Abstract: A solder joint and method of soldering are disclosed. Formation is controlled of atomic vacancies in a surface layer of a component to be soldered. Diffusion of the atomic vacancies during soldering is controlled. Vacancy formation may be controlled using a low current density during surface layer creation. Diffusion may be controlled by controlling layer thickness and soldering temperature.

Abstract: A case assembly includes a plurality of segments, at least one braze joint, and one or more welds. The braze joint connects the plurality of segments together and the one or more welds extend across adjacent segments.

Abstract: A wire bonding method for bonding a ball 11 which is formed at a tip end of a bonding wire to a pad 2 that is a first bond point to form a first bonding part 12 and bonding the wire 10 to an interconnect wiring 4 that is a second bond point to form a second bonding part, thus connecting the pad 2 and the interconnect wiring with the wire, wherein after the ball is bonded to the first bond point and a capillary 6 is ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bond point is found, then the capillary is caused to descend to execute bonding to bond the first bonding part to the first bond point.

Abstract: A method for non-destructive testing of open hollow components for tightness supplies a gas under pressure into the component and cools the component in a punctiform manner. Detecting a leak out of the component using a thermographic camera and using a computer connected downstream of the thermographic camera to visualise the leak, follows. The precise location of each leak is thus detected.

Abstract: A vibration welding system includes an anvil, a welding horn, a thin film sensor, and a process controller. The anvil and horn include working surfaces that contact a work piece during the welding process. The sensor measures a control value at the working surface. The measured control value is transmitted to the controller, which controls the system in part using the measured control value. The thin film sensor may include a plurality of thermopiles and thermocouples which collectively measure temperature and heat flux at the working surface. A method includes providing a welder device with a slot adjacent to a working surface of the welder device, inserting the thin film sensor into the slot, and using the sensor to measure a control value at the working surface. A process controller then controls the vibration welding system in part using the measured control value.

Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.

Abstract: Arc welding simulations that provide simulation of virtual destructive and non-destructive testing and inspection of virtual weldments for training purposes. The virtual testing simulations may be performed on virtual weldments created using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system). The virtual inspection simulations may be performed on “pre-canned” (i.e. pre-defined) virtual weldments or using virtual weldments created using a virtual reality welding simulator system. In general, virtual testing may be performed using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system), and virtual inspection may be performed using a standalone virtual weldment inspection (VWI) system or using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system).

Abstract: For selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate, one or more indentations are made onto at least one bond pad of the substrate with an indentation tool by applying a series of predetermined forces onto the at least one bond pad with the indentation tool. A depth-force profile of the substrate is measured comprising a relationship between each predetermined force that is applied and a resultant depth of the indentation made by the indentation tool. An appropriate set of bonding parameters suitable for forming wire bonds on the substrate is determined based on the measured depth-force profile.

Abstract: The invention utilizes vibration control, precision manufacturing tolerances for certain components of the system, and techniques for limiting thermal expansion of components, including passive insulation and active cooling techniques, in order to enable high speed tool rotation for Friction Stir Spot Joining of Advanced High Strength Steels.

Abstract: To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.

Abstract: A method for manufacturing a vehicle power transmission device having a case and a ring gear fitted to the outer peripheral surface of the case to transmit drive power from a drive source. The method includes: a welding step in which an annular flange is provided on the case or the ring gear and butt welding is performed by lapping a weld bead along the contact portion of one side surface of the annular flange and the case or the ring gear; a measurement step in which the outline of the other side surface of the annular flange placed in close proximity to the one side surface are measured; and an evaluation step in which a weld condition is evaluated based on part of the outline, which is determined in the measurement step, of a portion corresponding to the lapping portion of the weld bead.

Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

Abstract: A method for friction stir welding is provided. The method may include determining the temperature of one or both parts being welded. The parts may then be heated to a desired temperature and then friction stir welded together. By preheating the parts, the friction required to plasticize the parts during welding may be reduced. Thereby, the rotational speed of the friction stir welding tool may be reduced, and thus the tool life may be extended without decreasing the rate at which welds are created. Additionally, the cooling rate of the weld may be regulated with a thermal control device.

Abstract: A system for inspecting a free air ball (FAB) formed during a wire bonding process includes a torch for forming a FAB at a tip of a bonding wire held by a capillary. A camera is positioned near the FAB formation location and captures a color image of the FAB. A ball formation monitor inspects the image to determine a composition of an outer surface of the FAB and inhibits bonding of the FAB to a contact element based on a result of the inspecting. The system is particularly useful for bonding Copper wire plated with Palladium, where bonding of the FAB to the contact element is inhibited if the Copper is exposed.

Abstract: A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics. The laminate substrate is placed into a fixture with a correction to shape the laminate substrate based on the warpage characteristics. The laminate substrate is fluxed. A chip is placed onto the laminate substrate. The fixture is placed into a reflow furnace to join the chip and the laminate substrate. The fixture is removed from the reflow furnace. A warpage measurement is performed on the joined chip and laminate substrate. The correction may be modified if shorts are observed at the chip site.

Abstract: A friction stir welding method in which a welding tool rotating around an axis is pressed against a welding target portion of workpieces supported by a backing member so that frictional heat is generated and the friction heat softens the welding target portion. The welding tool is at least partially inserted into the softened welding target portion and stirs the softened welding target portion so that the welding target portion is stir welded in a solid phase state. The friction stir welding method includes detecting a temperature of a temperature measurement point provided in the backing member, and calculating an estimated temperature of the welding tool from the detected temperature of the temperature measurement point, based on a predefined correlation between a temperature of the welding tool and a temperature of the backing member.

Abstract: A method for friction stir welding is provided. The method may include beginning a friction stir welding operation by directing a rotating friction stir welding tool along a joint between two parts. A temperature of the resulting weld may be measured. Thereby, a controller may adjust process parameters associated with the friction stir welding process to decrease a difference between desired and measured temperatures of the weld. The desired temperature may correspond to a temperature at which the parts are plasticized. The process parameters may include rotational speed of the friction stir welding tool, feed rate, axial force along the length of the friction stir welding tool, and tilt angle of the friction stir welding tool.

Abstract: A method by which the amount of nickel contained in an alloy having a composition represented by Sn—X—Ni can be regulated. The method of nickel concentration regulation comprises adding phosphorus to Sn—X—Ni in a molten state (wherein X is one or more elements selected from the group consisting of Ag, Zn, Cu, Bi, Au, Ti, Ge, Ga, Si, and Ce), holding the mixture at 250-400° C., and removing the resultant dross floating on the surface of the liquid phase and containing a P—Ni compound and a P—Sn—Ni compound. An example of X is copper, and the content thereof may be 0.3-5 wt %. The phosphorus may be added in the state of a Sn—P alloy. The upper limit of the amount of the phosphorus to be added may be about half the nickel amount in terms of atomic amount.

Abstract: Methods, devices, and systems for providing certification of friction stir welds are disclosed. A sensor is used to collect information related to a friction stir weld. Data from the sensor is compared to threshold values provided by an extrinsic standard setting organizations using a certification engine. The certification engine subsequently produces a report on the certification status of the weld.

Abstract: A course of a position of a positioning device is determined as a laser beam welds a workpiece at a focus area of the laser beam. The positioning device is configured to position the focus area of a laser beam on a workpiece such that a joint is formed on the workpiece. A course of the joint on the workpiece from the determined course of the position of the positioning device is estimated, and a deviation between the determined course of the position of the positioning device and the estimated course of the joint on the workpiece is calculated. The deviation represents a parameter related to the precision of the seam position control.

Abstract: An electric soldering iron includes a soldering iron head, a sensor, a control unit, an air suction fan, a filtering unit, and an output unit. The control unit is connected to the sensor, the air suction fan, the filtering unit, and the output unit. The air suction fan is connected to the output unit through the filtering unit. The soldering iron head can be used to melt rosin and solder. When the sensor detects there is smoke near the soldering iron head, the sensor outputs a signal to the control unit. The control unit controls the air suction fan, the filtering unit, and the output unit to operate according to the signal. The air suction fan draws the smoke in and outputs the smoke to the filtering unit. The filtering unit filters harmful ingredients from the smoke. The output unit outputs the filtered smoke.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface.

Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.

Abstract: A coupler body for a railcar coupler, said coupler body comprising at least one central datum feature that does not wear during coupler use.

Abstract: A metal joining system having a first burner assembly configured to selectively heat a first zone and an assembly support at least partially vertically lower than at least a portion of the first heat zone and a first hood vertically above at least a portion of the assembly support.

Abstract: A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid.

Abstract: A method for monitoring free air ball (FAB) formation during a wire bonding process includes attaching a dummy bond wire to an unused location on a first surface of a semiconductor chip carrier, extending the dummy bond wire a predetermined distance from the first surface such that a tip of the dummy bond wire is spaced from the first surface, and forming a dummy FAB at the tip of the bond wire. A profile of the dummy FAB is inspected with an imaging unit to identify any defects in the dummy FAB. An alarm is triggered and the wire bonding process is halted if the dummy FAB is defective so that bonding parameters may be adjusted. The wire bonding process is restarted after the bonding parameters have been adjusted.

Abstract: A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.

Abstract: A dielectric device has a first conductor and a dielectric disposed thereon. An intermediate region is formed between the first conductor and dielectric. In the intermediate region, an additive different from the first conductor and dielectric and the dielectric are mixed with each other. The additive contains at least one element of Si, Al, P, Mg, Mn, Y, V, Mo, Co, Nb, Fe, and Cr.

Abstract: A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

Abstract: A package-on-package arrangement for maintaining die alignment during a reflow operation is provided. A first top die has a first arrangement of solder bumps. A bottom package has a first electrical arrangement to electrically connect to the first arrangement of solder bumps. A die carrier has a plurality of mounting regions defined on its bottom surface, wherein the first top die is adhered to the die carrier at a first of the plurality of mounting regions. One of a second top die and a dummy die having a second arrangement of solder bumps is also fixed to the die carrier at a second of the plurality of mounting regions of the die carrier. The first and second arrangements of solder bumps are symmetric to one another, therein balancing a surface tension during a reflow operation, and generally fixing an orientation of the die carrier with respect to the bottom package.

Abstract: An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: The invention relates to a method of displaying and monitoring the profile of a weld bead (4), in which, placed inside the groove, there is an assembly (10) comprising, facing one another, an image acquisition means (11), a light source (12), the beam of which is directed towards said image acquisition means, and, between the image acquisition means and the light source, a mask (13); the optical axis of the image acquisition means (11) is oriented so as to be approximately parallel to the sidewalls (5, 6) of the groove (3); a light beam produced by the light source (12) is directed towards the mask (13) and the image acquisition means (11); a central shadow zone and a peripheral halo are formed by means of the light beam and the mask (13), said halo illuminating, approximately perpendicularly, the weld bead (4) and the sidewalls (5, 6); the profile of the weld bead (4) and the sidewalls (5, 6) are displayed on a display/monitoring means; and said assembly (10) is moved inside the groove (3) longitudinally and

Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

Abstract: A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.

Abstract: Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.

Abstract: A tool welding system is disclosed that includes a table that heats a tool. A multi-axis robot includes a welding head that is moved relative to the table in response to a command. A controller is in communication with the robot and generates the command in response to welding parameters. The weld parameters are based upon a difference between an initial tool shape and a desired tool shape. The difference between the initial tool shape and the desired tool shape corresponds to a desired weld shape. The desired weld shape is adjusted based upon initial tool shape variations, which includes thermal growth of the tool. The tool is welded to provide the desired weld shape to achieve a desired tool shape.

Abstract: A device for cooling a rail weld zone according to the invention includes a first cooler cooling a head portion of the rail weld zone, a second cooler cooling a rail web portion of the rail weld zone, and a control section controlling the first and second coolers. The first cooler includes a first temperature detecting section that detects the temperature of the head portion, and a first ejection section that ejects a first cooling fluid to the head portion. The second cooler includes a second temperature detecting section that detects the temperature of the rail web portion, and a second ejection section that ejects a second cooling fluid to the rail web portion. The control section individually changes the kinds, the flow rates, and the flow velocities of the first and second cooling fluids while cooling the head portion and the rail web portion.

Abstract: Described herein is a method that can be used for heat treating a metal in at least one of the following processes: carburizing, carbonitriding, nitrocarburizing, and neutral carbon potential annealing operations that are used in a 1 atmosphere pressure furnace and in an atmosphere that is oxygen free and comprises nitrogen and at least one hydrocarbon.

Abstract: A soldering flux composition comprising: (i) a carrier vehicle comprising a solvent; (ii) an activator component for activating a metal surface for soldering; (iii) a color-imparting component with an appropriate color to facilitate optical detection of flux on the fluxed component; and optionally (iv) a gelling component to control flux rheology. The color-imparting component is utilized to indicate the presence of desired amounts of flux. A component with inadequate flux for reliable soldering can be rejected.

Abstract: A transfer process for bonding a solderable device to a solderable firsl substrate having a first oxidized surface comprises placing the solderable device proximate to the first substrate in a reducing chamber, where the first surface cannot be visually observed. We place a second substrate having a second oxidized surface in the chamber in a way to visually observe the second surface. Selecting the first substrate and the second substrate so that the reduction of the second surface correlates with the reduction of the first surface provides an indication of the degree of reduction of the first surface. Introducing a reducing agent into the chamber under reducing conditions reduces the surfaces which we track by irradiating and observing the second surface; evaluate any change in the second surface during irradiation and correlate the change with first surface reduction. When sufficiently reduced, we solder the first substrate to the device.

Abstract: A method of determining the quality of a friction weld between two components, the method comprising joining two components together using a friction welding process, measuring the loss of length of the components as a function of time during the friction welding process, determining the double differential with respect to time of the loss in length of the components as a function of time, determining the quality of the friction weld by calculating the R2 value of the linear fit to the loss in length of the components as a function of time over a defined time period, determining the end of the defined time period by identifying the start of the final positive peak of the double differential with respect to time of the loss of length of the components as a function of time, calculating R2 from the least square difference of the linear fit over the defined time period of the loss of length of the components as a function of time and comparing the calculated value of R2 with acceptable values of R2 to determine

Abstract: Components for use in vacuum electron devices are fabricated from highly oriented pyrolytic graphite (HOPG) and exhibit excellent thermal conductivity, low sputtering rates, and low ion erosion rates as compared to conventional components made from copper or molybdenum. HOPG can be reliably brazed by carefully controlling tolerances, calculating braze joint material volume, and applying appropriate compression during furnace operations. The resulting components exhibit superior thermal performance and enhanced resistance to ion erosion and pitting.

Abstract: The electronic component mounting line includes a computing unit for calculating a print position of solder paste printed on board-side electrodes, an electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, a placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, a bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and a mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.

Abstract: A device using the live welding method for aluminum electrolytic cell overhauling under series full current consists of short-circuit buses at the bottom of the cell (1), pillar buses (2), an anode bus (3), a balance bus (4), a inter-cell standby bus (5), a door-shaped pillar clamp (6), an arcuate clamp (7) of anode buses, a current conversion switch (8, a mechanical switching device (9) for the short-circuit port, a voltage sensor and wires thereof (10), a temperature sensor and wires thereof (11), a system (12) for data acquiring, displaying, analyzing and alarming, an A-side welding area (13), a B-side welding area (14) and compression-joint points (15) on pillar soft belts of overhauling cells; and the live welding method comprises the following steps: when welding is required to be performed in some zone, the currents of short-circuit buses at the bottom of the cell (1) and pillar buses (2) which influence the welding area most are cut off, the serial currents are shunted to other pillar buses (2), other

Abstract: A system for automated assembly and welding is disclosed. The system includes a pallet for receiving incoming workpieces; a workpiece holder having a plurality of electromagnets; a handling robot configured to transport incoming workpieces from the pallet to the workpiece holder; and a controller in communication with the workpiece holder and the handling robot. The controller is configured to determine an orientation of a workpiece positioned on the workpiece holder, and to selectively adjust an activation state of one or more electromagnets of the workpiece holder based upon the orientation of the workpiece. A method of assembling and welding workpieces is also disclosed.

Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.