Abstract: The present invention features a metallic resistive heater and uses thereof. The resistive heater includes a metallic component that is electroconductive (i.e., has low resistivity) and an oxide, nitride, carbide, silicide, and/or boride derivative of the metal component that is electrically insulating (i.e., has high resistivity). The resistivity is controlled in part by controlling the amount of oxide, nitride, carbide, silicide, and boride formation during the deposition of the metal component and the derivative.

Abstract: A method of producing a thin film heating element is provided which can be used in manufacturing a transparent thin film heating element of desired shape with an increased heat emission property and an excellent durability. Also provided is a heating device of the type incorporating the thin film heating element produced by this method. The inventive method comprises the steps of, applying heat- and oil-resistant ink on a predetermined surface area of a base element, allowing the ink to run dry, spraying conductive chemical composition on the base element to form a conductive thin heater film, removing the ink out of the base element, printing a thin film electrode leading to the thin heater film, and baking the base element into a thin film heating element.

Abstract: Provided for herein is a method of making a heated steering wheel, comprising depositing an electrically conductive layer on at least a portion of a steering wheel substrate to produce thereon a heating element for receiving an electrical current and providing a source of heat. Also disclosed is a heating element for a steering wheel and a heated steering wheel assembly formed using this method.

Abstract: A heater for fluids, the heater comprising a conduit having a wall and a surface, the conduit being configured to convey a fluid. In one arrangement, the conduit surface is roughened to mechanically secure a coating thereto. A conductor, configured to be electrically resistive and to extend over at least a portion of a roughened surface, and to adhere thereto throughout variations in operational temperatures thereof. The heater provides a clean, particle-free, non-reactive, non-trapping, ultra-pure, thermally tolerant, sealed system. The system maintains process fluids clean, even upon system failure, at contaminant levels below parts per billion, or even parts per trillion. In one arrangement, the heater comprises a quartz conduit with an electroless nickel plating of an engineered thickness on an external surface forming a resistive heater. The resistive heater conducts thermal energy through the wall of the conduit.

Abstract: The heating device includes a conductive layer which is positioned on an electrically insulative substrate. Preferably, the conductive layer is screen printed onto the substrate. The substrate is designed to limit elongation of the conductive layer, thereby improving the durability of the conductor and enabling the heating device to be used in flexible applications, such as automobile seats. The substrate can include at least one aperture passing therethough to further improve flexibility, fatigue resistance, and breathability of the heater. The conductive layer is configured to include a buss structure with a first buss ground inwardly adjacent from the periphery of the heating device and a first buss with serpentine paths extending from one edge of the heating device to another edge. The buss structure further includes a second buss with L-shaped portions positioned between the serpentine paths and the first buss ground. The second buss ground is located in a central location between the serpentine paths.

Abstract: The present invention relates to systems and methods for enhancement of biometric object image capturing. These systems and methods prevent undesirable interruptions of total internal reflection of a prism that result in improper biometric images. In embodiments of the invention, a thermal assembly comprising a plurality of thermal elements is placed adjacent to the image capturing device. The thermal elements upon supply of a current are capable of either heating or cooling the image capturing device or a platen of the image capturing device. If cooling of the biometric object receiving surface is required, the thermal elements can be controlled to decrease temperature of an area where a biometric object is placed, or an area adjacent to where the biometric object is placed.

Abstract: Devices and methods for applying heat to a platen of a biometric image capturing device are described that remove and prevent the formation of excess moisture on the platen. These devices and methods prevent undesirable interruptions of total internal reflection of a prism that result in biometric images having a halo effect. In embodiments of the invention, an electrically conductive transparent material is used to apply heat to the platen. In other embodiments, resistive heating elements attached to non-optical areas of the platen (e.g., the ends) are used to apply heat to the platen. Heater assemblies according to the invention can be used to heat an area where a biometric object is placed, or an area adjacent to where the biometric object is placed, to remove and prevent the formation of excess moisture on the platen.

Abstract: A ceramic substrate for a ceramic heater includes aluminum nitride, silicon nitride or silicon carbide as the main component for increasing mechanical strength and improving thermal shock resistance, and a proper additive for controlling thermal conductivity. A temperature gradient from a heating element to a power feeding electrode is reduced by providing a dimensional ratio of the substrate effective for preventing oxidation of a power feeding contact that contacts the electrode of the heating element formed on the surface of the ceramic substrate. The dimensional ratio A/B≧20 is satisfied, wherein A represents the distance from the contact between a circuit of the heating element and the electrode to an end of the ceramic substrate closer to the electrode, and B represents the thickness of the ceramic substrate. The thermal conductivity of the ceramic substrate is adjusted to 30 to 80 W/m·K.

Abstract: This system provides methods and apparatus for performing microanalytic and microsynthetic analyses and procedures. Specifically, the system provides a microsystem platform for use with a micromanipulation device to manipulate the platform by rotation, thereby utilizing the centripetal force resulting from rotation of the platform to motivate fluid movement through microchannels embedded in the microplatform. The microsystem platforms of the system are also provided having microfluidics components, resistive heating elements, temperature sensing elements, mixing structures, capillary and sacrificial valves, and methods for using these microsystems platforms for performing biological, enzymatic, immunological and chemical assays. An electronic spindle designed rotor capable of transferring electrical signals to and from the microsystem platforms of the system is also provided.

Abstract: A method of producing semi-conductive, electrical resistive heating elements comprising metal oxides, preferably binary metal oxides whereby the two metals are of different valencies and the conductivity of the binary oxide system is determined by the compositioned ratio of the two metals having different valencies and the degree of oxidation, and electrically resistive heating elements so produced.

Abstract: The present invention provides a circuit board/printed circuit board having pre-reserved conductive heating circuits, which comprises a plurality of metal circuit substrates and a plurality of layers of insulating material. The conductive heating circuits are disposed on the metal circuit substrates. Each of the conductive heating circuits has a plurality of direct heat-generating regions. The insulating material is disposed between the metal circuit substrates. When a current is provided to the conductive heating circuits, heat required for partly bonding and hardening can be generated so that the insulating material and the corresponding positions of the direct heat-generating regions on the metal circuit substrates can be bonded and hardened together. A pre-stacked multi-layer metal circuit board with partly bonding and hardening is thus finished.

Abstract: A heating element or heater for use with an automotive windshield is adapted to prevent the accumulation of ice and slush on windshield wipers. The heater is defined by a laminate having an electrical resistance member sandwiched between the first and second films forming the laminate. Contacts extend out of the laminate for connection to a source of power. The electrical resistance member, preferably, comprises a resistance wire which reaches a temperature sufficient to melt snow and ice accumulating on the windshield wipers, but which is insufficient to melt the laminate or to create a fire hazard. Optimally, the heater is powered through an automotive lighter outlet or accessory power outlet disposed within the interior of the vehicle.

Abstract: The invention provides a fluid heater in which the efficiency of heat transfer to a fluid is improved, downsizing of the heater itself can be achieved, and the rise time until warm water heated to a necessary temperature is supplied is shortened, which results in reduction of the power consumption. The heater includes a flat ceramic substrate (1) and a beating element formed on one surface of or in the interior of the ceramic substrate (1). The ceramic substrate (1) is made of AlN, etc. or silicon nitride, whose thermal conductivity is 50W/m·K or more. A zigzag water channel is formed by walls 6, etc., on the fluid-heating surface of the ceramic substrate (1). A plurality of fins 5 are fixed in the water channel. A heat insulating material 8 can be mounted so as to cover a surface excluding the fluid-heating surface of the ceramic substrate (1).

Abstract: A heater has a top-surface layer made of an imide-based resin formed on an electrical insulation layer. The heater can generally used for an image heating apparatus incorporated in an image forming apparatus. Since the top-surface layer has preferable sliding and insulating characteristics, the heater provides good heat efficiency and durability.

Abstract: A heating device is proposed, particularly for a sensor element for the analysis of exhaust gases of internal combustion engines. For this purpose, the heating device has a particularly meander-shaped heating conductor (11) proceeding on a substrate (10), as well as at least one heat-conducting element (12) positioned in one vicinity of the heating conductor (11) and electrically insulated from heating conductor (11).

Abstract: An apparatus for operably connecting an electrical source to a conductive coating or film. The apparatus may include a substrate made of a structural material. A conductive coating or thin film may be applied to the substrate. An interface layer may be applied over the conductive coating and conduct electricity thereto while transferring insufficient force to separate the conductive coating from the substrate. A conductor, for providing electricity to the interface layer comprising strands configured to be separable and electrically conductive, may be positioned in contact with the interface layer. A clamping mechanism may apply a clamping load urging the conductor toward the conductive coating. The strands of the conductor may be formed to distribute mechanical stress and strain induced by thermal expansion and the clamping load sufficiently to substantially reduce damage to the mechanical and electrical integrity of the conductive coating.

Abstract: A heatable vehicle window (e.g., windshield, sidelite or backlite) includes a multi-layer coating formed on a substrate. The multi-layer coating includes at least one dielectric layer and at least one conductive layer. A pair of bus bars are deposited on the substrate over the coating, so that at least the dielectric layer is provided between the bus bars and the conductive layer(s). In order to create an electrical connection between the bus bars and the conductive layer(s) of the coating, the bus bars and/or coating is/are heated to a temperature sufficient to permit the bus bars to reach molten or semi-molten form. Portions of bus bar material then flow down through at least the dielectric layer of the coating (i.e., forming a contact hole in the coating) so as to contact the coating's conductive layer(s). After cooling of the newly formed bus bars, the window may be selectively heated by passing current through the conductive layer(s) via the bus bars.

Abstract: A bus bar arrangement for a heatable vehicle window. An electroconductive coating is divided into two separate coating portions which represent two different respective heating zones. A single bottom bus bar is common to both heating zones, while a first upper/top bus bar portion is provided for the first heating zone and a different second upper/top bus bar portion is provided for the second heating zone. The two upper/top bus bars are spaced apart and electrically insulated from one another. Conductive bus bar extension portions lead from the respective upper bus bars down to a bottom edge of the window (e.g., vehicle windshield) so that electrical connectors for all three bus bars can be located along or proximate a single edge of the window.

Abstract: An electrically activated hot-melt adhesive tape for adhesively joining objects such as adjacent sections of carpet. The tape has a base which is typically paper, and an electrically conductive ink-like material is sprayed or printed on the base to form a thin central heating section, and thicker and hence lower-resistance conductive strips extending along opposite edges of the heating section. Scrim supporting beads of hot-melt adhesive is secured over the heating section. Alternatively, the heating section and conductive strips, which may be segmented, are applied to an underside of the base, and the scrim and adhesive beads to the opposite side of the base. An activating tool has extending electrodes which electrically contact the spaced-apart conductive strips to pass a current through the heating section to melt the adhesive beads in preparation for application to the objects to be joined.

Abstract: An electrical conductor including an areal conductor having a constricted current path region along a length thereof is described, in which an accessory conductor bridges the constricted current path region along the length of the areal conductor such that a substantially uniform current density exists throughout the electrical conductor. In this way, current hot spots in the region of the current path constriction are avoided. The constricted current path region may be defined by two lengthwise edges of the areal conductor and the accessory conductor may include two circular or parabolic contours, each opposing and spaced apart from a respective edge of the areal conductor defining the constricted current path region.

Abstract: A thermoconductive rubber patch comprises a thermoconductive rubber piece which is encased by an insulating casing and is made of rubber, carbon black granules and metal granules. The thermoconductive rubber piece is provided with an electric circuit and is capable of generating heat at the time when an electric current flows over the electric circuit. The thermoconductive rubber piece has a resistance, with the magnitude of the resistance being dependent on a ratio by which the carbon black granules and the metal granules are contained in the thermoconductive rubber piece.

Abstract: The invention relates to a microactuator arranged on a thermally insulating layer (2) and having a resistance layer (4) made from doped diamond, which is provided with an electrical supply and an electrical leakage (9).

Abstract: A method of heating air, fluid or materials in dry or humid conditions, fed by low voltage alternate or continuous electrical current or TBTS.

Abstract: A ceramic heater in which a resistor is firmly fixed onto a ceramic substrate. The resistor comprises at least two or more kinds of noble metal particles, ruthenium dioxide, and a glass frit.

Abstract: A thick film heater is shown wherein the thick film resistive circuit, as the heating element, is applied directly to a target object to be heated for very low temperature applications. The thick film used is polymer-based (preferably epoxy). The thick film resistive circuit is applied using conventional means. However, it is cured at higher temperatures and longer cycles than conventional thick film circuits, and preferably in multiple stages.

Abstract: A heater for fusing toner images onto recording paper is provided. The heater includes a supporting base that has an upper surface and a lower surface. The base has a relatively low thermal conductivity. The heater also includes a heating element formed on the upper surface of the base. A heat conductor is provided on the upper or lower side of the base. The heat conductor has a thermal conductivity greater than the thermal conductivity of the base.

Abstract: An electrical heater having a plurality electrodes disposed adjacently on a substrate in spaced apart relation and interconnected by a thermistor material, for example a positive temperature coefficient material. The electrodes each have at least one end portion and preferably two opposite end portions coupled to corresponding electrical terminal located at a common termination zone on the substrate. A spacing between adjacent electrodes may vary and adjacent electrodes may include interdigitated portions to vary the heat produced on select portions of the substrate.

Abstract: An improved TAB circuit is provided for use with ink jet printer cartridges, which carries electrical signals to an array of nozzles on a heater chip. The TAB circuit eliminates bent or broken electrical circuit traces before being bonded to the heater chip by creating a chip window that partially overlaps the edges of the heater chip, and by bringing the electrical circuit traces to the chip window and terminating these circuit traces at a PI (polyimide) edge, which defines the inner perimeter of the chip window. The circuit traces thus are not unsupported at their ends before being assembled to the heater chip, and are automatically correctly positioned to make contact with bond pads of the heater chip when the overall TAB circuit is in correct registration therewith. The TAB circuit also provides an improved tolerance for a covercoat placement that will tend to prevent corrosive ink from coming into contact with these metal traces.

Abstract: The object of the present invention is to provide a panel-type heating element having an excellent durability and high effectiveness in electric power saving

Abstract: A technology that achieves a highly uniform temperature distribution on the surface of large-area semiconductor wafers and substrates for liquid crystals without prior measurement of the resistance-heating-element circuit and subsequent adjustment of the value of resistance. At least one current-receiving point 4 and at least one current-releasing point 5 are provided at the central portion of an insulating substrate 1. One or more resistance-heating-element circuits 2 are embedded in the insulating substrate spirally or pseudospirally from the central portion including the current-receiving point 4 to the peripheral portion of the insulating substrate 1. All the circuits merge with one another at the outermost portion. One or more resistance-heating-element circuits are separated at the outermost portion of the resistance-heating-element circuits and are formed spirally or pseudospirally from the outermost portion to the central portion including the current-releasing point 5.

Abstract: A surface-heating element for a curved surface and method of producing a heating element is provided. The heating element includes a continuous, planar conductor arranged along a longitudinal axis including a plurality of turns connected by regions being generally transverse to the longitudinal axis. The conductor including end portions each having a terminal for receiving electrical current. The heating element also includes a film applied to one side of the conductor and configured to substantially follow an outer contour of the conductor. The film and the conductor form a continuous web generally centered about the longitudinal axis, and at least one turn connecting two generally transverse regions extends beyond the continuous web. The heating element may also include an adhesive layer on the other side of the heating element sealingly engaging the film.

Abstract: System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework.

Abstract: A flow heater for a sink heater or rethermalizing system is disclosed. The flow heater includes a flow tube in fluid communication with a fluid receptacle. The flow tube has a heating element that is in conductive communication with the flow tube and helically encircles the flow tube. Fluid flowing through the flow tube is caused by thermal siphoning effects. The flow heater system may be used for presoaking, soaking, or sanitizing dishware in a sink or for rethermalizing packaged foods.

Abstract: A wafer heating apparatus is provided, including a heat-homogenizing plate comprising a ceramic substrate and having a mounting surface which is an upper surface of the ceramic substrate for mounting a wafer thereon, a heating element provided on the lower surface of the heat-homogenizing plate and pad electrodes connecting electrically to the heating element on said lower surface, wherein the mounting major surface is convex, particularly, with the height of the central portion of the mounting major surface with respect to the periphery thereof is in a range of 10 to 80 &mgr;m. In the wafer heating apparatus a plurality of supporting pins are planted on the mounting surface to support the wafer thereon placed from the mounting surface. The ceramic substrate includes silicon carbide, and an insulating layer is secured on the ceramic substrate and the heating element is secured on said insulating layer, the insulating layer being a glass layer having an lower expansion coefficient by 0.

Abstract: Disclosed is a heating system, at least comprising a ceramic substrate and a resistive layer. The resistive layer comprises a thermally stable resin which is filled with a conductive material.

Abstract: A temperature control device comprising a heater element and a power source. The heater element having a conductive ink affixed to a substrate. The power source connected to the conductive ink to supply power to said conductive ink, thereby heating the heater element.

Abstract: In a conductive board heater using metal as the board, since thermal expansion is large, and expansion and shrinkage are repeated in a heating apparatus, there is a defect that the electrode portion to which a power supply spring contact point on the power supply connecter side is pressurized and contacted is worn and contact inferior occurs and it is easy to break. Furthermore, since the position of the resistor pattern of the heating body varies, excessive heating, insufficient heating, uneven heating at an end portion, or uneven curl unevenness at a paper end is occurred. A heater in an image heating apparatus is provided so as to prevent a contact defect between an electrode and a connecter of image heating apparatus.

Abstract: An electrical heater having a plurality electrodes disposed adjacently on a substrate in spaced apart relation and interconnected by a thermistor material, for example a positive temperature coefficient material. The electrodes each have at least one end portion and preferably two opposite end portions coupled to corresponding electrical terminal located at a common termination zone on the substrate. A spacing between adjacent electrodes may vary and adjacent electrodes may include interdigitated portions to vary the heat produced on select portions of the substrate.

Abstract: An electric heating element formed on an insulating ceramic substance includes and electrically heat-generating material film having a microstructure composed of a silicide alone, a mixture of silicide and Si, or Si along fused to the surface of sintered nitride or carbide ceramic insulating substrate. A heating mechanism is coupled with the bottom face of an electrostatically chucking mechanism provided with a dielectric ceramic and electrodes formed on the bottom face of face of the heating mechanism. The heating mechanism has a fusable electric-heating material film between two ceramic insulting substrates having the same or nearly the same coefficients of thermal expansion. The films is fused to the substrates.

Abstract: A method and apparatus for heating a charging unit to an appropriate temperature in a uniform manner is provided. In accordance with one example embodiment of the present invention, a heater for use in a charger includes a base. First and second contacts are disposed on the base. A heating element couples the first contact and the second contact. The heating element has an energy density that increases approximately exponentially from a first energy density at locations distal from the first and second heat sink locations to a relatively higher second energy density at locations proximal to the first and second heat sink locations. The heater, according to further embodiments of the present invention, is disposed on an opposite side of the substrate layer from the AC electrode layer, and underneath the charger.

Abstract: An apparatus for operably connecting an electrical source to a conductive coating or film. The apparatus may include a substrate made of a structural material. A conductive coating or thin film may be applied to the substrate. An interface layer may be applied over the conductive coating and conduct electricity thereto while transferring insufficient force to separate the conductive coating from the substrate. A conductor, for providing electricity to the interface layer comprising strands configured to be separable and electrically conductive, may be positioned in contact with the interface layer. A clamping mechanism may apply a clamping load urging the conductor toward the conductive coating. The strands of the conductor may be formed to distribute mechanical stress and strain induced by thermal expansion and the clamping load sufficiently to substantially reduce damage to the mechanical and electrical integrity of the conductive coating.

Abstract: A resistance heater for heating fluids including a fluid-permeable porous substrate. An electrically conductive porous thin film is deposited on the porous substrate. An electrical connector coupled to the thin film and adapted to provide an electrical circuit through said thin film to effect heating of said thin film in order to heat a fluid passing through the pours of the thin film and substrate. A method of making and using a resistance heater is also disclosed.

Abstract: The present invention relates to a heating member with a resistive surface (1) that comprises at least one resistive layer (10), two conductive layers (20, 30) as well as isolation layers (40, 50) respectively arranged between said layers (10, 20, 30). The first conductive layer (30) is made in the form of a neutral conductor, while the second conductive layer (30) is made in the form of a protection conductor. In a preferred embodiment of this invention, the resistive layer (10) comprises respectively a contact electrode (11, 12) on both sides in the edge area, while the first and second conductive layers (20, 30) each include a contact electrode (21, 31) in the edge area. The contact electrodes (11, 12, 21, 31) protrude longitudinally and on at least one side above their respective layers (10, 20, 30). A contact electrode (12) of the first resistive layer (10) coincides with the contact electrode (31) of the first conductive layer (30).

Abstract: The present invention features a metallic resistive heater and uses thereof. The resistive heater includes a metallic component that is electrically conductive (i.e., has low resistivity) and an oxide, nitride, carbide, and/or boride derivative of the metallic component that is electrically insulating (i.e., has high resistivity). The resistivity is controlled in part by controlling the amount of oxide, nitride, carbide, and boride formation during the deposition of the metallic component and the derivative.

Abstract: A temperature stabilization scheme reduces the effects of temperature variations on the performance of an electronic system that is implemented on a circuit board. In the temperature stabilization scheme, the circuit has an isolated region that is coupled to a remainder ofthe circuit board by one or more electrical pathways. Associated with each of the electrical pathways is an incidental thermal conduction path between the isolated region and the remainder of the circuit board. A temperature sensitive component ofthe electrical system is coupled to a mounting site on the isolated region and interfaces with the remainder of the circuit board through the one or more electrical pathways. A series of heaters, thermally coupled to the isolated region provides a compensating thermal profile that opposes thermal instability caused by the incidental thermal conduction paths, where the opposition is over a portion of the isolated region that includes at least the mounting site of the temperature sensitive component.

Abstract: An apparatus having a heating circuit including a resistor layer and a patterned conductor layer is disclosed. The pattern defines a current path that includes at least one portion of the resistor layer. When current is applied to the current path, heat is generated in the portion of the resistor layer that is a part of the current path. The heat is used to reflow solder to connect two components such as an integrated circuit chip (IC) to a multi-chip module (MCM) module. This localized electric heating method may be used to package multiple chips on a module. The apparatus having the heating circuit may be fabricated by first depositing a resistor layer on to a substrate. Then, a conductor layer is deposited and etched to define the current path.

Abstract: A thermal warming garment for user temperature management having at least one heating element matrix associated therewith, wherein the thermal warming garment has a top portion and a lower portion, wherein the lower portion has integral feet portions. The thermal warming garment is preferably powered by a battery power pack operatively connected to the at least one heating element matrix via a conductive wire.

Abstract: A heater for a gas sensor has a first thermistor element and a second thermistor element arranged in an electrically parallel configuration. Each thermistor element may be deposited onto a substrate such that the first thermistor element extends about a perimeter of the substrate and the second thermistor element extends across a portion of the substrate intermediate the perimeter of the substrate. The thermistor elements are preferably fabricated of materials having differing thermal coefficients of resistivity. A method of heating the gas sensor includes disposing the two thermistor elements in an electrically parallel configuration over a surface of the substrate and passing an electric current through the elements.

Abstract: An electrical heater having a plurality electrodes disposed adjacently on a substrate in spaced apart relation and interconnected by a thermistor material, for example a positive temperature coefficient material. The electrodes each have at least one end portion and preferably two opposite end portions coupled to corresponding electrical terminal located at a common termination zone on the substrate. A spacing between adjacent electrodes may vary and adjacent electrodes may include interdigitated portions to vary the heat produced on select portions of the substrate.

Abstract: A metallic overcoat is shown for use on the termination of a thick film heater. The invention is specifically useful for reducing overall wall thickness on thick film heaters used in the injection molding industry. The overcoat is placed over at least the termination point of the heating element with access holes for the termination. Thereafter, holes are drilled parallel to the heater axis for the insertion of power leads. The overcoat further provides insulation for better efficiency and mechanical protection for the heating element.