Abstract: A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).

Abstract: A metal joining system having a first burner assembly configured to selectively heat a first zone and an assembly support at least partially vertically lower than at least a portion of the first heat zone and a first hood vertically above at least a portion of the assembly support.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.

Abstract: A friction stir welding apparatus includes: a thermocouple and a temperature measurement device which are configured to detect a temperature of the temperature measurement point; a temperature monitor configured to calculate an estimated temperature of the welding tool from the detected temperature of the temperature measurement point, based on a predefined correlation between a temperature of the welding tool and a temperature of the backing member; and a controller configured to perform a predetermined procedure based on the estimated temperature of the welding tool so as to prevent overheating of the welding tool.

Abstract: A transfer process for bonding a solderable device to a solderable first substrate having a first oxidized surface comprises placing the solderable device proximate to the first substrate in a reducing chamber, where the first surface cannot be visually observed. We place a second substrate having a second oxidized surface in the chamber in a way to visually observe the second surface. Selecting the first substrate and the second substrate so that the reduction of the second surface correlates with the reduction of the first surface provides an indication of the degree of reduction of the first surface. Introducing a reducing agent into the chamber under reducing conditions reduces the surfaces which we track by irradiating and observing the second surface; evaluate any change in the second surface during irradiation and correlate the change with first surface reduction. When sufficiently reduced, we solder the first substrate to the device.

Abstract: A method of establishing filler metal composition for joining components includes determining an initial desired filler metal chemistry, adjoining a first filler rod having a first portion of the desired filler metal chemistry with a second filler rod having a second portion of the desired filler metal chemistry to form a test filler rod, joining a first component formed from a first material to a second component formed from a second material at a weld joint with the test filler rod providing a filler metal portion of the weld joint, and testing the weld joint for desired mechanical, chemical, and weldability properties to establish a desired filler metal composition.

Abstract: A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

Abstract: Process and apparatus for providing a solar cell (2) with a solder ribbon (3), the cell (2) having at least one bus bar (7), wherein flux (4, 4a-4d) is applied by an automatically controlled spray head (5, 6), and the solder ribbon (3) is connected to a bus bar (7) by an automatically controlled soldering unit. Flux (4, 4a-4d) is only applied to locations of the ribbon (3) to be connected to the bus bar (7) and/or flux (4, 4a-4d) is only applied to those locations of the bars (7) to be connected to the ribbon (3). A solar cell (2), that has at least one bus bar (7), with a solder ribbon (3), may be provided by such apparatus and processes.

Abstract: A process for operating a stringer (10) for connecting solar cells in series by solder ribbon cut-offs cut from continuous solder ribbon strip, includes monitoring depletion of the momentarily-employed continuous solder ribbon strip (13a) by a monitoring unit (16) detecting when the end (17) of this strip (13a) approaches, entering a new roll (2) with a new continuous solder ribbon strip (13b), connecting the end (17) of the momentarily-employed strip (13a) to this new strip (13b) thereby forming a composite continuous solder ribbon strip that includes a connection, moving this composite strip to a cutting station (14), cutting this composite strip into solder ribbon cut-offs in cutting station (14), and removing the ribbon cut-off that includes this connection. Also, stringer apparatus for performing such process.

Abstract: Friction stir welding equipment control force spindle for mounting in an orbital head housing uses a coaxial sensor to measure downforce. Simultaneously, an axial electrical actuator is controlled to dynamically correct the axial tool position during the welding, by a direct axial force system control, in order to maintain controlled downforce according to parameters previously set, based on numerical control. The equipment also sets up, monitors and controls spindle rotation speed, welding speed, acceleration speed and downforce using for example closed loop control functions. A laser system may scan the backing surface before welding and correct original tool path, in order to get an offset tool path. A precision alarm system may provide safe welding while preventing the tool from colliding with the backing surface.

Abstract: The present invention is a banjo tone ring with vertical sides (30) as opposed to the angled design of conventional banjo tone rings (120). The ring (30) of the present invention has specific height (h) to width (w) or thickness ratios and is within specific weight ranges for improved performance It vibrates much freer and thus raises the quality of musical tones from the banjo (10) to much higher aesthetic levels. Other embodiments also modify the musical tones for different sounds. Several novel embodiments of manufacturing methods are also described.

Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.

Abstract: A flux spraying system controls a flux sprayer to selectively spray soldering flux onto a printed circuit board (PCB) by a fixture. The fixture is disposed between the PCB and the flux sprayer, and comprises a plurality of openings corresponding to target areas of the PCB. The flux spraying system comprises a statistic module, a calculation module, and a control module. The statistic module records attributes of the fixture to determine spraying areas on the fixture. The calculation module calculates movement parameters of the flux sprayer, a movement length during a movement period and spraying segments of the flux sprayer, and spray duration of the flux sprayer based on the movement length during one movement period and the spraying segments of the flux sprayer. The control module directs the flux sprayer to coat the target areas of the PCB through the openings of the fixture.

Abstract: Friction welding systems and methods including a welding arrangement configured to impart kinetic friction between at least one surface of a first workpiece and at least one surface of a second workpiece to form a weld, a force providing mechanism arranged and disposed for applying a force to one or both of the first workpiece and the second workpiece, and a sensor arranged and disposed to measure a parameter of the welding arrangement, wherein an amount of vibration is determinable from the measured parameter.

Abstract: Copper purge fittings for brazing components of a special gas delivery line together are provided. An orifice is located on the top or end portion of each fitting to create a continuous flow of inert purging gas through the delivery line under construction while brazing. Each fitting will reach temperatures exceeding 1500 degrees. By having a continuous flow of inert gas while brazing, the protection of the interior portion of the system remains intact. Without a purge in place, the intense heat would create a rapid immediate buildup of carbon and other contaminates. Brazing is only commenced after the elimination of harmful oxygen and proper flow of purging gas is measured. The purging gas pressure is lowered if it becomes high enough to potentially cause separation of tubular sections from the purge fittings and is raised if a low flow rate is detected indicating potential insufficient flow of purging gas.

Abstract: An apparatus and computer program are disclosed for processing at least one workpiece using a rotary tool with rotating member for contacting and processing the workpiece. The methods include oscillating the rotary tool laterally with respect to a selected propagation path for the rotating member with respect to the workpiece to define an oscillation path for the rotating member. The methods further include obtaining force signals or parameters related to the force experienced by the rotary tool at least while the rotating member is disposed at the extremes of the oscillation. The force signals or parameters associated with the extremes can then be analyzed to determine a lateral position of the selected path with respect to a target path and a lateral offset value can be determined based on the lateral position. The lateral distance between the selected path and the target path can be decreased based on the lateral offset value.

Abstract: The present invention relates to an ultrasound welding device for welding material webs, for example, films, having an anvil (1) with an anvil welding surface, and a sonotrode (2) with a sonotrode welding surface, wherein the anvil is movable relative to the sonotrode.

Abstract: A multiple substrate system, a method, and structure for adapting solder volume to a warped module. An illustrative embodiment comprises a method for joining a first substrate to a second substrate. A deviation from a nominal gap between the first substrate and the second substrate at a first region of the first substrate is ascertained. A volume of solder paste necessary to compensate for the deviation from a nominal gap is determined. The volume of solder paste necessary to compensate for the deviation at the first region of the first substrate is applied. Further, the second substrate is bonded to the first substrate using, at least in part, the solder paste applied at the first region of the first substrate.

Abstract: The invention utilizes vibration control, precision manufacturing tolerances for certain components of the system, and techniques for limiting thermal expansion of components, including passive insulation and active cooling techniques, in order to enable high speed tool rotation for Friction Stir Spot Joining of Advanced High Strength Steels.

Abstract: The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

Abstract: An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.

Abstract: A method of performing a plurality of friction stir spot welds with a friction stir spot welding (FSSW) system includes measuring a length of a pin of a weld tool of the FSSW system. The length is compared to a first limit to determine if the length is above or below the first limit. Debris is removed off of a tip of the pin when the length is determined to be above the first limit. The length is also compared to a second limit to determine if the length is above or below the second limit. At least one friction stir spot weld is performed on a workpiece when the length is determined to be less than the first limit and above the second limit.

Abstract: Friction stir methods are disclosed for processing at least one workpiece using a rotary tool with rotating member for contacting and processing the workpiece. The methods include oscillating the rotary tool laterally with respect to a selected propagation path for the rotating member with respect to the workpiece to define an oscillation path for the rotating member. The methods further include obtaining force signals or parameters related to the force experienced by the rotary tool at least while the rotating member is disposed at the extremes of the oscillation. The force signals or parameters associated with the extremes can then be analyzed to determine a lateral position of the selected path with respect to a target path and a lateral offset value can be determined based on the lateral position. The lateral distance between the selected path and the target path can be decreased based on the lateral offset value.

Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.

Abstract: A method of manufacturing a wheel balance assembly (500) from a clip and weight, the method comprising the following steps: 1. annealing at least a portion of the clip; 2. positioning the clip and weight adjacent one another; and 3. welding the clip and weight to one another.

Abstract: The invention relates to a method for connecting material webs disposed with overlapping edges, wherein an automatic welding machine having a driven chassis and a drive unit disposed thereon and a welding unit is guided along the overlap zone of the material webs to be connected, such that the carried welding unit connects the edges to be connected to one another. The invention further relates to an automatic welding machine for performing the method.

Abstract: A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point 86a where the center of the capillary is positioned during second bonding on a lead 74 to a point “p”, and then moved horizontally by a first distance of L1 toward a pad 73, and lowered to a point “r”; a second folding step in which the tip end of the capillary is raised from the point “r” to a height of H2 and then moved horizontally toward the lead 74 by a second distance of L2; and a third bonding step in which the center of the capillary is aligned with and then lowered to a point 87a on the lead 74 adjacent to the point 86a.

Abstract: A process and a device for easily and rapidly producing a metal sample for analysis for determining the content of impurities in a molten metal with high accuracy. More particularly, according to the metal sample production process, a metal sample for high accuracy analysis is produced by solidifying a collected molten metal without segregating impurities contained in a molten metal, by rapidly cooling a collected molten metal using a metal sample production device having a thin-walled mold having a thin sample collection space for collecting a molten metal, and an opening/closing operation part with which the mold can be freely opened/closed.

Abstract: A method is provided for connecting an integrated circuit to a surface of a printed wiring board. The integrated circuit includes lead contacts and leadless contact pads. A first solder paste is applied to the leadless contact pads of the integrated circuit, and preformed conductive pieces are placed on the first solder paste. The preformed conductive pieces are slugs that have, for example, a cylindrical shape or a rectangular cross-section. The preformed conductive pieces are heated and brought into electrical contact with the leadless contact pads. The lead contacts are formed into gull wings. The bases of the preformed conductive pieces are generally aligned in a plane, and the bases of the gull wings are substantially coplanar with the plane such that they collectively generally define a contact plane.

Abstract: Methods and apparatus for improving wave soldering processes by measuring and controlling the amount of residual oxygen present in the soldering tank and thereby avoiding excess dross formation. The methods and apparatus utilize a glass plate with ports to support sensors, e.g. oxygen sensors to both protect the solder bath from contact with air and to measure the oxygen levels associated with the solder bath.

Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

Abstract: A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring.

Abstract: A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface.

Abstract: Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool.

Abstract: A method for raising a demagnetization temperature of a permanent magnet is disclosed. The method provides a ferromagnetic arrangement around the magnet to increase demagnetization thresholds for the duration of soldering, or any other process requiring high temperatures. Using the method disclosed, it is possible to apply high levels of heat directly to permanent magnets without demagnetization, and more particularly to create permanent magnetic assemblies fit for any environment.

Abstract: An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.

Abstract: An inspection method of determining the bonded status of a wire ball bonded to a pad of a semiconductor chip is provided. An image of the bonding position between the pad and the ball is taken by an image-taking unit for detection of an in focus height of the pad, in focus height of an upper surface of the bonded ball, an external diameter of the bonded ball, and a ball bonded point respectively while switching a color of a coaxial illuminating light depending on the specific position for the inspection. Blue light can be used in the detection of the pad and an external diameter of the bonded ball while red or yellow light is used for detecting an upper surface of the bonded ball and the ball bonded point.

Abstract: The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

Abstract: The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface.

Abstract: To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.

Abstract: A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).

Abstract: This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face 25 opposed to a joining tool plunging face 24 and the ultrasonic wave reflected from the joined object 20 is taken in. In this case, the joining region 21 and the joining strength is estimated by observing a reflected wave of the ultrasonic wave in the vicinity of a position, along a reference direction Z, corresponding to an interface 27 of two joining members, without using the reflected wave of the ultrasonic wave reflected from the joining tool plunging face, thereby inspecting the joined object based on the estimation result.

Abstract: In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.

Abstract: Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.

Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.