Abstract: An ultrasonic welding system includes a movable ultrasonic welding stack for applying vibrational energy to a workpiece. A motion control system controls the motion of the ultrasonic welding stack and one or more sensors sense a control variable and output a corresponding control signal. A controller provides control inputs, based on the control signal, to the motion control system and causes, following initiation of a welding operation, an automatic change of speed of motion of the ultrasonic welding stack. The automatic change of the speed is a function of at least one control variable until the control variable reaches a predetermined value.

Abstract: An ultrasonic welding system includes an ultrasonic welding stack that is movable to initiated a welding operation. A plurality of sensors measure respective control variables and output control signals corresponding, respectively, to the control variables. A motion control system is coupled to and causes controlled movement of the welding stack, including initiating the welding operation. The motion control system determines, based on the control signals, control inputs such that any motion of the welding stack, subsequent to the initiating, is initially delayed until the control signals satisfy a predetermined condition. In response to the predetermined condition being satisfied, the motion control system causes the welding stack to move in accordance with a weld profile.

Abstract: A vibration welding system and method having an operating vibration frequency of 260 Hz or higher. A pressing action between two workpieces is effected by directly controlling, with a control system and a sensor, the relative positions of the workpieces during some or all of the weld cycle, or by controlling the speed between the workpieces during some phase of the weld cycle and controlling the force between the workpieces during other phases. An external control device can be coupled to a control system, to produce an input signal to adjust the speed of relative motion between the workpieces, the force therebetween, or both speed and force based on the input signal.

Abstract: It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250).

Abstract: An ultrasonic welding system includes a motion control system that is coupled to and that causes controlled movement of an ultrasonic welding stack, in accordance with control inputs that are based on one or more control signals that are received from one or more sensors. The motion control system initiates a welding operation, subsequent to which an initial motion delay occurs until a predetermined condition is satisfied. Subsequently, in response to the predetermined condition being satisfied, the ultrasonic welding stack is caused to move in accordance with a weld profile. Subsequently, in response to an occurrence of a predetermined delay initiating condition, the ultrasonic welding stack is caused to stop motion and to maintain a stationary position. Subsequently, in response to an occurrence of a predetermined delay terminating condition, motion of the ultrasonic welding stack is resumed in accordance with the weld profile.

Abstract: Ni base superalloy components containing relatively large amounts of Al and Ti are known to be difficult to build up by a weld build up process without cracking. As the Al and Ti content of the superalloy is increased to improve the strength, the susceptibility to cracking is increased. It is shown herein that reducing the ?? phase in the additive built up material improves robustness against cracking. A stepwise, controlled heating and cooling process is described to be used in cooperation with an additive build up process to reduce the ?? present and thereby reduce cracking.

Abstract: A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors.

Abstract: An ultrasonic welding system includes a movable ultrasonic welding stack, an electrically powered linear actuator with a servo motor and a movable element, a controller, and at least two sensors. The controller causes the ultrasonic welding stack to apply a predetermined positive initial force to at least one workpiece prior to initiation of welding. The controller further causes the ultrasonic welding stack to initiate subsequent movement of the ultrasonic welding stack, following initiation of welding, only after the signal outputs from the at least two sensors indicate that a combination of control variables satisfies a predetermined condition.

Abstract: A non-volatile storage system includes non-volatile storage elements and one or more managing circuits in communication with the non-volatile storage elements. The non-volatile storage elements are arranged in blocks including a first block reserved for system use and a second block. The first block stores a pre-determined data pattern that was written to the first block subsequent to system testing and prior to completion of manufacturing of the non-volatile storage system. Subsequent to completion of manufacturing of the non-volatile storage system, the one or more managing circuits sense information stored in the first block and determine an error metric for the sensed information with respect to the pre-determined data pattern. The one or more managing circuits determine that the system experienced an IR reflow process if the error metric was determined to satisfy the threshold.

Abstract: In an embodiment, a method of forming an abrasive element is disclosed. The method includes sintering a powder mixture including a plurality of superabrasive particles, a plurality of sp2-carbon-containing particles, and a metallic constituent to form the abrasive element.

Abstract: A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.

Abstract: A method for simulating friction stir welding is provided. The method may include restraining first and second parts in a fixture. The method may also include axially forcing a non-rotating friction stir welding tool against a joint between the parts. Thereafter one or more resultant parameters may be measured, such as displacement of the first part, the second parts, and/or the fixture. The resultant parameters may also include the force applied to the first part, the second parts, and/or the fixture. Thereby, movement of the parts and fixture that may occur during friction stir welding may be simulated without actually completing a welding operation. A related system and computer program product are also provided.

Abstract: A controller for a welding system adapted to determine a value of a weld secondary parameter across a weld secondary component based on a sensed parameter is provided. The controller may also be adapted to compare the determined value to a reference value range and to alert a user to a presence and location of a weld secondary error when the determined value is outside the referenced value range.

Abstract: A chip includes a substrate and a dielectric layer disposed on the substrate. The dielectric layer includes a first dielectric region and a second dielectric region surrounding an outer periphery of the first dielectric region. A top surface of the first dielectric region is disposed below a top surface of the second dielectric region. The chip further includes a metal pad disposed in a through-hole in the first dielectric region and contacting a portion of the substrate.

Abstract: Methods of forming earth-boring tools include using a plasma spray device to gouge at least one recess through a hardfacing material and into a body. At least a portion of the recess may define a cutting element pocket in which a cutting element may be received and bonded. The recess formed using the plasma spray device optionally may be further machined to form the cutting element pocket. Earth-boring tools are fabricated using such methods.

Abstract: Techniques are provided to improve the performance and accuracy of landmark point detection using a Constrained Local Model. The accuracy of feature filters used by the model may be improved by supplying positive and negative sets of image data from training image regions of varying shapes and sizes to a linear support vector machine training algorithm. The size and shape of regions within which a feature filter is to be applied may be determined based on a variance in training image data for a landmark point with which the feature filter is associated. A sample image may be normalized and a confidence map generated for each landmark point by applying the feature filters as a convolution on the normalized image. A vector flow map may be pre-computed to improve the efficiency with which a mean landmark point is adjusted toward a corresponding landmark point in a sample image.

Abstract: Coiled tubing is provided with one or more conduits passing through and secured to an inner wall of the coiled tubing. The conduits are resistant to annealing temperatures and therefore are welded to flat plate which is used for forming the coiled tubing or are retained in a groove formed in the inner wall of the coiled tubing. When the coiled tubing is formed by rolling the flat plate into a slit tubular and seam welding the longitudinal joint, the coiled tubing and the heat resistant conduits are annealed. The conduit can be wireline, electric line, cable or an empty tubular, all of which are resistant to the annealing temperatures. The empty tubular can be used to retain a secondary conduit such as heat labile fiber optic cable which is run into the empty tubular, such as by pumping or floating, after the annealing process.

Abstract: An ultrasonic welding system includes a motion control system that is coupled to and that causes controlled movement of an ultrasonic welding stack, in accordance with control inputs that are based on one or more control signals that are received from one or more sensors. The motion control system initiates a welding operation, subsequent to which an initial motion delay occurs until a predetermined condition is satisfied. Subsequently, in response to the predetermined condition being satisfied, the ultrasonic welding stack is caused to move in accordance with a weld profile. Subsequently, in response to an occurrence of a predetermined delay initiating condition, the ultrasonic welding stack is caused to stop motion and to maintain a stationary position. Subsequently, in response to an occurrence of a predetermined delay terminating condition, motion of the ultrasonic welding stack is resumed in accordance with the weld profile.

Abstract: Beam soldering involves using a beam of light emitted from a source to reflow adjoining pairs of solder pads on components being joined. In some scenarios, material between adjacent solder pads on at least one of the components is absorptive of a certain spectrum of light and, consequently, can be damaged by such spectrum of light. A beam soldering tool is configured with a filter through which the light from the light source travels to a plurality of adjoining pairs of solder pads. The filter filters out a certain spectrum of light which could otherwise be damaging to material between adjacent solder pads.

Abstract: A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.

Abstract: According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.

Abstract: To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Abstract: A turbine rotor for a supercharger includes a TiAl turbine wheel and a carbon steel shaft joined to each other via an Ni brazing filler metal at a brazed part distanced from a back face of the turbine wheel so that a turbine wheel outer diameter ratio calculated by “a distance from the back face of the turbine wheel to the brazed part”/“an outer diameter of the turbine wheel” is within a range of from 7 to 10%.

Abstract: A method for semi-automatically reconditioning a railcar articulated connector that comprises a male portion including a parent casting material is provided. The method comprises applying weld material to a male portion of an articulated connector, mounting a housing mounting a housing defining an interior space to the male portion, the male connector within the interior space, centering and stabilizing the fixture laterally on the male portion, inserting a clamping mechanism attached to the housing within an opening of the male connector to affix the housing to the male portion, securing the clamping mechanism to a surface of the male portion, and automatically machining at least a portion of the weld and/or parent casting material.

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract: A system includes host and learning machines. Each machine has a processor in electrical communication with at least one sensor. Instructions for predicting a binary quality status of an item of interest during a repeatable process are recorded in memory. The binary quality status includes passing and failing binary classes. The learning machine receives signals from the at least one sensor and identifies candidate features. Features are extracted from the candidate features, each more predictive of the binary quality status. The extracted features are mapped to a dimensional space having a number of dimensions proportional to the number of extracted features. The dimensional space includes most of the passing class and excludes at least 90 percent of the failing class. Received signals are compared to the boundaries of the recorded dimensional space to predict, in real time, the binary quality status of a subsequent item of interest.

Abstract: Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate.

Abstract: A wire bonded electrical interconnection includes a first electrical contact, a second electrical contact, and a bond wire having a first end bonded to the first electrical contact, a second end bonded to the second electrical contact, and a central portion connecting the first and second ends. The central portion includes notches formed during a wire bonding process, with each notch having at least two corners.

Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.

Abstract: A method of performing a wire bonding operation is provided. The method includes the steps of: (a) performing a wire bonding operation between a portion of wire and a bonding location using a bonding tool; (b) raising the bonding tool to a desired height; (c) performing a test to determine if the portion of wire is sufficiently bonded to the bonding location; and (d) automatically performing another wire bonding operation between the portion of wire and the bonding location using the bonding tool if, during step (c), it is determined that the portion of wire was not sufficiently bonded to the bonding location in step (a).

Abstract: Various methods of mounting semiconductor chips on a substrate are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first plurality of solder interconnect structures to a first semiconductor chip. The first solder interconnect structures have a first melting point. The first semiconductor chip may be tested. If the first semiconductor chip passes the testing, then a second semiconductor chip is coupled to the first semiconductor chip using a second plurality of solder interconnect structures that have a second melting point lower than the first melting point.

Abstract: A wire bonding method in a circuit device mounted on a lead frame, the wire bonding method including: counting a stop time if an operation of a capillary stops; removing a contaminated free air ball (FAB) formed on an end of the capillary if the stop time exceeds a reference time; forming a new FAB; and restarting a wire bonding process.

Abstract: A welding device for a mask frame assembly, includes a chamber maintained in a vacuum state, a mask frame disposed in the chamber, a support frame disposed in the chamber and configured to support the mask frame, a mask disposed in the chamber and configured to be welded to the mask frame, a tensile unit disposed in the chamber, installed on the support frame and configured to apply a tensile force to stretch the mask; and a welding unit disposed in the chamber and configured to weld the mask frame and the mask to each other.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: A method of repairing a metallic component is disclosed. The method may include machining away a damaged first portion of the component, and machining away a second portion of the component adjacent the damaged first portion, the second portion being an area that would be subject to distortion resulting from solidification of molten weld material added to repair the damaged first portion. The method may also include inserting a dam made of a high-temperature-resistant material adjacent the machined away second portion to contain molten weld material added to the machined away second portion. Oxy-fuel welding may be performed to at least partially fill the machined away damaged first portion of the component and the machined away second portion of the component, and final machining of the welded portions may be performed.

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.

Abstract: Systems and method for controlling the flow and dissipation of thermal energy away from a weld between two components are provided. in one example embodiment, a structure may comprise a protrusion; a first component thermally coupled to the protrusion; a second component having a lower heat dissipation rate than the first component; a weld formed using a welding process to couple the protrusion to the second component, wherein the welding process generates thermal energy; and wherein the first component in combination with the protrusion dissipates the thermal energy from the welding process at about an equivalent rate as the second component.

Abstract: Methods for joining material to an article comprising one or more passageways include fluidly connecting a temperature controlled fluid source comprising temperature controlled fluid to at least one passageway and passing the temperature controlled fluid through the at least one passageway, wherein the temperature controlled fluid at least partially controls a temperature profile of the article. The methods further include joining material to the article, wherein the temperature profile of the article at least partially controls a resulting joined material characteristic.

Abstract: A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.

Abstract: The disclosed manufacture method for a length of tubing can produce a length of fatigue resistant tubing that has relatively high fatigue resistance and relatively low strip-to-strip welding length. The Fatigue resistance is calculated from experimental settings with controlled parameters and/or simulations reproducing similar material properties and loading conditions. A high fatigue resistance means certain product characteristics (e.g., low plasticization, low hydrostatic stress levels and free of imperfections welds) can be retained with an adequate bias weld design at low values after a specific test number of cyclic loading. The relatively low strip-to-strip welding length is an advantage for reducing probabilities of having cracks initiated and/or propagated at weld locations, where imperfections and localized differences of mechanical properties commonly cause failure. Low strip-to-strip welding length can also reduce the costs for welding.

Abstract: Methods of screening a polycrystalline diamond element for suitability for electrical discharge machining (“EDM”). The method includes providing a PCD element including a plurality of bonded diamond grains, determining at least one characteristic of the PCD table correlated to electrical conductivity of the PCD element, and EDM the PCD element if the value of the at least one characteristic correlates to an electrical conductivity above a threshold value.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A method of manufacturing a vehicle frame assembly, includes: (i) receiving threshold temperature data for an adhesive; (ii) defining an adhesive zone wherein which adhesive will be applied with respect to a first and second vehicle structural member; and (iii) determining a minimum distance a weld can be applied on the first structural member with respect to the adhesive zone based on empirical data.

Abstract: A thermocompression bonding method for mounting semiconductor chips on a substrate comprises: picking up the semiconductor chip with a chip gripper displaceably mounted on a TC bonding head; positioning of the chip gripper above the assigned substrate location; lowering the TC bonding head up to a position in which the chip gripper is deflected by a predetermined distance relative to the TC bonding head; heating of the semiconductor chip to a temperature above the melting point of the solder, so that the deflection of the chip gripper becomes zero again; waiting until the temperature of the semiconductor chip has fallen to a value beneath the melting temperature of the solder, and lifting of the TC bonding head.

Abstract: A system includes host and learning machines in electrical communication with sensors positioned with respect to an item of interest, e.g., a weld, and memory. The host executes instructions from memory to predict a binary quality status of the item. The learning machine receives signals from the sensor(s), identifies candidate features, and extracts features from the candidates that are more predictive of the binary quality status relative to other candidate features. The learning machine maps the extracted features to a dimensional space that includes most of the items from a passing binary class and excludes all or most of the items from a failing binary class. The host also compares the received signals for a subsequent item of interest to the dimensional space to thereby predict, in real time, the binary quality status of the subsequent item of interest.

Abstract: A system and method for repairing and/or joining together multiple lengths of tubulars using friction stir joining, and a system for manipulating the tubular so that friction stir joining may be performed while the tubular is on a reel and/or at a field site.

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.

Abstract: In a bobbin tool including a first shoulder surface which comes into contact with a front surface of a subject work piece, a second shoulder surface which is disposed so as to face the first shoulder surface and comes into contact with a rear surface of the work piece, and a shaft portion which connects the first shoulder surface and the second shoulder surface to each other with a gap therebetween fixed, the first shoulder surface and the second shoulder surface are provided with a first vortex groove and a second vortex groove which extend toward the front side of a tool rotation direction so as to be opened to the outer peripheral edge as it moves to the outer peripheral side.

Abstract: The invention described herein generally pertains to a system and method for detecting a moisture with a flux used in a welding process. A sensor is employed with a flux source that supplies a welding operation or process in which the sensor detects a moisture level with a flux within the flux source. A monitor component is configured to receive or aggregate data from the sensor, wherein the data relates to the moisture level associated with a flux supply or a portion of flux.