooking compartment (6) with a constantly controlled flow.

Abstract: In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given emission output; and a second stage of supplemental light irradiation of the semiconductor wafer, which irradiation is started after the peak, producing an emission output smaller than the above given emission output. The emission output in the second stage is two thirds or less than the above given emission output at the peak. The first-stage light-irradiation time is between 0.1 and 10 milliseconds, and the second-stage light-irradiation time is 5 milliseconds or more.

Abstract: Provided are methods of tuning the emission wavelength from a tunable infrared plasmonic emitting structure, which structure comprises: (a) a perforated or patterned first conductive layer having a plurality of relief features provided in a periodic spatial configuration, wherein the relief features are separated from each other by adjacent recessed features, wherein the distance between features is between 1-15 ?m; (b) a dielectric layer underlying the first conductive layer; (c) a second conductive layer underlying the dielectric film; and (d) a substrate underlying the second conductive layer; wherein the emission wavelength is tuned by applying a force in a biaxial direction parallel to the substrate, changing the distance between relief features, or changing the resistivity and dielectric constant of the dielectric layer.

Abstract: An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.

Abstract: A rotary tube furnace (1) comprising an insulated heating chamber (4), the insulated heating chamber having a product discharge outlet (21) and a process tube inlet (39), a heating element (14) operatively arranged to selectively heat the heating chamber, a generally horizontally extending process tube (2) supported for rotation relative to the heating chamber, the process tube having a first portion (36) generally arranged outside of the heating chamber and a cantilevered second portion (37) extending from the first portion into the heating chamber and terminating at a discharge end (38) within the heating chamber, a feed mechanism (40) configured and arranged to feed product into the process tube, and a bearing assembly operating between a support frame (34) and the first portion of the process tube and configured and arranged to support the process tube and transmit rotational torque to the process tube.

Abstract: A device for heating a substrate with light from a flash lamp having a semiconductor switch connected in series to the flash lamp. After triggering of a trigger electrode of the flash lamp, a first drive signal and a second drive signal are output from a gate circuit. The time period when the semiconductor switch is on due to the second drive signal is longer than the time period that the semiconductor switch is on by the first drive signal. Then, the semiconductor switch is switched on and off by the first drive signal and the substrate temperature is increased to a temperature, which is lower than the desired temperature to be achieved, and is maintained a that temperature for a short time, after which the surface temperature of the substrate is increased to the desired target temperature.

Abstract: A thermal processing furnace comprises: a tubular heat insulation member 4 surrounding a processing vessel 3 for receiving and thermally processing an object to be processed w; a heating resistor 5 helically arranged on an inner circumferential surface of the heat insulation member 4; and a support member 13 disposed on the inner circumferential surface of the heat insulation member 4, the support member 13 supporting the heating resistor 5 such that the heating resistor 5 can be thermally expanded and thermally shrunk. The thermal processing furnace further comprises: a movement prevention member 15 disposed on the heating resistor 5 to be in contact with one side surface of the support member 13 so as to prevent a downward movement of the heating resistor 5.

Abstract: An infrared cooker includes an infrared burner element that radiates heat towards a removable cooking surface, the removable cooking surface placed receives heat radiated from the infrared burner element, the cooking surface stores the heat received from the infrared burner element and upon a food item being placed above or upon the removable cooking surface, the food item simultaneously cooks by heat conducted from the removable cooking surface and direct radiation of the infrared burner.

Abstract: A method (and structure) of thermally treating a magnetic layer of a wafer, includes annealing, for a predetermined short duration, a magnetic layer of a single wafer.

Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.

Abstract: An oven muffle having a receiving space, at least some regions of which are delimited by wall elements, in which at least one of the wall elements is permeable to IR radiation or has a region that is permeable to IR radiation. In the oven muffle, the cooking performance is successfully improved while also providing an easily cleanable interior because a reflecting element that reflects IR radiation is positioned in the region of the outer surface of the wall element on a side oriented away from the receiving space.

Abstract: An apparatus for thermally treating semiconductor substrates has a processing space which is defined by first walls substantially parallel to the semiconductor substrate and a second side wall connected to the first walls; a substrate holding device disposed in the processing space which defines a substrate retaining region for a semiconductor substrate in the processing space; and heating elements which are disposed in the processing space between at least one of the first walls and the substrate retaining region. The thermal gradient between the edge of the semiconductor substrate and the center of the semiconductor substrate can be effectively compensated by providing a shutter between the substrate retaining region and the heating elements which limits the radiation emitted in the processing space by the heating elements in the direction of the substrate retaining region.

Abstract: The present invention provides improved apparatus for ultraviolet (UV) cure of thin films. A central external reflector (CER) reflects UV light at different angles to compensate for non-uniformity of the deposited film on the substrate. The CER is positioned between the UV light source and the substrate and includes an actuator that can change the angle of reflection before and during UV cure.

Abstract: An apparatus and methods are provided for heating and sensing the temperature of a chemical reaction chamber without direct physical contact between a heating device and the reaction chamber, or between a temperature sensor and the reaction chamber. A plurality of chemical reaction chambers can simultaneously or sequentially be heated independently and monitored separately.

Abstract: A lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, a lamp base configured to receive the pair of leads, a sleeve having a wall thickness of at least about 0.013 inches and a potting compound having a thermal conductivity greater than about 100 W/(K-m).