Abstract: A method for production of hollow bodies, in particular for radio-frequency resonators is shown and described. The object to provide a hollow bodies and a resonator, respectively, having improved electrical properties is achieved by a method comprising the following steps: Providing a substrate having a monocrystalline region, defining a cut area through the substrate, fitting markings on both sides of the cut area, producing two wafers by cutting along the cut area, wherein the wafers are completely removed from the monocrystalline region, forming the wafers into half-cells, wherein the half-cells have a joining area, joining together the half-cells to form a hollow body, wherein the joining areas bear on one another, and wherein the markings on the half-cells are oriented with respect to one another on both sides of the joining area as on both sides of the cut areas.

Abstract: A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature that maintains the liquid phase and directing the heated heat transfer medium from the preheating container to an evaporation container. In the evaporation container, the heat transfer medium can be vaporized to convert the heat transfer medium from the liquid phase to a gas phase. Further, the method can include directing the gas phase heat transfer medium from the evaporation container to a solder chamber. The soldering process occurs in the solder chamber.

Abstract: A robot welding apparatus including a welding station having a welding robot with weld tips for creating a weld along a work piece. A welding power supply and control pendant is also provided. A visual screen of the control pendant provides a view of the weld tips for use with the method to detect characteristics such as weld tip face measurement, tip wear measurement, tip alignment measurement, and cap replacement and type verification.

Abstract: A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.

Abstract: The invention refers to a procedure for consolidating and sealing a tube, whereby the tube is positioned between a sonotrode and an associated anvil of an ultrasonic welding device, the sonotrode being activated and displaced relative to the counter electrode for consolidating and sealing the tube. In order to enable automatic consolidating and sealing of a tube without individually entering the data of the tube into an ultrasonic welding device in advance, the following steps are proposed: positioning the tube and fixing it between the sonotrode and counter electrode, determining a characteristic variable of the tube with the tube being fixed between the sonotrode and counter electrode, retrieving stored welding parameters on the basis of the characteristic variable and activating the sonotrode and moving the sonotrode and counter electrode in relation towards each other for consolidating and sealing the tube.

Abstract: A technique for evaluation of the strength of a spot welded portion of a panel is provided. A stress value at the welded portion of the panel is calculated by a stress analysis according to a FEM using the elements, and then the strength of the welded portion is evaluated based on the stress value at the welded portion. A portion in the proximity of the spot welded portion is divided, with a central portion of the spot welded portion registered with a nodal point of the elements, into a central element and plural concentric ring-like elements from the center side provided by the central portion of the spot welded portion. Thereafter, the plural concentric ring-like elements are individually divided in a circumferential direction each into a plurality of portions to form the elements. Then, the strength is evaluated based on the stress value of the second ring-like element.

Abstract: An apparatus and method are provided for measuring loads on a rotating friction stir welding tool of a friction stir welding machine. The apparatus includes a frame that can be connected to the friction stir welding machine, and rollers rotatably connected to the frame are structured to contact and rotate with the friction stir welding tool. Each roller is adapted to adjust in a respective direction and communicate with a respective load cell so that the load cells detect a positional characteristic of the rollers and measure loads applied to the rotating friction stir welding tool during operation. The rollers can contact the rotating tool directly during operation of the machine, such as while the rotating tools is being moved through a workpiece to form a friction stir weld joint, to measure the loads on the tool in the direction of movement of the tool and a direction normal to the movement, i.e., the path and path normal directions.

Abstract: A purge gas introduction system for an orbital tube welding setup is provided, configured to inject high purity inert purge gas to the interior volume of a tube or tubular component. An o-ring is interposed between an annular base and an annular ring, their junction forming an annular o-ring groove, each part forming one sidewall, with the o-ring fully recessed within the groove, protecting the o-ring during the insertion and removal of a tube. The annular base and an annular ring are configured to receive a tube terminus. The sidewalls of the o-ring groove are divergent one to the other, wherein as the annular ring is drawn towards the annular base, the o-ring is forced partially out of the groove, forming a substantially leak tight seal between the tube and the o-ring. A purge gas from an external source is transmitted to the annular base through a purge connector, then, in turn, introduced to the interior volume of the tube.

Abstract: The present invention relates to a welding system. The welding system comprises: a fixing jig for securely fixing any one of a plurality of to-be-welded objects; a movable jig for moving another of the plurality of to-be-welded objects a movable block for horizontally moving the movable jig; a block driving mechanism for driving the movable block; a position sensor for detecting the position of the movable jig; and a control device for receiving position data from the position sensor to control the block driving mechanism. According to a welding system of the present invention, it is possible sequentially identify the positions of the to-be-welded objects after the melting and shrinkage thereof using a position sensor and determine an optimal welding position of the to-be-welded objects during the welding to thereby realize an optimal finished product.

Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.

Abstract: A method of inspecting a substantially circular circumferential weld for connecting together an inner pipe and a coaxial outer pipe, either directly or via a junction forging, by using an ultrasound probe having a plurality of robotic multibeam piezoelectric emitter-receivers. The method is performed by: a) positioning at least one ultrasound probe inside said inner pipe; b) scanning the various ultrasound beams from the various emitters of said probe while the probe is positioned at a given position; and c) moving said probe in rotation about the axis of said pipe through a given angle corresponding to an arc length less than or equal to the size of the weld defects that are to be detected; and then d) repeating steps b) and c) until the entire circumference of the weld has been inspected. The present invention also provides a device for inspecting a circumferential weld that is suitable for use in a method of the invention.

Abstract: The method of manufacturing a hermetically sealed container improved is provided. The height of each location of a bonding member is measured across all the extending directions of the bonding member. The control computer decides a pressing force of a pressing cylinder for pressing and deforming the substrate so that a constant pressure is applied between a substrate and the bonding member based on the height of the bonding member of the position heated by a heater. Next, a rotating body, the heater, and the pressing cylinder, which are integrally fixed, are scanned along the bonding member. By the pressing force calculated by the control computer, the pressing cylinder is driven and the rotating body is pressed to the substrate side, while being rotationally driven, so that the light beam by the heater such as a laser device is irradiated.

Abstract: The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure.

Abstract: A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board, a component volume that is occupied by the components mounted within a given area; determining the heating conditions in accordance with the calculated component volume; and performing the reflow heating based on the determined heating conditions.

Abstract: At a comparatively early stage, members to be bonded are pressurized together by an applied pressure that is a comparatively low pressure. Under an applied pressure condition (a gas venting process) of the comparatively low pressure, an organic protective film is vaporized by heating a bonding material, and a void portion of a porous structure that is formed by metal nanoparticles and a binder in the bonding material is not collapsed any more than necessary due to the applied pressure. Thus, the void portion of the porous structure functions as a degassing path for the gasified organic protective film, and the gas is smoothly released from between the members to be bonded. At the time point when the temperature of the bonding material has reached a predetermined temperature, the applied pressure is increased from the comparatively low pressure to a comparatively high pressure (a pressure increase process).

Abstract: An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across multiple component configurations. Said components can be implemented to detect, on a continuous basis, solder interconnect fractures as they occur during actual end-use, throughout the lifecycle of monitored components, rather than relying on a one-time electrical check prior to shipment.

Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.

Abstract: The invention relates to plastic metal forming, particularly to methods of manufacturing articles of titanium alloys by superplastic forming and diffusion welding. The method is particularly applicable to aircraft engine building for manufacturing articles, e.g. fan blades.

Abstract: An invention providing improvement in integrity testing of wire bonds between an IC die and a BGA substrate. The invention includes a BGA integrated circuit package comprising: 1) a BGA substrate having conducting bond fingers and a grounded feature on a first side thereof; 2) an IC die electrically connected to the conducting bond fingers with wire bonds; the BGA substrate configured to be formed into a singulated unit with the IC die; wherein the BGA substrate does not have direct electrical connection on the first side thereof between the bond fingers and the grounded feature; 4) the BGA substrate including an indirect electrical connection pathway from each wire bond to the grounded feature that enables electrical integrity testing for the wire bonds; the indirect electrical connection pathway configured so that at least a portion of each indirect electrical connection pathway is not present on the singulated unit.

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: An electronic component mounting device according to the invention includes a bonding head for holding and pressure bonding an electronic component to a mounting substrate, a local stage provided with a support surface formed in an area which is almost equal to or slightly larger than that of a mounting surface of the electronic component and serving to support a pressure bonding force from an antimounting surface of the mounting substrate through the support surface, a length measuring mechanism for measuring a distance between the bonding head and the mounting substrate, thereby calculating a virtual plane in a predetermined mounting position on the mounting substrate, and a tilting and moving mechanism for tilting and moving the bonding head and the local stage, thereby causing a normal of the virtual plane in the mounting position to be coincident with an action line of the pressure bonding force, and the pressure bonding is carried out along the normal.

Abstract: An apparatus for judgment of the quality of resistance brazing provided in a resistance brazing apparatus gripping a weld object between which a brazing material is interposed between a pair of electrodes, applying pressure to copper parts, and feeding power to the electrodes in that state, having a control unit controlling the amount of heat generated at the pair of electrodes during resistance brazing, a power feed time measurement unit measuring a power feed time to electrodes required from when an amount of displacement of the distance between the pair of electrodes reaches a first amount of displacement to a second amount of displacement, and a quality judgment unit judging there was a brazing material if the power feed time is a predetermined threshold value or less and judging there was no brazing material if the power feed time is larger than the predetermined threshold value.

Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including colinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

Abstract: Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a bonding wire which projects beyond a bonding contact, the wire bonder having a camera with a downstream image processing device for recording and processing an image of its working region at a workpiece.

Abstract: A method is provided for determining that the electrodes of an electric resistance welder are in need of replacement and dressing includes monitoring the rate at which the depth of the weld indentation caused by the electrode changes during the progressive wearing of the electrodes during the making of successive welds. The electrodes are then dressed when it is determined that the rate of change of the depth of the weld indentation formed by the electrodes has substantially leveled off to a stable depth of indentation.

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: Bonding methods and a bonding system including monitoring are disclosed. In one embodiment, a method of monitoring bonding a first and second substrate includes: providing a plurality of piezoelectric sensors to a substrate mounting stage of a substrate bonding system; and monitoring a force change measured by the plurality of piezoelectric sensors induced by a bond front between the first and second substrate during bonding. This method allows real time monitoring of the bonding quality and adjustment of the bonding process parameters.

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging system and configured to control movement of the imaging system to capture the image. The imaging system comprises a camera element configured to capture the image of at least the portion of the surface of the electronic substrate, and a first illumination element comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.

Abstract: The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive joint. Said component is positioned above the carrier plate in a relation to outer reference points by means of a gripper pertaining to a robot station. A joint is then created between the component and the carrier plate, the joint seam hardening under contraction between the component and the carrier plate, thus exerting a vertical tractive force on the gripper holding the component. At the same time as the contraction, the gripper is vertically displaced towards the carrier plate in a controlled or regulated manner, optionally up to a defined nominal position, and actively yields to the contraction such that the creation of high tensions is largely avoided and the position does not change when the component is detached from the gripper.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.

Abstract: A combinatorial process for production of material libraries from a single sample, comprising forming a diffusion multiple in the single sample, wherein the diffusion multiple comprises a plurality of interdiffusion regions at interfacial locations of dissimilar metals, metal oxides, or alloys, and wherein the diffusion multiple comprises at least three layers of the metals, non-metals, metal oxides, or alloys; and evaluating properties of the diffusion multiple as a function of composition at about the interdiffusion regions.

Abstract: A system and method of forming a continuous strip from a plurality of strips, each strip having a leading end and a trailing end. Embodiments can include a forming apparatus that chamfers at least one of the leading and trailing ends of each strip. The chamfered trailing ends may then be positioned against chamfered leading ends of successive ones of the plurality of strips. Once a leading end and a trailing end are positioned against one another, a first welding apparatus may weld on a first side, from above, the trailing and leading ends positioned against each other to form weld joints. Once at least two strips have been welded together, the strips can constitute the continuous strip. An inverting apparatus can then invert the continuous strip and weld joints. The inversion of the weld joints can be done so as not to create a reverse bend in the continuous strip. A second welding apparatus can then weld on a second side opposite the first side, from above, the inverted weld joints to form weld junctions.

Abstract: A bond strength tester unit is provided for testing adhesive bond strength of a nutplate or the like attached to a substrate, such as by adhesive bonded attachment to a blind side of the substrate in substantial alignment with a substrate opening. The nutplate may be constructed according to U.S. Pat. No. 5,013,391, and carries a fastener element such as a threaded nut or the like for subsequent connection with a mating fastener element such as a threaded bolt or the like passed through the substrate opening. The tester unit includes a tool tip having a reaction head for engaging the substrate, in combination with an actuator pin for applying a test force of selected magnitude against the adhesively bonded nutplate. In the event of inadequate bond strength, the actuator pin will separate the nutplate from the substrate.

Abstract: A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark portion. The monitoring device selectively emphasizes the outputs of the image sensor for any of luminance areas of the image taken by the image sensor using a sensor output characteristic table and can provide an image clearly showing both the very bright welding portion and the dark bead portion with a sufficient contrast allowing an observer to reliably recognize the objects in the image.

Abstract: A method for testing the integrity of a weld on a pipe includes the application of an axial stress on the weld during the integrity test. Ali assembly for performing the method is also provided, wherein a pair of circumferential supports are provided on the pipe on opposite sides of the weld, and between which extend axial force applying devices. In one aspect, the invention is used to test a weld securing a flange to a pipe. The invention also provides novel circumferential clamps for securing to the exterior of pipes.

Abstract: The present invention relates to a system and method that provide for automated notification to entities (e.g., individuals, groups of individuals, computers, systems . . . ) of welding system related information. The invention provides for determination of events and/or conditions that warrant automatic notification thereof to relevant entities. The notifications are conveyed via a most appropriate subset of available communication modes available. The system identifies most appropriate entities to receive the notification about the event, and optionally determines or infers state of the entities and conveys the notification via a communication mode (e.g., text, audio, graphical, video, combination thereof . . . ) and modality (e.g., wireless, Ethernet, cable, optical, telephone, e-mail, voicemail, pager, ghosting, instant messaging . . . ) that is most suitable given context/state of the event and entities.

Abstract: A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical direction. This computer 41 includes a memory 60, which stores the detected position of the capillary 5 at the time that secondary bonding is performed on a bump that is formed in a normal manner on the second conductor, and a comparator circuit 61, which outputs a “bump not-adhered” signal in cases where the output value of the height position counter 44 is outside the permissible error range of the detected position that is stored in the memory 60.

Abstract: A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and overlay measurement alignment marks on the lower substrate may be seen by the measurement system, using the measurement system to measure the positions of the overlay measurement alignment marks, determining the distance between corresponding overlay measurement alignment marks on the upper and lower substrates, and adjusting the determined distance to take into account an offset between the overlay measurement alignment marks on the upper substrate and the overlay measurement alignment marks on the lower substrate.

Abstract: A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus is configured so that a chip and a substrate are subjected to positioning on the basis of a recognition result of the chip recognition camera so that the chip is bonded onto the substrate. The chip recognition camera is disposed to be lower than a level of a substrate mounted surface of the substrate stage. A lower surface of the chip is recognized in a condition that the lower surface of the chip is located to be substantially on a level with a chip bonding surface of the substrate. Positioning of the chip and the substrate is performed by the recognition image.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: A method of measuring the quality of a stick electrode used in forming the root bead of a pipe joint, which electrode has a wire diameter, a length substantially greater than 12 inches and an upper exposed rod head. The method comprises: preparing a standardized workpiece including two spaced plates with a groove between the plates having a set profile including a lower gap duplicating the root gap of the pipe joint and mounting the standardized workpiece on an incline with the groove facing upwardly where the incline is at a fixed known angle. Then a stick electrode of the type to be measured is selected and the rod head of the selected electrode is connected to the power lead of a DC power source set to a given output current correlated with the type of electrode.

Abstract: A method and apparatus of comparing two or more welding flux systems to determine which flux system results in the smallest incidence of undercut about a weld bead in an inner diameter of a pipe.

Abstract: Stick welding electrode rating and ranking procedures are provided for determining stackability performance of stick electrodes for pipe welding operations. The rating technique involves performance of a standardized vertical down weld procedure using a stick electrode to form a weld bead in a test workpiece groove, in which the electrode is maintained during welding at a substantially constant angle relative to the workpiece groove. The electrode is advanced toward the groove at a slow speed to deposit molten metal in the groove while keeping the molten metal above the stick electrode end or the arc thereof without dripping. The resulting bead distance is measured along with the welding time and the stick electrode is rated according to a ratio of the weld time and the bead distance.

Abstract: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.