Abstract: A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially positioned, either manually or automatically, near a target weld path with the aid of the fiber optic device. The flexible articulate tubular device is then more precisely articulated to direct the terminus along the target weld path, with the aid of the heat sensors. As such, the flexible articulate tubular device operates in a heat seeking manner to follow the weld bead. Ultimately, a gaseous flux is supplied along the flexible articulate tubular device and toward the target weld path, so as to blast the weld bead with an anti-oxidation shield gas and thereby protect the weld.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: Solder is connected to the electrodes of the circuit board by using a temperature profile with a constant fusion temperature, a connection interface strength evaluation test is carried out on the soldered joints to obtain an appropriate reflow range free of decreases in the strength at the connection interface. On the basis of the appropriate reflow range obtained and using as the basis the chemical compound thickness which is determined uniquely by heat load, an appropriate reflow range in an optional temperature profile with one temperature peak is obtained. By carrying out connection in this appropriate reflow range, soldered joints can be obtained without decreases in the connection interface strength in the large-scale production stage.

Abstract: The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtaining luminance variations at an edge portion of the pad in each taken image to determine an in-focus height of the pad based on an image taking height position at which the taken image has the largest luminance variation at the edge portion of the pad; obtaining luminance variations on an upper surface of the ball in each taken image to determine an in-focus height of the upper surface of the ball based on an image taking height position at which the taken image has the largest luminance variation on the upper surface of the ball; and calculating the thickness of the ball by finding a difference between the obtained in-focus heights of the pad and the upper surface of the ball.

Abstract: The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by mounting a first electronic part 11 and a second electronic part 12 each having a solder bump in its bottom plane on a substrate 3 in stacked plural levels, after the first electronic part 11 is mounted on the substrate 3 that has been fed with solder, the solder bump 18 of the second electronic part 12 is mounted on the electrode 17 provided on the upper plane of the first electronic part 11, and thereafter the substrate 3 is heated in a reflow step to solder-bond the first electronic part 11 to substrate 3 along with solder-bonding the second electronic part 12 to the first electronic part 11. By such process, a stacked structure can be applied to a wide variety of electronic parts at a low cost.

Abstract: A computing environment is provided with the ability to at least contribute to generate a representation for a weld bead to be used to weld a number of components of an article of manufacture together at one or more edges of the components in the manufacturing of the article outside the computing environment, including the ability to generate an initial set of one or more data representations of an initial set of one or more wire bodies based on one or more data representations of the one or more edges respectively to synthesize one or more corresponding wire bodies for the one or more edges, and the ability to generate a final data representation of a final wire body based on the initial set of one or more data representations of the initial set of one or more wire bodies of the one or more edges.

Abstract: The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements. The visual assessment takes place by means of a video camera and a computing device connected to the video camera. The assessment criteria for the soldered joints are stored in the computing device. The invention also relates to an apparatus for carrying out the method.

Abstract: A welding apparatus includes a workpiece housing having a window therethrough and having a welding access therethrough for a welder to an interior of the workpiece housing. The workpiece housing is metallic with a heat insulation on an internal surface thereof. A lamp heat source is directed through the window and at the workpiece in the interior of the workpiece housing. A gas source delivers a controllable flow of a shielding gas to the interior of the workpiece housing. A temperature sensor senses a temperature of the workpiece within the interior of the workpiece housing. A feedback controller controls the power to the lamp heat source responsive to the temperature of the workpiece. To perform welding, the workpiece is placed into the interior of the workpiece housing so as to have its temperature sensed by the temperature sensor, and the gas source is operated to envelope the workpiece in the shielding gas.

Abstract: A system and method for assessing the quality of spot weld joints between pieces of metal includes an ultrasound transducer probing a spot weld joint. The ultrasound transducer transmits ultrasonic radiation into the spot weld joint, receives corresponding echoes, and transforms the echoes into electrical signals. An image reconstructor connected to the ultrasound transducer transforms the electrical signals into numerical data representing an ultrasound image. A neural network connected to the image reconstructor analyzes the numerical data and an output system presents information representing the quality of the spot weld joint. The system is trained to assess the quality of spot weld joints by scanning a spot weld joint with an ultrasound transducer to produce the data set representing the joint; then physically deconstructing the joint to assess the joint quality.

Abstract: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

Abstract: A welding machine that includes a welding torch assembly, a first rotary head, a second rotary head, a fixture, a processor and a memory subsystem. The first rotary head is configured to receive and selectively retain a first end of a bar and a first link approximate the first end of the bar. The second rotary head is configured to receive and selectively retain a second end of the bar and a second link approximate the second end. The fixture is configured to receive and selectively retain a third link and the fixture is positioned between the first and second rotary heads. The processor is coupled to the welding torch assembly, the first and second rotary heads and the fixture, as well as the memory subsystem.

Abstract: A micro-optical train manufacturing process includes a step of characterizing the position of optical components on an optical bench, typically using a metrology system. These optical components are then aligned with respect to each other in a passive alignment step based on data from the metrology system and optical system design information. As a result, a subsequent active align process can be avoided in some situations, or if a subsequent active alignment process is performed, the time required for that active alignment process can be reduced because of this initial metrology-based passive alignment step.

Abstract: A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame having concentrically arranged an outer conductive test pad footprint, and an intermediate bond pad footprint. Conductive traces connect the bond pads individually to test pads and to ball grid array pads on the TAB tape within the confines of the bond pad footprint. Wire bonds connect input/output points of the die to the bond pads The die and the wire bonding are next overmolded with a plastic forming a cased integrated circuit module. Testing and burn-in of the module is achieved by connecting test probes to the test pads After the test and bum-in step, the integrated circuit module is cut free from the TAB tape frame for attachment to a PC board, via the ball grid array.

Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21, shielding lids 31, 32, and 33 are disposed at upper and lower parts of a ring illumination 25 and at a lower part of lens barrel 29. Shimmer 37 of nitrogen gas that blows out from a working hole 24 can thus be prevented from entering inside ring illumination 25, especially by shielding lid 31 at the lower part of ring illumination 25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the ?m order can be improved.

Abstract: The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This is done so that the strip can be welded to the side wall to add a course. It is the objective to ensure that the tank wall is plumb (vertical) and in radius (both as to curvature and relative to the center of the tank) and that the width of the gap is optimized, at the weld point. The machine comprises a ‘floating’ main frame or platform suspended on a mobile undercarriage by four pivotally mounted cylinders. The cylinders are independently responsive to instruments monitoring the elevation, levelness and plumbness of the tank wall and the width of the gap. The main frame carries the coil and carries the strip and the tank wall in the vicinity of the weld point.

Abstract: A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps: Placing the capillary at a side of the wire loop and next to the wedge bond, whereby the tip of the capillary is located below the level of the wire loop. Moving the capillary parallel to the surface of the substrate and orthogonally to the wire loop until the wedge bond tears away from the connection point or the wire breaks, and simultaneously measuring a signal that is a measure for a force exerted by the capillary on the wire loop, and Determining the maximum of the measured signal.

Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21 provided with recognition device, a shimmer prevention blow mechanism 31 is disposed between a ring illumination 25 and a working hole 24 and near working hole 24. Though the nitrogen gas that blows out from working hole 24 gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism 31. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the ?m order can be improved.

Abstract: In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.

Abstract: A wire bonder 50 in which light rays 66 that leave an object on a carrying stand 60 pass through a light path 80 that passes through a parallel flat plate and reach an imaging camera 70 as light rays 68. The light path 80 that passes through a parallel flat plate includes a half-mirror 82 disposed in the light path, a parallel flat plate 86, and a reflective mirror 88 which is disposed perpendicular to the optical axis of the light rays 96 that have passed through the parallel flat plate 86 and which performs a mirror reflection operation, in a plane perpendicular to the optical axis, on the light rays 96, so that the light rays again return to the parallel flat plate 86 as reflected light 98.

Abstract: A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defective soldering of the least one electronic part is tested by contacting a probe pin to various probe pin contact sections on the electronic circuit baseboard. During the step of soldering, the Pb excluded solder is also supplied to at least one of the various probe pin contact sections in order to suppress oxidation thereof.

Abstract: A bonding configuration structure for facilitating electrical testing in a bonding process and a testing method are provided. The bonding configuration includes a bonded component, a bonding component, a bond portion and a leading component. The bonding component is disposed on the bonded component. The bonding component has a first end and a second end. The first end is coupled to the bond portion. The second end is disposed on the bonded component to form the first testing portion.

Abstract: A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With each bond cycle, after attachment of the wire to the connection point, the capillary is moved out of the bond position in a predetermined horizontal direction whereby the current flowing through the drive which moves the capillary is monitored and its maximum determined.

Abstract: A method and apparatus for confirming whether wire bonds are successfully made to sites on a workpiece by an ultrasonic bonding tool using wire supplied to an entrance bore through the tool from a despooling wire supply spool, and for providing a fault detection status signal if bonds are not successfully made, utilizes an automatic wire despooler which includes a spool drive motor for rotating a wire supply spool to thereby pay out wire from the supply spool to form a drooping catenary-shaped length of slack wire, located between the spool and an output wire guide having an aperture through which wire is supplied to a bonding machine head that supports an ultrasonic bonding tool. The apparatus includes a proximity-type feed sensor for detecting when the catenary straightens and shortens a predetermined amount in response to tension caused by moving the tool tip between successive bond sites, thereby drawing wire out through an exit opening of the bonding tool bore.

Abstract: The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area (18, 21, 22) is subjected to the action of ultrasonic waves, preferably to the action of shear waves, by using an ultrasound source (14). During a first welding process (n1), a signal processing (30) determines a first ultrasonic permeability (Dn1) from a received ultrasonic signal (UE). During at least one subsequent welding process (n2), a second ultrasonic permeability (Dn2) is determined from an ultrasonic signal (UE) that is received during a renewed exposure of the welding area (18, 21, 22) to ultrasonic waves. A display (32) and/or a diagnostic function and/or a correction of control quantities of the welding system is/are carried out as a function of the at least two ultrasonic permeabilities (Dn1, Dn2).

Abstract: Two members 11 and 12 are butted against each other, and the butted portion is cut with a cutter 20 to form a slit 14 thereto, and a filler member 21 is inserted to slit 14 using rollers 22, 23 and 25. Then, friction stir welding is performed to weld filler member 21 and two member 11 and 12 disposed on both sides thereof using a rotary tool 35, and the position of a gap formed between an end of filler member 21 at the upstream side in the rotating direction of rotary tool 35 and one member 11b at the upstream side in the rotating direction is detected using an optical sensor 35. Then, half the width of filler member 21 is added to the detected position, and the calculated position is set as the position of the rotary tool 35.

Abstract: A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first one of the pair of optical fibers, and an optical detector to receive an indirect image of a bottom surface of the first optical fiber through the alignment tool, such an offset between the first optical fiber and the optical detector is determined based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the first optical fiber, and receiving an indirect image of the first optical fiber through the cornercube offset tool.

Abstract: A micro-reactor that is formed from a plurality of metal foil layers that are shaped by use of lithographic techniques in specific shapes. The formed metal foils layers are stacked and aligned together and then connected together to form one or more portions of the micro-reactor.

Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Abstract: A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the position detection camera is processed, and an execution is made so as, for instance, to measure the diameter of a ball formed on a wire extending from the lower end of the capillary, to measure the tail length extending from the lower end of the capillary, to measure the ball position from the undersurface of the capillary, to observe the bending of the tail of the wire, to inspect the external appearance of the capillary, and to measure the amplitude of vibration of the capillary when an ultrasonic vibration is applied to the capillary.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A high-precision method for evaluating creep damage of high tension heat resistant steel used in high temperature exposed apparatuses involves comparing particle size behavior varying with creep damage progress of crystal grains having a crystal orientation difference of about 2 degrees or more, preferably 3 degrees or more at an evaluated part on the basis of a working curve or a working map prepared in advance by looking for the relation of grain sizes to creep damage extent. A high-precision apparatus evaluates the creep damage of high tension heat resistant steel used in high temperature exposed apparatuses.

Abstract: A method for finding optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a shear force exerted by the capillary on a connection point. A predetermined number of bonding operations with varying bonding parameters is performed. Optimum bond parameters are derived from the signal of the sensor.

Abstract: A method for controlling the edges (7, 7?) of a foil strip guided in a shaping funnel of a device producing tubular bodies from the foil strip by an overlapping weld seam using a guide wedge, the strip being then welded. According to the invention, after welding, the method consists in using a linear infrared sensor for measuring and evaluating a temperature profile perpendicular to the overlapping weld seam. In case of variation relative to the specific real profile, a signal is automatically transmitted to rotate the shaping funnel with the guide wedge, the welding being produced by the high frequency (HF) and the temperature profile being measured directly after welding.

Abstract: In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joining step at the highest joining temperature, immediately followed by a solder flux cleaning step and immediately followed by a testing of the entire module constructed thus far. There is provided a further specific type operation for each different type of component element that includes the providing of a loop for the introduction of a replacement for any broken discrete component with joining being achieved with use of a lower fusion temperature solder, flux cleaning and testing at each joining followed by reinsertion into the module. There is further provided an operation at the encapsulation stage of the module building for introducing underfill between the component and supporting carrier.

Abstract: A method for inspecting welds between welded tubular ends includes arranging a series electromagnetic acoustic transducer (EMAT) assemblies in circumferential direction adjacent to an inner and/or outer surface of at least one of the welded tubular ends and inducing the EMAT assemblies to transmit sequentially or simultaneously acoustic shear wave signals towards the weld and to detect the shear waves reflected by and/or passing through the weld while the EMAT assemblies are maintained in a substantially fixed position relative to the weld such that at least a substantial part of the weld is scanned by the EMAT assemblies instantly after the weld is made.

Abstract: This invention relates to a method of spatially integrating multiple pipeline datasets. The method involves weld matching multiple inline inspection datasets by selecting one dataset as master and designated the other datasets as slaves, then spatially slaving the weld positions in the slaves to the weld positions in the master. After the weld matching process is completed, the method repositions the other data in the slave datasets relative to the master datasets, and which itself was previously spatially fit against a centreline model.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: A method and system for directly measuring and controlling the amplitude of an ultrasonic horn comprising an ultrasonic horn, a non-contact measurement device for directly measuring an amplitude of the ultrasonic horn, and a controller for modulating the amplitude of the ultrasonic horn in communication with the non-contact measurement device. In accordance with the noncontact optical detection embodiments, the non-contact measurement device is an optical system in which one of a coherent or noncoherent light beam is transmitted from a light source onto a surface of the ultrasonic horn, generating reflected light at a photodetector. The photodetector produces an output signal proportional to at least one of the intensity or the location of the light spot. Detector output is then correlated to the amplitude of the ultrasonic horn and input to a controller for controlling the amplitude of the ultrasonic horn in real time.

Abstract: The circuit characteristics of an intermediate layer between an uppermost layer and a lowermost layer of a ceramic multilayer substrate with substrates laminated can be evaluated. A method for evaluating the characteristics of the intermediate layer circuit is provided. The intermediate layer circuit is installed on the intermediate layer of the multilayer substrate and has a wiring and a grounding pad, holding grounding potential, formed in the vicinity of the wiring. The method includes steps of: irradiating a region of the upper layer substrate located above the grounding pad of the intermediate layer with a laser to ablate material to a predetermined thickness; polishing the upper layer substrate ablated to the predetermined thickness with a hard polishing tool to expose the wiring and/or grounding pad; and bringing a probe needle in contact with the exposed wiring and/or grounding pad to evaluate characteristics of the intermediate layer circuit.

Abstract: To determine the vectorial distance D between the tip of a capillary and an optical axis of an image recognition system of a Wire Bonder, a glass fibre supplied with light is used as a reference point and as a sensor. On the one hand, the glass fibre serves as a reference point with which the position of the optical axis of the image recognition system can be determined. On the other hand, the glass fibre serves as a sensor with which the position of the tip of the capillary can be determined in that it is determined at which position of the bondhead the intensity of the light which is reflected back into the glass fibre by a wire ball formed at the tip of the capillary is at a maximum.

Abstract: A method for determining the quality of an examined weld joint comprising the steps of providing acoustical data from the examined weld joint, and performing a neural network operation on the acoustical data determine the quality of the examined weld joint produced by a friction weld process. The neural network may be trained by the steps of providing acoustical data and observable data from at least one test weld joint, and training the neural network based on the acoustical data and observable data to form a trained neural network so that the trained neural network is capable of determining the quality of a examined weld joint based on acoustical data from the examined weld joint. In addition, an apparatus having a housing, acoustical sensors mounted therein, and means for mounting the housing on a friction weld device so that the acoustical sensors do not contact the weld joint. The apparatus may sample the acoustical data necessary for the neural network to determine the quality of a weld joint.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: The invention provides a technique for evaluation of a spot welded portion by which the strength of a panel. In the evaluation method, a stress value at a welded portion of the panel is calculated by a stress analysis according to a FEM using the elements, and then the strength of the welded portion is evaluated based on the stress value at the welded portion. Particularly, a portion in the proximity of the spot welded portion is divided, with a central portion of the spot welded portion registered with a nodal point of the elements, into a central element and a plurality of concentric ring-like elements including first and second ring-like elements from the center side provided by the central portion of the spot welded portion. Thereafter, the plural concentric ring-like elements are individually divided in a circumferential direction each into a plurality of portions to form the elements. Then, the strength is evaluated based on the stress value of the second ring-like element.

Abstract: A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps:

Abstract: A method and guidance system for accurately positioning a welding torch relative to a desired weld path. The method and system are based on ultrasonic sensing of information relating to the distance between the welding torch and surfaces on one or more components being welded, and then using this information to move the welding torch to a specific point in space relative to the desired weld path. The method and system maintain the welding torch over the weld path and at a predetermined distance from the weld path during movement of the torch along the weld path.

Abstract: The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

Abstract: Apparatus for detecting the oscillation amplitude of an oscillating object (3) includes an optical radiation source (9) and a detector (10) including first and second optical radiation sensing areas (24A, 24B) adjacent each other. The detector (10) and the optical radiation source (9) are adapted to be located opposite each other with the oscillating object (3) located between the source (9) and the detector (10) so that the object (3) blocks a portion of the sensing areas (24A, 24B) from receiving optical radiation from the source (9). A processor (18) coupled to the detector (10) receives first and second output signals representing the magnitude of optical radiation sensed by the first and second optical radiation sensing areas (24A, 24B), respectively. The processor (18) processes the first and second output signals to obtain an indication of the amplitude of oscillation of the object (3).

Abstract: A solderless test interface (10) includes a thin, flexible, electrically insulative sheet (20) having metal plated through-holes (24) formed in the pattern of the external ball contacts (54) of a semiconductor device (14). The termini (26, 30) of the holes (24) on the surface of the sheet (20) are also plated. The metal (40) is coated with a soft metal (42) which will cold-flow under force. The sheet is inserted between the ball contacts (54) and a test board (18). Force is applied to the test board and/or the device to engage and deform the soft metal (42) at the hole termini (26, 30) by its engagement with the balls (54) and pads (16) on the test board. The deformation ensures a low resistance electrical path between the balls and the pads during testing of the device.